Abstract: A heating device is provided. A temperature sensing unit is configured to sense an ambient temperature and accordingly output a temperature sensing voltage. A driving unit is coupled to a heating transistor unit and the temperature sensing unit, and configured to drive the heating transistor unit for performing heating based on the temperature sensing voltage. An activating unit is coupled to the temperature sensing unit, configured to output an activating signal based on the temperature sensing voltage when a temperature of the printed circuit board has risen up to a preset temperature. The heating device as provided can assure that the activating signal can be normally outputted by the heating device under an ambient at an extremely low temperature.

Abstract: A memory heater and heating air arrangement includes circuit module including circuit board, a plurality of memory modules mounted at the circuit board, memory heat sink wrapped around each memory module and locating member mounted at the circuit board around the memory modules, heating aid including flat heat-transfer base panel bonded to top side of the memory heat sinks, mounting structure located at the border of the flat heat-transfer panel and affixed to the locating member to secure the heating aid to the circuit module, and a heater attached to a top surface of the flat heat-transfer base panel of the heating aid and controllable by the circuit module to emit heat to the memory modules via the heating aid, enabling the memory modules to work under a cold environment. Subject to the functioning of the heating aid, one single heater is sufficient to heat the memories, saving the cost.

Abstract: In one embodiment, the present invention includes an infrared apparatus to heat a body. The infrared apparatus includes layers. The first layer has a first conductive path coupled to pass a first current. The second layer has a second conductive path running coincident to the first conductive path. The second layer terminates an electric field produced within said first layer. The first conductive path includes a resistive element that produces heat from the current.

Abstract: A heat pump device includes: a compressor that compresses a refrigerant; a motor that drives the compressor; a wiring switching unit that switches a wiring structure of the motor; an inverter that applies a desired voltage to the motor; and an inverter control unit that generates a PWM signal for driving the inverter, that includes, as an operation mode, a heating operation mode in which a heating operation is performed on the compressor and a normal operation mode in which a refrigerant is compressed by performing a normal operation on the compressor, and that controls a switching operation of the wiring switching unit in accordance with an operation mode.

Abstract: Provided is a heating sheet for a battery module, including: a surface heating element; an insulating layer on one surface of the surface heating element; and an insulating adhesive layer on the other surface of the surface heating element, in which the area of the heating portion of the surface heating element is 40% to 90% of the entire area of the battery cell to which the surface heating element is attached. Also provided is a battery module including the heating sheet for a battery module and the battery cell, in which the area of the heated portion of the battery cell is 40% to 90% of the entire area of the battery cell.

Abstract: Endodontic instruments for use in performing root canal therapy on a tooth are disclosed. In one form, the instruments include an elongate shank having a cutting edge extending from a distal end of the shank along an axial length of the shank. The shank comprises a titanium alloy, and the shank is prepared by heat-treating the shank at a temperature above 25° C. in an atmosphere consisting essentially of a gas unreactive with the shank. In another form, the endodontic instruments have an elongate shank having a cutting edge extending from a distal end of the shank along an axial length of the shank. The shank consists essentially of a titanium alloy selected from alpha-titanium alloys, beta-titanium alloys, and alpha-beta-titanium alloys. The instruments solve the problems encountered when cleaning and enlarging a curved root canal.

Abstract: A semiconductor package is provided, which includes: a substrate having a metal pattern layer; a semiconductor die formed on the substrate; and an underfill filled between the substrate and the semiconductor die. At least an opening is formed in the metal pattern layer to reduce the area of the metal pattern layer on the substrate, thereby reducing the contact area between the underfill and the metal pattern layer, hence eliminating the underfill delamination.

Abstract: A dual enclosure including an inner housing inside an outer housing is provided for an optical bench supporting a plurality of optical elements. An air gap is provided between the inner and outer housings. The inner housing may act as a heat spreader for isothermal operation, and the outer housing may act as a heat insulator. The optical bench may be disposed within the inner housing on a supporting element or elements, which thermally and mechanically decouple the optical bench from the inner housing.

