Abstract: An electric heater includes a substrate; and a first plane heating element disposed on one surface of the substrate, in which the first plane heating element includes a first track; a second track spaced apart from the first track; and a third track spaced apart from the second track. At least a portion of the second track is located between the first track and the third track, and the first track and the second track are connected by a first bridge, where the first bridge includes a first outer protrusion protruding toward the third track. The third track is formed with a curved portion which protrudes in an outward direction, and the first outer protrusion faces an inside of the curved portion in the outward direction and is spaced apart from the curved portion.

Abstract: An expansion compensating coupler comprised of at least two expansion compensating assemblies for mounting a platen to a dough press. One end of a threaded rod is perpendicularly attached to the platen. A nut is turned onto the rod, a washer is placed on the rod, the rod is inserted through the bore of a sleeve residing in a hole in the dough press, a washer is placed on the rod, and a nut is turned onto the rod. The nuts are tightened to secure the platen to the dough press. The sleeve bore has the same diameter as the rod and the outer diameter of the sleeve is smaller than the hole so that there is a gap. Heating the platen causes it to expand and the threaded rod/sleeve to move into the gap. The minimum gap size is the maximum amount of expected expansion of the platen.

Abstract: The present disclosure discloses a driving circuit of a hand warmer and a hand warmer. The driving circuit of a hand warmer includes a charging control circuit, a heating control unit and a temperature regulating circuit. The temperature regulating circuit is configured to electrically connect the battery and the heating control unit, and includes a main control unit and a stepless regulating device electrically connected with the main control unit, the stepless regulating device is configured to be operated by a user to generate a stepless regulating signal within a preset regulating range. The main control unit is configured to receive the stepless regulating signal to generate a heating control signal and output the heating control signal to the heating control unit, so that the heating control unit outputs a driving signal according to the heating control signal to drive the heating element to heat within a preset temperature range.

Abstract: A heated floor panel may comprise a base assembly and a heating element located on a first surface of the base assembly. A panel skin may be located over the heating element and the first surface of the base assembly. The panel skin may extend from the first surface of the base assembly to a second surface of the base assembly opposite the first surface of the base assembly.

Abstract: A support pedestal includes a support member including a resistive layer having a plurality of zones, a routing layer, and a plurality of conductive vias. The plurality of zones are defined by a plurality of independently controllable resistive heating elements. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias.

Abstract: An electrode-embedded member 1 includes a ceramic-made substrate 2, an electrode 3, a connection member 4 containing at least one of tungsten and molybdenum and embedded in the substrate 2 in a state in which a first principal surface 4a faces the electrode 3 and is electrically connected to the electrode 3, and a hole portion 5 extending from an outer surface of the substrate 2 to a second principal surface 4b of the connection member 4. A buffer member 10 embedded in the substrate 2 contains at least a ceramic material forming the substrate 2 and a conductive material containing at least one of tungsten and molybdenum as a constituent element. The buffer member 10 covers at least part of an edge of the connection member 4.

Abstract: A hand held appliance including a fluid flow path extending between a fluid inlet and a fluid outlet and a ceramic heater within the fluid flow path wherein the fluid flow path is non-linear and the heater is non-linear. The appliance may include a housing wherein the housing houses the heater and encloses the fluid flow path, and wherein the housing is curved. The heater may be curved. The housing may include a straight section and a curved section and the heater is housed within the curved section. The heater may include at least one heating element comprising a flat ceramic plate and a conductive track. The heating element may be arcuate. The heating element may have a constant curvature.

Abstract: An electric heater includes a substrate (an insulating material capable of forming a conductor pattern on a surface of an insulating substrate), a first plane heating element formed on one surface of the substrate, and a second plane heating element formed on one surface of the substrate to be located outside the first plane heating element. The first plane heating element includes a first pattern portion connecting a start point with an end point located in a first zone, a pair of first electrodes located outside the first zone, and a pair of first connectors connecting the first pattern portion with the first electrodes. The second plane heating element includes a second pattern portion located in a second zone surrounding the first zone and connecting a start point with an end point, and at least some of the first connectors are located in the second zone.

