Abstract: Display with a heater, a) the display having at least one display glass, b) the heater having an electrically operated heating element connected to a voltage supply (UB, GND), c) the heating element comprising a thin layer, d) the layer being made of a material forming an electrical resistance, and e) the layer being applied over a surface area to the at least one display glass or being embedded over a surface area in the display.

Abstract: An apparatus for regulating a temperature of an object to a desired temperature includes a feedback circuit operable to produce a feedback error signal based on a difference of the desired temperature of the object and the temperature of the object; and a heating circuit operable to impart heat to the object as a substantially linear function of a command signal, the command signal being based on the feedback error signal.

Abstract: An optical device module using an integral heat transfer module. The heat transfer module has an integrally formed heat source and a temperature sensor for reading temperature. A heat transfer path is simplified in packaging the optical device module, so that the optical device can avoid performance degradation due to nonuniform temperature distribution. The amount power consumption can be reduced and excellent workability can be ensured.

Abstract: An electrical device includes a package having an array of connections, a thermally conductive, electrically insulative substrate in the package, a plurality of polymeric positive temperature coefficient (PPTC) resistors in the package in thermal contact with the substrate, and, at least one heating element such as a power field effect transistor in thermal contact with the substrate, for indirectly heating the PPTC resistors in response to a control current, thereby to trip the PPTC resistors from a low resistance state to a very high resistance state. A method for controlling a plurality of electrical loads is also disclosed.

Abstract: A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: A keyboard includes a plurality of keys mechanically and electrically coupled to a printed circuit board, the plurality of keys are arranged in a keyboard defining air gaps around the plurality of keys. The keyboard also includes a keyboard housing for containing the printed circuit board, the keyboard housing further including an opening on at least a portion of a top surface thereof for usably exposing the plurality of keys therethrough. The keyboard also includes a heating element located within the keyboard housing, the heating element and the printed circuit board deriving power from a keyboard port of a computer when the keyboard is coupled to the computer.

Abstract: A thermally controlled circuit board is provided. The circuit board includes a substrate, which carries a thermally controlled circuit. The thermally controlled circuit includes a heater, a logic unit and a thermostat. The heater includes planar resistive elements, which are embedded into the substrate. A power source is selectively coupled to the heater via control of the logic unit. The thermostat is programmed with a temperature set point, and outputs a control signal based on a measured temperature level relative to the temperature set point. The logic unit selectively couples the power source to the heater, based on the control signal output from the thermostat and selectively couples power to on-board components to control the temperature of the board and the components thereon to protect the components and insure reliable operation.

Abstract: An apparatus for separating a liquid in a liquid metal micro-switch. In representative embodiments, the apparatus comprises a heater and a sub-channel inside a structure. The heater is located inside a cavity of the structure onto which the liquid metal micro-switch is fabricated. The sub-channel inside the structure connects the cavity to a main channel. The sub-channel has a cross-sectional area. The value of the cross-sectional area at the boundary between the sub-channel and the main channel is less than the value of the cross-sectional area at the boundary between the sub-channel and the cavity. The gas permeates the cavity and the sub-channel and is capable of extending into the main channel.

Abstract: An improved thermally tunable system is provided. The improved thermally tunable system includes a thermally tunable apparatus including a first portion and a second portion, a heater configured to thermally tune the apparatus, and a heat sink disposed adjacent to the apparatus, wherein thermal flow is controlled to pass from the heater through the first portion of the apparatus, and then through the second portion into the heat sink, such that a temperature of the second portion remains substantially constant or within a predetermined range. A thermally conductive material is provided between the second portion of the apparatus and the heat sink. A thermally insulating material is provided between the first portion of the apparatus and the heat sink.