Abstract: A method for controlling a voltage based on a temperature and a terminal supporting the same are provided. The terminal includes a temperature sensor for detecting a temperature of at least one location of the inside and of the outside of at least one system and a voltage control unit for adjusting the voltage supplied to the at least one system according to the temperature detected by the temperature sensor.

Abstract: Provided is a semiconductor device. The semiconductor device includes a substrate including a cantilever configured to generate a flow of cooling media through dynamic movement, an active area on the substrate which an electronic device is provided on, an insulation layer disposed to be spaced apart from the active area on the substrate, a lower electrode on the insulation layer, a piezoelectric film on the lower electrode, and an upper electrode on the piezoelectric film.

Abstract: An integrated circuit chip includes trenches at least partially surrounding a critical portion of a circuit that is sensitive to temperature variations. The trenches are locally interrupted in order to permit circuit connections to pass between the critical portion and an outer portion containing a remainder of the circuit. The critical portion includes heating resistors and a temperature sensor.

Abstract: An object of the present invention is to suppress an error in the value detected by a pressure sensor, which may be caused when environmental temperature varies. A semiconductor substrate has a first conductivity type. A semiconductor layer is formed over a first surface of the semiconductor substrate. Each of resistance parts has a second conductivity type, and is formed in the semiconductor layer. The resistance parts are spaced apart from each other. A separation region is a region of the first conductivity type formed in the semiconductor layer, and electrically separates the resistance parts from each other. A depressed portion is formed in a second surface of the semiconductor substrate, and overlaps the resistance parts, when viewed planarly. The semiconductor layer is an epitaxial layer.

Abstract: Forming a solder joint between metal layers by preparing a structure having solder material placed between two metal layers and heating the structure to grow an intermetallic compound in a space between the two metal layers. Growing the intermetallic compound includes setting a first surface, in contact with the solder material between the two metal layers, to a first temperature, thereby enabling growth of the intermetallic compound; setting a second surface, in contact with the solder material between the two metal layers, to a second temperature, wherein the second temperature is higher than the first temperature; and maintaining a temperature gradient (temperature/unit thickness) between the two metal layers at a predetermined value or higher until the intermetallic compound substantially fills the space between the two metal layers.

Abstract: The invention is an actuator which includes at least one control element which has thermally activatable transducer material and which, in response to the supply or dissipation of energy, changes from a first shape state into a second shape state, and a mechanical energy storage, which is functionally connected to the control element. When the control element is in the second shape state, it exerts a restoring force on the control element which returns the control element to the first shape state. The mechanical energy storage includes an elastomer body, which at least in some regions is in direct physical and thermal contact with the control element. The elastomer body is connected in a spatially fixed manner to the control element in at least two spatially separated joining regions along the control element.

Abstract: A flexible display substrate mother board and a method of manufacturing a flexible display substrate are provided. The method includes: forming a heating pattern layer on a support substrate, wherein the heating pattern layer includes a plurality of regional blocks spaced apart from each other; forming a flexible substrate on the substrate provided with the heating pattern layer, and forming display elements on the flexible substrate; and heating the flexible substrate by utilization of the heating pattern layer, cutting the flexible substrate, stripping the flexible substrate corresponding to the regional block from the support substrate, and forming flexible display substrates. The method can avoid the damage of the display elements on the flexible substrate when the flexible substrate and the support substrate are separated from each other, and avoid uneven separation.

Abstract: A heated electrostatic chuck is provided, including a base having an upper surface and peripheral side surfaces, a thermal barrier coating formed by plasma deposition directly on at least the upper surface of the base, at least one heating element formed on portions of the thermal barrier coating, an electrically insulating layer formed on the heating element and exposed portions of the thermal barrier coating, at least one chucking electrode formed on at least a portion of the electrically insulating layer, and a protective layer formed on the chucking electrode.

