Abstract: A device for welding a plurality of foils to one another by means of a laser, for use in a packaging machine, comprises a clamping unit configured for applying pressure to a plurality of foils in a predetermined area as well as for conducting the laser radiation used for the purpose of welding to this area. A method for welding a plurality of foils to one another by means of a laser in a sealing station comprises welding the foils to one another along a sealing seam by means of the radiation of the laser while pressing them together in the area of the sealing seam.

Abstract: This invention relates to a method producing a common rail excellent in fatigue strength from an inexpensive steel which uses as the material of the common rail a steel for high-strength liquid phase diffusion bonding having good toughness and fatigue strength, which steel contains, in mass %, C: 0.01 to 0.3%, Si: 0.01 to 0.5%, Mn: 0.01 to 3.0%, Cr: 1.0 to 12.0% and Mo: 0.1 to 2.0%, further contains, in mass %, V: 0.01 to 1.0%, B: 0.0003 to 0.01%, Ti: 0.01 to 0.05% and N: 0.001 to 0.01%, has P content limited to 0.03% or less, S content to 0.01% or less and O content to 0.01% or less, further has total content of grain boundary segregated embrittling elements As, Sn, Sb, Pb and Zn limited to 0.015% or less, and a balance of unavoidable impurities and Fe. The steel is used for liquid phase diffusion bonding.

Abstract: The invention firstly comprises a method of ablation processing including a step of ablating a region of a substrate (1) by way of a laser beam (3) characterized by a further step of removing debris ablated from the region (1) by way of a flow of a fluid (7), namely a gas or vapour, a liquid or a combination of these, wherein the flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter to remove the entrapped debris from the region by directing the flow of fluid with any entrapped debris away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.

Abstract: A laser machining nozzle herein obtained includes a main assist-gas nozzle (2) for emitting a laser beam (8) and a main assist-gas, and an auxiliary assist-gas nozzle (5) annularly surrounding the main assist-gas nozzle for emitting an auxiliary assist-gas, whereby a gold plating (12) is provided on an interior surface of the main assist-gas nozzle to reflect the laser beam, so that a temperature rise of the laser machining nozzle can be prevented, and even when the laser beam (8) is reflected on the interior surface of the laser machining nozzle, it is possible to reduce peeling of the gold plating (12) applied onto the interior surface of the laser machining nozzle.

Abstract: A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described.

Abstract: There is provided an improved laser shock hardening method and apparatus which can eliminate spattering of a liquid and waving of the liquid surface upon laser irradiation, and can stably irradiate a workpiece with a laser beam. Thus, the present invention provides in a laser shock hardening method for carrying out surface processing of a workpiece in contact with a liquid by irradiating through the liquid the surface of the workpiece with a pulsed laser beam intermittently emitted from a laser irradiation device, the improvement comprising: providing a solid transparent to the wavelength of the laser, serving as an entrance window to the surface of the liquid; allowing the liquid to be present in the light path of the laser beam between the solid and the surface of the workpiece; and allowing the laser beam to enter through the solid and irradiating through the liquid the surface of the workpiece with the laser beam, thereby shock-hardening the surface of the workpiece.

Abstract: The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.

Abstract: Devices for laser machining include a machining head for directing laser light towards a workpiece, the laser light being emitted from a laser light source and directed along an optical beam path and the machining head including one or more focusing optics that are arranged in the optical beam path, a collimator including one or more collimating optics that are arranged in the optical beam path in front of the focusing optics and the collimator having an axis that extends parallel to the main direction of the laser light at the collimating optics, one or more deflecting optics arranged in the optical beam path between the collimating optics and the focusing optics, the deflecting optics configured to deflect the laser light emerging from the collimating optics towards the focusing optics, wherein the machining head is adjustable relative to the collimator along a z-axis, and the axis of the collimator extends under an angle to the z-axis.

Abstract: The present invention discloses a coating layer removing apparatus and a method for the same. The apparatus of the present invention comprises a transport device displacing an electrode plate; a laser device having a laser head arranged above the displacement path of the electrode plate; and a control center electrically connected to the transport device and the laser device. The method of the present invention comprises mounting an electrode plate on the transport device; using the control center to set the speed of displacing the electrode plate, and program the time interval, count and penetration depths of the laser beams; and using the device of the present invention to form exposed areas equidistantly on the electrode plate. The apparatus of the present invention automatically removes a coating layer with a laser beam without directly contacting the electrode plate. Therefore, the present invention can fast form exposed areas of high quality.

