Beam Position Control Patents (Class 219/121.78)
  • Patent number: 10994372
    Abstract: The machine includes a working head with a focusing device arranged to focus a laser beam on the surface of a tube or profiled section to be worked, a carriage and a scanning system arranged to scan a portion of the outline of the cross-section of the tube or profiled section. The working head and laser scanning module are mounted on the carriage, and the carriage is able to translate with respect to the tube or profiled section in longitudinal and transverse directions such that the working head and laser scanning module translate with the carriage. The scanning system includes at least one laser scanning module including a laser emitter arranged to emit a light blade with which to illuminate a portion of the tube or profiled section and a camera arranged to acquire an image of the portion of tube or profiled section illuminated by the light blade.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: May 4, 2021
    Assignee: ADIGE S.p.A.
    Inventors: Paolo Galvagnini, Giovanni Dalfollo, Paolo Benatti, Luca Cevasco, Claudio Cenati, Lorenzo Molinari Tosatti, Diego Parazzoli
  • Patent number: 10926336
    Abstract: A machine for additive manufacturing of components by sintering powder includes a framework, a working zone, at least two beam emission and control modules, and at least two actuators. Each module, which is structured to emit an energy beam and to control the energy beam, is mounted inside the framework and is provided with an emission source and an optical system for focusing the energy beam emitted from the source. Each module acts on the working zone to manufacture a same component. Each optical system is axially movable in translation with respect to the framework. The actuators are associated with the optical systems, respectively, and are arranged to adjust axial positions of the optical systems with respect to the working zone, the axial positions being adjustable independently of each other.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: February 23, 2021
    Inventors: Gilles Walrand, Christian Geay, Jean-Baptiste Allard
  • Patent number: 10845589
    Abstract: An optical apparatus includes a rotatable reflecting member including a first reflecting surface and a second reflecting surface, an optical system including a plurality of reflecting surfaces and configured to sequentially reflect light having been reflected at the first reflecting surface at the plurality of reflecting surfaces to make the light incident on the second reflecting surface, a driving part configured to change an angle of the reflecting member, a control unit configured to control the driving part to change a path of light emitted from the reflecting member after being reflected at the second reflecting surface, and a light incident portion configured to recognize a position of the light having been reflected at the first reflecting surface.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: November 24, 2020
    Inventors: Masaharu Kume, Yukihiro Inoue
  • Patent number: 10807240
    Abstract: A robot control device is provided with a display unit for displaying a three-dimensional image of a jog coordinate system and a robot, and an input unit including keys corresponding to coordinate axes of the jog coordinate system. The input unit is formed so that an operator operates an image on the display unit. A display control unit changes the image so that the direction of the jog coordinate system is fixed while the direction of the robot changes in accordance with the operation of the operator in the input unit. When the operator pushes the key, a manual control unit changes the position and orientation of the robot based on the direction of the jog coordinate system with respect to the robot in the image.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: October 20, 2020
    Inventors: Yuusuke Kurihara, Tomoyuki Yamamoto
  • Patent number: 10773384
    Abstract: A robot control device is provided with a display unit for displaying a three-dimensional image of a jog coordinate system and a robot, and an input unit including keys corresponding to coordinate axes of the jog coordinate system. The input unit is formed so that an operator operates an image on the display unit. A display control unit changes the image so that the direction of the jog coordinate system is fixed while the direction of the robot changes in accordance with the operation of the operator in the input unit. When the operator pushes the key, a manual control unit changes the position and orientation of the robot based on the direction of the jog coordinate system with respect to the robot in the image.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: September 15, 2020
    Inventors: Yuusuke Kurihara, Tomoyuki Yamamoto
  • Patent number: 10766102
    Abstract: Embodiments of present disclosure discloses system and method for performing laser marking. Initially, a first image of a region to be laser marked may be captured and compared with a predefined image of a predefined pattern to be laser marked on the region. By the comparison, a first score may be computed. The first score may indicate marking present in the region to be laser marked, in relation to the predefined image. Further, a co-ordinate data of a configuration file, relating to the predefined pattern, in the laser marking system may be modified based on the first score, for performing the laser marking on the region.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: September 8, 2020