Abstract: A redundant package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar lightwave circuit (PLC), e.g., an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: An oven-controlled oscillator includes a thermostatic oven having a heat source, a vibrator provided in the thermostatic oven, an oscillation circuit for generating an oscillation signal in response to an action of the vibrator, and a heat source control circuit. The heat source control circuit includes a sensor for detecting an internal temperature of the thermostatic oven, an operational amplifier for controlling current to flow through the heat source in response to a resistance value of the sensor so that the internal temperature of the thermostatic oven may be maintained at a predetermined preset temperature, and a feedback resistor for the operational amplifier. The feedback resistor includes a thermistor whose resistance value drops as the temperature rises, and the thermistor is thermally coupled to the thermostatic oven. Preferably, a quartz-crystal element is used as the vibrator.

Abstract: A temperature stabilization scheme reduces the effects of temperature variations on the performance of an electronic system that is implemented on a circuit board. In the temperature stabilization scheme, the circuit has an isolated region that is coupled to a remainder ofthe circuit board by one or more electrical pathways. Associated with each of the electrical pathways is an incidental thermal conduction path between the isolated region and the remainder of the circuit board. A temperature sensitive component ofthe electrical system is coupled to a mounting site on the isolated region and interfaces with the remainder of the circuit board through the one or more electrical pathways. A series of heaters, thermally coupled to the isolated region provides a compensating thermal profile that opposes thermal instability caused by the incidental thermal conduction paths, where the opposition is over a portion of the isolated region that includes at least the mounting site of the temperature sensitive component.

Abstract: The component, located inside a corresponding package, is associated with a first heat sensor, located in proximity to the component inside the package, together with a second heat sensor. A thermal conditioning element is controlled in such a way as to keep the temperature of the first sensor at a level identified by a reference signal (rifv). The second sensor is associated with the package in such a way as to generate a second temperature signal indicating the external temperature, and the aforesaid reference signal (rifv;) is modified as a function of the said second temperature signal, providing effective temperature control of the component.

Abstract: The invention relates to an arrangement for heating an assembled printed circuit board to a specified temperature. A plurality of resistors are arranged on at least one surface of the printed circuit board in order to generate heat. The resistors are distributed approximately uniformly over the surface and are supplied with electronic energy from a separate source.

Abstract: An oven-controlled oscillator includes a thermostatic oven having a heat source, a vibrator provided in the thermostatic oven, an oscillation circuit for generating an oscillation signal in response to an action of the vibrator, and a heat source control circuit. The heat source control circuit includes a sensor for detecting an internal temperature of the thermostatic oven, an operational amplifier for controlling current to flow through the heat source in response to a resistance value of the sensor so that the internal temperature of the thermostatic oven may be maintained at a predetermined preset temperature, and a feedback resistor for the operational amplifier. The feedback resistor includes a thermistor whose resistance value drops as the temperature rises, and the thermistor is thermally coupled to the thermostatic oven. Preferably, a quartz-crystal element is used as the vibrator.

Abstract: A printed circuit board (1) includes a multi-layered structure. One of the layers (3) provides a heating layer such that heat applied to that layer (3) is transferred to electronic components (2) mounted on the board (1). The components (2) can thus be maintained at a suitable operating temperature. The heat can be supplied by ohmic heating of a resistive element within the printed circuit board (1). In an exemplary embodiment of the invention, one of a conducting layer and a ground or earthing layer of the printed circuit board (1) provides the heating layer (3).

Abstract: There are disposed on a printed substrate a crystal resonator as a piezoelectric resonator, an oscillation circuit, a plurality of surface mount heaters and a temperature controlling circuit for controlling a heating temperature of the heaters. A case of the piezoelectric resonator and a lead terminal of the piezoelectric resonator are heated respectively at the same time by individually separate heaters for the purpose of heating the piezoelectric resonator, the oscillation circuit and the temperature controlling circuit at the same time. Accordingly, it is possible to provide a piezo-oscillator excellent in low power consumption and compactness.

Abstract: A heater apparatus (10) for a piezoelectric device (12) includes a resistive heating element (18) on an insulating substrate (14). The heating element (18) maintains a temperature of the piezoelectric device (12) within a predetermined temperature range. A plurality of electrical couplings (20) extend through the insulating substrate (14). The electrical couplings (20) electrically connect to the heating element (18) and mechanically and electrically connect to the piezoelectric device (12). The piezoelectric device (12) is suspended above the heating element (18) on at least two of the electrical couplings (20). As a result, the heater apparatus (10) and piezoelectric device (12) can be enclosed within a standard crystal package.

