Abstract: An optical device includes a first transparent substrate having a first transparent electrode disposed on a surface of the first transparent substrate and a second substrate having a second electrode disposed on a surface of the second substrate and facing the first transparent electrode. A liquid-crystal (LC) material is sandwiched between the first and second electrodes such that a voltage applied between the first and second electrodes controls orientation of the liquid-crystal material. The device includes a control system that applies a current through at least one electrode of the first and second electrodes to resistively heat the LC material.

Abstract: A power control system includes: an ECU configured to control (i) charging from a power facility to a vehicle and (ii) discharging from the vehicle to the power facility; and a user terminal configured to allow a user to separately set a charging power setting value and a discharging power setting value. When the charging from the power facility to the vehicle is performed, the ECU is configured to control power charged to the vehicle per unit time to correspond to the charging power setting value set by the user using the user terminal. When the discharging from the vehicle to the power facility is performed, the ECU is configured to control power discharged from the vehicle per unit time to correspond to the discharging power setting value set by the user using the user terminal.

Abstract: A heating cooker system includes a first coil configured to produce a first high-frequency magnetic field by receiving supply of a first high-frequency current, a first inverter circuit configured to supply the first high-frequency current to the first coil, a first heating element positioned in reach of the first high-frequency magnetic field produced by the first coil to be inductively heated by the first coil, a second coil configured to produce a second high-frequency magnetic field by receiving supply of a second high-frequency current, a second inverter circuit configured to supply the second high-frequency current to the second coil, a power receiving coil positioned in reach of the second high-frequency magnetic field produced by the second coil to receive electric power from the second coil, and a second heating element configured to generate heat by the electric power received by the power receiving coil.

Abstract: A cooking engagement system and methods therefore are provided. The system includes a cooktop appliance and an interactive assembly positioned above the cooktop appliance. The interactive assembly includes an image monitor that presents various images and information to a user, e.g., recipes. The system includes an infrared sensor for detecting operation of the cooktop appliance. When the infrared sensor senses a temperature level that exceeds a threshold, a controller communicatively coupled thereto activates an air handler to move or motivate an airflow across or about the image monitor. In this way, the image monitor may be cooled and condensation is prevented from forming on the imaging surface of the image monitor.

Abstract: A wireless power transmitting device may transmit wireless power signals to a wireless power receiving electronic device. The electronic device may have a coil that receives the transmitted wireless power signals and may have a power receiving circuit that rectifies the received wireless power signals to produce a corresponding direct-current voltage signal. The direct-current signal may be used to power circuitry in the electronic device and may be used to charge a battery in the electronic device. Control circuitry in the electronic device may use a temperature sensor to make temperature measurements. In response to detecting that the device is below a given threshold temperature and based on other information such as information on which applications are running on a controller in device, the device may supply drive current signals to the coil to heat the battery and improve battery performance.

Abstract: An apparatus and method of keeping an energy storage cell at or above a target temperature, includes receiving at a processing circuit, an analog voltage that is proportional to a temperature of the energy storage cell, converting, at the processing circuit, the analog voltage to a pulse-width-modulated signal having a duty cycle that is proportional to the analog voltage, and driving a switch, with the pulse-width-modulated signal, between conductive and non-conductive states to modulate a voltage passing across (or a current flowing through) a heating element in series with the switch, the heating element being in thermal communication with the energy storage cell, wherein the duty cycle of the pulse-width-modulated signal is adjusted to maintain the temperature of the energy storage cell at or above the target temperature.

Abstract: A device and method for a MEMS device with at least one sensor is disclosed. A thermal element is disposed in the MEMS device to selectively adjust a temperature of the MEMS device. A calibration operation is initiated for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature. The correction value is stored.

Abstract: A vehicle traction battery assembly may include a traction battery cell, a case, and a thermal plate. The case may define a cavity to receive the traction battery cell and has a first side defining a first form feature. The thermal plate may be for positioning adjacent the traction battery cell and define a coolant channel sized for engagement with the case via the first form feature such that traction battery cell is in thermal communication with coolant flowing through the coolant channel. The first form feature may be serpentine-shaped or S-shaped. The first form feature may be castle-shaped from a cross-sectional plan view. The case may be multi-layered and include a first polymer layer, a second polymer layer, and an aluminum layer disposed between the polymer layers.