    Assignee: Wipro Limited
    Inventor: Sujith Krishnan Pallath
  • Patent number: 10665508
    Abstract: A cutting apparatus includes a cutting unit configured to cut a workpiece held on a chuck table, and a groove detecting unit including a CCD imaging element photographing the workpiece held on the chuck table. The groove detecting unit photographs, by the CCD imaging element, a laser-processed groove and a cut groove illuminated by an oblique illumination set such that a light amount of light in a direction parallel with an extending direction of the laser-processed groove as viewed in plan is higher than a light amount of light in a direction orthogonal to the extending direction of the laser-processed groove.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: May 26, 2020
    Inventors: Makoto Tanaka, Shinya Yasuda, Satoshi Hanajima, Harunobu Yuzawa
  • Patent number: 10589352
    Abstract: In molten metal jetting, where droplets of metal are jetted to 3D print a part, each layer may be traversed each successive layer with a normalizing grinding wheel or other leveling device such as a layer to level each successive layer, and/or the melt reservoir or printing chamber may be filled with an anoxic gas mix to prevent oxidation.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: March 17, 2020
    Assignee: MARKFORGED, INC.
    Inventor: Gregory Thomas Mark
  • Patent number: 10569357
    Abstract: A scanned optical beam is divided so as to form a set of scanned subbeams. To compensate for scan errors, a portion of at least one subbeam is detected and a scan error estimated based on the detected portion. A beam scanner is controlled according to the estimated error so as to adjust a propagation direction of some or all of the set of scanned subbeams. The scanned subbeams with adjusted propagation directions are received by an f-theta lens and directed to a work piece. In typical examples, the portion of the at least one subbeam that is detected is obtained from the set of scanned subbeams prior to incidence of the scanned subbeams to the f-theta lens.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: February 25, 2020
    Assignee: nLIGHT, Inc.
    Inventors: Scott R. Karlsen, Robert J. Martinsen
  • Patent number: 10363630
    Abstract: A laser processing method is performed in a laser processing apparatus which outputs a laser beam from a processing head to a workpiece, to perform laser processing while controlling reflected light of the output laser beam to a prescribed value or less. The laser processing method includes the step of, before performing laser processing for the workpiece, increasing laser power stepwise from laser power lower than laser power included in a processing condition of the laser processing, to emit a laser beam from a laser oscillator, and measuring reflected light by a reflected light sensor, and the step of deciding an output condition for decreasing reflected light based on a measured value of the reflected light and the prescribed value, and the step of decreasing reflected light before performing the laser processing by irradiating the workpiece with a laser beam for a predetermined period of time on the decided output condition.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: July 30, 2019
    Inventor: Takashi Izumi
  • Patent number: 10216168
    Abstract: An operation of a processing machine with redundant actuators is controlled according to a reference trajectory by selecting, from a set of points forming a segment of the reference trajectory to be processed for a period of time, a subset of points corresponding to a fraction of the period of time. The subset of points is selected such that the redundant actuators are capable to position the worktool at each point in the subset within the period of time and are capable to maintain the worktool at the last point of the subset after the period of time while satisfying constraints on motion of the redundant actuators. The constraints on motion are selected based on the mode of operation of the processing machine. The segment of the reference trajectory is modified in the time domain and the control inputs for controlling the motion of the redundant actuators are determined using the modified segment of the reference trajectory.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: February 26, 2019
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Abraham Goldsmith, Stefano Di Cairano, Uros Kalabic
  • Patent number: 10179375
    Abstract: Provided is an NC program generating device that generates an NC program used in laser machining, using a rapid traverse command that moves a relative position between a machining head and a workpiece at a first movement speed, and a linear interpolation movement command that moves the relative position at a second speed, while causing the relative position to trace the workpiece, the device comprising: a movement time calculation unit that calculates a first movement time of the relative position when using the rapid traverse command and a second movement time of the relative position when using the linear interpolation command, a movement method selection unit that selects the movement command corresponding to the shorter time of the first movement time and the second movement time, and an NC program generating unit that generates an NC program by setting the selected movement command between the machining points.