Abstract: A housing for optical integrated circuits for protecting the circuit from temperature induced stresses has a base and cap and a thermal bed contained therein. The thermal bed has a region for containing the integrated circuit therein, suspended in a thermally conductive grease. At least one heater is affixed to the thermal bed for heating it, and temperature monitoring apparatus is included for supplying signals to a control apparatus for activating the heater when the temperature of the thermal bed falls outside of the operating temperature range.

Abstract: A crystal resonator assembly is described wherein a piezo-electric resonator is mounted over a heat conducting substrate and one or more heat generating elements are located on the substrate. The heating elements provide heat both by conduction and radiation and by virtue of the use of a heat conducting substrate enable a uniform and efficient heating of the crystal resonator to a desired oven temperature.

Abstract: A transparent LCD back-lit display has a transparent indium-tin oxide heater layer extending across the display and a resistive metal strip heater, supported in a frame of low thermal conductivity, extending around its edge. One temperature sensor is mounted at the center of the display and another is mounted at the edge. The sensors are connected to a heater control unit, which controls power supplied to the heater layer and the edge strip heater to maintain the temperatures at the center and edge of the display equal.

Abstract: A temperature controlled cryogenic package system for efficiently and precisely monitoring and controlling the operating temperature of a high temperature superconductor circuit placed on a substrate. The cryogenic package system comprises a heating element formed on the same substrate as the high temperature superconductor circuit, a control circuit capable of activating and deactivating the heating element, and a temperature sensor placed in thermal proximity to the high temperature superconductor circuit. The temperature sensor monitors the operating temperature of the high temperature superconductor circuit, and conveys temperature information to the control circuit. The control circuit activates or deactivates the heating element according to the warming or cooling effect that is necessary in order to maintain the high temperature superconductor circuit within a predetermined temperature range, where the range of temperature fluctuation is within plus or minus 0.1 K of a predetermined temperature.

Abstract: An emergency positioning indication radio buoy used in case of emergency by being thrown into the sea from a ship. This radio buoy comprises a transmitting unit for generating a high frequency signal of a predetermined frequency, a battery for supplying the power to the transmitting unit, a switch which is normally breaking the power supply circuit from the battery to the transmitting unit and operates automatically or is operated by hand to make the circuit when the buoy is used, and an antenna for radiating the high frequency signal from the transmitting unit into the air, and is characterized by that at least the crystal resonator of said transmitter unit is put in a heat insulating container which is enclosed with a vacuum or a heat insulating material and that an antifreezing solution, oil or other appropriate material is filled in the heat insulating container.

Abstract: A heater controller for an atomic frequency standard provides accurate and stable temperature control for an assembly, such as a lamp assembly, by regulating a current flow through a heating device so as to maintain a substantially constant heating power output during start-up and by reducing the DC temperature errors of the system during normal operation. The heater controller includes an integrating amplifier which generates an amplified temperature signal based on the temperature of the lamp assembly. The heater controller further includes a device for receiving the amplified signal from the integrating amplifier and establishing a control voltage having an upper limit based on a voltage of the heater power supply.

Abstract: A method for growing multiple high-purity single crystals from a replenished melt by maintaining the purity of molten source material in the melt held in a crucible in a furnace of the type used for growing high-purity single crystals. The method includes the steps of growing at least one crystal from the source material in the crucible, extracting a portion of a volume of the melt remaining in the crucible, adding high-purity source material to the melt, and growing at least one more single crystal. Extractor apparatus used in the method includes an insulated receptacle having an inlet tube for conducting molten source material into the receptacle. A vacuum attached to the receptacle is used to draw the source material into the receptacle.