Abstract: A laser processing apparatus is provided. The laser processing apparatus removes and extracts debris generated by irradiating a transparent resin layer formed on a substrate with laser light during a patterning process, and includes a debris extraction module provided on the upper side of the substrate, wherein the debris extraction module sucks and extracts debris due to sublimation, thermal processing and composite action thereof generated from the transparent resin layer on the substrate irradiated with the laser light from the lower side thereof.

Abstract: An apparatus for removing heavy metals from a thin film stack. A glass or plastic substrate has a front surface and a back surface and a heavy metal thin film is deposited on the back surface. A laser is provided for generating high density radiation. A scanning means directs the high density radiation through the substrate so that the high density radiation impinges upon the heavy metal thin film. The substrate is disposed in contacting relation to a flowing liquid and a liquid bath is provided for containing the flowing liquid and collecting heavy metal that is ablated by the high density radiation. The heavy metals are filtered from the liquid bath. The same parts can also remove heavy metals from both sides of a substrate or may be used to remove only peripheral edges of a thin film stack.

Abstract: A device for maintaining a cutting edge, e.g. a focused laser beam at a constant distance from a surface of the work piece as the cutting edge imposes a cut line in a coating on the surface of the work piece. The device includes a constant force spring connecting a tube to a support and a surface follower mounting an end of the tube. The positions of a surface of the surface follower and the cutting edge have a predetermined relationship to one another. Gas moving out of the tube provides a first gas bearing between the surface follower and inner surface of the tube, and gas moving through passageways in the surface follower provide a second gas bearing between the surface of the surface follower and a surface of the coating. The thicknesses of the bearings remain constant as the follower moves over the surface of the piece to maintain the cutting edge at a constant distance from the surface of the coating.

Abstract: A laser processing apparatus is provided for patterning with laser light a resin film or a metal film formed on a substrate. The apparatus includes a laser light source; and a debris collection device having a transmission window through which the laser light is transmitted, a vortex generation mechanism generating a vortex gas flow by allowing gas to flow into a region near a laser light-irradiated area of the resin film or the metal film, and a screening device having an opening through which the incident laser light passes and screening a flow of debris. The mechanism is placed close to the resin film or the metal film on the substrate. Debris generated by laser light irradiation and before and after being stacked on the object film is entrained in the vortex gas flow generated by the vortex generation mechanism and is exhausted to outside through the screening device.

Abstract: A laser beam treatment device capable of solving problem in a conventional technology that any uniform laser anneal cannot be realized since use of a galvano mirror changes the angle of incidence of the laser beam to the substrate and the reflected light from a back side of a transmissive substrate interferes with the reflected light from a surface of a semiconductor film or an interface between the semiconductor film and the substrate. Laser anneal is performed by using the laser beam treatment device comprising a laser, an optical system for shaping the laser beam oscillated from the laser, and a substrate holds to hold a work formed on the transmissive substrate, in which the substrate holder holds a liquid, and the liquid is brought into contact with the surface.

Abstract: A method of cutting bulk amorphous alloy includes: positioning a target cutting path of the bulk amorphous alloy in an atmosphere of an inert gas; cutting the target cutting path to form a cut surface using a pulsed laser; and removing a plurality of burrs located on the cut surface produced during the cut.

Abstract: An arrangement for the repair of BLISK blades damaged at their leading and trailing edges by use of laser deposition welding, includes a laser source and laser optics for generating a focused laser beam (26) and a powder line (35) connected to a powder reservoir for supplying metal powder to be melted by the laser beam to the weld area. A modular, tubularly elongated welding apparatus (7) with a connection module (13) which is connected to a laser source and in which the entering laser beam is deflected in longitudinal direction and parallelized, and to the one side of the connection module (13) is connected to a camera module for a CCD camera (12) enabling the precise positioning of the welding apparatus and the deposition of the molten metal powder on the respective blade to be monitored and controlled.

