Abstract: A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of the transparent conductive film. The debris extraction module is disposed close to the substrate, and debris before deposition and after deposition on the substrate, which is generated by laser irradiation, is entrapped into the vortex flow to be extracted to the outside with the gas.

Abstract: A field-installable connector includes a connector housing and a ferrule having front and rear opposed faces and at least one fiber bore defined longitudinally therethrough. A laser processed stub optical fiber is disposed within the one fiber bore of the ferrule and extends a predetermined distance beyond the rear face of the ferrule. An alignment feature is operable for self-centering the stub optical fiber and a field optical fiber to perform a mechanical splice using a camming means. A method of laser processing a stub optical fiber includes rotating the stub optical fiber and sweeping a laser beam directed at a desired angle back and forth across a surface of the optical fiber. An oscillating motion of the laser is driven by an intermittent sinusoidal signal that results in two deposits of energy onto the stub optical fiber followed by a cooling period before subsequent deposits of energy occur.

Abstract: A workpiece positioner includes a workpiece holder that is mounted to a chassis for rotation about a central axis, and further includes a first set of workpiece supports for retaining and supporting a first workpiece between a drive end and an idler end, and a second set of workpiece supports for retaining and supporting a second workpiece between the drive end and the idler end. The workpiece positioner also includes a support member that links the drive end to the idler end. This support member has a cross-sectional shape that is best characterized as an I-beam, and as such, the work envelopes for the first and second working pieces are very close together, but at the same time, still separated such that welding or other similar manufacturing and/or processing operations can be performed on each workpiece without any interference or effect on the other workpiece.

Abstract: A machine tool installation for laser cutting of sheet metal workpieces includes a workpiece support having a multiplicity of parallel spaced grid elements providing the upper surface thereof, and a machine frame having a generally vertical rear wall and an arm extending therefrom over the workpiece support, and upon which is supported a laser cutting unit with a laser cutting head, said grid elements of said workpiece support extending perpendicularly to said vertical wall of said machine frame. An unloading unit is provided to lift the cut parts from the workpiece support and transport them to a discharge station. In the unit a frame movably supports a pair of opposed fork assemblies which move between open and closed positions. These fork assemblies are spaced apart in the open position and have their opposed ends in adjacent relationship in the closed position, and they are movable vertically to enable the forks to be moved between the grid elements to pick up the parts.

Abstract: Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, GaAs, indium phosphide, or single crystalline sapphire, using ultraviolet laser ablation. These patterns include very high aspect ratio cylindrical through-hole openings for integrated circuit connections; singulation of processed die contained on semiconductor wafers; and microtab cutting to separate microcircuit workpieces from a parent semiconductor wafer. Laser output pulses (32) from a diode-pumped, Q-switched frequency-tripled Nd:YAG, Nd:YVO4, or Nd:YLF is directed to the workpiece (12) with high speed precision using a compound beam positioner. The optical system produces a Gaussian spot size, or top hat beam profile, of about 10 microns. The pulse energy used for high-speed ablative processing of semiconductors using this focused spot size is greater than 200 ?J per pulse at pulse repetition frequencies greater than 5 kHz and preferably above 15 kHz.

Abstract: A machine tool installation for laser cutting of sheet workpieces has a workpiece support, an elongated machine frame of generally C-shaped configuration providing an arm extending over the workpiece support, a pair of tracks on the arm and extending longitudinally of the frame. A motion unit is suspended from the tracks and mounted for movement therealong with one end located adjacent the outer side of the workpiece support. The motion unit is movable bidirectionally along the track, and a laser cutting unit is mounted on the motion unit and includes a laser cutting head movable thereon in an axis perpendicular to the arm. The laser cutting unit is moved along the motion unit and is movable to the one end of the motion unit on the outer side of the workpiece support for facile servicing thereof by an operator.

Abstract: There is provided a laser machining apparatus, and a laser machining method using the same. The laser machining apparatus has a body portion having a plurality of laser irradiating sections and work mounting sections, a supplying stocker for supplying workpieces, and a discharging stocker for discharging the workpieces. The apparatus further comprises a supply-side transfer unit having work retaining tables capable of attracting/releasing the workpieces and being of the same number as the laser irradiating sections, and moving in vertical and horizontal directions, and a discharge-side transfer unit having work retaining tables capable of attracting/releasing the workpieces and being of the same number as the laser irradiating sections, and moving in vertical and horizontal directions.

