Abstract: An object to provide a hot plate making it possible to heat an object to be heated uniformly, and the hot plate of the present invention is characterized in that a resistance element having a thickness dispersion of ±3 ?m or less is formed on an insulating substrate.

Abstract: An objective of the present invention is to provide a ceramic heater making it possible to heat an object to be heated, such as a silicon wafer, evenly. The ceramic heater of the present invention is a ceramic heater having and a resistance heating element formed on the surface of the ceramic substrate or inside the ceramic substrate, wherein: said ceramic heater is equipped with: a temperature-measuring means measuring the temperature of said ceramic substrate and an object to be heated; a control unit supplying electric power to said heating element; a memory unit memorizing the temperature data measured by said temperature-measuring means; and an operation unit calculating electric power required for said heating element from said temperature, said ceramic heater being constituted such that said heating element is divided into at least 2 or more circuits and different electric power is supplied to each of the circuits of said resistance heating element.

Abstract: A system and method for heating materials is provided. Generally, the system contains a first layer upon which a material may be placed for heating the material, wherein the first layer has sufficient conductivity to allow heat to travel through the first layer. The system also contains a heater layer provided on the first layer, which is capable of providing heat to the first layer for heating the material. In addition, the system has an insulator layer for protecting the heater layer from contaminants.

Abstract: The invention relates to a ceramic cooktop comprising a cooking plate (12) made of glass ceramic or glass. The ceramic cooktop also comprises an electrical heat conductor layer (22) and an insulating layer (14) that is located between the cooking plate (12) and the heat conductor layer (22). The insulating layer (14) consists of a plurality of individual layers (16, 18, 20) that each have a porosity that decreases toward the heat conductor layer (22).

Abstract: The cook top is divided into at least one cold zone and cooking zones heatable by radiant heating elements under the cooking zones. The cook top includes a transparent, colorless glass ceramic or glass plate and a non-ceramic underside layer or layers on the underside of the plate. The upper side of the glass ceramic or glass plate is free of any decoration or layer, thus providing a cooking surface having improved smoothness for easy cleaning. The non-ceramic underside layer is permeable to infrared radiation in the cooking zones and is a color-imparting decoration. The underside layer, at least in cooking zones, has transmission properties for visible light such that the radiant heating elements are not visible from above, at least when they are not in a switched-on state.

Abstract: A ceramic beater for a semiconductor producing/examining device having a resistance heating element superior in adhesion to a substrate. The ceramic heater includes a ceramic substrate and a resistance heating element formed on the surface of the ceramic substrate. Further, irregularities are formed on the side face of the resistance heating element.

Abstract: A bake plate is integrally formed from a copper disk whose lower surface defines a desired heater element channel pattern that is filled with electrically conductive resistive material. Copper contamination is prevented by coating the structure. The channel pattern and fill material may be tailored to optimize thermal uniformity across the bake plate surface, and to produce a bake plate that may be mass produced with substantially uniform and repeatable thermal characteristics.

Abstract: A thin food heating unit suitable for use as a restaurant griddle includes a silicone rubber heating blanket vulcanized to the underside of a highly thermally conductive metal food warming plate for heating a food item placed thereon, a base insulated from the heating blanket and the food warming plate by a high temperature ceramic fiber insulation, insulating standoffs between the food warming plate and the top of the base, a separate power supply which supplies electrical energy to the griddle at a relatively low voltage compared to standard line voltage, and a power controller including an on/off switch which is separate from the base and which can be mounted separately in a restaurant installation.

Abstract: The present invention discloses a ceramic substrate for semiconductor manufacture and/or inspection conducive to decrease radiated &agr;-rays and to minimize changes in thermal conductivity as a function of time, thereby yielding a superior temperature controllability. This invention is related to a ceramic substrate for apparatuses for use in semiconductor manufacture and/or inspection, wherein the level of &agr;-rays radiated from said ceramic substrate exceeds 0.25 c/cm2·hr and is not higher than 50 c/cm2·hr.

Abstract: An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.

Abstract: A bake plate is integrally formed from a copper disk whose lower surface defines a desired heater element channel pattern that is filled with electrically conductive resistive material. Copper contamination is prevented by coating the structure. The channel pattern and fill material may be tailored to optimize thermal uniformity across the bake plate surface, and to produce a bake plate that may be mass produced with substantially uniform and repeatable thermal characteristics.