    Type: Grant
    Filed: April 28, 2014
    Date of Patent: January 15, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroaki Kurokawa, Toshiki Koshimae, Yoshiyuki Ito
  • Patent number: 10099390
    Abstract: A robot includes: a first arm that has a first light guide path, a second arm that has a second light guide path, a joint portion that has a rotation axis and connects the first arm and the second arm to each other so as to be rotatable about the rotation axis and a light rotary joint that is provided between the first light guide path and the second light guide path inside the joint portion and that optically connects the first light guide path and the second light guide path to each other. In addition, the light rotary joint has a first light guide portion which is fixed to the first light guide path and has a tubular shape about the rotation axis and an end portion of the second light guide path on the light rotary joint side faces the first light guide portion.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: October 16, 2018
    Assignee: Seiko Epson Corporation
    Inventor: Junichi Okamoto
  • Patent number: 10037346
    Abstract: The subject matter described herein provides techniques to ensure that queries of a distributed database observe a consistent read of the database without locking or logging. In this regard, next-write timestamps uniquely identify a set of write transactions whose updates can be observed by reads. By publishing the next-write timestamps from within an extendable time lease and tracking a “safe timestamp,” the database queries can be executed without logging read operations or blocking future write transactions, and clients issuing the queries at the “safe timestamp” observe a consistent view of the database as it exists on or before that timestamp. Aspects of this disclosure also provide for extensions, done cheaply and without the need for logging, to the range of timestamps at which read transactions can be executed.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: July 31, 2018
    Assignee: Google LLC
    Inventors: Wilson Cheng-Yi Hsieh, Eric Hugh Veach, Michael James Boyer Epstein, Alexander Lloyd
  • Patent number: 9741678
    Abstract: A laser welding machine includes: an elevator that is capable of sliding an elevating platform; a pressing actuator that is fixed to the elevating platform at a base part of the pressing actuator and has a tip slidably connected to the base part and pressing a conductive upper terminal toward a conductive lower terminal; a laser oscillator; a machining optical device that is fixed to the elevating platform and has a lens to focus the laser light emitted from the laser oscillator; a position detector that detects a vertical positioning of the pressing actuator; a counter that receives an output of the position detector and delivers position information; and a control circuit that controls, based on the received signal from the counter, the elevator, the pressing actuator, and the machining optical device, and controls operation of the laser oscillator.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: August 22, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Takeshi Matsushita, Yuta Tamai, Toshiyuki Miyasaka
  • Patent number: 9718146
    Abstract: A method calibrates a laser processing machine by commanding a scan head to direct a laser beam to a desired position, then senses an actual position of the laser beam directly using a position sensitive detector (PSD) after the scan head is positioned. A relative position between the scan head and PSD is altered using one or more linear actuators. A position feedback loop is closed around the linear actuators so that the relative position of the laser beam on the PSD is reduced to zero. The actual position of the laser spot is then measured indirectly by encoders attached to linear axes of the laser processing machine. The actual position is stored in a memory. An error is determined as a difference between the desired position and the actual position. Compensation coefficients are determined from the error and stored for later use during operation of the laser processing machine.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: August 1, 2017
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Abraham M Goldsmith, Scott A Bortoff, Vijay Shilpiekandula, Alan Sullivan, William S Yerazunis, John C Barnwell, III
  • Patent number: 9609859