Abstract: Disclosed are an energy harvesting apparatus and a current control circuit which include: a current control unit; a first voltage control unit that controls the current control unit so that an input voltage to the current control unit becomes equal to or higher than a first voltage; and a second voltage control unit that controls the current control unit so that an output voltage from the current control unit becomes equal to or lower than a second voltage which is equal to or higher than the first voltage.

Abstract: A shape memory actuator system and control methods thereof are provided that include a shape memory actuator having a body made of shape memory material, with individual power conductors interfaced with a first portion of the body, and one or more individual ground conductors interfaced with a second portion of the body. A power source provides power to the individual power conductors. One or more controllers are provided for pulse controlling or regionally controlling a resistive heating current connection sufficient to impart shape memory to the body or regions of the body between the individual power conductors and the one or more individual ground conductors with the provision that the ground conductors are physically separated from the individual power conductors. Structures of shape memory actuators and methods of control are also provided.

Abstract: In one embodiment, a testing apparatus comprises: a modularized logic unit comprising circuitry for testing a plurality of devices under test (DUTs); a DUT interface board for physically and electrically interfacing with said modularized logic unit, said DUT interface board comprising: a loadboard comprising a plurality of sockets for receiving said plurality of DUTs; and a partial enclosure for partially enclosing said plurality of DUTs; a top fan disposed adjacent to a top of said partial enclosure; and a bottom fan disposed adjacent to a bottom of said partial enclosure, wherein the top fan and the bottom fan are operable to generate a vertical ambient air flow from the bottom fan to the top fan to cool said plurality of DUTs with exposed top and bottom sides, wherein the bottom fan is operable to draw ambient air from a surrounding environment.

Abstract: A battery support structure for a vehicle includes a first peripheral member configured to be supported by a longitudinal section of a vehicle frame. A second peripheral member has an end surface that selectively attaches at an inside surface of the first peripheral member to enclose a corner section of a battery containment area. Prior to fixed attachment of the first and second peripheral members, a slip plane is defined between the end surface and the inside surface to adjust the second peripheral member along the first peripheral member to a predefined dimension of the battery containment area.

Abstract: Embodiments of the invention include a temperature sensing device that includes a base structure that is positioned in proximity to a cavity of an organic substrate, an input transducer coupled to the base structure, and an output transducer coupled to the base structure. The input transducer includes a first piezoelectric material to generate vibrations which are transmitted on the base structure in response to input signals being applied to the input transducer. The output transducer includes a second piezoelectric material to receive the vibrations and to generate output signals which are used to determine a change in ambient temperature.

Abstract: A battery pack includes a lower case having a plurality of cell fastening portions fastened to a plurality of cells, respectively, and a bracket to support the lower case to a floor panel of a vehicle. The bracket has a plurality of case fastening portions fastened to the lower case, and a body fastening portion to be fastened to the floor panel. The body fastening portion is disposed on the outer side of the vehicle relative to an outermost cell fastening portion disposed on the outermost side of the vehicle of the plurality of cell fastening portions. The case fastening portions are disposed on the inner side of the vehicle relative to the outermost cell fastening portion.

Abstract: A thermal management system includes an integrated circuit (IC). The IC includes a plurality of digitally addressable sectors. Each sector includes an on-die sensing element. The on-die sensing element includes an on-die temperature sensor configured to measure a sector temperature and provide an analog signal associated with the sector temperature; and an on-die digitizer configured to generate a digital sensed temperature signal based on the analog signal. The IC further includes a first output configured to output a plurality of digital sensed temperature signals from the plurality of sectors.

Abstract: An alert sensing stove assembly includes a stove that includes a plurality of burners. A plurality of valves is provided and each of the valves is in fluid communication with an associated one of the burners. A processor is coupled to the stove and the processor is electrically coupled to each of the valves. A sensor array is coupled to the stove to detect a variety of alert agents. The processor sends a shut down signal to each of the valves when the sensor array detects one of the alert agents. Thus, the sensor array enhances safety with respect to unattended operation of the stove. A communication unit is provided and the communication unit is coupled to the stove. The communication unit transmits an alert signal to an extrinsic communication network when the processor sends the shut off signal to alert a user to a potentially dangerous situation.