Abstract: A method for manufacturing integrally bladed rotors by laser brazing a rotor disk (1) made of a nickel or titanium-base material to blades (3) made of titanium aluminide. A brazing metal similar to the blade material is used, which is introduced into the laser beam (4) as brazing power jet (5) and whose heat capacity, which is controlled by the melting temperature and the volume of the molten metal bath This provides for melting of the disk material and alloying with this material, but not for melting of the blade material, to which it is connected by adhesion. Such blisk features a low blade weight, reduced centrifugal effects and enhanced service life.

Abstract: A method for laser fusion cutting of a metal workpiece including applying a laser beam to the workpiece, where a kerf is melted in the workpiece by the laser beam and a laser beam diameter in a working point is configured to expel molten material from the kerf without cutting gas.

Abstract: A system for laser shock peening includes a laser positioned to direct a laser pulse at a first side of a work piece and a coupler on a second side of the work piece. The system further includes a Doppler shift detector positioned to measure a velocity of the coupler. A method for laser shock peening includes depositing an amount of energy from a laser pulse into a first side of a work piece and transmitting a pulse having a first frequency at a second side of the work piece. The method further includes receiving a reflected pulse having a second frequency from the second side of the work piece and determining the velocity of the work piece based on the difference between the first frequency and the second frequency.

Abstract: A method for purging of, and debris removal from, a hole created with laser energy in which a swirling purge gas stream is provided in a hole containing debris to be removed, imparting a swirl to the debris and lifting the debris from a bottom of the hole. In accordance with one embodiment, the purge gas is swirled in a purge gas nozzle providing purge gas into the hole. In accordance with another embodiment of this invention, the purge gas is swirled directly in the hole.

Abstract: The invention relates to a method for severing brittle flat materials, for example made of glass, ceramic, silicon, gallium arsenide or sapphire. The method includes the step of heating the flat material along desired dividing lines below its melting temperature by means of a laser alone desired separating lines. Then the material is shocked by a coolant jet so that a thermally-induced mechanical stress difference brings about a material separation. Traces are formed in the flat material in advance along the separation lines, so that the flat material has a lower breaking stress along the traces than in the unworked flat material, and the separation with the laser takes place along these traces.

Abstract: A machining head includes a machining head element having an inner-head channel for passing laser light and assist gas, the nozzle having an inner-nozzle channel connecting to the inner-head channel and a nozzle orifice, pins protruding radially inward from a curved inner surface of the nozzle, a pin-locking part formed on the outside of the machining head element, the pin-locking part having pin-fitting openings, a head alignment part formed on a nozzle-side end surface of the machining head element, a nozzle alignment part formed on the nozzle at a location where the nozzle is aligned with the machining head element, and an O-ring fitted between the head alignment part and the nozzle to create a clearance between the head alignment part and the nozzle alignment part for mutual alignment.

Abstract: An exemplary water jet guided laser device includes a water-ejecting device and a hollow light guide pipe. The water-ejecting device has a water chamber, a light incident through hole and a water-ejecting through hole defined at opposite sides thereof. The light incident through hole and the water-ejecting through hole are in communication with the water chamber. The water-ejecting device is configured for ejecting water from the water chamber through the water-ejecting through hole. The light incident through hole is configured for introducing a laser beam in the water chamber. The hollow light guide pipe is mounted in the water chamber and aligned with the light incident through hole and the water-ejecting through hole. The light guide pipe is watertight and is configured for receiving and guiding the laser beam from the light incident through hole to the water-ejecting through hole.

Abstract: A method of capturing and removing metallic debris created on a target side of a target metal specimen undergoing laser micromachining entails providing a barrier that encompasses the immediate volume surrounding a laser cutting head output nozzle to contain the ejected debris and extracting the debris through a vacuum outlet. A preferred system implementing this approach to debris management includes a barrier in the form of a flexible fiber brush configured in the shape of a ring and positioned to trap ejected debris within a localized area surrounding a target area where the laser beam is incident on the target metal specimen. The ring brush is made of material that is robust to molten metals. An inert gas directed at a high flow rate along the target surface of the metal specimen carries ejected surface debris trapped in the ring brush toward a vacuum outlet.