Abstract: An air conditioner equipped with a compressor, an indoor heat exchanger and an outdoor heat exchanger includes: an inverter circuit that drives a motor of the compressor; an inverter-power detecting unit that detects power of the inverter circuit; a PWM-signal generating unit that inverter-current detecting unit generates PWM signals for controlling the inverter circuit; a voltage-command-value generating unit that outputs voltage command values to the PWM-signal generating unit; and an accumulation detecting unit that detects accumulation of a liquid refrigerant within the compressor and outputs a detection result to the voltage-command-value generating unit, wherein when accumulation of a liquid refrigerant within the compressor is detected, the voltage-command-value generating unit outputs the voltage command value so that power of the inverter circuit has a predetermined power value.

Abstract: A power system of an electric vehicle, an electric vehicle comprising the same and a method for heating a battery group of the electric vehicle are provided. The power system comprises: a battery group; a battery heater, in which the battery heater comprises a output power adjusting module configure to adjust a heating power of the battery heater by adjusting a charge current and/or a discharge current; a battery management device configured to control the output power adjusting module to adjust the heating power of the battery heater to heat the battery group according to a temperature of the battery group when the temperature of the battery group is lower than a first heating threshold and a residual electric quantity of the battery group is larger than a parking electric quantity threshold; a motor controller connected with a motor and an electric distribution box respectively; and an isolation inductor.

Abstract: A radiation sensor (27) includes a radiation sensor chip (1) including first (7) and second (8) thermopile junctions connected to form a thermopile (7,8). The first thermopile junction is disposed in a floating portion of a dielectric membrane (3) thermally insulated from a silicon substrate (2) of the chip, and the second thermopile junction is disposed in the dielectric membrane directly adjacent to the substrate. Bump conductors (28) are bonded to corresponding bonding pads (28A) coupled to the thermopile (7,8) to physically and electrically connect the chip to conductors on a printed circuit board (23). The silicon substrate transmits infrared radiation to the thermopile while blocking visible light.

Abstract: Embodiments include methods, computer systems and computer program products for controlling resistance value of a resistor in a circuit. Aspects include: retrieving, via a controller, a set of parameters of the resistor from a non-volatile memory in the circuit, detecting, via the controller, an operating temperature of the resistor during circuit operation in field using a temperature sensor, generating, by the controller, a temperature difference between the operating temperature detected and a target temperature at which the resistor has a target resistance value, producing, by the controller, a control signal responsive to the temperature difference generated, and transmitting the control signal to a temperature regulator placed adjacent to the resistor to adjust the resistance value of the resistor. The resistance value of the resistor varies in response to temperature changes around the resistor according to a temperature coefficient of the resistance of the resistor.

Abstract: An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.

Abstract: A chassis for a storage system contains a digital chamber that houses conventional electronic components and a thermal chamber that houses non-volatile solid state memory such as flash memory. A temperature regulating system monitors temperature within the digital chamber to keep the components therein below their maximum junction temperature. The temperature regulating system tightly regulates the temperature of solid state memory chips to within a nominal operating temperature range selected to extend the lifetime and/or improve the endurance and reliability of the solid state memory. The temperature regulating system may regulate different memory chips to different nominal temperatures based on the operations being performed and lifetime factors for the memory chips including current health and prior use.

Abstract: A device comprising a first detector, comprising an output, disposed at a first location of an integrated circuit chip and configured to determine a first temperature information, a chip heater, comprising an input to receive a control signal, disposed at a second location of the integrated circuit and configured to heat an area of the integrated circuit device that includes the first location and the second location, based upon the control signal, and a heater controller comprising a first input coupled to the output of the first detector to receive the first temperature information, and an output coupled to the input of the chip heater, the heater controller configured to generate the control signal based upon the first temperature information.

Abstract: A warm-up apparatus for a vehicle including a system which charges a battery by using an external power supply is provided. The warm-up apparatus includes a heater for warming up, a current detector, a voltage detector and a resistance changer. The heater is mounted in the vehicle and produces heat by receiving electric power from the external power supply. The current detector detects an allowable current value of the external power supply. The voltage detector detects an output voltage value of the external power supply. The resistance changer changes an electric resistance value of the heater based on the allowable current value detected by the current detector and the output voltage value detected by the voltage detector.