Abstract: A system and method for heating silicon carbide substrates is disclosed. The system includes a heating element that utilizes LEDs that emit light at wavelengths between 600 nm and 650 nm. This wavelength is better absorbed by silicon carbide. In certain embodiments, collimating optics are disposed between the LEDs and the silicon carbide substrate. The collimating optics may increase the allowable distance between the LEDs and the substrate. In other embodiments, a diffuser is disposed between the LEDs and the substrate. In addition, a method of heating a substrate is disclosed. The relationship between absorption coefficient and wavelength is determined for the substrate. Based on this relationship, an optimal wavelength or range of wavelengths is selected. The substrate is then heated using an LED emitting light at the optimal wavelengths.

Abstract: Some embodiments include methods of forming voids within semiconductor constructions. In some embodiments the voids may be utilized as microstructures for distributing coolant, for guiding electromagnetic radiation, or for separation and/or characterization of materials. Some embodiments include constructions having micro-structures therein which correspond to voids, conduits, insulative structures, semiconductor structures or conductive structures.

Abstract: A probe system includes a heater and a control circuit. The heater includes a resistive heating element routed through the probe system. An operational voltage is provided to the resistive heating element to provide heating for the probe system. The control circuit is configured to provide the operational voltage and monitor a capacitance between the resistive heating element and a metallic sheath of the heater over time. The control circuit is further configured to determine a remaining useful life of the probe system based on the capacitance.

Abstract: Disclosed herein is an X-ray detector comprises: an X-ray absorption layer configured to absorb X-ray photons; an electronics layer comprising an electronics system configured to process or interpret signals generated by the X-ray photons incident on the X-ray absorption layer; and a temperature driver in the X-ray absorption layer or the electronics layer.

Abstract: An oscillator includes a vibration element, an oscillation circuit configured to oscillate the vibration element and output an oscillation signal, a temperature sensor, a temperature compensation circuit configured to compensate for a frequency temperature characteristic of the vibration element based on an output signal of the temperature sensor. The vibration element is within a first case having a first atmosphere, and the oscillation circuit, the temperature sensor, and the first case are within a second case having a second atmosphere, whereby the first atmosphere has a higher thermal conductivity than the second atmosphere.

Abstract: The invention relates to a device for the heat treatment of a product, comprising an enclosure, means of conveyance inside the enclosure, which comprise a screw mounted so as to rotate in the enclosure about a geometrical rotational axis and means for rotating the screw about said axis, and means for heating the screw by Joule effect. According to the invention, the screw comprises a strip which is made of an electrically insulating material and is applied to the screw so as to form an outer circumference of the screw.

Abstract: An electronic device that includes a first electronic component with a pin element and a second electronic component with a solder element. A joint is formed that provides an electrical and mechanical connection between the first electronic component and second electronic component when the pin element is heated, inserted into the solder element, and cooled.

Abstract: In some examples, a method of regulating a temperature of a printhead includes charging, in a first state of a temperature regulator, an analog memory to a reference voltage that corresponds to a predetermined temperature of the printhead. The temperature regulator monitors, during a second state, the temperature of the printhead, the monitoring including measuring a thermal voltage representing an actual temperature of at least a first local area of a plurality of local areas of the printhead, and comparing, with a comparator, the reference voltage to the thermal voltage to obtain a comparison result for at least the first local area. Based on the comparison result, a series of warming pulses from a warming pulse circuit to at least the first local area is selectively enabled.

Abstract: The present application discloses a circuit board and a method for manufacturing the same, and a terminal test device. The circuit board includes a base substrate, and a plurality of conductive lines on the base substrate, each of the plurality of conductive lines having one end configured to be connected with a signal output bus of a signal generator and the other end configured to be connected with a terminal. A fuse is connected in series in each conductive line, and a breaking current IT of the fuse, a maximum operating current I of the conductive line and a fault current IF of the conductive line satisfy: I<IT?IF, where the breaking current IT of the fuse is a minimum current that causes the fuse to open.

Abstract: A high-voltage unit casing 10 for on-vehicle use to house therein a plurality of devices includes: a first side face 20; a second side face 21 opposed to the first side face; and a connecting portion 22 for structurally connecting the first side face and the second side face to each other. The connecting portion includes a partitioning portion 50 which is fixed to the first side face at a fixing portion and which extends from the fixing portion toward the second side face, the partitioning portion being located at a position separate from an upper surface and a lower surface of the high-voltage unit casing in an inner surface of the first side face. Spaces for placing at least one device included in the plurality of devices are formed on both upper and lower sides, respectively, of the partitioning portion.