Abstract: A laser machining apparatus comprising jet liquid, a laser beam, and a laminar flow forming channel for supplying jet liquid to a nozzle. The channel includes a distribution channel formed by a cavity, an interconnecting channel disposed to communicate with said channel downstream in an axial direction of the nozzle and formed by an annular cavity around the axis of the nozzle to provide a narrower flow passage, and a liquid reservoir chamber. Said chamber has an outer peripheral edge communicating with the interconnecting channel over an entire circumference of the annular shape. An outer peripheral surface and an outer peripheral surface of the chamber form a continuous surface and an inner peripheral wall surface and an inner peripheral surface of the channel are both formed as an inclined inward surface that is downstream, the inner peripheral surface and the inner peripheral wall surface forming a planar continuous surface.

Abstract: A laser processing machine having a laser processing head that is open to a workpiece has a device for providing gas to the laser beam guide that introduces a first gas through a first gas inlet into the laser beam guide and introduces a second gas through a second gas inlet into the laser beam guide.

Abstract: Methods used to perform an annealing process on desired regions of a substrate are disclosed. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially melt certain desired regions of the substrate to remove unwanted damage created from prior processing steps (e.g., crystal damage from implant processes), more evenly distribute dopants in various regions of the substrate, and/or activate various regions of the substrate. The preferential melting processes will allow more uniform distribution of the dopants in the melted region, due to the increased diffusion rate and solubility of the dopant atoms in the molten region of the substrate. The creation of a melted region thus allows: 1) the dopant atoms to redistribute more uniformly, 2) defects created in prior processing steps to be removed, and 3) regions that have hyper-abrupt dopant concentrations to be formed.

Abstract: A laser machining nozzle having at least one supply chamber for the laser beam and for a processing gas has a cavity arranged in the region of the orifice of the gas supply chamber, which cavity is open in the direction towards the workpiece to be machined, this opening having a wedge-shaped edge.

Abstract: A processing apparatus is provided in which a laser beam L2 is irradiated onto a processing portion of a workpiece W, and at the same time as the laser irradiation, an assist gas G is injected toward the processing portion from a nozzle 3 arranged concentric to the laser beam L2 so that the processing portion is covered with the assist gas G, thereby processing a piercing hole H on the processing portion. The apparatus includes control means 10 for processing a piercing hole H while moving the nozzle 3 within the range of 5 mm from a processing start point after the irradiation of the laser beam L2 is started.

Abstract: A method for fabricating a composition of Zr-rich bulk amorphous alloy includes providing a weld member and a base, both made of Zr-rich bulk amorphous alloy, and welding the weld portion of the weld member to the base by a pulsed laser in a protective gas environment. A maximum power of the pulsed laser exceeds or equals 3.5 kW, and a welding rate exceeds 2 mm/sec.

Abstract: A laser cutting/welding installation including a laser head configured to deliver a laser beam and a cooling device for cooling the laser head is disclosed. The laser beam is designed to generate a hot spot on a workpiece by incidence thereon and form a solder bath from a portion of the workpiece affected by the hot spot. The cooling device includes a vortex tube with a compressed gas inlet supplied with a compressed gas, a cold gas outlet, and a hot gas outlet. The vortex tube cold gas outlet is plumbed directly to an interior volume of the laser head and configured to deliver a cold gas directly to the interior volume of the laser head for cooling thereof.

Abstract: A laser machining apparatus comprises a nozzle for ejecting a jet liquid to a workpiece and a liquid supply unit for supplying the jet liquid to the nozzle, while a laser beam is introduced into a jet liquid column ejected from the nozzle. The laser machining apparatus further comprises a laminar flow forming channel for supplying the jet liquid to the nozzle in a laminar state.

Abstract: The present invention relates to hard coating of ferrous metal substrates using a laser beam with diamond particles in a metal matrix produced from precursor powders of metals which bond to the diamond particles and to the ferrous substrate. The hard coating is particularly useful for white iron castings for pumps (200) used in piping tar sand and water mixtures.