Abstract: A system and method for compensating in real time the dynamic power variation of a computer chip containing CMOS devices is provided. The present invention functions to control the temperature variations on the chip thus eliminating the drift to analog signals associated with CMOS devices. The present invention controls the temperature with the use of a compensation heater located on the CMOS chip. The compensation heater is driven by a plurality of signals which act in harmony with one another to control the temperature on the chip when it becomes unstable. The system and method includes driving the compensation heater with a maximum dynamic power value to effectively maintain the temperature on the chip, evaluating the chip for temperature fluctuation, and compensating for the temperature fluctuation by driving the compensation heater with at least one compensation power value.

Abstract: A method is shown, along with apparatus for accomplishing same, for minimizing power required to keep an enclosed electronic module from overheating in a high temperature environment, while still operating to maintain the module at greater than a given minimum temperature when the environmental temperatures are far below the sensed minimum temperature for the module. This is accomplished by placing a thin sheet of heating material between the module to be temperature maintained and a heat sink which is exposed to the environment exterior the enclosure. Energy applied to the sandwiched heater prevents transfer of heat from the electronic module to the environment in such a way as to drastically reduce the heat (power consuming) requirements as compared to prior art heater approaches.

Abstract: In a device for thermal regulation of an enclosure comprising a temperature-measuring circuit which consists of a resistor bridge, of at least one heat-sensitive element on one bridge arm and of an amplifier, a control signal which is representative of the difference between the measured temperature of the enclosure and a reference temperature is delivered at the output of the amplifier. The absolute value of the control signal is adjusted by a negative feedback loop. A circuit for heating the enclosure is regulated by the temperature-measuring circuit and is constituted by at least one control transistor which delivers an adjustable heating current. The feedback loop of the output amplifier is mounted between the emitter resistor of the control transistor and the inverting input of the amplifier.

Abstract: A piezoelectric resonator (1) consists of a piezoelectric reed (2) encased in a housing composed of a cap (7) and a base (8). The resonator (1) is placed in a thermostatically controlled containment (10). The thermostatically controlled containment (10) consists of an inner cell (40) which is screwed into an outer cell (30). These cells (30, 40) each possess sides (34, 44) and a bottom (35, 45). A thermal seal (16) is inserted between the bottom (35) of the outer cell (30) and the bottom (45) of the inner cell (40). The cap (7) of the resonator is soldered over its entire outer surface to the sides (44) and to the bottom (45) of the inner cell (40). The thermostatically controlled containment (10) is placed in a secondary containment (21). A narrow space (22) separates the two containments (10, 21), and the surface of the contact between the two containments is as small as possible. The invention is used for ultrastable on-board oscillators.

Abstract: In a device for thermal regulation of an enclosure comprising a temperature-measuring circuit which consists of a resistor bridge, of at least one heat-sensitive element on one bridge arm and of an amplifier, a control signal which is representative of the difference between the measured temperature of the enclosure and a reference temperature is delivered at the output of the amplifier. The absolute value of the control signal is adjusted by a negative feedback loop. A circuit for heating the enclosure is regulated by the temperature-measuring circuit and is constituted by at least one control transistor which delivers an adjustable heating current. The feedback loop of the output amplifier is mounted between the emitter resistor of the control transistor and the inverting input of the amplifier.

Abstract: Over for the burn-in of integrated circuits (12), comprising: a chamber (B) for receiving such circuits (12); first means (4), for heating such integrated circuits (12) in the chamber (B) with the circuits (12) fed with supply voltages; and control means for controlling the first means (4), including a computer (15) for monitoring power consumed by the circuits (12), the computer (15) being capable of storing information concerning the number of said circuits (12) and being adapted to provide from said power, a signal dependent on the mean power dissipation of the circuits (12): and in which oven the control means controls the heating of the circuits (12) in dependence on said signal.

Abstract: An ovenized oscillator having a temperature sensitive section of an oscillator and a heater supported in a chamber within an enclosure having an insulating gas surrounding the oscillator section and heater. Insulating walls may be added within the chamber to reduce convective heat loss through the gas. These walls form cavities around the oscillator section and are separated from each other except for small vent holes to equilibrate the pressure between cavities.

