Abstract: A laser-based workpiece processing system includes sensors connected to a sensor controller that converts sensor signals into focused spot motion commands for actuating a beam steering device, such as a two-axis steering mirror. The sensors may include a beam position sensor for correcting errors detected in the optical path, such as thermally-induced beam wandering in response to laser or acousto-optic modulator pointing stability, or optical mount dynamics.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A mechanical apparatus maintains and/or cleans support strips of a workpiece support that forms a support plane for supporting workpieces. The mechanical apparatus includes a transport device for moving the workpiece support along a transport axis X and a service device that has a tool for processing the support strips. The service device is movable by means of a mechanical movement unit along a movement axis Y that is arranged at an angle relative to the transport axis X and/or along a movement axis Z that is arranged at an angle relative to the transport axis X and that is different from the movement axis Y, with the movement of the workpiece support along the transport axis X and the movement of the service device along the movement axis Y and/or along the movement axis Z being controllable in a coordinated manner by means of a control unit.

Abstract: Methods used to perform an annealing process on desired regions of a substrate are disclosed. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially melt certain desired regions of the substrate to remove unwanted damage created from prior processing steps (e.g., crystal damage from implant processes), more evenly distribute dopants in various regions of the substrate, and/or activate various regions of the substrate. The preferential melting processes will allow more uniform distribution of the dopants in the melted region, due to the increased diffusion rate and solubility of the dopant atoms in the molten region of the substrate. The creation of a melted region thus allows: 1) the dopant atoms to redistribute more uniformly, 2) defects created in prior processing steps to be removed, and 3) regions that have hyper-abrupt dopant concentrations to be formed.

Abstract: A method for manufacturing a solar cell module includes forming a first electrode on a first surface of a substrate; forming a semiconductor layer on the first electrode; forming a second electrode on the semiconductor layer; inverting the substrate with the first electrode, semiconductor layer and second electrode formed thereon, and then, positioning the inverted substrate on a plurality of supports; patterning the second electrode and the semiconductor layer while the inverted substrate is on the supports by irradiating a laser on a second surface of the substrate to form a plurality of solar cells, wherein the second surface of the substrate is opposite the first surface of the substrate; identifying defective solar cells by using the supports; and repairing the defective solar cells by using the supports.

Abstract: The invention relates to a laser treatment apparatus including a laser oscillator, an interlock provided in the laser oscillator, a movable table which moves with a certain movement period, a timer, an interlock provided in the timer, a sensor which can detect movement of the movable table, and a computer, in which the timer starts measuring time when the sensor senses passage of the movable table, and when the movable table does not pass the sensor even after the movement period, conduction between contacts of the interlock provided in the timer is blocked to operate the interlock in the laser oscillator, thereby stopping laser output. The invention also relates to a laser treatment method using the laser treatment apparatus.

Abstract: The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Abstract: Workpiece rests are disclosed, for holding workpieces in machining systems which machine the workpieces using a cutting beam, e.g., a laser beam. A workpiece rest includes a frame, a plurality of rest elements which are arranged adjacent to one another in the frame so as to support the workpiece, and a supporting element attached to at least one of the rest elements.

Abstract: A monitoring device by laser shadowscopy, which comprises a light emitter (5) and receiver (6), mounted on an arm (8) oscillating at will around two joints (13, 14), in order to restore the image of the monitored profile more accurately. An important application relates to welding methods and especially in hollow beveled edges.

Abstract: A CATV filter assembled inside a housing has the housing marked by a laser system with indicia relating to specific characteristics of the filter. The housing is thus not mechanically deformed during the step of marking, resulting in unchanged RF characteristics of the filter as a result of the marking.