    Abstract: An apparatus and methods are provided for removing unwanted plants or weeds from an area such as an agricultural plot or lawn. The apparatus includes a three-dimensional imager configured to capture plant images and locate plants; an image processor configured to distinguish between wanted and unwanted plants based upon the captured plant images; at least one removal device configured to damage a target on the unwanted plants; a guidance system configured to direct at least one laser beam toward the unwanted plant; a stabilization system configured to provide feedback compensation to one or both of the three-dimensional imager and the guidance system; and a chassis configured to support the three-dimensional imager, the laser device, the guidance system, and the stabilization system. The chassis is configured to be moved across the area.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: April 4, 2017
    Inventors: Timothy David Stowe, Patrick Yasuo Maeda, Tim Curley
  • Patent number: 9468992
    Abstract: A device and a method for machining workpieces (5, 6) by means of a laser beam. Said device has a delivery means (3) for delivering the workpieces (5,6) to a first machining position (8.1) and a machining means (2) which has at least one machining head (2.1) for machining of a workpiece (5,6) delivered to the first machining position (8.1). The delivery means (3) is a gripping robot with a gripping device (3.2). At least one clamping means (9,10) is disposed in order to accommodate a workpiece (5,6) delivered by the delivery means (3), wherein respective machining position is defined by each clamping means (9,10). The machining head (2.1) can be delivered to each machining position for machining of the workpieces (5,6).
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: October 18, 2016
    Assignee: JENOPTIK Automatisierungstechnik GmbH
    Inventors: Stefan Vogt, Thomas Doering, Pierre Geipel, Robert Michel-Triller
  • Patent number: 9403238
    Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: August 2, 2016
    Assignee: Align Technology, Inc.
    Inventor: James C. Culp
  • Patent number: 9114478
    Abstract: An additive manufacturing apparatus comprises a processing chamber (100) defining a window (110) for receiving a laser beam and an optical module (10) The optical module is removably-mountable to the processing chamber for delivering the laser beam through the window. The optical module contains optical components for focusing and steering the laser beam and a controlled atmosphere can be maintained within the module.
    Type: Grant
    Filed: September 7, 2009
    Date of Patent: August 25, 2015
    Inventors: Simon Peter Scott, Chris Sutcliffe
  • Patent number: 9050687
    Abstract: An apparatus that can change an irradiating direction of the beam and a method of recognizing an irradiation-enabled area with respect to a processing course for a work piece. The method establishes an irradiation-enabled area at a focal length that corresponds to one point along the processing course, even when the beam irradiating device is moved away from the one point along the processing course of the work piece. The method further recognizes the irradiation-enabled area with respect to the one point along the processing course.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: June 9, 2015
    Assignee: NISSAN MOTOR CO., LTD.
    Inventor: Daisuke Tanaka
  • Patent number: 9040867
    Abstract: According to an example embodiment, a machine includes, among other things, a housing and a support situated for supporting a work piece in a selected position relative to the housing. A radiation source is situated for emitting a beam of radiation in the housing. A magnetic field generator is situated for generating a magnetic field in the housing near the support. The magnetic field has a selectively variable strength at a plurality of locations in the housing for selectively steering the beam of radiation toward the support.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: May 26, 2015
    Assignee: United Technologies Corporation
    Inventors: Benjamin Joseph Zimmerman, Adam Z. Doherty, Benjamin T. Fisk
  • Publication number: 20150121962
    Abstract: A laser material processing system which includes a pulsed fiber laser source having a continuous wavelength bandwidth of larger than 100 nm and pulse width of from 100 femtosecond to 1 microsecond, a broad band laser emitted from one core of an optical fiber, where the broad band laser is applied to a subject material to produce removal of the subject material and/or color change of the subject material.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 7, 2015
    Inventors: Shibin Jiang, Jihong Geng, Qing Wang
  • Publication number: 20150108102
    Abstract: Methods of circumscribing defects in optical devices are described. A perimeter is formed about a defect by laser ablation, where the perimeter electrically isolates the defect. The perimeter does not have damage due to excess energy from the laser and thus does not create new electrical shorts.