Abstract: Operating temperature of a liquid crystal cell is controlled by passing heated air on its surface, the heater for the air being operated according to the average temperature of the cell measured by a sensor. Fine control is effected by means of resistive heaters affixed on the exterior surface and by electrodes provided at strategic locations inside to pass current through a conductive layer.

Abstract: A heater control circuit for the integral heater of a liquid crystal display comprising solid state switches that simultaneously connect and disconnect the high side and low side of the heater from power and ground, respectively, in response to display temperature. A blend resistor is connected between the heater and ground to bleed off accumulated charge that would erroneously drive one of the solid state switches into conduction.

Abstract: A planer heater includes a thin metal plate having a relatively high specific resistance such as stainless, nichrome, nickel-chrome iron alloy, etc. The thin metal plate is subjected to etching-working to form a mesh-like heat generating body, opposite ends of which are provided with terminal portions for connection into an electrical circuit.

Abstract: This invention relates to a thermostatted oscillator comprising an assembly support constituted by a printed circuit provided with an opening, on the edge of which is fixed, at a reduced number of points, an electrically insulating secondary support on which are fixed, on the one hand, a piezo-electric resonator and, on the other hand, a prediffused circuit comprising in integrated form the essential elements of the electronic circuits for regulating the supply voltage of the assembly, of the electronic circuits for maintaining and amplifying the oscillations of the resonator, and of the electronic circuits for regulating the temperature of the resonator. The invention is more particularly applicable to miniature oscillators of high stability and low consumption.

Abstract: An environmental control apparatus for electronic circuit elements includes an enclosure for the element and standoff brackets supporting the enclosure, the enclosure and support brackets together defining an area of both high heat resistivity and high heat conductivity, with a heating mechanism with the area of high heat conductivity in order to reduce the flow of heat and to maintain a balanced temperature profile along the enclosure.

Abstract: An integrated circuit chip is alloyed to a ceramic header for a standard semiconductor package in an elongated preheater fixture. The fixture has a heating position laterally spaced from a loading position, with slots running from the loading to heating positions accommodating the pins of the header. The slots also function as fins to radiate heat so that a temperature gradient is created between loading and heating positions. As the headers slide from the loading position along the length of the fixture, the headers are heated to the bonded temperature without producing undue thermal stress.

Abstract: A method and a device for regulating the heating of a thermostatically controlled enclosure of a quartz oscillator. During a first stage, the thermostatically controlled enclosure is exposed to an external temperature close to the maximum operating temperature and the frequency of the oscillator is measured. During a second stage, the thermostatically controlled enclosure is exposed to an external temperature close to the minimum temperature of the range and the difference between the frequency of the oscillator and the frequency previously measured is cancelled out by modifying the distribution of the powers dissipated by the heating elements of the thermostatically controlled enclosure. The heating of the enclosure is performed by a chain of voltage stabilizer semiconductor circuits connected in series, each of the circuits being traversed by a regulated heating current. The regulating of the heating action is performed by modifying the stabilized voltages of the circuits.

Abstract: An apparatus for controlling the temperature of a device whose temperature is to be stabilized within a preset range is disclosed. The apparatus is particularly applicable to stabilizing the temperature, and thus frequency of operation of, a crystal controlled oscillator, without expending additional energy in specialized crystal heating apparatus. The apparatus preferably includes first and second power supply regulators coupled to a source of unregulated voltage. The second power supply regulator preferably has a higher output voltage than the first power supply regulator and the outputs of the two regulators are coupled together. The cyrstal is attached to the second regulator so that heat generated by the second regulator is dissipated in the crystal. A temperature sensing device is coupled to the crystal and generates a signal proportional to the temperature of the crystal.

Abstract: An assembly for a quartz crystal oscillator housed within a can is set forth in which the oven assembly for the crystal is partially formed with metallized circuit boards to which the components for the electrical circuits for controlling the crystal oscillator are connected. A control transistor is directly mounted to one wall of the oven to further provide the major source of heat for the oven while reducing consumption of power.

