Abstract: The invention relates to a coating device and to a method for metal-coating of workpieces, comprising a housing, which surrounds a working space, a retaining apparatus for retaining at least one workpiece in the working space, at least one deposition apparatus comprising a deposition nozzle for applying a metal powder to a workpiece surface to be coated, and a laser for locally melting the metal powder on the workpiece surface to form a coating, at least one movement apparatus, by means of which the at least one deposition apparatus can be moved relative to the workpiece surface during the coating, at least one air supply and at least one air discharge. According to the invention, it is provided that the air supply is arranged in an upper region of the working space above the workpiece and the air discharge is arranged in a lower region of the working space below the workpiece. In addition, a additional suction apparatus is provided with at least one suction opening, which is arranged close to the workpiece.

Abstract: A laser welding apparatus (1) includes a laser welding head (5) configured to irradiate a workpiece (10) with laser light, a welding filler feeding mechanism (6) configured to supply a welding material to a position on which laser welding is performed, and a hollow structural moving mechanism (100) configured to move a welding unit (50) including the laser welding head and the welding filler feeding mechanism. The hollow structural moving mechanism has an insertion portion (3a) through which an optical cable (41) of the laser welding head and a wire material (62) of the welding filler feeding mechanism are inserted.

Abstract: A mechanism for detecting the inside of a workpiece includes a wavelength delaying unit for outputting each pulse of a pulsed laser beam emitted from a laser oscillator with time differences imparted to respective wavelengths, and a ring generating unit for generating a ring-shaped pulsed laser beam from the pulsed laser beam with the time differences imparted to the respective wavelengths and diffracting the ring-shaped pulsed laser beam into ring-shaped laser beams ranging from small to large at the respective wavelengths. When the ring-shaped laser beams with the time differences imparted to the respective wavelengths are applied to the workpiece, they produce an interference wave of ultrasonic waves in the workpiece, and vibrations are produced at a position where the interference wave of the ultrasonic waves is converged. A laser beam is applied to an upper surface of the workpiece at a position aligned with the center of the vibrations.

Abstract: A laser oscillator support table includes a base, a fixed plate supported over the base with intermediary of a Z-axis direction movement unit, and a Y-axis direction moving plate mounted on the fixed plate, movable orthogonal to an X-axis direction. An optical path direction of the beam emitted from a laser oscillator supported by the laser oscillator support table is defined as the X-axis direction. The laser oscillator support table further includes a rotating plate that is mounted on the Y-axis direction moving plate rotatably around a rotation center pin fixed to the Y-axis direction moving plate and supports the laser oscillator, a Y-axis direction movement unit that moves the Y-axis direction moving plate in the Y-axis direction, and a rotational movement unit that rotates the rotating plate around the rotation center pin in a plane parallel to a plane formed by the X-axis direction and the Y-axis direction.

Abstract: A laser machining system for machining a workpiece uses a laser beam, preferably for cutting or welding a workpiece using a laser beam. The laser machining system includes a machining head with a housing having an opening for emitting the laser beam from the machining head, a measuring device configured to direct an optical measurement beam through the opening, and an optical unit for aligning the laser beam and the optical measurement beam, the optical unit being settable to adjust the laser beam and the optical measurement beam perpendicular to the optical axis of the machining head in the region of the opening. The measuring device is further configured to determine a setting of the optical unit corresponding to the central alignment of the laser beam on the basis of measurement values based on reflections of the optical measurement beam for different settings of the optical unit.

Abstract: A laser machining tool is disclosed. The laser machining tool includes a machining device that has a movable carriage. A machining unit, which includes a machining head, is arranged on the movable carriage. The machining head is configured to direct a laser beam of laser light onto a workpiece to be machined. A flexible fibre cable for supplying the laser light from a laser light source is connected to the machining head. The machining unit can be moved linearly together with the machining head relative to the movable carriage. The flexible fibre cable is fixed to the machining unit with a first fixing means and fixed to the movable carriage with a second fixing means. The flexible fibre cable is freely movable for enabling a linear movement of the machining unit relative to the movable carriage in a predetermined guide plane between the first and second fixing means.