Abstract: Self-heating integrated circuits are provided. In one embodiment, a self-heating integrated circuit comprises a drive circuit configured to drive a device and a controller configured to selectively operate the drive circuit in a first mode or a second mode. In the first mode, the controller is configured to operate the drive circuit to drive the device and, in the second mode, the controller is configured to operate the drive circuit to heat the integrated circuit to a target temperature.

Abstract: A battery system includes a battery having a battery case and a resistor provided on at least one of surfaces of the battery case, and the resistor is made of a material having specific resistance not more than 10×10?8 [?·m, 0° C.].

Abstract: A tunable liquid crystal optical device is described. The optical device has an electrode arrangement associated with a liquid crystal cell and includes a hole patterned electrode, wherein control of the liquid crystal cell depends on electrical characteristics of liquid crystal optical device layers. The optical device further has a circuit for measuring said electrical characteristics of the liquid crystal optical device layers, and a drive signal circuit having at least one parameter adjusted as a function of the measured electrical characteristics. The drive signal circuit generates a control signal for the electrode arrangement.

Abstract: A battery heater device which heats a battery with a plurality of cells mounted on a vehicle comprises a first heater part which heats cells positioned at an outer side in the battery; a second heater part which heats cells positioned at an inner side in the battery; and a controller which controls power to be supplied to the first and second heater parts; wherein the controller reduces the power supplied to the second heater part at a predetermined timing after start of the power supply to the first and second heater parts, thereby improving quick-heating performance of the battery and heating the battery more uniformly with use of simple arrangement.

Abstract: One aspect of the present invention provides an electrochemical cell system comprising at least one electrochemical cell configured to be selectively connected to a load to discharge the cell by generating electrical current using a fuel and an oxidant. The electrochemical cell system may alternatively be connected to a power supply to recharge the cell. The electrochemical cell system comprises a plurality of electrodes and electrode bodies therein. The electrochemical cell system further comprises a switching system configured to permit progressive movement of the anodes used for charging each electrochemical cell, maintaining a minimum distance from a progressively moving cathode that is the site of fuel growth.

Abstract: With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB.

Abstract: An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.

Abstract: The present disclosure is directed to a safety circuit for use in textile heating devices, such as heating pads, heating blankets, and the like. The safety circuit provides a system for checking/verifying the integrity of the controller, which can shut off power to the textile heating device if the controller has lost integrity.

Abstract: Disclosed is an induction cooking device that is not likely to be affected by induction heating and wherein boiling-over can be detected. An induction cooking device has: a top plate on which a cooking container is placed; a heating coil that generates an induction magnetic field for heating the cooking container; a heating control unit that controls the heating power of the cooking container by controlling the high-frequency current supplied to the heating coil; electrodes disposed in a lower surface of the top plate; and an electrostatic capacity detector that detects changes in electrostatic capacity occurring in the electrodes when articles to be cooked contact with the top plate. When the electrostatic capacity detector senses changes in the electrostatic capacity of the electrodes, the heating control unit decreases or stops the heating power of the cooking container, and the electrodes are disposed outside of the outer circumference the heating coil.

Abstract: A method of forming a hybridized device including forming a first component provided with metal bumps, and a second component provided with connection elements, attaching the bumps to the connection elements. The manufacturing of the second component includes forming, on a surface of a substrate, resistive elements at the locations provided for the connection elements; depositing an electric insulator layer at least on the resistive elements; and forming the connection elements, each comprising a metal well having an opening capable of receiving the corresponding metal bump of the first microelectronic component and at least partially filled with a fusible element, particularly indium or an alloy of tin and gold, or with a conductive ink, particularly based on silver or copper. Further, the attachment of the balls to the connection elements comprises applying an electric current through the resistive elements to heat the bumps.