Abstract: The brittle workpiece splitting system 1 includes a substrate holding mechanism 10 for holding a substrate 51, and a processing unit 5 for splitting the substrate 51 held by the substrate holding mechanism 10 by a splitting process. The substrate holding mechanism 10 has an edge damper 12 adapted to clamp an edge part of the substrate 51 from the sides of the opposite surfaces of the edge part, and support members 19 for supporting the substrate 51 thereon at a predetermined height. The support members 19 are disposed on the side opposite the side of the edge damper 12 with respect to the intended split line 61 parallel to the edge part of the substrate 51. The edge damper 12 has an edge holder 15 on which the substrate 51 is seated, and a pressure bar 14 for pressing the substrate 51 against the edge holder 15 to hold the substrate 51 between the edge holder 15 and the pressure bar 14.

Abstract: A technique to control segregation of impurities when reforming crystallinity and crystallization of a semiconductor film by using a laser beam irradiation is provided. The present invention is to irradiate the substrate with applying ultrasonic vibration while keeping the end portion of the substrate in space. The substrate on which a semiconductor film is formed is kept onto the stage provided with opening pores, and floated by spouting gas from opening pores. Supersonic vibration can be efficiently provided to the substrate by irradiating with a laser beam with ultrasonic vibration while keeping the end portion of the substrate.

Abstract: Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interface of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.

Abstract: A drain port and an exhaust port arranged at the bottom of a cup surrounding a substrate holding unit. A drainage tray is arranged below the cup so as to cover the moving area of the drain port when the substrate holding unit and the cup move in X-directions and Y-directions. An exhaust unit is arranged at a position corresponding to the position of the exhaust port of the cup when the substrate holding unit is in its spin-drying position. The exhaust unit is connected to the exhaust port to suck the interior of the cup when the spin-drying of the substrate is executed. The use of a flexible tube which is always connected to the exhaust port is no longer necessary.

Abstract: An energy collector is used to assist a laser coupling process by reducing the amount of output power of a laser that is used to modify a device attaching element. The energy collector includes an energy collector tip configured to be placed proximate to a device attaching element during the laser coupling process. The energy collector tip is configured to receive laser energy reflected from the device attaching element during the laser coupling process and is formed from a material that converts this reflected energy to heat. Sufficient thermal coupling is created between the energy collector and a surface to provide a conductive pathway for the energy, which has been converted to heat, between the energy collector and the device attaching element.

Abstract: An exemplary laser cutting device (300) includes a laser source (40), a lens module (51), a sprayer (60), a rotating subassembly (52), and a driving member (55). The lens module is configured for focusing a laser beam emitting from the laser source. The sprayer is rotatably connected to the lens module. The rotating subassembly is connected to the lens module. The rotating subassembly is configured for driving the lens module to rotate, such as to make the laser beam rotate relative to an axis of the laser beam. The driving member is connected to the lens and configured for driving the sprayer to rotate relative to the lens module.

Abstract: An apparatus for comprises a base, a wall, and an opening in the wall. The base has a first end, a second end, and a channel system. The channel system is located closer to the first end than the second end of the base. The wall extends from a side of the base to partially enclose the channel system. The opening in the wall is located closer to the second end than the first end. The shape of the wall is capable of retaining a gas introduced through the channel system in a welding location and causing the gas to move away from the channel system and through the opening in the wall.

Abstract: A method for connecting pipe members for an endoscope includes the steps of arranging two pipe members each made of a corrosion-resistant alloy material by fitting one in another so that a passage is defined through the two pipe members, jetting inert gas toward an exterior of an area at which the two pipe members are to be connected, injecting inert gas through the passage defined through the two pipe members, and connecting the two pipes by laser welding such that a laser beam is irradiated toward the exterior of the area at which the two pipe members are to be connected with jetting the inert gas toward the exterior of the area at which the two pipe members are to be connected and injecting the inert gas through the passage defined by through the two pipe members.

Abstract: An exemplary laser cutting device (300) includes a laser source (40), a lens module (51), a sprayer (60), a first rotating subassembly (52), and a second rotating subassembly (53). The lens module is configured for focusing a laser beam emitting from the laser source. The first rotating subassembly is connected to the lens module and configured for driving the lens module to rotate relative to the laser source. The second rotating subassembly is rotatably connected to the lens module. The sprayer is connected to the second rotating subassembly and driven to rotate relative to the laser source by the second rotating subassembly.