    Type: Application
    Filed: May 16, 2013
    Publication date: April 23, 2015
    Applicant: View, Inc.
    Inventor: Todd Martin
  • Patent number: 9000321
    Abstract: A thermal cutter for cutting with heat a board mounted upon a table having an internal space includes a plurality of walls and a sound absorbent material. The walls are disposed in the internal space of the table to partition a plurality of exhaust chambers with each of the exhaust chambers having an aperture that opens towards a side on which the board is mounted. The sound absorbent material is provided to at least a portion of at least one of the walls, the sound absorbent material being removably coupled to the table.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: April 7, 2015
    Assignee: Komatsu Industries Corporation
    Inventors: Yoshihiro Yamaguchi, Satoshi Ohnishi
  • Publication number: 20150090702
    Abstract: Provided is a laser cutting device and method which changes a cutting speed of a laser according to a difference between characteristics (absorption coefficients) of an object to be cut, so as to uniformly supply an energy of laser to the whole of the object, thereby preventing the object from being incompletely cut. A laser cutting device includes a database that stores information about a cutting pattern, a moving part that changes a location of a laser beam emitted to an object to be cut, a characteristic value input part that receives speed information from a user according to locations on the cutting pattern, and a control part that adjusts a moving speed of the laser beam by controlling the moving part according to the speed information from the characteristic value input part, and the information about the cutting pattern from the data base.
    Type: Application
    Filed: December 10, 2014
    Publication date: April 2, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Jin Ho BAN, Chang Bum AHN, Ki Hong MIN, Ji Won PARK, Myung Hoon KO, Seung Ho NA
  • Publication number: 20150072084
    Abstract: The subject of the invention is a process for obtaining a substrate provided on at least one portion of at least one of its sides with a coating, comprising a step of depositing said coating on said substrate, then a step of heat treatment of said coating using a pulsed or continuous laser radiation focused on said coating in the form of at least one laser line, the wavelength of which is within a range extending from 400 to 1500 nm, said heat treatment being such that a relative displacement movement is created between the substrate and the or each laser line, the speed of which is at least 3 meters per minute, the or each laser line having a beam quality factor (BPP) of at most 3 mm·mrad and, measured at the place where the or each laser line is focused on said coating, a linear power density divided by the square root of the duty cycle of at least 200 W/cm, a length of at least 20 mm and a width distribution along the or each line such that the mean width is at least 30 micrometers and the difference betwe
    Type: Application
    Filed: April 15, 2013
    Publication date: March 12, 2015
    Inventors: Emmanuel Mimoun, Matthieu Bilaine
  • Publication number: 20150060422
    Abstract: An apparatus for laser materials processing including a laser (4) for generating a laser beam and a laser head (5) which is movable along at least one spatial direction and is connected to the laser via a light guide, and which emits a laser beam (7) capable of processing a material. The present invention also relates to an apparatus for selective laser melting or selective laser sintering having an apparatus for laser materials processing.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 5, 2015
    Inventors: Christian LIEBL, Steffen Schlothauer
  • Patent number: 8969752
    Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: March 3, 2015
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Kenshi Fukumitsu, Fumitsugu Fukuyo, Naoki Uchiyama
  • Patent number: 8965556
    Abstract: This robot system includes a robot, a laser emitting portion moved by the robot, capable of scanning a welding locus with a laser beam at least in a state where the laser emitting portion is not moving, and a control portion controlling the laser emitting portion to scan the welding locus with the laser beam in order to perform welding with weaving on the welding locus at least in the state where the laser emitting portion is not moving.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: February 24, 2015