Abstract: A memory controller can provide current to a heater in a flash memory to reduce cycling induced errors. If necessary, after heating, the memory may be refreshed. In non-battery powered systems, data may be removed from the memory prior to heating and restored to the memory after heating.

Abstract: An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.

Abstract: Aspects of the present invention are directed to providing a printed circuit board including a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a heater layer interposed between the top conductive layer and the bottom conductive layer and configured to generate and transfer heat to at least one of the electronic components.

Abstract: An integrated heater formed as a field effect transistor in a semiconductor substrate, with the transistor having source and drain regions with a channel region extending therebetween to conduct current. The channel region has a resistance when conducting current to generate heat above a selected threshold. A dielectric layer is disposed on the channel region and a gate electrode is disposed on the dielectric layer to control the current of the channel region. A thermally insulating barrier is formed in the semiconductor material and may extend about the transistor. The object to be heated is positioned to receive the heat generated by the resistance of the channel region; the object may be a fluid chamber.

Abstract: A cooking appliance have at least one burner operable in an ON condition for producing heat and an OFF condition for not producing heat and a Hot Surface Indicator having an illumination source that may be operated when the burner is not producing heat as well as a method for illuminating the Hot Surface Indicator.

Abstract: A method and device for creating a temperature gradient among a plurality of temperature gradient devices. Each device is formed of a first layer of conductive material having a top surface and a bottom surface. The first layer is adjacent to a second layer of conductive material and has electrical resistive heating properties. A power supply is used to provide a current flow through at least the first layer when the power supply is activated. When activated, the resulting current flow causes the second layer to heat and thus create a temperature gradient between the bottom surface of the second layer and the top surface of the first layer. Activation of the power supply is controlled by a control unit so that activation of adjacent temperature gradient devices is avoided for a predetermined time after activation of the first temperature gradient device.

Abstract: The cooking device includes a top plate on which a container is to be placed, heating devices provided below the top plate, electrodes provided in a lower face of the top plate and including a boiling-over detection parts placed near an outer periphery of a portion of the top plate positioned above the heating devices, contact parts for supplying an AC current to the boiling-over detection parts, and contact parts for connecting the contact parts and one-side ends of the boiling-over detection parts to each other, respectively, an electrode-use capacitance detection device for detecting changes in capacitance of the boiling-over detection parts, and a control device for controlling the heating devices based on changes in capacitance detected by the electrode-use capacitance detection device.

Abstract: A method is provided which allows the facile deicing of a surface of a structure in general. Electromagnetic induction or IR/Microwave radiation is used to heat up a layer or a coating on said surface of the structure in general whereby said layer preferably contains conductive particles such as carbon nano particles, such as graphite, carbon nano tubes, carbon nano cones, metal in powder form, metalized glass beads, carbon fibers, chopped or as woven structure, etc all collectively named Carbon Nano Tubes (CNTs) or cones or metallic particles at concentrations above 0.01% by weight. Heat conductors such as boron nitride may be used to improve the heat transfer to the surface. Constructions are disclosed which shield the microwave emitters from lightning receiving elements, and which protect the complete structure during lightning events. Radiation can be supplied both from the inside of the structure as well as from the outside.

Abstract: In a heather control apparatus for a gas sensor, a CPU obtains upper and lower limit values by adding a predetermined value to and subtracting the predetermined value from an Rpvs average obtained in a last heater energization period (or to an Rpvs value obtained for the first time), and sets a window W1. The CPU obtains a plurality of Rpvs values [P2] to [P11], and obtains an Rpvs average A1 while excluding Rpvs values [P5], [P6], and [P9] which do not fall within the window W1 (not less than the lower limit value and not greater than the upper limit value). The CPU obtains the upper and lower limit values by adding the predetermined value to and subtracting the predetermined value from the Rpvs average A1, and sets a window W2 for the next heater energization period.