Abstract: Laser cleaning equipment and a cleaning method for a shaft component are provided. The equipment includes: a supporting base assembly; two driving wheel structures on the supporting base assembly, driving wheels of each of which is configured for being close to or away from each other, and the shaft component to be cleaned is placed between the two driving wheel structures; a friction wheel structure that is tangent to driving wheel structure(s) and uses a friction force thereof to drive driving wheel structure(s) to rotate; a connection shaft assembly that coaxially passes through the friction wheel structure; a power driving mechanism, one end of which that faces toward the connection shaft assembly is in drive connection with the connection shaft assembly and is configured to drive the connection shaft assembly to rotate; and a laser cleaning mechanism configured for performing laser cleaning on the shaft component to be cleaned.

Abstract: Method for scanning the surface (O) of metallic workpieces (W), wherein, during a scanning process before a welding process is carried out, a welding torch (1) with a meltable welding wire (2) is moved over the surface (O) of the workpieces (W), and at predefined times (ti) the welding wire (2) is moved towards the surface (O) of the workpieces (W) until a contact of the welding wire (2) with one of the workpieces (W) is detected, and the position (Pi) of the surface (O) of the workpieces (W) at each time (ti) is determined and stored in the welding power source (4), wherein an edge (K) is determined if the current position (Pi) of the surface (O) of the workpieces (W) exceeds at least one of the stored previous positions (Pi-n) of the surface (O) of the workpieces (W) by a predefined threshold value (S).

Abstract: A machine learning apparatus able to obtaining an optimal shift amount of an assist gas. The machine learning apparatus comprises a state-observation section configured to observe machining condition data included in a machining program given to the laser machine, and measurement data of a dimension of dross generated at a cutting spot of the workpiece when the machining program is executed, as a state variable representing a current state of an environment in which the workpiece is cut; and a learning section configured to learn the shift amount in association with cutting quality of the workpiece, using the state variable.

Abstract: A processing machine for processing a workpiece with a processing beam includes a nozzle changer and a protective enclosure. The nozzle change is for mounting nozzles on or demounting nozzles from a processing head of the processing machine. The nozzle changer has multiple nozzle holders for holding nozzles. The protective enclosure is configured to close off a working space for the processing of the workpiece with the processing beam from a working space surrounding area. The nozzle changer is movable between a nozzle changing position within the protective enclosure and a setup position outside the protective enclosure.

Abstract: A laser machining apparatus that separates a workpiece into a machined product and a remnant material by cutting using irradiation with a laser beam includes: a nozzle that squirts gas at a machining point; a rotation mechanism that causes the nozzle or the workpiece to rotate about an optical axis; and a controller that performs control of the rotation mechanism. This control causes the nozzle, which squirts the gas at the machining point, to be at the machined product side during the cutting.

Abstract: The disclosure relates to inducing compressive stress with shot peen elements in an internal opening of an additively manufactured component. Methods according to the disclosure include: receiving a component made by a metal powder additive manufacturing process, the component including a body having an external surface and an internal opening passing at least partially through the body, the internal opening including an additively manufactured shot peen element detached from a surface of the internal opening, wherein the additively manufactured shot peen element is shaped to induce a residual compressive stress upon contact with the surface of the internal opening; and vibrating the component at a selected frequency, wherein the additively manufactured shot peen element induces the compressive stress against the surface of the internal opening during the vibrating.

Abstract: An optical station for a laser processing device including a plurality of holders for holding respective optical elements; a rotatable magazine having a plurality of accommodation spaces for accommodating the plurality of holders; a positioning device having a holder clamp for clamping and positioning a selected one of the optical elements. a magazine actuator for rotating the magazine; linear shifting means for shifting the magazine in a direction parallel to the optical axis, wherein the magazine is shifted towards the positioning device such that the positioning device lifts the holder from its accommodation space.

Abstract: The machine includes a working head with a focusing device arranged to focus a laser beam on the surface of a tube or profiled section to be worked, a carriage and a scanning system arranged to scan a portion of the outline of the cross-section of the tube or profiled section. The working head and laser scanning module are mounted on the carriage, and the carriage is able to translate with respect to the tube or profiled section in longitudinal and transverse directions such that the working head and laser scanning module translate with the carriage. The scanning system includes at least one laser scanning module including a laser emitter arranged to emit a light blade with which to illuminate a portion of the tube or profiled section and a camera arranged to acquire an image of the portion of tube or profiled section illuminated by the light blade.