Abstract: A laser target includes a shank having a first wedge converging from a step to a distal end of the wedge. A complementary second wedge is mounted on the step and converges with the first wedge. The two wedges have respective target apertures aligned with each other transversely therethrough.

Abstract: There is provided a printed board machining apparatus having fewer restrictions in terms of the length of printed boards to be machined, that can be readily controlled in positioning a sheet-like workpiece and that is capable of improving the machining efficiency. Plural sets of optical scanners and f? lenses that compose laser condensing and positioning mechanisms are disposed apart in a width direction (X direction) orthogonal to a longitudinal direction (Y direction) of the sheet-like workpiece and two sheet-like workpieces are fixed on a machining table in parallel, and in the width direction to machine printed boards on the sheet-like workpieces The disposition of the f? lenses allows the machining of the plurality of lengthy printed boards to be completed practically at the same time or at the same time without limiting the length of the printed boards to be machined.

Abstract: The object of this invention is to provide a laser beam machining system and a laser beam machining method, wherein the working environment for the laser beam machining in the safety cabin is not impaired, and carrying out of the machined work can be performed without causing a shift of the machined work on the machining table, and also, without the laser beam machining being suspended, thereby enabling improvement in the productivity. At least one carriage of two, first and second carriages (11), (19) placed in a safety cabin (29) is moved back and forth above a machining table, and a laser machining head provided in that carriage is moved right and left, to thereby perform laser beam machining with respect to a work (W) on a machining table (7 or 9). The second carriage is moved back and forth above the machining table (7 or 9), so that a holding device (25) provided in the second carriage is moved right and left, to thereby hold and carry the machined work (W).

Abstract: An apparatus for inspecting drawing accuracy in a liquid droplet ejection apparatus performs drawing by ejecting a function liquid droplet while moving a function liquid droplet ejection head relative to a workpiece by using a moving mechanism. In response to the relative movement, a laser irradiating mechanism performs visually recognizable stippling on the workpiece by irradiating coherent light thereon. A control part drives the laser irradiating mechanism for stippling at a predetermined frequency timing.

Abstract: Disclosed herein is a laser welding system having a travel path to carry a first blank and a second blank. An upstream clamp assembly and a downstream clamp assembly are positioned on the travel path and each of the upstream and downstream clamp assemblies are movable to an open position to allow the first blank to pass through the upstream clamp assembly to a first location within the downstream clamp assembly. A laser welding source is directed at a weld location on the travel path between the upstream and downstream clamp assemblies. At least one locating means is operable to locate the first weld edge adjacent the weld location. A first displacement means displaces the first weld edge against the locating means. The downstream clamp assembly is movable from the open position to a closed clamped position to clamp the first blank with the first weld edge adjacent the weld location. The locating means is operable to be withdrawn from the travel path.

Abstract: A machine tool installation for laser cutting of sheet workpieces has a workpiece support, an elongated machine frame providing an arm extending over the workpiece support, and a track on the arm which extends longitudinally of the frame. A motion unit is suspended from the track and mounted for movement therealong, and there is drive assembly for moving the motion unit bidirectionally along the track. A laser cutting unit is mounted on the motion unit and includes a laser cutting head movable thereon along an axis perpendicular to the track on the machine frame. A loading unit is provided at a loading station adjacent one end of said machine frame for lifting and transporting a sheet workpiece above the plane of the upper surface of the workpiece support and the loading assembly is moveable on the track on the frame.

Abstract: A system is disclosed for monitoring and controlling laser cladding process by powder injection in real-time. The invention combines laser cladding technique along with automated direct feedback control to achieve a good quality clad in terms of dimensional and metallurgical characteristics. The system uses optical CCD-based detectors as the feedback system. The optical CCD-based detectors along with a pattern recognition algorithm is used to determine the clad characteristics in real-time. These characteristics are clad's dimensions, solidification rate, and roughness that are fed into a closed loop control system to adjust the laser power and table velocity to produce desired clad quality.

Abstract: A novel apparatus for heat treating semiconductor wafers includes a heating device which comprises an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. The tuning devices adjust the overall irradiance distribution of the light energy sources. The tuning devices can either be active sources of light energy or passive sources which reflect, refract, or absorb light energy. For instance, in one embodiment, the tuning devices can comprise a lamp spaced from a focusing lens designed to focus determined amounts of light energy onto a particular location of a wafer being heated.