Abstract: An approach to reduce thermal cycling fatigue associated with an identified component in an electrical system. The approach includes a controller determining power to the electrical system is turned off and initiating power from an external power source to one or more heating elements in a vicinity of the identified component. The approach includes a controller receiving a first temperature from one or more temperature sensors in the vicinity of the identified component and determining whether the first temperature is within a predetermined temperature range. Responsive to the controller determining that the first temperature is not within the predetermined temperature range, the approach includes the controller adjusting a power level of the one or more heating elements.

Abstract: A compressor driving apparatus and an air conditioner including the same, whereby the compressor driving apparatus includes a capacitor connected to a DC terminal, an inverter, including a plurality of three-phase switching devices, to convert DC power from the capacitor into AC power to drive a compressor motor, an output current detector to detect output current flowing in the motor, and a controller to output a switching control signal for controlling the inverter based on the output current, wherein the controller performs control such that some of the three-phase switching devices in the inverter are turned on or off in a compressor preheating mode.

Abstract: A sample holder 2 for holding a capillary 40 for X-ray analysis has a first thermal transport member 36 on the base portion 14 on one side of a longitudinal slit 12 and a second thermal transport member 38 on the base portion 16 on the other side. The thermal transport members 36, 38 are compressed between a frame 30 and the base portion 14, 16 in the transverse direction to urge the edges of the first and second thermal transport members together, to hold a capillary 40 longitudinally aligned with the longitudinal slit 12.

Abstract: A calibration device including a thermal sensing device, and a reference heater, where the heater and the sensing device are integrated together, the heater and the sensing have at least one dimension substantially in common, and the over all dimensions are in the range of thermal micro probes, 100 nm-500 microns.

Abstract: An electronic device that includes a first electronic component with a pin element and a second electronic component with a solder element. A joint is formed that provides an electrical and mechanical connection between the first electronic component and second electronic component when the pin element is heated, inserted into the solder element, and cooled.

Abstract: A power and control device (1) for medium voltage applications characterized in that it comprises a power and control unit (2) having a first feeding port (21) electrically coupleable with electric power supply means (60), a first control device (3) operatively coupled to said first feeding port, said first control device being adapted to prevent the electrical feeding of said power and control unit through said first feeding port, when the operating temperature of said power and control device is lower than a first threshold value (TH1) indicative of a minimum operating temperature provided for said power and control unit.

Abstract: Provided are an apparatus for manufacturing a semiconductor device and a method of manufacturing a semiconductor package using the same. The manufacturing apparatus may include a base with a plurality of through holes and weight blocks respectively bound by the through holes.

Abstract: A rotary encoder of the present invention has a hermetically sealed structure having at least one desiccant and an electric circuit by which the moisture absorbing amount of the desiccant can be obtained. The desiccant is arranged in a sealed space defined by a flange and a cover member. The electric circuit, a rotary slit plate, a light emitting element and a light receiving element are arranged in the sealed space.

Abstract: A substrate processing system includes a processing chamber, a pedestal arranged in the processing chamber, and an electrostatic chuck (ESC) arranged on the pedestal. The ESC contains a printed circuit board assembly (PCBA) made up of a plurality of printed circuit board layers to mount circuitry that controls operation of the ESC. One or more of the printed circuit board layers includes a heater layer having one or more metal traces, which may be copper, to cover some or all of a surface of the heater layer sufficiently to provide heat to one or more of the remaining printed circuit board layers, to maintain the circuitry within a predetermined temperature range. The heat may be conducted directly among the various other printed circuit board layers, or may be conducted through vias in various ones of the printed circuit board layers.

Abstract: A method of operating an electric vehicle having a battery system with a first battery module and a second battery module includes sending a triggering signal. And, in response to the triggering signal, selectively dissipating energy from the first battery module without dissipating energy from the second battery module.

Abstract: Interferometer (10) for the real-time measurement of absolute distances and/or relative position movements between a first and a second machine part, comprising a measurement unit (20) and a reflector unit (40). wherein the measurement unit (20) comprises a housing (21) with at least one wall made of heat-conducting material, wherein several measurement elements are arranged in the housing (21), wherein the measurement elements comprise: a laser source (22), a Peltier element (24) and a digital control (23) wherein the measurement elements are thermally coupled to the wall of the housing (21) made of heat-conducting material.