Abstract: A machine for additive manufacturing of components by sintering powder includes a framework, a working zone, at least two beam emission and control modules, and at least two actuators. Each module, which is structured to emit an energy beam and to control the energy beam, is mounted inside the framework and is provided with an emission source and an optical system for focusing the energy beam emitted from the source. Each module acts on the working zone to manufacture a same component. Each optical system is axially movable in translation with respect to the framework. The actuators are associated with the optical systems, respectively, and are arranged to adjust axial positions of the optical systems with respect to the working zone, the axial positions being adjustable independently of each other.

Abstract: An optical apparatus includes a rotatable reflecting member including a first reflecting surface and a second reflecting surface, an optical system including a plurality of reflecting surfaces and configured to sequentially reflect light having been reflected at the first reflecting surface at the plurality of reflecting surfaces to make the light incident on the second reflecting surface, a driving part configured to change an angle of the reflecting member, a control unit configured to control the driving part to change a path of light emitted from the reflecting member after being reflected at the second reflecting surface, and a light incident portion configured to recognize a position of the light having been reflected at the first reflecting surface.

Abstract: A robot control device is provided with a display unit for displaying a three-dimensional image of a jog coordinate system and a robot, and an input unit including keys corresponding to coordinate axes of the jog coordinate system. The input unit is formed so that an operator operates an image on the display unit. A display control unit changes the image so that the direction of the jog coordinate system is fixed while the direction of the robot changes in accordance with the operation of the operator in the input unit. When the operator pushes the key, a manual control unit changes the position and orientation of the robot based on the direction of the jog coordinate system with respect to the robot in the image.

Abstract: A robot control device is provided with a display unit for displaying a three-dimensional image of a jog coordinate system and a robot, and an input unit including keys corresponding to coordinate axes of the jog coordinate system. The input unit is formed so that an operator operates an image on the display unit. A display control unit changes the image so that the direction of the jog coordinate system is fixed while the direction of the robot changes in accordance with the operation of the operator in the input unit. When the operator pushes the key, a manual control unit changes the position and orientation of the robot based on the direction of the jog coordinate system with respect to the robot in the image.

Abstract: Embodiments of present disclosure discloses system and method for performing laser marking. Initially, a first image of a region to be laser marked may be captured and compared with a predefined image of a predefined pattern to be laser marked on the region. By the comparison, a first score may be computed. The first score may indicate marking present in the region to be laser marked, in relation to the predefined image. Further, a co-ordinate data of a configuration file, relating to the predefined pattern, in the laser marking system may be modified based on the first score, for performing the laser marking on the region.

Abstract: A cutting apparatus includes a cutting unit configured to cut a workpiece held on a chuck table, and a groove detecting unit including a CCD imaging element photographing the workpiece held on the chuck table. The groove detecting unit photographs, by the CCD imaging element, a laser-processed groove and a cut groove illuminated by an oblique illumination set such that a light amount of light in a direction parallel with an extending direction of the laser-processed groove as viewed in plan is higher than a light amount of light in a direction orthogonal to the extending direction of the laser-processed groove.

Abstract: In molten metal jetting, where droplets of metal are jetted to 3D print a part, each layer may be traversed each successive layer with a normalizing grinding wheel or other leveling device such as a layer to level each successive layer, and/or the melt reservoir or printing chamber may be filled with an anoxic gas mix to prevent oxidation.

Abstract: A scanned optical beam is divided so as to form a set of scanned subbeams. To compensate for scan errors, a portion of at least one subbeam is detected and a scan error estimated based on the detected portion. A beam scanner is controlled according to the estimated error so as to adjust a propagation direction of some or all of the set of scanned subbeams. The scanned subbeams with adjusted propagation directions are received by an f-theta lens and directed to a work piece. In typical examples, the portion of the at least one subbeam that is detected is obtained from the set of scanned subbeams prior to incidence of the scanned subbeams to the f-theta lens.

Abstract: A laser processing method is performed in a laser processing apparatus which outputs a laser beam from a processing head to a workpiece, to perform laser processing while controlling reflected light of the output laser beam to a prescribed value or less. The laser processing method includes the step of, before performing laser processing for the workpiece, increasing laser power stepwise from laser power lower than laser power included in a processing condition of the laser processing, to emit a laser beam from a laser oscillator, and measuring reflected light by a reflected light sensor, and the step of deciding an output condition for decreasing reflected light based on a measured value of the reflected light and the prescribed value, and the step of decreasing reflected light before performing the laser processing by irradiating the workpiece with a laser beam for a predetermined period of time on the decided output condition.