Abstract: In a ceramic heater having a plate-like body made of a ceramic, heating element in one main face of the plate like body, and an electric supply portion to be electrically connected with the heating element, it has been a problem that the temperature is uneven if bent portions are formed in heat generating patterns. The ceramic heater simultaneously satisfying the following: 0.15≦S≦0.85, 0.3≦P≦6.71×S2+1.52, and 0.3≦G≦6.71×(1−S)2+1.55, in which the reference character S1 denotes the surface area of the heating element in optional 10 mm square region of the effective heat generation area having the heating element therein; the surface ratio S denotes S=S1/100 mm2, the reference character P denotes the width of the heating element: and the reference character G denotes the gap between the heating element.

Abstract: The invention relates to a ceramic cooktop comprising a cooking plate (12) made of glass ceramic or glass. The ceramic cooktop also comprises an electrical heat conductor layer (18), an insulating layer (16) that is located between the cooking plate (12) and the heat conductor layer (18), and an electrically conductive intermediate layer (14) between the cooking plate (12) and the insulating layer (16). The intermediate layer (14) is a thermally sprayed layer consisting of an electrically conductive ceramic material, preferably of an oxide layer that is rendered electrically conductive by oxygen loss occurring during thermal spraying, or of a cermet.

Abstract: A heating assembly is provided for heating objects, for example, food items, that comprises a substrate attached to an insulating frame, which may optionally be attached to a metal pan. The complete assembly is attached to a cooking appliance. The substrate may take the form of a glass disk, for example, tempered soda-lime silica glass, having a conductive coating disposed on one of its surfaces. Conductive metal bus bars, for example, sprayed copper, are disposed onto and in electrical contact with the coating. A temperature sensor may be placed in thermal contact with the heating assembly. As a result, the temperature sensor would allow a cooking appliance to control the electric current being conducted through the heating assembly and, consequently, the temperature of the object being heated.

Abstract: A heating element for an electric appliance for heating or cooking foods. The heating element is composed of: a tubular metal envelope; and a resistance wire encased in an insulator disposed at the interior of the tubular envelope. The wire is composed of nickel and iron as the two principal elements, and has a temperature coefficient &agr; greater than 1500 ppm/° C. The wire may be wound in a spiral and the outer diameter of the spiral is greater than 0.7 times the inner diameter of the tubular envelope.

Abstract: A graphite heater and method of forming a graphite heater comprising a graphite body configured in a spiral or serpentine geometrical shape defining at least one zone of an electrical heating circuit having opposed ends so as to provide an electrical path for each heating zone through the graphite body from the opposed ends with said graphite body having at least one heating surface, a coating of pyrolytic boron nitride or aluminum nitride encapsulating said graphite body and a surface layer of pyrolytic boron nitride or aluminum nitride disposed on said graphite body such that said heating surface is continuous and solid.

Abstract: The invention relates to a ceramic hot-plate with a glass ceramic plate which includes heating elements, which are separated by an insulating layer, for direct heating on the lower side thereof. The cooking area is sub-divided into at least one inner and one outer area which include individual heating elements for each partial area. Said heating elements can be switched or adjusted with regard to the output thereof by means of a control device according to temperature values detected by temperature sensors associated with the partial areas. Concentrically arranged conductor strips enable the hot-plate to be constructed easily, the design thereof ensuring that the surface thereof is used in an optimum manner and providing a high degree of heating efficiency by virtue of the homogeneous manner in which the partial areas are heated.

Abstract: A thin food heating unit suitable for use as a restaurant griddle includes a silicone rubber heating blanket vulcanized to the underside of a highly thermally conductive metal food warming plate for heating a food item placed thereon, a base insulated from the heating blanket and the food warming plate by a high temperature ceramic fiber insulation, insulating standoffs between the food warming plate and the top of the base, a separate power supply which supplies electrical energy to the griddle at a relatively low voltage compared to standard line voltage, and a power controller including an on/off switch which is separate from the base and which can be mounted separately in a restaurant installation.

Abstract: A heater assembly of a semiconductor device manufacturing apparatus minimizes a temperature difference between a peripheral portion and a central portion of the wafer being processed in the apparatus. The heater assembly includes a unitary resistive heating member in the form of a disc, heat blocks that divide the peripheral portion and central portion of the upper surface of the disc into respective heating sections, a support for supporting the heating member, and an electric power source for supplying electric current to the unitary heating member. The widths of the heating sections become greater towards the center of the heater, and thus the electrical resistance of the heater also increases in a direction towards the center of the heater. The power source for the heater includes a lead that extends from the bottom surface of the heater to a bottom portion of the heater support.