Abstract: A clamping apparatus for holding a louvered blind assembly while applying a decorative graphic thereto includes a pair of rectangular frames hingedly connected together for pivoting movement between an open position for receiving slats of the blind assembly, and a closed position in which the slats of the blind assembly are clamped therebetween. A slip resistant pad material is disposed on opposing faces of the frames for providing a soft, slip resistant surface for engaging the slats. First and second pairs of brackets are positioned at first and second ends of the clamping apparatus, respectively, for providing shelves for holding portions of the blind assembly that are not clamped between the top and bottom frames. Locating holes are formed in the brackets for aligning the clamping apparatus within a machine that applies the decorative graphic. A laser is used for etching and perforating graphic images and trimming blinds to length.

Abstract: A laser drilling system forms an opening in the coating of a pharmaceutical dosage form and includes an orienting assembly to correctly orient dosage forms, a debris removal assembly to reduce buildup of and reduce exposure to drilling debris and a quality control assembly to verify that the opening formed conforms to predetermined specifications.

Abstract: Disclosed herein is a laser welding system having a travel path to carry a first blank and a second blank. An upstream clamp assembly and a downstream clamp assembly are positioned on the travel path and each of the upstream and downstream clamp assemblies are movable to an open position to allow the first blank to pass through the upstream clamp assembly to a first location within the downstream clamp assembly. A laser welding source is directed at a weld location on the travel path between the upstream and downstream clamp assemblies. At least one locating means is operable to locate the first weld edge adjacent the weld location. A first displacement means displaces the first weld edge against the locating means. The downstream clamp assembly is movable from the open position to a closed clamped position to clamp the first blank with the first weld edge adjacent the weld location. The locating means is operable to be withdrawn from the travel path.

Abstract: Various processes for heating semiconductor wafers is disclosed. In particular, the present invention is directed to configuring light sources emitting light energy onto a wafer in order to optimize absorption of the energy by the wafer. Optimization is carried out by varying the angle of incidence of the light energy contacting the wafer, using multiple wavelengths of light, and configuring the light energy such that it contacts the wafer in a particular polarized state. In one embodiment, the light energy can be emitted by a laser that is scanned over the surface of the wafer.

Abstract: A computer controlled laser machine tool is provided wherein the machine tool work zone is smaller than the size of the workpiece that can be processed. The machine tool has an apparatus to register the workhead guidance system to the workpiece without requiring a hole in the workpiece. The machine tool is adapted with an image sensor, a form of a digital camera, to measure the position of targets etched in or affixed to the surface of the workpiece. Registration of the workhead guidance system relative to the workpiece is checked before and after the workpiece support is indexed.

Abstract: The invention relates to an operating method and a trolley for a system used for machining objects by using laser beams, particularly for a system used for boring or structuring substrates. The system has a great number of slow-working laser machining machines than rapid working laser machining machines. A rapid-working laser machining machine utilized afterwards or beforehand can be better used to capacity due to the parallel operation of a number of slow-working laser machining machines. The transfer of objects to be machined or already machined objects is preferably effected by means of trolleys, which are both compatible with both the loading stations and the unloading stations of the laser machining machines. This enables the objects, which are to be machined, to be directly received by a trolley located in a loading station and, after machining, to be placed in a trolley that is introduced into an unloading station of a laser machining machine.

Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, wherein the machine further comprises a protective film forming means for forming a protective film on the to-be-processed surface of the workpiece before laser beam processing.

Abstract: A laser assembly includes a removable work table defining a planar work surface. A frame is configured for supporting the removable work table with the work surface in a work surface plane. An X-Y beam transport is operatively associated with the frame and is configured to direct a laser beam from a laser beam source to X-Y coordinates relative to the frame. At least one clamp is operatively associated between the frame and the removable work table with each clamp having a clamping position for clamping the work table to the frame with the work surface in the work surface plane in a release position or removing the work table from the frame. A void underlies the removable work table and is operatively associated with the X-Y beam transport with the removable work surface removed. A X axis control member moves the work table along a Z axis normal to the work surface plane between a proximal position near the X-Y beam transport and a distal position away from the X-Y beam transport.

