With Fluid Supply Patents (Class 219/121.84)
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Patent number: 8872058Abstract: An improved laser shock hardening method and apparatus which can eliminate spattering of a liquid and waving of the liquid surface upon laser irradiation, and can stably irradiate a workpiece with a laser beam. In a laser shock hardening method for carrying out surface processing of a workpiece in contact with a liquid by irradiating through the liquid the surface of the workpiece with a pulsed laser beam intermittently emitted from a laser irradiation device, the disclosed method provides a solid transparent to the wavelength of the laser, serving as an entrance window to the liquid surface; allowing the liquid to be present in the light path of the laser beam between the solid and the surface of the workpiece; and allowing the laser beam to enter through the solid and irradiating through the liquid the surface of the workpiece with the laser beam.Type: GrantFiled: November 14, 2012Date of Patent: October 28, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Yuji Sano, Naruhiko Mukai, Masaki Yoda, Yoshiaki Ono, Ryoichi Saeki, Hideki Naito
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Patent number: 8872057Abstract: An electrode of an inductive output tube (IOT) is provided with channels for guiding cooling fluid. In one aspect of the invention, the channels are in a confronting relationship with a jacket surrounding the electrode and spaced from the electrode so as to define an interior region. Cooling fluid such as oil is circulated in the channels in fluid communication with the interior region, providing an escape mechanism for trapped bubbles in order to prevent localized heating of the electrode. In another aspect of the invention, the channels form multiple intersecting helical patterns of different pitches, with the steeper-pitched channels providing a more direct escape route for the bubbles.Type: GrantFiled: March 15, 2006Date of Patent: October 28, 2014Assignee: Communications & Power Industries LLCInventors: Paul A. Krzeminski, Gordon R. Lavering
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Patent number: 8866040Abstract: A spatter removing device for a laser welder including an optic head to which a laser beam is transferred through an optic fiber from a laser oscillator, a cross jet mounted at one side of a lower end portion of the optic head, a safety cover provided at the outside of the optic head so as to surround the optic head, and a material injection unit that injects a material to be welded below the optic head, the device includes a discharge unit and a spatter cooling device. The discharge unit is provided with a discharge pipe that discharges a welding gas and the spatter at one side portion of the safety cover. The spatter cooling device is connected to the discharge pipe and cools the spatter so that the spatter is forcibly collected.Type: GrantFiled: February 15, 2012Date of Patent: October 21, 2014Assignee: Samsung SDI Co., Ltd.Inventors: Tae-Young Ko, Jin-Pil Kim
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Publication number: 20140305918Abstract: A laser processing apparatus including a dust discharging unit for discharging dust generated by the application of a laser beam from a focusing unit to a workpiece. The dust discharging unit includes a dust collector provided below the focusing unit and a suction unit connected to the dust collector. The dust collector has a U-shaped configuration composed of a rectangular top wall having an opening for allowing the pass of the laser beam applied from the focusing unit, a first side wall projecting downward from one side edge of the top wall, and a second side wall projecting downward from the other side edge of the top wall so as to be opposed to the first side wall. The suction unit includes a suction duct having one end connected to the dust collector and the other end connected to a vacuum source.Type: ApplicationFiled: March 19, 2014Publication date: October 16, 2014Applicant: DISCO CORPORATIONInventors: Tomoaki Endo, Kentaro Odanaka
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Patent number: 8859934Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.Type: GrantFiled: March 25, 2014Date of Patent: October 14, 2014Assignee: Insera Therapeutics, Inc.Inventors: Vallabh Janardhan, Vikram Janardhan
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Patent number: 8859988Abstract: Reliable coupling of a high-power laser beam into a liquid-jet in a liquid-jet guided laser system can be achieved with high lifetime performance of the nozzle and the protection window, through setting the parameters of the liquid-jet guided laser system according to an optimum relationship that links the focus point of the laser, the focus cone angle, the laser beam energy distribution profile and the nozzle geometry.Type: GrantFiled: May 30, 2014Date of Patent: October 14, 2014Assignees: se2quel Management GmbHInventors: Jens Guenter Gaebelein, Jeroen Hribar