Abstract: An object of the present invention is to provide a ceramic heater for a semiconductor-producing/examining device which has a short temperature dropping time and can be rapidly cooled. The present invention is a ceramic heater for a semiconductor-producing/examining device comprising a resistance heating element on a surface thereof, wherein the resistance heating element has a surface roughness Ra according to JIS B 0601 of 0.01 &mgr;m or more.

Abstract: A hot plate unit that cools within a short period of time without a complicated or enlarged structure. The hot plate unit (1) includes a hot plate (3), which is arranged in an opened portion (4) of a casing (2A) and has a resistor (10). The casing (2A) and the hot plate (3) form a space to enable the circulation of air. An inner bottom plate (41) is provided in the casing (2A).

Abstract: An objective of the present invention is to provide a ceramic heater making it possible to heat an object to be heated, such as a silicon wafer, uniformly. The ceramic heater of the present invention is a ceramic heater wherein a heating element is formed on a surface of a ceramic plate or inside the ceramic plate, wherein: a bottomed hole is made, being directed from the opposite side to a heating surface for heating an object to be heated, toward the heating surface; the bottom of said bottomed hole is formed relatively nearer to the heating surface than the heating element; and a temperature-measuring element is set up in this bottomed hole.

Abstract: An object of the present invention is to provide a heater wherein even if a through hole into which lifter pins and the like for supporting a semiconductor wafer will be inserted is made, the temperature in the vicinity of the through hole is not lowered so that the temperature in its heating face is even. The present invention is a ceramic heater comprising a ceramic substrate; and a resistance heating element formed on the surface of the ceramic substrate or inside above-mentioned ceramic substrate, above-mentioned ceramic substrate being equipped with a through hole, wherein the wall face of above-mentioned through hole has a surface roughness of Rmax=0.05 to 200 &mgr;m based on JIS B 0601.

Abstract: A cooking appliance includes a grilling grate supported directly above at least one heating element and situated adjacent to a downdraft grill. The grilling grate includes structure to effectively shield the heating element(s) from an air flow generated during operation of the downdraft system. More specifically, the grilling grate includes a grilling surface on an upper side, and a plurality of conductive heat members on a lower side. The conductive heat members have side portions which extend about the heating element in order to cloak the heating element from the effects of the airflow produced by the downdraft system thereby providing a more efficient means of energy transfer to the grilling surface.

Abstract: A hot plate unit for heating semiconductor wafers. The hot plate unit includes a case, a hot plate, a seal element, and a holding ring. The seal element is made of a heat insulative material and is arranged between the case and the hot plate. The hot plate is clamped between the holding ring and the seal element. Screws for fastening the holding ring do not contact the hot plate.

Abstract: A hot plate unit for heating semiconductor wafers. The hot plate unit includes a case, a hot plate, a seal element, and a holding ring. The seal element is made of a heat insulative material and is arranged between the case and the hot plate. The hot plate is clamped between the holding ring and the seal element. Screws for fastening the holding ring do not contact the hot plate.

Abstract: A method of bonding a heating element onto the back of a glass or glass-ceramic material is provided. The heating element is bonded to the back of the glass or glass-ceramic material using a suitable adhesive material, such as an adhesive tape, RTV silicone, or a similar temperature resistant, chemically inert material. A burner unit formed from a glass or glass-ceramic material having a desired shape with the heating element connected to it with a heat resistant adhesive can be formed by this method. This allows greater freedom of design of burners to have any desired shape, as well as providing a strong, easily cleanable surface.

Abstract: The present invention has its object to provide a ceramic heater which has a high thermal conductivity so that the surface temperature of the heater plate promptly follows the temperature change of the heating element to control the temperature of the wafer-heating surface with high efficiency and the thermal diffusion of impurity from the ceramic heater can be successfully prevented.

Abstract: An objective of the present invention is to provide a ceramic heater making it possible to prevent a short circuit in its resistance heating element and heat a semiconductor wafer evenly. The ceramic heater of the present invention is a ceramic heater comprising: a ceramic substrate; an insulating layer having volume resistivity higher than that of said ceramic substrate, being formed on at least a part of said ceramic substrate; and a resistance heating element formed on said insulating layer.