Abstract: An operation of a processing machine with redundant actuators is controlled according to a reference trajectory by selecting, from a set of points forming a segment of the reference trajectory to be processed for a period of time, a subset of points corresponding to a fraction of the period of time. The subset of points is selected such that the redundant actuators are capable to position the worktool at each point in the subset within the period of time and are capable to maintain the worktool at the last point of the subset after the period of time while satisfying constraints on motion of the redundant actuators. The constraints on motion are selected based on the mode of operation of the processing machine. The segment of the reference trajectory is modified in the time domain and the control inputs for controlling the motion of the redundant actuators are determined using the modified segment of the reference trajectory.

Abstract: Provided is an NC program generating device that generates an NC program used in laser machining, using a rapid traverse command that moves a relative position between a machining head and a workpiece at a first movement speed, and a linear interpolation movement command that moves the relative position at a second speed, while causing the relative position to trace the workpiece, the device comprising: a movement time calculation unit that calculates a first movement time of the relative position when using the rapid traverse command and a second movement time of the relative position when using the linear interpolation command, a movement method selection unit that selects the movement command corresponding to the shorter time of the first movement time and the second movement time, and an NC program generating unit that generates an NC program by setting the selected movement command between the machining points.

Abstract: A robot includes: a first arm that has a first light guide path, a second arm that has a second light guide path, a joint portion that has a rotation axis and connects the first arm and the second arm to each other so as to be rotatable about the rotation axis and a light rotary joint that is provided between the first light guide path and the second light guide path inside the joint portion and that optically connects the first light guide path and the second light guide path to each other. In addition, the light rotary joint has a first light guide portion which is fixed to the first light guide path and has a tubular shape about the rotation axis and an end portion of the second light guide path on the light rotary joint side faces the first light guide portion.

Abstract: The subject matter described herein provides techniques to ensure that queries of a distributed database observe a consistent read of the database without locking or logging. In this regard, next-write timestamps uniquely identify a set of write transactions whose updates can be observed by reads. By publishing the next-write timestamps from within an extendable time lease and tracking a “safe timestamp,” the database queries can be executed without logging read operations or blocking future write transactions, and clients issuing the queries at the “safe timestamp” observe a consistent view of the database as it exists on or before that timestamp. Aspects of this disclosure also provide for extensions, done cheaply and without the need for logging, to the range of timestamps at which read transactions can be executed.

Abstract: A laser welding machine includes: an elevator that is capable of sliding an elevating platform; a pressing actuator that is fixed to the elevating platform at a base part of the pressing actuator and has a tip slidably connected to the base part and pressing a conductive upper terminal toward a conductive lower terminal; a laser oscillator; a machining optical device that is fixed to the elevating platform and has a lens to focus the laser light emitted from the laser oscillator; a position detector that detects a vertical positioning of the pressing actuator; a counter that receives an output of the position detector and delivers position information; and a control circuit that controls, based on the received signal from the counter, the elevator, the pressing actuator, and the machining optical device, and controls operation of the laser oscillator.

Abstract: A method calibrates a laser processing machine by commanding a scan head to direct a laser beam to a desired position, then senses an actual position of the laser beam directly using a position sensitive detector (PSD) after the scan head is positioned. A relative position between the scan head and PSD is altered using one or more linear actuators. A position feedback loop is closed around the linear actuators so that the relative position of the laser beam on the PSD is reduced to zero. The actual position of the laser spot is then measured indirectly by encoders attached to linear axes of the laser processing machine. The actual position is stored in a memory. An error is determined as a difference between the desired position and the actual position. Compensation coefficients are determined from the error and stored for later use during operation of the laser processing machine.

Abstract: An apparatus and methods are provided for removing unwanted plants or weeds from an area such as an agricultural plot or lawn. The apparatus includes a three-dimensional imager configured to capture plant images and locate plants; an image processor configured to distinguish between wanted and unwanted plants based upon the captured plant images; at least one removal device configured to damage a target on the unwanted plants; a guidance system configured to direct at least one laser beam toward the unwanted plant; a stabilization system configured to provide feedback compensation to one or both of the three-dimensional imager and the guidance system; and a chassis configured to support the three-dimensional imager, the laser device, the guidance system, and the stabilization system. The chassis is configured to be moved across the area.