Abstract: A machining device for simultaneously machining a plurality of work pieces 71, 72 on one machining table 7 with high positional accuracy is provided. The machining device detects positions of the work pieces 71, 72 with detectors 91, 92 mounted to respective machining heads 81, 82. The machining device has respective units for, based on the positional data, moving the machining table 7 to a position where displacements of respective machining heads 81, 82 are nearly equal, and for moving machining ranges of machining heads 81, 82 so as to substantially eliminate displacements between respective machining heads 81, 82 and work pieces 71, 72.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract: The invention relates to a device for accommodating flat materials when separated by laser, water-jet, cutting torch or milling. The slot provided under the separating device is displaced by enlarging one bearing surface and reducing the size of the other bearing surface when the separating device is moved, whereby damage to the bearing surface is reduced when cutting any particular contours. The invention enables separation, targeted sorting of the separated parts and the clearing away of the remaining materials.

Abstract: The device for positioning a tool (1) in relation to a workpiece (6) controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) through two cameras (10, 11), the first (1) of which takes an image essentially along a spatial axis (y), the other (11) being oriented essentially vertically with respect to a surface (8) of the workpiece.

Abstract: An apparatus for thermal cutting of workpieces includes a cutting means for separating a workpiece into a finished part and a residual part, a workpiece support, and support elements for supporting the workpiece. Separate first and second support elements are provided for adjustable support of the finished part or the residual part and are disposed at a mutual separation in the region of the separating cut.

Abstract: A system for shaping an optical fiber with various geometries while minimizing unwanted artifacts in the core of the optical fiber. The system facilitates control of sag in the region of the core that is exposed to a beam of optical energy. The sag is reduced, if not eliminated, by maintaining the cross-sectional area of the core that is exposed to the beam at thermal equilibrium.

Abstract: A method of making a catheter balloon or other expandable medical device, and a balloon or other device formed thereby, in which at least a portion of a tubular, wrapped sheet of polymeric material is heated with laser radiation to form a fused seam extending along at least a section of the length of the tubular body. In one embodiment, the portion of the sheet heated by laser radiation is less than the entire area of the sheet, so that the fused seam is formed by heating portions of the sheet without heating sections of the sheet spaced apart from the fused seam. In one embodiment, the sheet of polymeric material comprises a polymer having a porous and preferably a node and fibril microstructure, which in one embodiment is selected from the group consisting of expanded polytetrafluoroethylene (ePTFE) and expanded ultra high molecular weight polyethylene.

Abstract: A method and apparatus for manufacturing patterns on a reticle blank comprising a substrate made from material transparent to UV irradiation and having a first surface and a second opposite surface, the first surface coated with a chrome layer. The method comprises providing ultra-short pulsed laser beams, focusing means, relative displacement facilitator for facilitating relative displacement of the reticle blank relative to said at least one of a plurality of target locations, and a controller for controlling the synchronization and operation of the laser beam source, the focusing means and the relative displacement facilitator. Ultra-short pulsed laser beam is irradiated in a predetermined pattern directed at the second surface and passing through the substrate, focused on the chrome layer or on its proximity.

Abstract: A method and device for welding pin contacts and socket contacts to an optical waveguide, the welding device has a contact loading station, a contact transport carriage, a laser welding device, and an electrical control unit. The contact loading station has a socket contact transfer device and a pin contact transfer device. The contact transport carriage has a pin contact holder and a socket contact holder. The contact transport carriage is displaceable between the contact loading station and the laser welding station. The electrical control unit controls the combination and number of socket contacts and pin contacts transferred from the socket contact transfer device to the socket contact holder and from the pin contact transfer device to the pin contact holder without having to re-tool the welding device.

Abstract: A method is proposed for welding a first component part to a second component part, the energy to melt melting regions being supplied by a laser beam. In this context, the laser beam is directed through the first component part, which is made of a nonabsorbing material, to the second component part. The second component part is made of a material which strongly absorbs laser beam. At least one stop is provided outside melting regions.

Abstract: The cutting of the flat glass plate (1) into rectangular plates with a predetermined edge length is performed by forming initial cracks at the beginning of cutting lines on the glass plate and moving a laser beam along the cutting lines followed by a cooling spot to induce a thermo-mechanical stress alone the cutting lines. First the glass plate (1) is cut apart into partial plates (2-5) along first parallel cutting lines spaced according to the predetermined edge length. Then the cut apart glass plate is rotated by 90° and the partial plates (2-5) are moved apart from each other. Subsequently the partial plates that have been moved apart are cut apart alone several parallel second cuts (4-9) perpendicular to the first cuts. This method facilitates exact placement of the initial cracks.