Abstract: A planar heater for a liquid crystal element includes a thin metal plate having a relatively high specific resistance such as stainless, nichrome, nickel-chrome iron alloy, etc. The thin metal plate is subjected to etching-working to form a mesh-like heat generating body, opposite ends of which are provided with terminal portions for connection into an electrical circuit.

Abstract: A resonator with an integrated infrared thermostat, having a sealed casing enclosing reflectors including concave spherical domes covered with an interior coating of reflecting metal, placed on either side of a piezoelectric crystal, an infrared heating means device positioned on either side of the crystal in front of the spherical domes, and a temperature sensor including a thermocouple of two thin metal layers superimposed seriatim on one side of the active part of the crystal and constituting additionally and simultaneously one of the excitation electrodes for the crystal.

Abstract: A thickness monitor useful in deposition or etching reactor systems comprising a crystal-controlled oscillator in which the crystal is deposited or etched to change the frequency of the oscillator. The crystal rests within a thermally conductive metallic housing and arranged to be temperature controlled. Electrode contacts are made to the surface primarily by gravity force such that the crystal is substantially free of stress otherwise induced by high temperature.

Abstract: A closed loop integrated circuit temperature stabilizer 10 has an on-chip temperature sensor 12 for supplying a voltage indication of temperature to an op amp 22 which maintains chip temperature equilibrium by controlling a load transistor 30 which draws current through on-chip heating means 16.

Abstract: The frequency of an electronic oscillator is controlled by a crystal located in the oven. The heaters in the oven include resistance elements for quick warm-up, and steady state. The circuit allows the quick warm-up power to be reduced incrementally as the set temperature is approached and effects a smooth transition to the steady-state heater. This is accomplished by circuit features which reduce the control loop gain when high power is applied to the heaters and increase the gain as the warm-up power decreases.

Abstract: The disclosed temperature-compensated crystal resonator unit has a crystal resonator element with a first ceramic member attached thereto, which resonator element is housed in a vessel with a second ceramic member being mounted on the housing and electrically connected to said first ceramic member in series thereto, both of said first and second ceramic members having positive temperature coefficients of electric resistance, said second ceramic member being mechanically separated from both the first ceramic member and the crystal resonator element.

Abstract: Temperature stability is quickly achieved for a crystal oscillator mounted in a warm-up crystal oven because the heat is applied proportionally to the mass of the oscillator and circuitry during the initial warm-up period of time and then applied proportionally to the area that will allow compensation for thermal loss after the warm-up period. The oscillator crystal is encapsulated within a case along with an oscillator circuit for the oscillator crystal that is thermally mounted to the case. A controlled heater heats the warm-up crystal oven and crystal oscillator. The controlled heater is controlled by a temperature controller that responds to a first thermal sensor that senses the temperature of the case and a second thermal sensor that senses the temperature of the controlled heater.

Abstract: A semiconductor integrated circuit supporter on which a heating element is dielectrically provided, said supporter comprising a package, printed circuit board, mother board, etc. for supporting a semiconductor integrated circuit which includes devices such as transistors.The heating element provided on said semiconductor integrated circuit supporter is capable of heating the whole or a required part only thereof so that the semiconductor integrated circuit is preheated to a temperature required for its normal operation with precision and stability thereby improving the accuracy and reliability of various devices of which a semiconductor integrated circuit is composed as well as the control by said devices.

Abstract: Apparatus for compensating thermal drift of temperature sensitive circuitry in an integrated circuit by heating the temperature sensitive circuitry by applying power to a heating element in the integrated circuit, testing the temperature sensitive circuitry, and trimming a thin film resistor in accordance with the testing results. The heating element is an integrated resistor adjacent to or surrounding the temperature sensitive circuitry. The integrated circuit further includes a thin film compensating resistor which affects or determines the degree of temperature sensitivity of the temperature sensitive circuitry. As the temperature of the temperature sensitive circuitry is increased, testing apparatus is utilized to measure a temperature sensitive parameter of the temperature sensitive circuitry.