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Patent number: 8839497Abstract: A machining process and apparatus capable of increasing removal rates achievable when machining titanium and its alloys. The process includes heating a portion of a workpiece with a laser beam, cryogenically cooling a cutting tool with a cryogenic fluid without flowing the cryogenic fluid onto the workpiece, and machining the heated portion of the workpiece with the cutting tool. The apparatus includes a cutting tool, a device for heating a portion of a workpiece with a laser beam prior to being machined with the cutting tool, and a device for cryogenically cooling the cutting tool with a cryogenic fluid without flowing the cryogenic fluid onto the workpiece. The cryogenic fluid is circulated around the cutting tool to achieve a temperature differential between the workpiece and the cutting tool that is capable of improving removal rates and extending tool life at cutting speeds of, for example, above 100 m/min.Type: GrantFiled: February 19, 2010Date of Patent: September 23, 2014Assignee: Purdue Research FoundationInventor: Yung C. Shin
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Publication number: 20140273431Abstract: Embodiments of the present disclosure are directed to laser removal of resist material from integrated circuit (IC) packaging components, as well as package assemblies and systems incorporating such material and removal methods. A resist layer may be applied to one or more components of a package assembly. The resist layer may be subsequently removed by applying laser radiation and a flow of fluid to the resist layer. The laser radiation may cause cracking, delamination, and/or polymer chain scission, and the flow of fluid may enhance mechanical separation of the resist material from the package assembly components.Type: ApplicationFiled: March 14, 2013Publication date: September 18, 2014Inventor: Motohiko Sasagawa
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Patent number: 8829393Abstract: The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.Type: GrantFiled: April 9, 2012Date of Patent: September 9, 2014Assignee: Applied Materials, Inc.Inventors: Dean C. Jennings, Mark Yam, Abhilash J. Mayur, Vernon Behrens, Paul A. O'Brien, Leonid M. Tertitski, Alexander Goldin
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Patent number: 8829388Abstract: A method for contactless laser welding of a plurality of sheets of material stacked upon one another includes simultaneously delivering a laser beam and a stream of fluid through a laser head and further through an end cap which is removably mounted to the laser head. The end cap is configured with a stationary cylinder, which is coupled to the laser head, and a piston movable relative the cylinder. The piston moves in response to a pressure differential generated by the fluid in chambers above and below the piston. Once the pressure equilibrium is reached between the chambers, the pressure in the chamber below the piston is sufficient to reliably press the sheets of material against one another during a laser welding operation.Type: GrantFiled: July 29, 2011Date of Patent: September 9, 2014Assignee: IPG Photonics CorporationInventors: Igor Samartsev, Vladimir Antonenko, Leonid Pudov
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Publication number: 20140245608Abstract: In removal processing using a pulsed laser beam, processing deviation occurs in the depthwise direction to cause a processing error in a predetermined removal shape. A first pulsed laser beam L1 is a pulsed laser beam having a wavelength that exhibits transmittance to a workpiece 6, and a second pulsed laser beam L2 is a pulsed laser beam having a wavelength that exhibits absorption to the workpiece 6. The first pulsed laser beam L1 is focused into the workpiece 6, and a focal point P1 of the first pulsed laser beam L1 is scanned along the outline of a predetermined removal region R1 to form a modified portion 6A along the outline of the predetermined removal region R1. Next, removal processing is performed by scanning the second pulsed laser beam L2 in a region enclosed by the modified portion 6A.Type: ApplicationFiled: October 3, 2012Publication date: September 4, 2014Applicant: Canon Kabushiki KaishaInventors: Hiroyuki Morimoto, Kosuke Kurachi
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Publication number: 20140246129Abstract: A process for localized hardening of steel sheet components includes scanning a laser beam in a scan direction across a predetermined portion of the steel sheet component. The laser beam selectively heats material within the predetermined portion of the steel sheet component to a temperature of austenitizing transformation. During scanning of the laser beam across the predetermined portion, a source of external cooling is applied to the material within the predetermined portion and immediately behind the laser beam along the scan direction of the laser beam. The source of external cooling is selected to cool the material at a sufficiently rapid rate to form a locally hardened region that is defined substantially within the predetermined portion. Subsequent to applying the source of external cooling, the material within the predetermined portion of the steel sheet component is allowed to cool to ambient temperature.Type: ApplicationFiled: July 25, 2012Publication date: September 4, 2014Applicant: MAGNA INTERNATIONAL INC.Inventors: Maximilian Amtmann, Boris Shulkin, Aldo Van Gelder, Hongping Gu