Abstract: A heating apparatus for heating electronic components on a printed circuit board in low temperature environment includes a printed circuit board, a heating unit, a switch unit, a temperature-sensing unit, an electric power unit, and a control unit. The heating unit, the switch unit, the temperature-sensing unit, and the control unit are fixed connected to the printed circuit board and are electrically connected with the metal lines on the printed circuit board. The heat source is sent to the heat-conducting layer on the printed circuit board through the heat-conducting terminal after the switch unit is conducted by the control unit and the power is sent from the electric power unit to the heating unit. Then, the electronic components are heated with the heat source through the heat-conducting layer, so that the electronic components are in the working temperatures for starting up.

Abstract: A temperature control circuit of oven-controlled crystal oscillator includes a heater resistor, a first resistor, a thermistor, a second resistor, a third resistor, a differential amplifier, a PNP-type power transistor, and a PNP-type current-limiting transistor. The thermistor outputs a voltage depending on a temperature. The differential amplifier amplifies a difference between the voltage received by the one input terminal and the voltage received by the other and output as a control voltage. The PNP-type power transistor includes an emitter where the other end of the heater resistor is connected, a base that receives an output of the differential amplifier, and a grounded collector. The PNP-type current-limiting transistor has an emitter where a power voltage is supplied, a base that receives a voltage between the other end of the heater resistor and the emitter of the power transistor, and a collector connected to the base of the power transistor.

Abstract: Provided are a device and method and an electronic device for temperature control, which are used to solve the problem that electronic devices and components cannot operate in a low-temperature state. The temperature control device includes a temperature detection unit (10) configured to detect the operating temperature of a component (16); a heating unit (12) configured to heat the component (16) according to the detection result of the temperature detection unit (10) so that the operating temperature is between a first temperature and a second temperature; and a power supply interface (14) respectively connected to the temperature detection unit (10) and the heating unit (12) and configured to supply power to the temperature detection unit (10) and the heating unit (12). The first temperature is the lower limit value of the operating temperature of the component (16), and the second temperature is the upper limit value of the operating temperature of the component (16).

Abstract: The invention includes a heating assembly, a heating device and an auxiliary cooling module for a battery. The heating assembly is connected to a battery and includes a heat-conducting element and a heating element. The heat-conducting element has at least one heat-absorbing portion and at least one heat-conducting portion. The heat-conducting portion is provided to correspond to the battery. The heating element has at least one first heating portion located to correspond to the heat-absorbing portion for heating the heat-absorbing portion. The other side of the heat-conducting element opposite to the battery is provided with a heat-insulating portion. The auxiliary cooling module is further provided with at least one cooling pipe in the heat-conducting element, thereby cooling the battery.

Abstract: A glow plug (100) includes: a housing (130) having a metal shell (110) and a cap unit (120); and a heater unit (150). A coupling member (180) is joined with the housing (130) and is also joined with the heater unit (150) at its edge portion (188), so as to enable the heater unit (150) to move along an axis line O and couple the heater unit (150) with the housing (130). When the edge portion 188 of the coupling member 180 is irradiated with a laser, at least part of the edge portion (188) melted by laser welding fills a gap (50) between the coupling member (180) and the heater unit (150) to form a welded part (210). As a result, even when there is a gap prior to welding, the weld strength between the coupling member (180) and the heater unit (150) can be maintained.

Abstract: A heating element and circuit module stack structure includes a circuit module carrying a chip unit, a heat sink having a flat bottom block protruded from a thermally conductive base member and in contact with the chip unit, a heat transfer layer set between the thermally conductive base member and the chip unit around the flat bottom block, an electric heating element mounted in between the heat transfer layer and the thermally conductive base member around the flat bottom block for heating the chip unit, and a thermal insulation component isolating the thermally conductive base member from the electric heating element. The circuit module turns on the electrical heating element when the temperature of the chip unit drops blow 0° C., and turns off the electrical heating element when the temperature reaches the normal operating temperature range, enabling the computer to be used in a low temperature or cold outdoor environment.

Abstract: A memory controller can provide current to a heater in a flash memory to reduce cycling induced errors. If necessary, after heating, the memory may be refreshed. In non-battery powered systems, data may be removed from the memory prior to heating and restored to the memory after heating.