Abstract: Glass substrate cutting apparatuses using lasers are disclosed, where a laser cutting head is moved. A glass substrate cutting apparatus includes two parts for a laser cutting head: heavy laser beam generators fixed to respective ends of a gantry structure moving in parallel along two gantry stages located on either side of a cutting table, and relatively lightweight laser irradiation heads moving horizontally in parallel with the gantry structure. The glass substrate cutting apparatus includes a cutting table for maintaining a glass substrate in a horizontal state; biaxial gantry stages for moving a gantry structure along the cutting table; the gantry structure moving in between an upper part of the biaxial gantry stages; laser beam generators fixed to respective ends of the gantry structure for oscillating the laser; and laser irradiation heads that move horizontally on respective ends of the gantry structure and irradiate the laser upon the glass substrate.

Abstract: A technique to control segregation of impurities when reforming crystallinity and crystallization of a semiconductor film by using a laser beam irradiation is provided. The present invention is to irradiate the substrate with applying ultrasonic vibration while keeping the end portion of the substrate in space. The substrate on which a semiconductor film is formed is kept onto the stage provided with opening pores, and floated by spouting gas from opening pores. Supersonic vibration can be efficiently provided to the substrate by irradiating with a laser beam with ultrasonic vibration while keeping the end portion of the substrate.

Abstract: An apparatus for machining tubing includes a weighted base, an upright frame attached to the weighted base, and a laser light source attached to the weighted base. The apparatus also includes a guide bushing tooling attached to the upright frame which holds a guide bushing. A rotary drive bushing is aligned with the guide bushing holder. An optical assembly for focusing the laser light to a laser beam spot is also attached to the guide bushing tooling block. Spacer plates may be used to correctly space the optical assembly from the tubing material.

Abstract: There is provided a three-dimensional laser beam machining apparatus for a long workpiece, which includes an automatic loading device for a large variety of materials that feeds materials to a three-dimensional laser beam machine. The automatic loading device 100 for a large variety of materials has a bundle type material loading device 120. A bundle type material W1 is a round pipe or a polygonal pipe, and the posture thereof around the axis line is aligned automatically when the material is conveyed by a roller conveyor 140. The front material stopped by a stopper 150 is sent out to an inclined conveyor 180 over the stopper 150 by means of a swing arm 170. The bundle type material as well as a versatile type material, the posture of which around the axis line is not aligned automatically, are set on a receiving member 210 of a common conveyor 200 and sent to the three-dimensional laser beam machine by the operator.

Abstract: A method for joining dissimilar materials of sensor button for measuring torque is illustrated. The dissimilar materials can be welded together by laser welding. The parts can be cleaned and held together firmly by a fixture and welded with established machine parameters. The method of micro-crack free weld joint can give a robust joint for the life time of the automotive which mandate for the function of torque sensor to facilitate the positive strain transfer from the parent material.

Abstract: Continuous wave laser apparatus with enhanced processing efficiency is provided as well as a method of manufacturing a semiconductor device using the laser apparatus. The laser apparatus has: a laser oscillator; a unit for rotating a process object; a unit for moving the center of the rotation along a straight line; and an optical system for processing laser light that is outputted from the laser oscillator to irradiate with the laser light a certain region within the moving range of the process object. The laser apparatus is characterized in that the certain region is on a line extended from the straight line and that the position at which the certain region overlaps the process object is moved by rotating the process object while moving the center of the rotation along the straight line.

Abstract: A laser welding apparatus and method for easily adjusting a laser focusing position according to a distance from a laser irradiating device to a laser irradiating point on a work piece, or a welding point. A post-collimation laser diameter is measured when the laser emitting end has an optimal laser diameter on the work piece with respect to the distance from the laser processing head to the work piece. Corresponding data is stored with the above distance and the post-collimation laser diameter corresponding to each other. During welding, a diameter of the laser beam passing through a collimate lens is measured by a laser diameter measuring device. The post-collimation laser diameter is adjusted to be an optimal value according to the corresponding data.

Abstract: A mechanical arrangement for processing pipes by cutting using a cutting beam has a cutting head, a pipe holder, a catching lance and a stripper. The stripper is transferable relative to a processing axis of the cutting head in the longitudinal direction of the pipe to various positions by means of a positioning movement.