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Patent number: 8822878Abstract: A system and process for production of nanometric or sub-micrometric powders in continuous flux under the action of laser pyrolysis in at least one interaction zone between a beam emitted by a laser and a flux of reagents emitted by an injector, in which the laser is followed by optical means for distributing the energy of the beam emitted by the latter according to an axis perpendicular to the axis of each flux of reagents, in an elongated cross-section having adjustable dimensions at the level of this at least one interaction zone.Type: GrantFiled: November 7, 2005Date of Patent: September 2, 2014Assignee: Commissariat a l'Energie AtomiqueInventors: Francois Tenegal, Benoit Guizard, Nathalie Herlin-Boime, Dominique Porterat
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Patent number: 8820434Abstract: Delivering high power laser energy to form a borehole deep into the earth using laser energy. Down hole laser tools, laser systems and laser delivery techniques for advancement, workover and completion activities. A laser bottom hole assembly (LBHA) for the delivery of high power laser energy to the surfaces of a borehole, which assembly may have laser optics, a fluid path for debris removal and a mechanical means to remove earth.Type: GrantFiled: August 19, 2009Date of Patent: September 2, 2014Assignee: Foro Energy, Inc.Inventors: Mark S. Zediker, Mark S. Land, Charles C. Rinzler, Brian O. Faircloth, Yeshaya Koblick, Joel F. Moxley
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Publication number: 20140238961Abstract: A laser machining apparatus includes a laser nozzle for supplying an assistive gas to remove undesirable materials and applying a laser beam at an angle, which is inclined with respect to a surface of a workpiece, a sputter blocking jig disposed over a region of the workpiece that is irradiated with the laser beam, so as to lie across directions in which the laser beam is scattered, and for blocking sputtered particles that are generated from the surface by the applied laser beam, and a joint connecting the laser nozzle and the sputter blocking jig to each other. The joint moves the laser nozzle and the sputter blocking jig in synchronism with each other.Type: ApplicationFiled: February 25, 2014Publication date: August 28, 2014Applicant: HONDA MOTOR CO., LTD.Inventor: Daisuke Kato
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Publication number: 20140238963Abstract: A mask manufacturing apparatus includes a chamber, a laser beam irradiator, a stage, a cooling system, and a fan. The chamber provides an interior space therein. At least an upper wall of the chamber comprises a glass. The laser beam irradiator is disposed outside the chamber and configured to divide a laser beam into a plurality of sub-laser beams to irradiate the sub-laser beams onto a shadow mask material. The stage is disposed in the chamber and the shadow mask material is placed on the stage. The cooling system is configured cool the interior space. The fan configured to discharge heat generated in the interior space of the chamber to the outside of the chamber. Therefore, the shadow mask may be protected from overheating.Type: ApplicationFiled: September 9, 2013Publication date: August 28, 2014Applicant: Samsung Display Co., Ltd.Inventors: Jun Ho JO, Doh-Hyoung LEE
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Patent number: 8816241Abstract: Together with a scanner device, an air blower is provided above a workpiece, and the air blower exhausts air in the shape of a ring toward the workpiece, the air in a ring shape surrounding an optical axis of a laser beam emitted from the scanner device. A housing of the air blower is formed in a ring shape, a ring-shaped cavity is formed in the housing, an inner ring member is attached to an undersurface of the housing, an outer ring member is attached to an outer peripheral side of the inner ring member, and a ring-shaped exhaust port is formed between the inner ring member and the outer ring member. An exhaust direction of the air is defined by inclination of an outer-peripheral-side end surface of the inner ring member and inclination of an inner-peripheral-side end surface of the outer ring member (FIG. 2).Type: GrantFiled: September 14, 2011Date of Patent: August 26, 2014Assignee: Suzuki Motor CorporationInventors: Sachio Kishino, Manabu Kobayashi
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Patent number: 8816244Abstract: A stent manufacturing device and methods for making intravascular stents and other medical devices. The stent manufacturing device may include a base, a laser or other cutting device coupled to the base, a horizontal motor coupled to the base, and a rotary motor coupled to the horizontal motor. A workpiece can be attached to the cutting device, for example adjacent the rotary motor, and the workpiece can be cut with the cutting device.Type: GrantFiled: April 13, 2004Date of Patent: August 26, 2014Assignee: Boston Scientific Scimed, Inc.Inventors: Kenneth Merdan, Matt Shedlov