Abstract: A ceramic heater capable of reducing temperature uniformity at the periphery of through holes such as insertion holes and vacuum suction holes is provided, which protects wafer against thermal shocks and has improved controllability for temperature control parts such as thermocouples and temperature fuse. Further, a ceramic heater capable of uniform resin curing is provided. A heat generation body is disposed on the surface or inside of a ceramic substrate. Further, corners for the insertion holes, the recesses and the vacuum suction holes of the ceramic substrate are chamfered.

Abstract: A building for containing occupants, with at least one covering element to provide at least one roof portion, at least one wall portion, and at least one floor portion, to provide an interior space to contain and protect occupants from an adverse environment about the building or other structures. The building has an opening to permit occupants to ingress and egress, a window comprising at least one pane, comprising at least an outer pane disposed to contact the adverse environment about the building and at least one inner pane disposed toward the interior space of the building. The pane exposed to the environment about the building or structure comprises a glass material that has a minimized coefficient of thermal expansion. The building also has an insulation to protect occupants from adverse temperature and environmental conditions about the building and a heating apparatus to provide heat to the space provided by the at least one covering element, the window, and the insulation.

Abstract: A heat treatment unit comprises a heat plate made of aluminum nitride which is excellent in heat conductivity and strength inside thereof. The entire circumference of the heat plate is supported by a supporting member which is excellent in thermal insulation. The heat treatment unit is equipped with a nozzle for blowing dry air against the reverse side of the heat plate. When a temperature of the heat plate is lowered, the dry air is blown from the nozzle, thereby quickly lowering the temperature of the heat plate.

Abstract: An object of the present invention is to provide a ceramic substrate that is superior in temperature rising/dropping characteristics and breakdown voltage at a high temperature, has a small warp amount, and is optimum as a substrate used for an element for temperature adjustment of an optical device. A ceramic heater of the present invention is a ceramic heater having temperature adjustment means, characterized in that the number of pores which are formed in the ceramic substrate and which have a diameter of 0.5 &mgr;m or more is 15×1011 or less per m2, or 0.

Abstract: An object of the present invention is to provide a ceramic heater for a semiconductor producing/examining device wherein a scattering in the resistance value of its resistance heating element is hardly generated and its heating face is excellent in temperature evenness. The present invention is a ceramic heater for a semiconductor producing/examining device having a resistance heating element formed on a surface of a ceramic substrate, wherein a gutter is formed along the direction of current flowing through the resistance heating element.

Abstract: An object of the present invention is to provide a heater wherein even if a through hole into which lifter pins and the like for supporting a semiconductor wafer will be inserted is made, the temperature in the vicinity of the through hole is not lowered so that the temperature in its heating face is even. The present invention is a ceramic heater comprising a ceramic substrate; and a resistance heating element formed on the surface of the ceramic substrate or inside above-mentioned ceramic substrate, above-mentioned ceramic substrate being equipped with a through hole, wherein the wall face of above-mentioned through hole has a surface roughness of Rmax=0.05 to 200 &mgr;m based on JIS B 0601.

Abstract: An object of the present invention is to provide a hot plate for a semiconductor producing/examining device, in which hot plate, when an object to be heated such as a silicon wafer is heated in a state that the object is distanced by a certain distance from the heating face, air is less likely to stagnate between the silicon wafer and the heating face and thus the object to be heated can be evenly heated. Specifically, the hot plate for a semiconductor producing/examining device of the present invention comprises a resistance heating element formed on a surface of a ceramic substrate or inside the ceramic substrate, wherein the glossiness of the heating face of said ceramic substrate is 1.5% or more.

Abstract: By dividing a resistor heating body into 2 or more circuits at outer peripheral side and inner peripheral side and feeding different powers to these circuits based on results of temperatures measured through a temperature measuring means to conduct temperature control, the temperature at the outer peripheral side is made equal to or more than the temperature at the inner peripheral side to uniformize the temperature distribution of the substrate heating face in a radial direction and make small a temperature difference of a heating face for silicon wafer.

Abstract: In a ceramic heater having a plate-like body made of a ceramic, heating element in one main face of the plate like body, and an electric supply portion to be electrically connected with the heating element, it has been a problem that the temperature is uneven if bent portions are formed in heat generating patterns. The ceramic heater simultaneously satisfying the following: 0.15≦S≦0.85, 0.3≦P≦6.71×S2+1.52, and 0.3≦G≦6.71×(1−S)2+1.55, in which the reference character S1 denotes the surface area of the heating element in optional 10 mm square region of the effective heat generation area having the heating element therein; the surface ratio S denotes S=S1/100 mm2, the reference character P denotes the width of the heating element and the reference character G denotes the gap between the heating element.