Abstract: Embodiments of the present invention provide apparatus and method for reducing noises in temperature measurement during thermal processing. One embodiment of the present invention provides a chamber for processing a substrate comprising a chamber enclosure defining a processing volume, an energy source configured to direct radiant energy toward the processing volume, a spectral device configured to treat the radiant energy directed from the energy source towards the processing volume, a substrate support disposed in the processing volume and configured to support the substrate during processing, and a sensor assembly configured to measure temperature of the substrate being processed by sensing radiation from the substrate within a selected spectrum.

Abstract: An X & Y orthogonal cut apparatus for scribing a pair of parallel cuts on a planar workpiece, the workpiece plane having an X-axis and a Y-axis, where the apparatus includes a laser device generating at least two beams including a first beam and a second beam, the first beam and the second beam each having an impact point on the workpiece, the first and second impact points being positioned diagonally with respect to the X and Y axes of the workpiece, and at least one actuator to move at least one of the impact points relative to the workpiece and the workpiece relative to the impact points.

Abstract: A machining apparatus in which the machining efficiency can be improved even if characters are machined in a printed circuit board. A coordinate transformation unit is provided for transforming central coordinates of each dot d of each character of a character string into coordinates in a machining coordinate system with which the holes will be machined. Prior to machining, based on a character string and position information of the character string described in a machining program, central coordinates of each dot of each character of the character string are transformed into coordinates in the machining coordinate system with which the holes will be machined. Each dot d is regarded as a hole and machined. The number of times of movement of a table can be thus minimized so that the machining efficiency can be improved.

Abstract: A method and apparatus for forming a visible symbol or other indicium on a tab portion of a beverage container. The method comprises the steps of advancing a tab stock material through a series of tab-forming stations. The tab portion is at least partially formed from the tab stock at each of the tab-forming stations. The advancement of the tab stock is dwelled or halted while the tab is formed. The tab stock is accelerated from dwell to resume advancement of the tab stock material between the stations. A selected portion of the tab is irradiated with light energy to form the visible indicium. The apparatus comprises a plurality of tab-forming stations, each tab-forming station at least partially forming the tab from a tab stock. A conveyor or track mechanism is configured to advance the tab stock from one tab-forming station to another. An etching apparatus is associated with the conveyor and tab-forming stations to selectively etch the symbol on the tab.

Abstract: There is provided a laser machining apparatus for sheet-like workpieces that allows an installation area to be reduced and that may be readily controlled. The laser machining apparatus includes a Y-table movable in X- and Y-plane directions orthogonal to a laser beam irradiated from an f? lens, a supply reel for holding a supply-side roll which contains a sheet-like workpiece, and a take-up reel for holding a take-up side roll containing a finished sheet-like workpiece. Machining is carried out by fixing the sheet-like workpiece in the machining area on the movable table and by irradiating the laser beam while moving the movable table relative to the laser beam. At least one of the supply reel and the take-up reel is disposed on the movable table.

Abstract: The invention relates to a machine tool for processing a plate-like workpiece, including a processing tool. The processing tool is movable relative to the workpiece and the workpiece is movable relative to the processing tool along a common movement axis. A control unit selectively actuates the processing tool and the workpiece in such a manner that in a first processing mode both the processing tool and the workpiece are moved along the common movement axis and, in a second processing mode the processing tool alone is moved along the common movement axis. The invention further relates to a method for processing a workpiece of the kind mentioned above, to a method for creating a processing program, and to a computer program product having code for performing all steps of the method for creating the processing program.

Abstract: A manipulator for use in e.g. a Transmission Electron Microscope (TEM) is described, said manipulator capable of rotating and translating a sample holder (4). The manipulator clasps the round sample holder between two members (3A, 3B), said members mounted on actuators (2A, 2B). Moving the actuators in the same direction results in a translation of the sample holder, while moving the actuators in opposite directions results in a rotation of the sample holder.