Abstract: A method of manufacturing a honeycomb structure and a through hole forming device used in the manufacture of the honeycomb structure are provided, in which the step of closing a part of the cell ends at an end surface of the honeycomb structure is rationalized. In closing a part of the cell ends (82) at the end surface (861) of a honeycomb structure body (86), a film (2) is attached to the end surface (861) of the honeycomb structure body (86) in such a manner as to cover the cell ends (82). The portion of the film (2) located at the cell ends (82) to be closed is thermally melted or burnt off thereby to form through holes (20). The end surface (861) is dipped in a slurry containing an end surface closing material, so that the slurry is caused to enter the cell ends (82) by way of the through holes (20). After that, the slurry is hardened while at the same time removing the resin film (2).

Abstract: A footprint (an area on a plane necessary for processing) of a laser irradiation apparatus for moving a stage supporting thereon a substrate in X and Y direction becomes unavoidably large when the substrate becomes greater in size, and the apparatus becomes very great as a whole. In a laser irradiation apparatus of the invention, a galvanomirror or a polygon mirror irradiates and scans a laser beam to and on a semiconductor film and always keeps an angle ? of incidence of the laser beam to the semiconductor film at a certain angle.

Abstract: To provide a continuous oscillation laser apparatus, and a manufacturing method of a semiconductor device using the continuous oscillation laser apparatus, which can enhance processing efficiency. A laser apparatus according to the present invention includes: a laser oscillation apparatus; a unit for rotating an object to be processed; a unit for moving the object to be processed toward a center of the rotation or toward an outside from the center; and an optical system for processing a laser light outputted from the laser oscillation apparatus and irradiating the processed laser light to a definite region in a moving range of the object to be processed, in which, while the object to be processed is rotated, the object to be processed is moved toward the center of the rotation or toward the outside from the center to move a position where the definite region and the object to be processed overlap.

Abstract: Pulse-position synchronized deposition of a material in miniature structure manufacturing processes is carried out in a fabrication tool including a material carrier element, a source of energy generating pulses of energy, a substrate, and a control unit operatively coupled to the source of energy, substrate, and the material carrier element. The control unit exposes a first area of the material carrier element to a first pulse of energy, pauses the exposure while initiating relative motion between the source of energy and the substrate at a predetermined first speed and relative motion between the material carrier element and the energy source at a predetermined second speed which is a function of the first speed, and slowing (or stopping) relative motion between the energy source, material carrier element, and the substrate, while exposing the unablated area of the material carrier element adjacent to previously ablated area to a second pulse of energy.

Abstract: Disclosed are a welding device of a fuel tank for vehicles, which welds flanges of upper and lower panels of the fuel tank together by pressing and melting using a laser, and a welding method thereof The welding device includes a feed unit for holding upper and lower panels of the fuel tank provided with flanges formed at edges thereof under the condition that the flanges are stacked, and for transferring the upper and lower panels in a horizontal direction; a pressure unit for pressing the flanges of the upper and lower panels, transferred by the feed unit, at front and rear portions of at front and rear portions, and for guiding the transfer of the upper and lower panels; and a laser beam generator perpendicularly separated from central portions of the flanges pressed by the pressure unit by a designated interval, for irradiating a laser beam to the upper and lower panels so that the flanges of the upper and lower panels are fusion-welded together by using heat generated from the irradiated laser beam.

Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, wherein the machine further comprises a protective film forming means for forming a protective film on the to-be-processed surface of the workpiece before laser beam processing.

Abstract: The present invention provides a laser drilling system for drilling holes or cavities in a solid, in particular a solid dosage form. The system includes a loading zone, firing zone, inspection zone and delivery zone. The system also includes optional components such as a process validation system, solids detector, color detector, solids rejection/repositioning means, accepted products receptacle, rejected products receptacle and/or solids inspection system. Operation of the laser device in the firing zone and of other optional equipment is synchronized with movement of a continuous solids indexer by way of an electronic synchronizer. A solids handling system includes an optional fill level detector that directly or indirectly controls solids loading means that fills a solids reservoir. The system can be run continuously, semicontinuously or batchwise.