Abstract: A method of repairing a turbomachine blisk having at least one damaged zone by build-up of metal in the damaged zone using a laser build-up welding machine is disclosed. The method includes preparing the damaged zone by machining the damaged zone to obtain a zone of defined profile to be repaired, build-up welding of a start-of-run test piece that includes the defined profile using the laser build-up welding machine, checking geometric and metallurgical quality of the test piece, and build-up welding the zone to be repaired of the blisk using the laser build-up welding machine.

Abstract: A laser shock peening process for producing one or more compressive residual stress regions in a medical device is disclosed. A high-energy laser apparatus can be utilized to direct an intense laser beam through a confining medium and onto the target surface of a workpiece. An absorption overlay disposed on the target surface of the workpiece absorbs the laser beam, inducing a pressure shock wave that forms a compressive residual stress region deep within the workpiece. Medical devices such as stents and guidewires having one or more of these compressive residual stress regions are also disclosed.

Abstract: A processing machine for workpiece processing includes a cutting head that produces a cutting beam directed toward a workpiece, and a beam-catching device for receiving a discharge of the cutting beam from an underside of the workpiece during processing of the workpiece. The beam-catching device includes a housing defining an opening that opens toward the cutting beam and a beam-catching space adjacent the opening, the cutting beam discharging from the underside of the workpiece during the processing of the workpiece and entering the beam-catching space of the housing through the opening. The beam-catching device also includes at least one nozzle on at least one wall section of the housing, the nozzle feeding a fluid jet as a free jet to the beam-catching space in such a way that the at least one fluid jet crosses the cutting beam.

Abstract: A method and an apparatus for repairing gas-turbine blisks uses an endoscope 15 provided with processing optics featuring a flexible light guide arrangement 16. A laser source 9 is connected to a flexible optical fiber arrangement 10, with a filler material feeder 7 for supplying welding flux via a flexible line 8, with a water supply 11 connected to a flexible line 12, and with an inert gas supply 13 connected to a flexible line 16 for supplying inert gas, with the flexible lines 8, 12, 14, the flexible light guide arrangement 16 and the flexible optical fiber arrangement 10 being combined to form a flexible long repair implement 17 at least at its distal end areas.

Abstract: A method and an apparatus of minimizing the deposition of debris onto a sample being ablated. The method comprising the steps of: 1) reducing a laser pulse energy to approximately a threshold level for ablation; and 2) ablating a region of the sample using a multitude of laser pulses, each pulse being sufficiently separated in time to reduce a concentration of ablation products in a gas phase. An apparatus for ablating a region of a sample with a laser beam. The apparatus comprises: 1) a source providing a pulsed laser beam of a certain energy, the source focusing the laser beam on the sample to ablate a region of the sample; and 2) a device for providing a flowing fluid over the region being ablated to remove the ablation products.

Abstract: The present invention is an annealing apparatus configured to perform an annealing process to an object to be processed, the annealing apparatus comprising: a processing vessel in which the object to be processed can be accommodated; a support unit configured to support the object to be processed in the processing vessel; a gas supply unit configured to supply a process gas into the processing vessel; an exhaust unit configured to discharge an atmosphere in the processing vessel; and a rear-side heating unit including a plurality of laser elements configured to irradiate heating light beams toward an overall rear surface of the object to be processed.

Abstract: A laser scanner system for removing a coating from a surface.

Abstract: Laser-based material processing systems, exhaust systems, and methods for using such systems are disclosed herein. One embodiment of a laser-based material processing system can include an exhaust assembly configured to remove contaminants from a material processing area. The exhaust assembly can include a vacuum source and an exhaust plenum carried by a moveable arm of a gantry-style laser beam positioning assembly. The moveable arm can extend along a first axis and can be moveable along a second axis generally normal to the first axis. The exhaust plenum can extend lengthwise in a direction generally parallel with the first axis. The exhaust assembly can also include an intake slot extending lengthwise along the exhaust plenum across at least a portion of the material processing area. The exhaust assembly can further include one or more flexible exhaust ducts in fluid communication with the vacuum source and the exhaust plenum.