Abstract: An apparatus processes a surface of an inhabitable structure. The apparatus includes a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure. The base unit includes an energy wave generator and a head coupled to the energy wave generator. The head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes a manipulation system which includes an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the head. The manipulation system is adapted to controllably adjust the position of the head relative to the structure. The apparatus further includes a controller electrically coupled to the base unit. The controller is adapted to transmit control signals to the base unit in response to user input.

Abstract: An object of the present invention is to provide a method and a device for constantly setting the energy distribution of a laser beam on an irradiating face, and uniformly irradiating the laser beam to the entire irradiating face. Further, another object of the present invention is to provide a manufacturing method of a semiconductor device including this laser irradiating method in a process. Therefore, the present invention is characterized in that the shapes of plural laser beams on the irradiating face are formed by an optical system in an elliptical shape or a rectangular shape, and the plural laser beams are irradiated while the irradiating face is moved in a first direction, and the plural laser beams are irradiated while the irradiating face is moved in a second direction and is moved in a direction reverse to the first direction.

Abstract: The invention provides a method of making a component from first and second parts which are joined in a welding process wherein a laser beam is transmitted in a direction from a laser source and at least partly into a gap. The gap is made between edges of the component, and to enable a faster laser welding process, the laser has a focus point size which is at least of the size of the gap. To enable better control of the width of the gap, the invention further provides a method and components wherein one part is formed with a neck which extends into a complementary socket of the other part to prepare the parts for the welding process. The invention in particular concerns welding of brass.

Abstract: A beam-catching device is provided for a cutting-beam processing machine configured to deliver a cutting beam to a workpiece. The beam-catching device includes a housing which has a line-like opening pointing toward the cutting beam, the cutting beam discharging from the underside of the workpiece during processing of the workpiece and entering the housing through the opening, and a solid medium disposed within the housing and configured to move relative to the opening of the housing in a direction crossing the cutting beam in order to absorb energy.

Abstract: A donor substrate for a laser induced thermal imaging method and an organic light emitting display manufactured using the same are provided. A laser induced thermal imaging apparatus includes a stage grounded by a grounding means, and a method of fabricating an organic light emitting display is capable of controlling static electricity which may be built up while an organic layer is formed using the apparatus.

Abstract: A method and an apparatus for processing workpieces with a laser beam include first and second stages for holding the workpieces and first and second laser beam paths. The first workpiece is loaded upon the first stage, aligned with the first laser beam path, and processing begun. While the first workpiece is aligned in relation to the first laser beam path, the second workpiece is prepared in relation to the second laser beam path. Processing of the second workpiece is begun as soon as the laser beam is available for processing.

Abstract: An automatic leveling fixture includes a base, at least one jaw slidably connected to the base, a base plate slidable relative to the base. The at least one jaw has a base plate camming surface engaging the base plate and causing the at least one jaw to move a preselected distance relative to a distance moved by the base plate.

Abstract: Embodiments of the present invention are directed to methods and systems for micromachining a conical surface. In one embodiment, such a system may include a rotating platform for receiving a long line of laser illumination, a mask having a predetermined pattern comprising a sector of a planar ring, the mask being positioned on the rotating platform, a workpiece stage having a rotational axis for rotating a removably-affixed workpiece comprising a conical surface, wherein the sector comprises the planar image of the conical surface, an excimer laser for producing a laser beam, a homogenizer for homogenizing the laser beam in at least a single direction, at least one condenser lens, a turning mirror and at least one projection lens.

Abstract: A system (20) adapted for securing a hollow workpiece (22) in a fixed position, for cutting at least one portion of the workpiece (22) to produce a free body scrap (24), and for collecting and conveying the scrap (24) to a predetermined destination away from the interior space defined by the workpiece (22), wherein said system (20) includes a cutting device (26), a base plate (36), and at least one clamp (30), a collecting and conveying conduit (32) having a tube (42), ejector (44), and biasing mechanism (48) for biasing the tube (42) towards a first inlet position, and a bin (34) for receiving the scrap (24), and more preferably also includes an air pressure device (38) for directing the scrap (24) towards the conduit (32).