Abstract: A device and a method for machining workpieces (5, 6) by means of a laser beam. Said device has a delivery means (3) for delivering the workpieces (5,6) to a first machining position (8.1) and a machining means (2) which has at least one machining head (2.1) for machining of a workpiece (5,6) delivered to the first machining position (8.1). The delivery means (3) is a gripping robot with a gripping device (3.2). At least one clamping means (9,10) is disposed in order to accommodate a workpiece (5,6) delivered by the delivery means (3), wherein respective machining position is defined by each clamping means (9,10). The machining head (2.1) can be delivered to each machining position for machining of the workpieces (5,6).

Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

Abstract: An additive manufacturing apparatus comprises a processing chamber (100) defining a window (110) for receiving a laser beam and an optical module (10) The optical module is removably-mountable to the processing chamber for delivering the laser beam through the window. The optical module contains optical components for focusing and steering the laser beam and a controlled atmosphere can be maintained within the module.

Abstract: An apparatus that can change an irradiating direction of the beam and a method of recognizing an irradiation-enabled area with respect to a processing course for a work piece. The method establishes an irradiation-enabled area at a focal length that corresponds to one point along the processing course, even when the beam irradiating device is moved away from the one point along the processing course of the work piece. The method further recognizes the irradiation-enabled area with respect to the one point along the processing course.

Abstract: According to an example embodiment, a machine includes, among other things, a housing and a support situated for supporting a work piece in a selected position relative to the housing. A radiation source is situated for emitting a beam of radiation in the housing. A magnetic field generator is situated for generating a magnetic field in the housing near the support. The magnetic field has a selectively variable strength at a plurality of locations in the housing for selectively steering the beam of radiation toward the support.

Abstract: A laser material processing system which includes a pulsed fiber laser source having a continuous wavelength bandwidth of larger than 100 nm and pulse width of from 100 femtosecond to 1 microsecond, a broad band laser emitted from one core of an optical fiber, where the broad band laser is applied to a subject material to produce removal of the subject material and/or color change of the subject material.

Abstract: Methods of circumscribing defects in optical devices are described. A perimeter is formed about a defect by laser ablation, where the perimeter electrically isolates the defect. The perimeter does not have damage due to excess energy from the laser and thus does not create new electrical shorts.

Abstract: A thermal cutter for cutting with heat a board mounted upon a table having an internal space includes a plurality of walls and a sound absorbent material. The walls are disposed in the internal space of the table to partition a plurality of exhaust chambers with each of the exhaust chambers having an aperture that opens towards a side on which the board is mounted. The sound absorbent material is provided to at least a portion of at least one of the walls, the sound absorbent material being removably coupled to the table.

Abstract: Provided is a laser cutting device and method which changes a cutting speed of a laser according to a difference between characteristics (absorption coefficients) of an object to be cut, so as to uniformly supply an energy of laser to the whole of the object, thereby preventing the object from being incompletely cut. A laser cutting device includes a database that stores information about a cutting pattern, a moving part that changes a location of a laser beam emitted to an object to be cut, a characteristic value input part that receives speed information from a user according to locations on the cutting pattern, and a control part that adjusts a moving speed of the laser beam by controlling the moving part according to the speed information from the characteristic value input part, and the information about the cutting pattern from the data base.

Abstract: The subject of the invention is a process for obtaining a substrate provided on at least one portion of at least one of its sides with a coating, comprising a step of depositing said coating on said substrate, then a step of heat treatment of said coating using a pulsed or continuous laser radiation focused on said coating in the form of at least one laser line, the wavelength of which is within a range extending from 400 to 1500 nm, said heat treatment being such that a relative displacement movement is created between the substrate and the or each laser line, the speed of which is at least 3 meters per minute, the or each laser line having a beam quality factor (BPP) of at most 3 mm·mrad and, measured at the place where the or each laser line is focused on said coating, a linear power density divided by the square root of the duty cycle of at least 200 W/cm, a length of at least 20 mm and a width distribution along the or each line such that the mean width is at least 30 micrometers and the difference betwe

Abstract: An apparatus for laser materials processing including a laser (4) for generating a laser beam and a laser head (5) which is movable along at least one spatial direction and is connected to the laser via a light guide, and which emits a laser beam (7) capable of processing a material. The present invention also relates to an apparatus for selective laser melting or selective laser sintering having an apparatus for laser materials processing.

Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

Abstract: This robot system includes a robot, a laser emitting portion moved by the robot, capable of scanning a welding locus with a laser beam at least in a state where the laser emitting portion is not moving, and a control portion controlling the laser emitting portion to scan the welding locus with the laser beam in order to perform welding with weaving on the welding locus at least in the state where the laser emitting portion is not moving.

Abstract: A welding equipment that forms an end part includes a vacuum chamber; a holding member that is installed in the vacuum chamber and that holds the end part in which a welding groove is formed by placing a half cell, an end plate, and a beam pipe next to each other; a window that is installed in a top-end surface portion of the vacuum chamber, which intersects with an axial center of the end part, and that forms a portion thereof; a laser radiating head that is installed outside the vacuum chamber and that radiates a laser beam into an internal space of the end part through the window; and a mirror member that is installed in the internal space of the end part and that adjusts a reflected laser beam, formed by reflecting the laser beam, so as to be oriented perpendicular to the welding groove.

Abstract: In the thermal cutting of a workpiece by means of a laser beam, said beam is generated by means of a laser source and supplied to a movable laser head. In the laser head, an optical deflection element is provided for deflecting the laser beam such that, when viewed in working direction, it encloses a tilt angle (?) differing from 0 degrees with the longitudinal axis of the laser head. Starting therefrom, to produce the inclination of the collimated laser beam to the vertical with a very small number of optical components if possible, the invention suggests that the laser beam is supplied to the laser head by means of an optical fiber and the laser beam is collimated, passes through the deflection element laterally offset to the longitudinal axis of the laser head and is deflected by means of said element onto the workpiece surface and focused at the same time.

Abstract: Laser crystallization equipment includes a laser generator generating a laser beam, the laser beam being directed toward a processing target substrate, and a blade member over the processing target substrate, the blade member being configured to chop the laser beam with a predetermined width in two directions, wherein two ends of the laser beam chopped by the blade member are irradiated to the processing target substrate as diffraction light.

Abstract: A laser annealing apparatus includes: a laser beam generator for providing a stable single-pulse laser; a cyclic delay unit (300) for splitting the single-pulse laser into several pulsed lasers; an optical module for converging one or more of the pulsed lasers on a substrate (204); and a movable stage (500) for providing the substrate (204) with movement in at least one degree of freedom. A laser annealing method includes: providing a stable single-pulse laser; splitting the single-pulse laser into several pulsed lasers according to a delay requirement and an energy ratio; and irradiating a substrate (204) successively with one or more of the pulsed lasers to keep a surface temperature of the wafer around the melting point or around a needed annealing temperature for a sufficiently long time during the annealing process, thus resulting in an improvement in both the laser energy utilization efficiency and effect of the annealing process.

Abstract: A laser machining apparatus is provided with: a workpiece support unit; a machining head; and a machining head moving unit. The workpiece support unit includes: an end support part that supports a width end of a workpiece; and an inside support part that supports an inside portion of the workpiece in a width direction. The end support part is movable in a longitudinal direction independently from the inside support part in response to a movement of the machining head.

Abstract: A machine for machining workpieces by a laser beam. The optical fiber terminates at an optical output head (27) that defines the optical axis of the laser light beam, which vaporizes the material. The optical output head (27) is rigidly attached to the frame (49) or to the casing of the laser head so that said optical output head remains integrally fastened to said frame or casing during the rotation of the laser head about the horizontal pivot axis (B). The polluted gases generated in the machining area by the evaporation of material are collected by a suction nozzle (37) which is driven with the laser machining head during its rotation about the horizontal axis (B). A stream of clean dry gas is injected into the machining area by an injection nozzle (35) which is also driven with the laser machining head (8) during its rotation about the horizontal axis (B).

Abstract: A pulsed laser beam is applied to a workpiece held on a chuck table by a laser beam applying unit. The laser beam applying unit includes a pulsed laser beam oscillator, a focusing lens, and a piezoelectric motor for displacing the focusing unit in a direction inclined at a predetermined angle (?) with respect to the Z direction. A controller controls the frequency and voltage of an RF current to be applied to the piezoelectric motor in relation to the repetition frequency of the pulsed laser beam to move the focusing unit in the X direction by ?x and in the Z direction by ?z in feeding the chuck table in the X direction, thereby displacing the focal point of the pulsed laser beam to be focused by the focusing lens in the thickness direction of the workpiece held on the chuck table.