Abstract: An electric heater includes a substrate; and a first plane heating element disposed on one surface of the substrate, in which the first plane heating element includes a first track; a second track spaced apart from the first track; and a third track spaced apart from the second track. At least a portion of the second track is located between the first track and the third track, and the first track and the second track are connected by a first bridge, where the first bridge includes a first outer protrusion protruding toward the third track. The third track is formed with a curved portion which protrudes in an outward direction, and the first outer protrusion faces an inside of the curved portion in the outward direction and is spaced apart from the curved portion.

Abstract: An electric heater includes a substrate and a plane heating element disposed on one surface of the substrate. The plane heating element includes a first pattern portion including a start point and an end point, a second pattern portion that surrounds at least a portion of the first pattern portion and includes a start point and an end point, which are located at an innermost side of the second pattern portion, and a third pattern portion that surrounds at least a portion of the second pattern portion and includes a start point and the end point, which are located at an outermost side of the third pattern portion.

Abstract: A road finisher comprising a screed plate extending at right angles to the working direction of the road finisher, and a tamper bar disposed rearwardly and/or forwardly of the screed plate in the working direction, wherein at least one electrically operated heating element is present, which is configured so as to heat up a heating surface facing a road subsurface, and wherein the heating element comprises a heating layer at least partially obtained through thermal spraying onto a substrate surface, wherein the tamper bar is made from two parts with an upper tamper bar member and a lower tamper bar member assembled together. Further, a tamper bar for a road finisher and a method of manufacturing a tamper bar are provided.

Abstract: The invention relates to a device for heating preform bodies or flat or preformed semi-finished products from thermoplastic material (3), comprising at least one base body (1.0, 2.0), on the surface of which at least a first layer or coating is formed, which comprises at least one electric heating resistor in the form of a flat, geometrically arranged conductor loop. The base body also has contact elements, by which the at least one heating resistor can be connected to a power source, wherein, as a result of the geometrically arranged conductor loop(s), a defined temperature profile can be generated, which can be transmitted contactlessly to the preform body or the semi-finished product by an outer contact layer formed on the first layer or coating, by contact the surface of a preform body or semi-finished product and/or by using convection or thermal radiation.

Abstract: The sensor device comprises a hotplate on a membrane. The hotplate is heated by a N-fold rotationally symmetric heater structure having N>1 heater elements of identical design. Each heater element comprises an inner section, an intermediate section and an outer section arranged in series, with the inner section having a larger electrical cross section than the outer section. This design allows to heat the hotplate to a homogeneous temperature at moderate supply voltages.

Abstract: A hot forming line for producing hot formed and press hardened steel sheet products, includes: a forming device; a heating device having a temperature treatment station, wherein the temperature treatment station includes an upper tool and a lower tool, and at least one temperature treatment source; and exchangeable temperature treatment plates for conductive temperature treatment of a blank or part inserted into the temperature treatment station, wherein the exchangeable temperature treatment plates are constructed for arrangement on the upper tool and/or the lower tool, and the temperature treatment source is constructed for heating or cooling the temperature treatment plates. The temperature treatment station is constructed for treating different regions of the blank or part with different temperatures by conductive contact of the temperature treatment plates with the blank of part.

Abstract: A heating apparatus assembly and method are provided for heating a surface. The heating apparatus contains a substrate with a multiplicity of heating elements disposed upon at least one surface of the substrate where each element is individually controllable.

Abstract: A method of operating a heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, wherein the heating plate comprises power supply lines and power return lines and respective heater zone connected between every pair of power supply line and power return line. The method reduces maximum currents carried by the power supply lines and power return lines by temporally spreading current pulses for powering the heater zones.

Abstract: A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.