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Patent number: 8807218Abstract: A method and apparatus for wellbore perforation in which a laser beam at a downhole location of a wellbore is directed to a target area of a wellbore wall to be perforated. The laser beam is guided through a longitudinally extensible nozzle onto the target area and a purge fluid is introduced into the longitudinally extensible nozzle, thereby longitudinally extending the nozzle toward the target area. The purge fluid in the longitudinally extensible nozzle is passed through a purge fluid outlet of the nozzle onto the target area, thereby removing debris from the target area generated by the laser beam.Type: GrantFiled: August 10, 2011Date of Patent: August 19, 2014Assignee: Gas Technology InstituteInventors: Mark S Kleefisch, Iraj Salehi
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Patent number: 8803030Abstract: A system for removal of slag during laser cutting of a hypotube by a laser cutting system may include a cooling system and a cooling fluid inlet regulator. The cooling system may be configured to be coupled to a laser nozzle of a laser cutting system. The cooling system may include a supply of gas and a gas inflow valve configured to regulate the gas that flows into the laser nozzle from the supply of gas. The cooling fluid inlet regulator may be configured to inject cooling fluid into an inner lumen of a hypotube during laser cutting by the laser cutting system at a velocity configured to facilitate removal of slag generated during the laser cutting of the hypotube. The cooling fluid inlet regulator may be configured to cool the hypotube during the laser cutting.Type: GrantFiled: March 25, 2014Date of Patent: August 12, 2014Assignee: Insera Therapeutics, Inc.Inventors: Vallabh Janardhan, Vikram Janardhan
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Patent number: 8785814Abstract: Systems and methods for the protection of optics are provided. In one example embodiment, a laser processing system is provided, the laser processing system comprising a laser source and an optic. The laser processing system may further comprise at least one of a liquid delivery mechanism configured to deposit liquid on the optic and an evacuation mechanism.Type: GrantFiled: May 5, 2009Date of Patent: July 22, 2014Assignee: LSP Technologies, Inc.Inventors: Steven M. Toller, Ronald L. Johnson
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Publication number: 20140197146Abstract: A below plate coolant recovery and waste separation system is provided for a combined machining and thermal metal plate cutting machine A trolley structure is located underneath a table supporting a fume chamber and coolant tray. The trolley is movable both in the X axis, and in response to the location of the cutting tools which move with the gantry along the rails to be positioned over the table and plate to be cut, during use in cutting the plate such that the coolant or cutting fluid is captured and reused and kept separate from the cutting waste. The trolley structure is suspended under the cutting table and includes a chamber for movably supporting at least one fume extraction chamber and at least one tray for receiving and removing coolant, whereby the coolant recovery and waste separation system movement is synchronised with the cutting tools by the machine control system.Type: ApplicationFiled: August 17, 2012Publication date: July 17, 2014Applicant: Eigen Systems LimitedInventor: Murray Houlton Forlong
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Patent number: 8772670Abstract: A system prevents oxidation of a laser cut workpiece by utilizing a laser source that utilizes laser source with an inert gas, such as argon or helium, rather than air or oxygen, to create the slots or kerfs which form the pattern cut into the workpiece. The system introduces oxygen gas through the workpiece as it is being laser cut to oxidize any slag or dross created during the laser cutting process. Oxygen or a mixture of oxygen with other gases cools the slag and the workpiece while at the same time oxidizing the slag to either completely burn or partial burn the slag before it strikes an exposed surface of the tubular member.Type: GrantFiled: July 9, 2012Date of Patent: July 8, 2014Assignee: Abbott Cardiovascular Systems Inc.Inventors: Jeffrey W. Baxter, David Mackiewicz
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Patent number: 8735769Abstract: A laser processing head in accordance with the present invention comprises: a laser emitting unit for irradiating a workpiece with a laser light; and a powder feeder disposed around a periphery of the laser emitting unit for discharging filler material powder to the workpiece, in which the powder feeder includes: a position adjustment mechanism for adjusting a position where the powder concentrates; and a powder concentration diameter adjustment mechanism for adjusting a diameter of the filler material powder. The laser processing head further comprises a controller for controlling the position adjustment mechanism and the powder concentration diameter adjustment mechanism.Type: GrantFiled: October 19, 2010Date of Patent: May 27, 2014Assignee: Hitachi, Ltd.Inventors: Masanori Miyagi, Takeshi Tsukamoto, Hirotsugu Kawanaka