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Yuki Oe, Keiji Makino
  • Patent number: 8957348
    Abstract: A welding equipment that forms an end part includes a vacuum chamber; a holding member that is installed in the vacuum chamber and that holds the end part in which a welding groove is formed by placing a half cell, an end plate, and a beam pipe next to each other; a window that is installed in a top-end surface portion of the vacuum chamber, which intersects with an axial center of the end part, and that forms a portion thereof; a laser radiating head that is installed outside the vacuum chamber and that radiates a laser beam into an internal space of the end part through the window; and a mirror member that is installed in the internal space of the end part and that adjusts a reflected laser beam, formed by reflecting the laser beam, so as to be oriented perpendicular to the welding groove.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: February 17, 2015
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Katsuya Sennyu, Shuho Tsubota, Fumiaki Inoue
  • Patent number: 8952290
    Abstract: In the thermal cutting of a workpiece by means of a laser beam, said beam is generated by means of a laser source and supplied to a movable laser head. In the laser head, an optical deflection element is provided for deflecting the laser beam such that, when viewed in working direction, it encloses a tilt angle (?) differing from 0 degrees with the longitudinal axis of the laser head. Starting therefrom, to produce the inclination of the collimated laser beam to the vertical with a very small number of optical components if possible, the invention suggests that the laser beam is supplied to the laser head by means of an optical fiber and the laser beam is collimated, passes through the deflection element laterally offset to the longitudinal axis of the laser head and is deflected by means of said element onto the workpiece surface and focused at the same time.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: February 10, 2015
    Assignee: Messer Cutting Systems GmbH
    Inventor: Karl Eck
  • Patent number: 8952289
    Abstract: Laser crystallization equipment includes a laser generator generating a laser beam, the laser beam being directed toward a processing target substrate, and a blade member over the processing target substrate, the blade member being configured to chop the laser beam with a predetermined width in two directions, wherein two ends of the laser beam chopped by the blade member are irradiated to the processing target substrate as diffraction light.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: February 10, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Byoung-Kwon Choo, Cheol-Ho Park, Kwon-Hyung Lee, Sung-Chul Pyo
  • Publication number: 20150037984
    Abstract: A laser annealing apparatus includes: a laser beam generator for providing a stable single-pulse laser; a cyclic delay unit (300) for splitting the single-pulse laser into several pulsed lasers; an optical module for converging one or more of the pulsed lasers on a substrate (204); and a movable stage (500) for providing the substrate (204) with movement in at least one degree of freedom. A laser annealing method includes: providing a stable single-pulse laser; splitting the single-pulse laser into several pulsed lasers according to a delay requirement and an energy ratio; and irradiating a substrate (204) successively with one or more of the pulsed lasers to keep a surface temperature of the wafer around the melting point or around a needed annealing temperature for a sufficiently long time during the annealing process, thus resulting in an improvement in both the laser energy utilization efficiency and effect of the annealing process.
    Type: Application
    Filed: July 19, 2013
    Publication date: February 5, 2015
    Inventors: Jun Zhang, Zhidan Li, Zhe Li
  • Patent number: 8946587
    Abstract: A laser machining apparatus is provided with: a workpiece support unit; a machining head; and a machining head moving unit. The workpiece support unit includes: an end support part that supports a width end of a workpiece; and an inside support part that supports an inside portion of the workpiece in a width direction. The end support part is movable in a longitudinal direction independently from the inside support part in response to a movement of the machining head.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: February 3, 2015
    Assignee: Honda Motor Co., Ltd.