Abstract: A far infrared ray ceramic flat plate heating module is provided. The far infrared ray ceramic flat plate heating module includes a ceramic heat-generating flat plate, an integrated terminal block for electrical distribution, a metal plate and a metal frame. The ceramic heat-generating flat plate includes a ceramic flat plate, a heat-generating film coated on a surface of the ceramic flat plate, silver paste electrodes configured on and coupled to two opposite sides of the heat-generating film, a first insulating layer coated on the heat-generating film and the silver paste electrodes, a temperature sensor configured by forming a temperature sensing paint layer on the first insulating layer, and a second insulating layer formed on the temperature sensor. The integrated terminal block is secured on the metal plate. The metal frame is disposed surrounding the periphery of the metal plate and the ceramic heat-generating flat plate.

Abstract: A resistive heating element 30 has a higher molybdenum carbide content in a central portion 35 than in a peripheral portion 34. Since molybdenum carbides have a low temperature coefficient of resistance compared to molybdenum, the amount of heat generated in the central portion 35 of the resistive heating element 30 does not increase as much as in the peripheral portion 34 even when the temperature is increased, and the increase in difference in temperature between the peripheral portion 34 and the central portion 35 can be suppressed. In other words, generation of hot spots near the center can be suppressed and a good uniform heating property in a wide range of operation temperatures can be obtained.

Abstract: A cooking or food warming appliance having a heated heat sink plate situated in a vacuum environment within an outer shell. A food vessel intimately engages the heat sink plate along a food contacting surface thereof by virtue of the vacuum. The vacuum eliminates air gaps between the food contacting surface of the food vessel and the heat sink plate so as to provide instantaneous and uniform heating of the food vessel. The vacuum environment also provides thermal insulation for the heat sink plate whereby heat loss by convection is virtually eliminated.

Abstract: A heating apparatus assembly and method are provided for heating a surface. The heating apparatus contains a substrate with a multiplicity of heating elements disposed upon at least one surface of the substrate where each element is individually controllable.

Abstract: A ceramic heater according to the present invention includes a heating portion made of ceramics, and a cooling plate portion. In the heating portion, a belt like printed electrode is formed continuously in a spiral shape along a circumferential direction, and in the printed electrode, slits extended in a width direction of the printed electrode are provided. In such a way, a ceramic heater in which uniform heating performance in the heating surface is high can be obtained.

Abstract: The invention is directed to a device for heating lock elements in aircraft, in particular to prevent icing up of door locks and emergency slide locks. The object of the invention, to find a novel possibility for heating lock elements in aircraft, particularly for preventing icing of door locks and emergency slide locks, which reliably eliminates icing of the lock elements without requiring frequent maintenance and repair due to high mechanical, chemical and thermal stresses, is met according to the invention in that a base body which is mounted in the floor of the aircraft and contains an insert profile has an integrated, inserted sliding plate and in that the sliding plate is hollowed out from the bottom over a large surface to receive a heating foil, wherein the heating foil is embedded in the hollowed out recess in a sandwich-type construction, and the sliding plate is hermetically sealed from the bottom.

Abstract: A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processing a treatment object having a given emission spectrum at a treatment object temperature which causes the treatment object to produce a treatment object radiated energy. The chamber responds in a first way to the heating arrangement radiated energy and in a second way to the treatment object radiated energy that is incident thereon. The chamber may respond in the first way by reflecting the majority of the heat source radiated energy and in the second way by absorbing the majority of the treatment object radiated energy. Different portions of the chamber may be treated with selectively reflectivity based on design considerations to achieve objectives with respect to a particular chamber performance parameter.

Abstract: The power-supplying member comprises: a first rod-shaped member connected to at least one of a heating resistor and an electrode; a second rod-shaped member connected to a power supply; and a thermal-function member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which has a smaller axial cross section area and a larger surface area as compared to the first and second rod-shaped members.

Abstract: A power-supplying member comprises: a first rod-shaped member connected to power-supplied object; a second rod-shaped member connected to power supply; and a thermal-expansion absorbing member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which shrinks in a longitudinal direction in response to changes in shape of the first rod-shaped member and the second rod-shaped member in the longitudinal direction due to thermal expansion.

Abstract: A heating apparatus assembly and method are provided for heating a surface. The heating apparatus contains a substrate with a multiplicity of heating elements disposed upon at least one surface of the substrate where each element is individually controllable.