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Patent number: 8728849Abstract: A method of laser cutting through dissimilar materials separated by a metal foil. A material stack includes a semiconductor layer or film, with a metal foil layer attached to the back surface. The metal foil layer is attached to an insulative support material layer. A laser parameter is selected and optimized for the material stack. A laser beam creates a kerf in the material stack down to the metal foil layer. The laser beam removes metal through the kerf primarily by gasification rather than melting. Kerf formation continues after optimization of the laser parameter for removal of material from the remaining layers. A debris field resulting from the laser cutting of the metal layer is reduced and/or a portion of the debris is removed in an assisted manner as the beam cuts. The materials are diced by cutting the kerf through all materials.Type: GrantFiled: August 31, 2011Date of Patent: May 20, 2014Assignee: Alta Devices, Inc.Inventors: Laila Mattos, Daniel G. Patterson
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Patent number: 8723075Abstract: Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interlace of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.Type: GrantFiled: December 14, 2011Date of Patent: May 13, 2014Assignee: Electro Scientific Industries, Inc.Inventors: James N. O'Brien, Peter Y. Pirogovsky, Michael S. Nashner
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Patent number: 8710401Abstract: A laser processing machine includes a cavity, a laser system, at least one processing platform, and at least one upper motion platform. The laser system is disposed at a lower part inside the cavity, and used for outputting a laser beam. A traveling direction of the laser beam is opposite to the gravity direction. The processing platform is disposed at an upper part inside the cavity, and includes an adsorption surface and a connection surface facing each other. The adsorption surface is located below the connection surface, and is used for adsorbing a workpiece. The upper motion platform is disposed at the upper part inside the cavity, and is correspondingly connected to the connection surface of the processing platform, in order to cause the processing platform to move.Type: GrantFiled: September 23, 2011Date of Patent: April 29, 2014Inventor: Chun-Hao Li
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Patent number: 8710400Abstract: The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between 1.07 and 1.1 ?m, preferably 1.07 ?m, the quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon, oxygen, CO2 and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from H2 and CH4.Type: GrantFiled: June 2, 2011Date of Patent: April 29, 2014Assignee: L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges ClaudeInventors: Francis Briand, Karim Chouf, Hakim Maazaoui
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Publication number: 20140097162Abstract: A laser processing apparatus using a laser. The laser processing apparatus includes a light source for generating a hollow laser beam in a first direction; a reflection member for changing a path of the hollow laser beam toward the first direction into a second direction toward the substrate; a lens for collecting the hollow laser beam reflected by the reflection member; and an air supply unit for supplying air toward particles generated while the substrate is processed by the hollow laser beam, wherein the lens has a first hole passing through the lens, the reflection member has a second hole passing through the reflection member, and the first and second holes form a discharge path of the particles.Type: ApplicationFiled: March 4, 2013Publication date: April 10, 2014Applicant: SAMSUNG DISPLAY CO., LTD.Inventors: Il-Young Jeong, Gyoo-Wan Han, Jun-Hyung Kim
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Publication number: 20140076868Abstract: A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A liquid flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a liquid inside the airfoil, and disrupting the first fluid column with the liquid flowing inside the airfoil.Type: ApplicationFiled: September 14, 2012Publication date: March 20, 2014Applicant: GENERAL ELECTRIC COMPANYInventors: Zhaoli Hu, Douglas Anthony Serieno, Sharon Trombly Swede, Jane Marie Lipkin
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Publication number: 20140069898Abstract: The invention relates to a laser nozzle that can be used in laser cutting, notably with a fibre or disc laser, comprising a nozzle body comprising an axial housing passing axially through said nozzle body and comprising a first outlet orifice situated at the front face of the nozzle body, and a movable element comprising a skirt-forming front part arranged in the axial housing of the nozzle body, said movable element being capable of translational movement in the axial housing of the nozzle body and comprising an axial passage with a second outlet orifice opening onto the skirt-forming front part.Type: ApplicationFiled: April 25, 2012Publication date: March 13, 2014Applicant: L'Air Liquide Société Anonyme pour I'Etude et I'Exploitation des Procédés Georges ClaudeInventors: Isabelle Debecker, Thomas Jouanneau, Philippe Lefebvre