Abstract: A manipulator for use in e.g. a Transmission Electron Microscope (TEM) is described, said manipulator capable of rotating and translating a sample holder (4). The manipulator clasps the round sample holder between two members (3A, 3B), said members mounted on actuators (2A, 2B). Moving the actuators in the same direction results in a translation of the sample holder, while moving the actuators in opposite directions results in a rotation of the sample holder.

Abstract: A device and a method for producing nozzle-type openings in spray arms for dishwasher machines, which enables the form of the nozzle-type openings in spray arms to alter rapidly even if only one spray arm is provided and enable different nozzle geometries to be created during the production process in the event of different spray arms.

Abstract: The invention relates to the general field of cutting machines using a laser beam; it relates more particularly to a system of slats for a laser-cutting machine table. These slats (8) each consist of a trough (9) containing a plurality of juxtaposed inserts (10) arranged parallel or substantially parallel to one another, each insert (10) taking the form of a folded thin sheet-metal plate comprising at least two parts connected along a fold line, a first part arranged substantially parallel to the direction of incidence of the laser beam and constituting a support strip whose free upper edge forms a support element for the product (4) to be cut, and a second part which is inclined with respect to the direction of incidence of the laser beam and constitutes an oblique strip for deflecting the laser beam (3).

Abstract: A method of producing a diaphragm damper 1 having a high pressure chamber 3 comprised of two diaphragms 2 with flanges 6 welded together and charged inside with a high pressure gas. The diaphragms 2 are made of magnetically attractable thin metal sheets. A pair of jigs 30, 40 provided to face each other inside the pressure vessel 20 hold the diaphragms 2 by magnetic force. The pressure vessel 20 is sealed and evacuated, then the pressure vessel 20 is charged and pressurized by a mixed gas including helium. After this, the pair of jigs 30, 40 are made to approach each other to make the flanges 6 of the pair of diaphragms 2 come into close contact. Inside the pressure vessel 20, the jigs 30, 40 are simultaneously rotated to rotate the pair of diaphragms 2 and a laser beam is fired at the flanges 6 of the diaphragms 2 to weld the flanges 6 over their entire circumferences.

Abstract: The invention provides a substrate treatment method and apparatus. Embodiments show a substrate in the form of a rotary encoder ring having a pattern of marks producable by means of a laser treatment device controllable to produce the pattern in the correct manner whilst there is continuous relative displacement between the ring and the laser treatment device.

Abstract: A foreign substance removing apparatus includes a mounting table for mounting and rotating a substrate; and a laser beam irradiation unit for removing foreign substances attached to a surface of the substrate by irradiating foreign substance cleaning laser beam onto the substrate mounted and rotated on the mounting table. In the foreign substance removing apparatus, the laser beam irradiation unit irradiates laser beam having an elongate shaped irradiation cross section onto the surface of the substrate.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A novel silicon crystallization apparatus and a silicon crystallization method renders it is possible to form alignment key without additional photolithography, and to adjust a substrate to a correct position by sensing a deviation of the substrate when the substrate is loaded. The silicon crystallization apparatus includes a moving stage being moved in a horizontal direction, and a fixing plate provided in the moving stage, to fix a substrate. A rotating frame is provided in the moving stage, to rotate the fixing plate.

Abstract: A method of forming embrittled areas in multiple layers inside a wafer so as to enable the wafer to be divided correctly even at areas where embrittled areas intersect. In a first direction embrittling step an embrittled area is formed as a bottom layer, in a second direction embrittling step embrittled areas are formed as a bottom layer and a second layer, in the first direction embrittling step the embrittled areas are formed as a second layer and a third layer, and thereafter, the second direction embrittling step and the first direction embrittling step are alternately implemented, and finally, in the second direction embrittling step, embrittled area is formed as a top layer, so that a length of an unprocessed area is contained within a range that does not interfere with division.