Abstract: Because of extreme hardness, diamonds have a number of important industrial application. Generally experts work on it. Marking is done by experts after examining each rough diamond to decide how it should be cut to yield the greatest value. But in this process, there can be lots of wastage as it is only an image of the stone in the mind of the person. The present invention comprises Laser planner which scans each and every point of diamond by rotating it 360° and thus gives individual coordinate of that diamond. It shows us the wire frame image on the computer monitor is a machine to scan the stone and to plan and mark for the best-fit diamond from that stone. All the data of the diamond is stored in the computer. It is material saving, time saving, mass processing increase in productivity.

Abstract: Disclosed herein is a laser welding system having a travel path to carry a first blank and a second blank. An upstream clamp assembly and a downstream clamp assembly are positioned on the travel path and each of the upstream and downstream clamp assemblies are movable to an open position to allow the first blank to pass through the upstream clamp assembly to a first location within the downstream clamp assembly. A laser welding source is directed at a weld location on the travel path between the upstream and downstream clamp assemblies. At least one locating means is operable to locate the first weld edge adjacent the weld location. A first displacement means displaces the first weld edge against the locating means. The downstream clamp assembly is movable from the open position to a closed clamped position to clamp the first blank with the first weld edge adjacent the weld location. The locating means is operable to be withdrawn from the travel path.

Abstract: A machining device comprises workpiece holding means for holding a workpiece, laser beam machining means for shining a laser beam to the workpiece held by the workpiece holding means to machine the workpiece, and moving means for moving the workpiece held by the workpiece holding means, and a laser beam shone to the workpiece relative to each other. Suction means is disposed for sucking from a machining region where the laser beam is shone to the workpiece. The suction means includes a central hood, a central suction source for sucking through the central hood, an outer hood, and an outer suction source for sucking through the outer hood, and the suction force of the central suction source is greater than the suction force of the outer suction source.

Abstract: An automatic handling assembly that can load and unload photonic package components into a laser station. The laser station may include three lasers that weld the package components in a horizontal position. The package components may include a sleeve coupled to an optical fiber and a fiber package. The package may be mounted to a yoke that may “gimbal” about tooling plates. The yoke may include vacuum pulled friction bands that lock and unlock the position of the package. The package tooling may also have an actuator to apply a biasing force to the yoke to offset the affects of gravity. Additionally, the package tooling may have an actuator that can couple and de-couple electrical contacts to the yoke.

Abstract: The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

Abstract: The machine (1) has a receiving device (13) for clamping the workpiece (14) on one side. A laser optic (12) is movable NC-controlled in the three spatial coordinates x, y, and z for processing the workpiece (14). An additional slide (21) may be displaced longitudinally in a controlled way on the base (3) of the machine frame (2). The slide (21) has a carrier plate (29) having multiple attachment elements, arranged in a regular raster, for replaceable, removable attachment of at least one auxiliary device (37), e.g., a support element (39). In this way, the machine (1) is usable in manifold ways. The quality of the processing may be improved through improved positioning and support of the workpiece, and the clock frequency may be elevated.

Abstract: The system for laser processing webs includes a laser system having a beam source, a controller and one or more heads to direct a laser beam onto a web. A cylinder capable of controlled rotation applies a web-securing force to the web under the laser beam to secure the web so that the web does not flutter or shift during laser processing. A template may be placed over the cylinder to apply the web-securing force in specific patterns or areas as needed.

Abstract: An apparatus for producing a sleeve-shaped printing form from a plate-shaped blank includes a circular shaping device for the blank, a welding system, by means of which the plate edges forming the start and end of the printing form can be cut to size, maintaining their dimensions, and welded, and a displaceable device for picking up and for transporting the blank to the circular shaping device. The displaceable device has a fixing frame which has two lifting elements which can be adjusted in accordance with the distance between the plate edges to be joined and can be set along the respective plate edge.

Abstract: As the output of laser oscillators become higher, it becomes necessary to develop a longer linear shape beam for a process of laser annealing of a semiconductor film. However, if the length of the linear shape beam is from 300 to 1000 mm, or greater, then the optical path length of an optical system for forming the linear shape beam becomes very long, thereby increasing its footprint size. The present invention shortens the optical path length. In order to make the optical path length of the optical system as short as possible, and to increase only the length of the linear shape beam, curvature may be given to the semiconductor film in the longitudinal direction of the linear shape beam. For example, if the size of the linear shape beam is taken as 1 m×0.4 mm, then it is necessary for the optical path length of the optical system to be on the order of 10 m.