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Patent number: 8664563Abstract: A method for purging of, and debris removal from, a hole created with laser energy in which a swirling purge gas stream is provided in a hole containing debris to be removed, imparting a swirl to the debris and lifting the debris from a bottom of the hole. In accordance with one embodiment, the purge gas is swirled in a purge gas nozzle providing purge gas into the hole. In accordance with another embodiment of this invention, the purge gas is swirled directly in the hole.Type: GrantFiled: January 11, 2011Date of Patent: March 4, 2014Assignees: Gas Technology Institute, Halliburton Energy Services, Inc.Inventors: Hamid Ali Abbasi, Roger Schultz
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Patent number: 8658938Abstract: A method of forming an aperture in an article includes directing a laser at the article and traversing the high energy beam to form a cut extending along the periphery of the aperture in a first direction to a second point on the periphery and then reversing the direction of cutting along the periphery till the aperture is formed.Type: GrantFiled: July 31, 2008Date of Patent: February 25, 2014Assignee: Rolls-Royce PLCInventors: Ian M. Garry, Michael N. Wybrow
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Publication number: 20140048519Abstract: A laser processing apparatus including a processing head for applying a laser beam to a workpiece. The processing head includes a focusing lens and a collecting unit provided between the focusing lens and the workpiece for collecting debris generated by the application of the laser beam focused by the focusing lens to the workpiece. The collecting unit includes a suction source for sucking the debris and a suction line having one end connected to the suction source and the other end opening to the front side of the workpiece. The laser processing apparatus further includes a cleaning liquid supplying unit for supplying a cleaning liquid to the suction line.Type: ApplicationFiled: August 7, 2013Publication date: February 20, 2014Applicant: Disco CorporationInventor: Michael GADD
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Publication number: 20140027418Abstract: The present invention relates to a method for electrically contacting terminal faces of two substrates (6, 7), in particular of a chip (6) and of a carrier substrate (7). Furthermore, the invention relates to a device for performing a second phase of the method according to the invention. The method according to the invention takes place in two successive phases, wherein, in a first phase, the chip (6) is positioned with its terminal faces against terminal faces of the substrate (7) and laser energy (5) is applied to the chip (6) at the rear and, in a subsequent second phase, in a housing (3), a flux medium is applied and at the same time a reflow is performed by means of laser energy (5) being applied to the chip (6) at the rear, and a process of rinsing the housing interior is subsequently performed.Type: ApplicationFiled: January 30, 2012Publication date: January 30, 2014Applicant: PAC TECH - PACKAGING TECHNOLOGIES GmbHInventor: Ghassem Azdasht
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Patent number: 8636085Abstract: The removal of material from the path of a high power laser beam during down hole laser operations including drilling of a borehole and removal of displaced laser effected borehole material from the borehole during laser operations. In particular, paths, dynamics and parameters of fluid flows for use in conjunction with a laser bottom hole assembly.Type: GrantFiled: August 19, 2009Date of Patent: January 28, 2014Assignee: Foro Energy, Inc.Inventors: Charles C. Rinzler, Mark S. Zediker, Brian O. Faircloth, Joel F. Moxley
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Publication number: 20140008332Abstract: A system and method for using gas flow to control a molten puddle in out-of-position applications is provided. The system includes a high intensity energy source configured to heat at lease one workpiece to create a molten puddle and a housing assembly configured to supply a gas over the molten puddle in order to minimize sagging of the molten puddle in the out-of-position applications. The system also includes a gas source that is configured to supply the gas. The gas source is operatively connected to the housing assembly. The pressure of the gas in the housing assembly is in a range of 15 psi to 35 psi. The method includes heating at least one workpiece to create a molten puddle and supplying a gas over the molten puddle via a housing assembly in order to minimize sagging of the molten puddle in the out-of-position applications.Type: ApplicationFiled: March 7, 2013Publication date: January 9, 2014Inventors: Jonathan S. OGBORN, Edward Enyedy, Steven R. Sumner
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Publication number: 20140008337Abstract: The present application relates to a method for hybrid machining colored glass, includes the following steps: (1) providing a laser generator having a machining head, the colored glass is processed through the machining head by means of laser beam emitted by the laser generator. The colored glass particles melted or vaporized by the laser beam are blown away by the pressured gas through the nozzle on the machining head, so as to form a pore on the colored glass; (2) the colored glass is further processed at the pore by means of mechanical machining tools. The method for hybrid machining colored glass in the present application possesses economical, fast machining speed and high machining successful rate (or high successful machining product rate) as such beneficial characteristics.Type: ApplicationFiled: June 27, 2013Publication date: January 9, 2014Inventor: Wai Lam William YIM