Abstract: A spinning-type pattern-fabrication system comprises at least one carry table used to carry objects, an object-fixing device used to fix the objects onto the carry table, and a control system controlling carry table or at least one laser device. The control system controls the laser device to move linearly back and forth to enable the laser device to fabricate patterns on the objects with the laser beam emitted via the laser device.

Abstract: There is provided a method and a device capable of holding a sheet-like workpiece without wrinkles. The sheet-like workpiece holding method includes mounting the sheet-like workpiece such that almost no tensile force is applied thereon on a machining table, and pressing out wrinkles of the sheet-like workpiece by lowering a pressing member whose surface facing to the workpiece protrudes in the shape of a convex lens toward the workpiece so that the workpiece is pressed against the machining table. The method also includes retaining the sheet-like workpiece on the machining table using suction while continuously pressing the sheet-like workpiece with the pressing member and releasing the pressing force of the pressing member while retaining the sheet-like workpiece.

Abstract: A sequential lateral solidification device and a method of crystallizing silicon using the same controls a size and arrangement overlapping areas of laser beam patterns adjacently irradiated onto a substrate to within specific regions of a pixel area and a driving area outside the pixel area. The device includes a laser generating device irradiating a laser beam, a focusing lens focusing the laser beam, a mask having a pattern of transparent regions permitting the laser beam to be transmitted a laser beam pattern, a reduction lens reducing the laser beam pattern transmitted by the mask, a substrate having a pixel area and a driving area exposed to the irradiated laser beam pattern, a moveable stage having, on which the substrate is mounted, and a position sensor sensing an position of the irradiated laser beam pattern and controlling a size and arrangement overlapping areas between adjacently irradiated laser beam patterns.

Abstract: Methods and systems process a semiconductor substrate having a plurality of structures to be selectively irradiated with multiple laser beams. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects a first target location on or within the semiconductor substrate. The method also generates a second laser beam that propagates along a second laser beam axis that intersects a second target location on or within the semiconductor substrate. The second target location is offset from the first target location in a direction perpendicular to the lengthwise direction of the rows by some amount such that, when the first target location is a structure on a first row of structures, the second target location is a structure or between two adjacent structures on a second row distinct from the first row.

Abstract: Methods and systems use laser pulses to process a selected structure on or within a semiconductor substrate. The structure has a surface, a width, and a length. The laser pulses propagate along axes that move along a scan beam path relative to the substrate as the laser pulses process the selected structure. The method simultaneously generates on the selected structure first and second laser beam pulses that propagate along respective first and second laser beam axes intersecting the selected structure at distinct first and second locations. The first and second laser beam pulses impinge on the surface of the selected structure respective first and second beam spots. Each beam spot encompasses at least the width of the selected link. The first and second beam spots are spatially offset from one another along the length of the selected structure to define an overlapping region covered by both the first and the second beam spots and a total region covered by one or both of the first and second beam spots.

Abstract: An apparatus for cutting a substrate includes a laser oscillator generating a femtosecond laser beam, a first beam splitter splitting the femtosecond laser beam into first and second femtosecond laser beams, a first condenser lens receiving the first femtosecond laser beam and condensing the first femtosecond laser beam to have a first focal depth, a second condenser lens receiving the second femtosecond laser beam, and condensing the second femtosecond laser beam to have a second focal depth different from the first focal depth, and a second beam splitter receiving and splitting the first femtosecond laser beam condensed through the first condenser lens and the second femtosecond laser beam condensed through the second condenser lens, and irradiating the split first and second femtosecond laser beams at different positions on a substrate to be cut.

Abstract: A method and apparatus (1) for machining a semiconductor or ceramic workpiece (32) causes a portion of the workpiece to undergo high pressure phase transformation to form a high pressure phase transformation portion which has altered optical properties from the remainder of the workpiece. A laser is irradiated on the high pressure transformation portion to heat the high pressure transformation portion and cause it to soften and then the workpiece is plastically deformed, at smaller loads and forces, along the softened portion in order to accomplish the machining of the workpiece with a machining tool (21).