Abstract: A lead free, thick film heating element. Known thick film heating elements contain environmentally hazardous material such as lead. This is particularly problematic when manufacturing thick film heating elements, as lead is often used in thick film formulations to allow the glass-based thick film to be processed at low firing temperatures. Using composite sol gel technology, the present invention provides a method to produce a lightweight mica-based thick film heating element based on thick film materials that are free from lead or cadmium. This mica-based element is lightweight, has the performance advantages of a thick film heating element, and may be processed at a low temperature using thick film materials.

Abstract: A ceramic heater according to the present invention includes a heating portion made of ceramics, and a cooling plate portion. In the heating portion, a belt like printed electrode is formed continuously in a spiral shape along a circumferential direction, and in the printed electrode, slits extended in a width direction of the printed electrode are provided. In such a way, a ceramic heater in which uniform heating performance in the heating surface is high can be obtained.

Abstract: An electric heating device based on a ribbon of crystalline metal foil with high specific resistance, which is additionally treated to increase its plasticity and/or additionally coated with a mold release agent to enhance compatibility of the ribbon and insulating envelope. The ribbon combines high electrical resistance, high stability, sufficient mechanical strength and relative cheapness with very important properties including significant plasticity and compatibility with insulating polymers, including rubber and silicone. The above compatibility provides high reliability and life span. Different structures for flexible and rigid heaters on the basis of this ribbon are described, as are different applications.

Abstract: A substrate heater is provided including a plate-shaped ceramic base having a first side defining a convex heating surface on at least a portion of which a substrate is placed, a resistance-heating element embedded in the ceramic base, and a tubular member joined to a central portion on an opposed second side of the ceramic base. The convex heating surface has a central portion and a peripheral portion, wherein the height of the heating surface decreases from the central portion toward the peripheral portion thereof.

Abstract: An electrical heating assembly (2) comprises a glass-ceramic cooking plate (4) having an upper surface (6) for receiving a cooking vessel (8) and a lower surface (10). A radiant electric heater (12) incorporating at least one electric heating element (20) is supported in contact with the lower surface of the cooking plate. Temperature sensing means (29) is spaced above the at least one heating element (20). The temperature sensing means includes a support member (33) which has provided on an upper surface a film form temperature-sensitive electrical resistance element (30) and which is provided with electrical connecting leads (34). Thermal insulation means (40) is adapted and arranged to shield the support member (33) and a corresponding region of the lower surface (10) of the cooking plate (4) from direct thermal radiation from the at least one electric heating element (20).

Abstract: A process for producing a ceramic heater includes forming a resistance heating element on a surface of a ceramic substrate. The resistance heating element is divided into plural sections. Resistivities of the plural sections are measured, respectively. Each of the plural sections is trimmed according to a comparison between the resistivities of the plural sections.

Abstract: An objective of the present invention is to provide a ceramic heater making it possible to heat an object to be heated, such as a silicon wafer, evenly. The ceramic heater of the present invention is a ceramic heater having and a resistance heating element formed on the surface of the ceramic substrate or inside the ceramic substrate, wherein: said ceramic heater is equipped with: a temperature-measuring means measuring the temperature of said ceramic substrate and an object to be heated; a control unit supplying electric power to said heating element; a memory unit memorizing the temperature data measured by said temperature-measuring means; and an operation unit calculating electric power required for said heating element from said temperature, said ceramic heater being constituted such that said heating element is divided into at least 2 or more circuits and different electric power is supplied to each of the circuits of said resistance heating element.

Abstract: A ceramic beater for a semiconductor producing/examining device having a resistance heating element superior in adhesion to a substrate. The ceramic heater includes a ceramic substrate and a resistance heating element formed on the surface of the ceramic substrate. Further, irregularities are formed on the side face of the resistance heating element.

Abstract: A glass or glass ceramic cooking top 1 has on its underside 6 at least one heating unit 7. The heating unit 7 is in flat, heat-conducting contact with the underside 6, and contains an electrical resistance heating element exhibiting PTC behavior, the temperature in zone 3 being limited to a desired value without the use of a temperature limiter.