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Publication number: 20130313238Abstract: A laser machining system includes a workpiece support, a laser machining unit arranged above the workpiece support and for machining a workpiece located on the workpiece support, at least one extraction opening beneath the workpiece support, and an enclosure separating the workpiece support, the laser machining unit and the at least one extraction opening from an external environment. The enclosure includes at least one air inflow opening arranged above the workpiece support and relative to the at least one extraction opening such that, during operation of the laser machining system, a pressure difference between the air inflow opening and the at least one extraction opening establishes a flow of air between the workpiece support and the laser machining unit, in which the flow of air separates the interior of the enclosure into a laser machining area beneath the flow band and a laser free area above the flow band.Type: ApplicationFiled: August 1, 2013Publication date: November 28, 2013Applicant: Trumpf Laser-und Systemtechnik GmbHInventors: Andreas Twisselmann, Dietrich Sauter
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Patent number: 8581141Abstract: A laser machining apparatus comprising jet liquid, a laser beam, and a laminar flow forming channel for supplying jet liquid to a nozzle. The channel includes a distribution channel formed by a cavity, an interconnecting channel disposed to communicate with said channel downstream in an axial direction of the nozzle and formed by an annular cavity around the axis of the nozzle to provide a narrower flow passage, and a liquid reservoir chamber. Said chamber has an outer peripheral edge communicating with the interconnecting channel over an entire circumference of the annular shape. An outer peripheral surface and an outer peripheral surface of the chamber form a continuous surface and an inner peripheral wall surface and an inner peripheral surface of the channel are both formed as an inclined inward surface that is downstream, the inner peripheral surface and the inner peripheral wall surface forming a planar continuous surface.Type: GrantFiled: February 3, 2012Date of Patent: November 12, 2013Assignee: Sugino Machine LimitedInventors: Ryoji Muratsubaki, Yukiaki Nagata, Tadashi Sugimori
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Patent number: 8575515Abstract: A laser annealing apparatus is provided that is capable of reducing irradiation unevenness of laser light caused by a refraction phenomenon of the laser light due to fluctuation in the temperature of inert gas. The laser annealing apparatus includes a gas supply unit for supplying inert gas G to at least a laser irradiation area of a workpiece, and a gas temperature controller for regulating the temperature of the inert gas G. The gas temperature controller controls the temperature of the inert gas G supplied to the laser irradiation area so as to decrease a temperature difference between the temperature of the inert gas G and the atmospheric temperature of a space (a room R) that is disposed outside the supply area of the inert gas so the temperature controlled inert gas surrounds the optical path of the laser light.Type: GrantFiled: June 17, 2009Date of Patent: November 5, 2013Assignee: IHI CorporationInventors: Norihito Kawaguchi, Ryusuke Kawakami, Kenichiro Nishida, Jun Izawa, Miyuki Masaki, Masaru Morita
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Patent number: 8530784Abstract: Some embodiments include methods, and systems of machining using a beam of photons. In some embodiments, a machining method to remove material in a machined region may include reducing transparency of the region to at least a predefined wavelength by irradiating the region with a first beam of photons to induce generation of free electrons in the region; and machining the region with a second beam of photons having the predefined wavelength. Other embodiments are described and claimed.Type: GrantFiled: January 28, 2008Date of Patent: September 10, 2013Assignee: Orbotech Ltd.Inventors: Uri El-Hanany, Arie Shahar, Alex Tsigelman, Zeev Gutman
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Patent number: 8502104Abstract: A method of building up an aluminum alloy part by welding is disclosed. The method includes the steps of manually depositing a layer of aluminum alloy powder on the part in a build-up zone and welding the powder layer onto the part by laser welding. A mask having an opening of dimensions corresponding to the dimensions of the build-up zone is positioned on the part and the layer of powder is deposited on the part both in the build-up zone and overlaps onto the mask around the build-up zone. The height of the powder layer relative to the surface of the part is calibrated prior to the welding step.Type: GrantFiled: February 19, 2008Date of Patent: August 6, 2013Assignee: SNECMA ServicesInventors: Cathy Chau, Katia Duverneuil