    Inventors: Takuo Kobayashi, Shin Yoshida, Izuru Hori, Masahiro Koike, Kenichi Fukami
  • Patent number: 8941030
    Abstract: A pulsed laser beam is applied to a workpiece held on a chuck table by a laser beam applying unit. The laser beam applying unit includes a pulsed laser beam oscillator, a focusing lens, and a piezoelectric motor for displacing the focusing unit in a direction inclined at a predetermined angle (?) with respect to the Z direction. A controller controls the frequency and voltage of an RF current to be applied to the piezoelectric motor in relation to the repetition frequency of the pulsed laser beam to move the focusing unit in the X direction by ?x and in the Z direction by ?z in feeding the chuck table in the X direction, thereby displacing the focal point of the pulsed laser beam to be focused by the focusing lens in the thickness direction of the workpiece held on the chuck table.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: January 27, 2015
    Assignee: Disco Corporation
    Inventor: Keiji Nomaru
  • Patent number: 8941027
    Abstract: A machine for machining workpieces by a laser beam. The optical fiber terminates at an optical output head (27) that defines the optical axis of the laser light beam, which vaporizes the material. The optical output head (27) is rigidly attached to the frame (49) or to the casing of the laser head so that said optical output head remains integrally fastened to said frame or casing during the rotation of the laser head about the horizontal pivot axis (B). The polluted gases generated in the machining area by the evaporation of material are collected by a suction nozzle (37) which is driven with the laser machining head during its rotation about the horizontal axis (B). A stream of clean dry gas is injected into the machining area by an injection nozzle (35) which is also driven with the laser machining head (8) during its rotation about the horizontal axis (B).
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: January 27, 2015
    Assignee: Agie Charmilles New Technologies SA
    Inventor: Dino Cataldo Paganelli
  • Patent number: 8933374
    Abstract: A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: January 13, 2015
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventor: Makoto Hayashi
  • Publication number: 20150001194
    Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.
    Type: Application
    Filed: September 18, 2014
    Publication date: January 1, 2015
    Inventors: Mark A. Unrath, Andrew Berwick, Alexander A. Myachin
  • Publication number: 20150001195
    Abstract: An optical system head of the laser processing machine includes a focusing optical system configured to deflect and condense an incident laser beam so that a target object to be processed is irradiated and a deflecting direction adjusting unit configured to adjust the direction of deflection of the laser beams about at least two axes perpendicular or substantially perpendicular to each other. A nozzle holding head of the laser processing machine includes a cutting nozzle configured to blow a cutting gas at a site of the target object, at which the laser beam is irradiated, and a nozzle position adjusting unit configured to adjust the position of the cutting nozzle in a top plane parallel or substantially parallel to the target object. The optical system head and the nozzle holding head are separately supported by an optical system nozzle support member configured to selectively advance or retract in three axis directions relative to the target object.
    Type: Application
    Filed: January 16, 2013
    Publication date: January 1, 2015
    Inventor: Takuya Okada
  • Patent number: 8912465
    Abstract: A laser engraving device which can adjust its machining position is disclosed. The device includes a laser machine for supplying laser beam, a guide rod adjacent to and parallel to the laser machine, a galvanometric scanner coupled to the guide rod and being movable with the guide rod, and a driver disposed at an end of the guide rod for driving the guide rod.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: December 16, 2014
    Assignee: Legend Laser Inc.