Abstract: A sensor is compensated by selectively activating a temperature element to drive temperature within the thermal envelope encompassing the sensor towards an operating temperature and applying a compensation to output of the sensor based at least in part on the operating temperature. The initial ambient temperature is estimated and the operating temperature is selected from a set of predetermined temperatures based on the estimate. The current ambient temperature is estimated and a new operating temperature selected when the current ambient temperature is within a threshold of the operating temperature. Correspondingly, the temperature element is selectively activated to drive temperature within the thermal envelope towards the new operating temperature and an appropriate compensation is applied to the sensor output.

Abstract: An apparatus with a burn-in board containing a microcontroller unit and a heater socket for insitu testing of a packaged integrated circuit while under stress. A method for insitu testing of a packaged integrated circuit while under stress. A method for insitu testing of multiple packaged integrated circuits while under stress.

Abstract: Disclosed is a probe card case for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.

Abstract: A field-effect transistor includes a source electrode, a drain electrode, and a control electrode. The control electrode is configured as a heating unit having two terminals for receiving a heating voltage for heating the control electrode. The heating unit is configured as a meander-type heating element. A current-measuring device is configured to detect a current flowing between the source electrode and the drain electrode.

Abstract: Some embodiments include methods of forming voids within semiconductor constructions. In some embodiments the voids may be utilized as microstructures for distributing coolant, for guiding electromagnetic radiation, or for separation and/or characterization of materials. Some embodiments include constructions having micro-structures therein which correspond to voids, conduits, insulative structures, semiconductor structures or conductive structures.

Abstract: An apparatus including an analog memory, a temperature sensor, a comparator, and a pulse circuit. The analog memory is charged to a reference voltage corresponding to a predetermined temperature of a printhead. The temperature sensor measures a thermal voltage of at least one of the plurality of local areas of the printhead. The comparator obtains a comparison result by comparing the reference voltage to the thermal voltage. The pulse circuit selectively transmits a series of warming pulses to the at least one of the plurality of local areas of the printhead based on the comparison result.

Abstract: An apparatus for the thermal testing of electronic devices may include a universal base board for coupling to an electronic driver unit for receiving electrical signals therefrom, and a plurality of test boards arranged on the base board. Each test board may include a holder for receiving a device under test and routing thereto electrical signals from the electronic driver unit as well as an adaptation board to the base board. Each test board may include a respective electrically powered heating element for heating the electronic device received thereat.

Abstract: Provided is a method for recovering output of a gas sensor in shorter time. The method includes: determining a recovering temperature T1 and a recovering time ??1 based on a condition setting range where a high recovery rate is expected; and recovering the output based on T1 and ??1, wherein in the recovering, a duty ratio for a heater is instantly increased to value D1 higher than a value in a normal driving mode when the recovering starts, D1 is maintained up to T1, and PID control is performed by reducing the duty ratio to value D2 to maintain T1. After an elapse of ??1, the duty ratio is reduced to value D3. When the temperature of the element reaches a value 1 to 1.2 times as high as the temperature in the normal drive mode, the duty ratio is instantly changed to value D0 in the normal drive mode.

Abstract: Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for providing a thermal interface to a PCB may include a heat sink couplable to a printed circuit board (PCB) via a thermal interface. The heat sink may include a base configured to accommodate a plurality of heat pipes. The system may further include a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB. Other embodiments may be described and/or claimed.

Abstract: Disclosed is a touchscreen. The touchscreen can include a base material, a first coating, and a controller. The first coating can be applied to the base material. The first coating can be configured to generate an input signal. The controller can be configured to apply a base signal to the first coating, and filter the input signal from a combined signal. The combined signal can include the input signal and the base signal.

Abstract: A battery management system comprises a circuit for controlling a heating component for a battery to prevent overheating of the battery. The circuit can include an RTD, a primary resistor and a secondary resistor, wherein respective reference voltages are compared to generate a signal. The signal can be filtered and converted to a digital signal for use to by a software programmable processing device (SPPD) to control a temperature of the battery via the heating component. Further, a method is provided that allows hardware only comparison of the nonlinear temperature representation to a fixed set point.

Abstract: The present invention relates to an electrical energy storage apparatus having a plurality of electrical storage cells connected in series and to an inductive balun for balancing the storage cell voltages, wherein the balun has a balancer transformer having separate single coils for the storage cells and has a respective electric switch for each storage cell. Provision is made in accordance with the invention that the coils of the balancer transformer are connected to a pole of the respective storage cell via a respective at least one inductance and a switch connected to the named inductance, with the switch associated with one respective storage cell being connected via a diode to a pole of a storage cell respective arranged upstream or downstream.