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Patent number: 8497451Abstract: An exemplary brittle non-metallic workpiece (70) is made by the laser beam (31), a cutting surface (701 ) of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device (40) for making the same is also provided.Type: GrantFiled: June 18, 2008Date of Patent: July 30, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Mu-Chi Hsu, Qing Liu, Guo-Han Yue, Chi-Lu Chih, Jun-Qi Li
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Patent number: 8487218Abstract: In a number of practical situations it is desirable to provide consistency with regard to a metering material presentation. For example, with regard to welding and shape metal deposition it is desirable to provide a homogenous vortex free cloud of gas shielding about a work piece prior to and subsequent to processing. Unfortunately, metering meshes are subject to distortion through thermal gradients. By providing a support matrix arrangement comprising a first planar member and a second planar member incorporating ribbon elements and deflector portions bilateral deflection in the plane of the metering mesh can be accommodated whilst outward buckling is avoided. In such circumstances there is consistency with regard to metering mesh presentation and therefore gas flow through shielding.Type: GrantFiled: October 1, 2007Date of Patent: July 16, 2013Assignee: Rolls-Royce PLCInventor: Jeffrey C. Bishop
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Patent number: 8487209Abstract: A laser welding apparatus and method reduce the effect of the fume resulting from a weld. An air injecting nozzle is installed at a laser processing head. The injecting direction of air from the air injecting nozzle is set such that the air flows across a laser beam irradiated from the laser processing head while the air flow avoids direct contact with the laser irradiating point on the work piece.Type: GrantFiled: March 8, 2007Date of Patent: July 16, 2013Assignee: Nissan Motor Co., Ltd.Inventors: Tsuyoshi Sakamoto, Kazuya Okada, Yasushi Morikawa, Takahisa Hasegawa, Atsushi Saito, Junichi Yamashita
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Patent number: 8487212Abstract: The present invention provides a method of and apparatus for marking or inscribing a workpiece (3) with high-energy radiation, more particularly with a laser beam (1), the workpiece (3) having a light-scattering surface (9) and the material of the workpiece (3) being transparent for the radiation wavelength, and a polymer matrix (7) being disposed on the workpiece (3) in such a way that the radiation passes through the workpiece (3) and its light-scattering surface (9) before impinging on the polymer matrix (7), characterized in that the light-scattering surface (9) of the workpiece (3) is wetted with a liquid or viscoelastic medium (11).Type: GrantFiled: October 28, 2009Date of Patent: July 16, 2013Assignee: tesa SEInventors: Arne Koops, Sven Reiter, Bernd Lühmann
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Publication number: 20130105452Abstract: A method for processing workpieces with a laser processing machine including a laser processing head having a nozzle receiving member configured to receive a laser nozzle. The method includes holding a workpiece on a workpiece support plane of a workpiece support, transferring a laser nozzle between a nozzle magazine of a nozzle changing device located at a first side of the workpiece support and a nozzle receiving member of the laser processing head located at a second side of the workpiece support such that the laser nozzle is assembled on or disassembled from the nozzle receiving member, and moving the laser nozzle through a through-opening defined in the workpiece support along a transverse direction to the workpiece support.Type: ApplicationFiled: December 18, 2012Publication date: May 2, 2013Applicant: TRUMPF Werkzeugmaschinen GmbH + Co. KGInventor: TRUMPF Werkzeugmaschinen GmbH + Co. KG
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Patent number: 8431859Abstract: A stress treatment device has an operating unit including a head unit performing peening by irradiating an inside of a hole formed in a structure with laser to form a compressive stress region in the hole; a laser unit having an optical fiber guiding the laser to the head unit; a jetting unit jetting liquid into the hole; and a support part supporting the optical fiber in a manner of allowing the jetted liquid to flow through and being fixed in the head unit.Type: GrantFiled: November 23, 2011Date of Patent: April 30, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Hidekazu Sasaki, Itaru Chida, Itaru Murakami, Hiroshi Nomura
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Patent number: 8373425Abstract: A method for determining a distance between a first piece and a second piece includes measuring, at the first or second piece, an AC signal, and determining the distance based on the measured AC signal. A system for determining a distance between a first piece and a second piece includes a measuring device adapted to measure, at one or both of the first and second piece, an AC signal, and a signal processing device adapted to determine the distance based on the measured AC signal. The AC signal includes a DC offset.Type: GrantFiled: April 4, 2008Date of Patent: February 12, 2013Assignee: Hypertherm, Inc.Inventors: Sanjay Garg, William J. Connally