    Inventor: Shyr-Cherng Kuo
  • Publication number: 20140353295
    Abstract: A deburring system for removing burrs from a surface of a pipe is provided. The deburring system comprises: a shaft having an anterior end; a conduit contained in the shaft for carrying a laser beam generated from a laser; and a directing module to direct the laser beam emanating from the conduit radially from the shaft to the surface of the pipe. The deburring system is shaped to fit inside the pipe.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 4, 2014
    Inventor: Michael CLAERHOUT
  • Patent number: 8878095
    Abstract: Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: November 4, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Guangyu Li, Mehmet E. Alpay
  • Patent number: 8872065
    Abstract: A method and an apparatus for the manufacture of a tool from a blank, such as, a rotational tool which rotates about a longitudinal axis (L) which includes at least one cutting edge and a chip groove. Preferably, the rotational tool is in its operating area in a cross-section thereof radially symmetrical with respect to it's longitudinal axis (L) and manufactured from a cylindrical blank by laser ablation using a laser machining apparatus with a laser scanner with a predetermined pulse area. The laser beam impulses are directed via a positioning arrangement within the pulse area onto a plurality of impact locations disposed along a predetermined pulse path (B). This pulse area is moved, like a tool, along the surface of the blank to form the chip groove and the cutting edge by sublimation of the material.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: October 28, 2014
    Assignee: EWAG AG
    Inventor: Christoph Pluss
  • Patent number: 8872067
    Abstract: A cylindrical lens (4) diverges a laser beam (L1) in the Y-axis direction (i.e., within the YZ plane) but neither diverges nor converges it in the X-axis direction (i.e., within the ZX plane). An objective lens (5) converges the laser beam (L1) emitted from the cylindrical lens (4) into a point P1 in the Y-axis direction and into a point P2 in the X-axis direction. A pair of knife edges (13) adjust the divergence angle (?) of the laser beam (L1) incident on the objective lens (5) in the Y-axis direction. As a consequence, the cross section of the laser beam (L1) becomes an elongated form extending in the Y-axis direction at the point P2, while the maximum length in the Y-axis direction is regulated. Therefore, locating the point P2 on the front face of a work (S) can form an elongated working area extending in the Y-axis direction by a desirable length on the front face of the work (S).
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: October 28, 2014
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Kenshi Fukumitsu, Shingo Oishi, Shinichiro Aoshima, Atsuko Aoshima
  • Publication number: 20140312013
    Abstract: A laser machining system (20) employs a fast positioner (68), such as a pair of galvanometer mirrors (70), that directs a beam axis (24) at a specified velocity to a start position of a cutting path (92) in coincidence with one of multiple laser pulses emitted from a laser (28) a constant laser pulse repetition rate, which runs independently of the relative position of the beam axis (24) with respect to the workpiece (26).
    Type: Application
    Filed: March 15, 2014
    Publication date: October 23, 2014
    Applicant: Electro Scientific Industries, Inc.
    Inventors: Joseph Frankel, Bob Beauchaine, Doug Gibson
  • Patent number: 8866041
    Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: October 21, 2014
    Assignees: TDK Corporation, Rohm Co., Ltd, SAE Magnetics (H.K.) Ltd.
    Inventors: Koji Shimazawa, Osamu Shindo, Yoshihiro Tsuchiya, Yasuhiro Ito, Kenji Sakai
  • Patent number: 8859934
    Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: October 14, 2014
    Assignee: Insera Therapeutics, Inc.
    Inventors: Vallabh Janardhan, Vikram Janardhan
  • Patent number: 8857055
    Abstract: A process is provided for forming shaped air holes, such as for use in turbine blades. Aspects of the disclosure relate to forming shaped portions of air holes using a short pulse laser, forming a metered hole corresponding to each shaped portion, and separately finishing the shaped portion using a short-pulse laser. In other embodiments, the order of these operations may be varied, such as to form the shaped portions and to finish the shaped portions using the short-pulse laser prior to forming the corresponding metered holes.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: October 14, 2014
    Assignee: General Electric Company
    Inventors: Bin Wei, Jon Conrad Schaeffer, Ronald Scott Bunker, Wenwu Zhang, Kathleen Blanche Morey, Jane Marie Lipkin, Benjamin Paul Lacy, Wilbur Douglas Scheidt
  • Publication number: 20140302270
    Abstract: A recording apparatus includes a rotation driving unit configured to rotate a recording layer forming medium in which a recording layer is formed, a laser irradiation unit configured to apply laser light to the recording layer of the recording layer forming medium, a first slide mechanism configured to change a position of an irradiation spot of the laser light on the recording layer in a first direction parallel to an in-plane direction of the recording layer, and a recording unit configured to perform a recording operation in which the position of the irradiation spot is changed in the first direction by the first slide mechanism while applying the laser light to the recording layer by the laser irradiation unit and rotating the recording layer forming medium by the rotation driving unit, thereby recording a predetermined pattern in consecutive areas including a central portion of the recording layer.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 9, 2014