Abstract: A ceramic heater in which a resistor is firmly fixed onto a ceramic substrate. The resistor comprises at least two or more kinds of noble metal particles, ruthenium dioxide, and a glass frit.

Abstract: A rotary nozzle device has:

Abstract: A ceramic heater improving a uniformity of temperature distribution in a work heating face, wherein a resistance heating body formed on a face of a ceramic substrate opposite to the work heating face thereof is such that the scattering of thickness is within ±50% of an average thickness, and a surface roughness of the resistance heating body is a range of 0.05-100 &mgr;m as Rmax and not more than 50% of the average thickness.

Abstract: An object of the present invention is to provide a ceramic heater making it possible to suppress an outflow of heat to a supporting case and so on to make the temperature of its ceramic substrate uniform. The ceramic heater of the present invention is a ceramic heater wherein a heating element is arranged on a surface of a ceramic substrate or inside the ceramic substrate, the surface roughness Rmax of the side face of the ceramic substrate being from 0.1 to 200 &mgr;m according to JIS B 0601.

Abstract: By dividing a resistor heating body into 2 or more circuits at outer peripheral side and inner peripheral side and feeding different powers to these circuits based on results of temperatures measured through a temperature measuring means to conduct temperature control, the temperature at the outer peripheral side is made equal to or more than the temperature at the inner peripheral side to uniformize the temperature distribution of the substrate heating face in a radial direction and make small a temperature difference of a heating face for silicon wafer.

Abstract: A hot plate unit that cools within a short period of time without a complicated or enlarged structure. The hot plate unit (1) includes a hot plate (3), which is arranged in an opened portion (4) of a casing (2A) and has a resistor (10). The casing (2A) and the hot plate (3) form a space to enable the circulation of air. An inner bottom plate (41) is provided in the casing (2A).

Abstract: A processing station adaptable to standard cluster tools has a vertically-translatable pedestal having an upper wafer-support surface including a heater plate adapted to be plugged into a unique feedthrough in the pedestal. At a lower position for the pedestal wafers may be transferred to and from the processing station, and at an upper position for the pedestal the pedestal forms an annular pumping passage with a lower circular opening in a processing chamber. A removable, replaceable ring at the lower opening of the processing chamber allows process pumping speed to be tailored for different processes by replacing the ring. In some embodiments the pedestal also has a surrounding shroud defining an annular pumping passage around the pedestal. A unique two-zone heater plate is adapted to the top of the pedestal, and connects to a unique feedthrough allowing heater plates to be quickly and simply replaced.

Abstract: A device and method for the removal of excess embedding tissue from histological samples comprising a plate with heating elements. The plate has at least one trench and a plurality of grooves at the surface of the plate. The plate is arranged at a slight angle as compared to a horizontal plane. Once the device reaches working temperature the user slide the cassette, with extra embedding medium down the surface of the plate. The extra embedding medium melts from the cassette and runs through the plurality of grooves to the trench and finally to a receptacle.

Abstract: A cooking surface for a cooktop. Encrusted, spilled, or overflowing food is deposited on the cooking surfaces of cooktops during cooking and the removal of such residue is difficult because the surface of a cooktop is typically rough and uneven. The invention teaches the manufacture of an easy-to-clean glass ceramic cooktop from a floated glass ceramic. As a result of the increased use of controls in cooking devices, an increased number of displays are also being used under the surface of the cooktops. The invention provides a cooktop with a smooth, distortion-free surface that is easy to clean. The invention also relates to window panes for enclosed hot areas with high temperatures, which are typically made of transparent glass ceramic. When used as windows in warming stoves or in self-cleaning ovens, combustion residues are thereby deposited on the windows, which residues must then be removed.

Abstract: A hot plate unit for heating semiconductor wafers. The hot plate unit includes a case, a hot plate, a seal element, and a holding ring. The seal element is made of a heat insulative material and is arranged between the case and the hot plate. The hot plate is clamped between the holding ring and the seal element. Screws for fastening the holding ring do not contact the hot plate.

Abstract: A hot plate unit for heating semiconductor wafers. The hot plate unit includes a case, a hot plate, a seal element, and a holding ring. The seal element is made of a heat insulative material and is arranged between the case and the hot plate. The hot plate is clamped between the holding ring and the seal element. Screws for fastening the holding ring do not contact the hot plate.

Abstract: A cooking appliance having a bowl portion and a hotplate portion whereby differing cooking modes can be simultaneously effected by the appliance.