Abstract: A ceramic cooking system including a glass ceramic plate, with an underside that supports an electrical insulation layer having one or more heating elements for directly heating the glass ceramic plate. This invention improves the adhesion of the insulation during heating and prevents the insulation from partially detaching. Thus, the insulation layer is subdivided into several insulation segments that extend over the cooking area and support heating elements specifically assigned to each segment.

Abstract: Ceramic susceptor having a processed-object retaining face—and semiconductor as well as liquid-crystal manufacturing apparatuses in which the susceptor is installed—in which temperature uniformity in the surface of an object being processed on the susceptor is enhanced. Forming a resistive heating element in the susceptor surface on other than its processed-object retaining side, or on an internal surface of the susceptor, and forming a lead circuit for supplying electricity to the resistive heating elements in a surface separate from the surface on which the resistive heating element is formed, allows the temperature uniformity of the susceptor to be enhanced and enables uniformization of the temperature distribution in the processed-object retaining face.

Abstract: A ceramic heater capable of reducing temperature uniformity at the periphery of through holes such as insertion holes and vacuum suction holes is provided, which protects wafer against thermal shocks and has improved controllability for temperature control parts such as thermocouples and temperature fuse. Further, a ceramic heater capable of uniform resin curing is provided. A heat generation body is disposed on the surface or inside of a ceramic substrate. Further, corners for the insertion holes, the recesses and the vacuum suction holes of the ceramic substrate are chamfered.

Abstract: An object of the present invention is to provide a hot plate making it possible to heat an object to be heated uniformly, and the hot plate of the present invention is characterized in that a resistance element having a thickness dispersion of ±3 &mgr;m or less is formed on an insulating substrate.

Abstract: In a ceramic heater having a plate-like body made of a ceramic, heating element in one main face of the plate like body, and an electric supply portion to be electrically connected with the heating element, it has been a problem that the temperature is uneven if bent portions are formed in heat generating patterns. The ceramic heater simultaneously satisfying the following: 0.15≦S≦0.85, 0.3≦P≦6.71×S2+1.52, and 0.3≦G≦6.71×(1−S)2+1.55, in which the reference character S1 denotes the surface area of the heating element in optional 10 mm square region of the effective heat generation area having the heating element therein; the surface ratio S denotes S=S1/100 mm2, the reference character P denotes the width of the heating element: and the reference character G denotes the gap between the heating element.

Abstract: A heating and cooling apparatus is provided which employs a series of thermally conductive plates thermally coupled to heating and cooling devices to heat or cool a mounting plate loaded with semiconductor devices. The mounting plate is assembled on a heating plate, which is then assembled on a cooling plate. The heating plate includes upper and lower plates with a heater therebetween which can heat the heating plate to a desired temperature, which in turn heats the mounting plate and the semiconductor devices. The cooling plate has ‘S’ shaped flow grooves formed throughout. When cooling fluid is flowed through the flow grooves, the cooling plate is cooled, which cools the heating plate, which in turn cools the mounting plate and the semiconductor devices.

Abstract: The present invention is to provide an electrical heating plate structure, including an insulating plate, and an electrically conducting plate mounted on the insulating plate. The electrically conducting plate includes multiple heat emitting sections. Each of the heat emitting sections has different radial widths, so that each of the heat emitting sections has radial cross-sectional areas different from each other, thereby capable of controlling a temperature distribution of each region of the electrical heating plate structure.

Abstract: An objective of the present invention is to provide a ceramic substrate making it possible to control its heating face into even temperature even if through holes into which lifter pins, supporting pins and the like will be inserted are made. The present invention is a ceramic substrate having: a heating element composed of one or more circuit(s) on a surface thereof or inside thereof; and a through hole being made in the ceramic substrate, wherein the heating element circuit is formed in the range of 20 mm or less from the inner wall of the through hole.

Abstract: The present invention provides a ceramic heater which makes it possible to make the distance between a semiconductor wafer and the heating surface of a ceramic substrate constant at any time, heat the semiconductor wafer at an even temperature and prevent contamination of the semiconductor wafer, and which does not cause dropping-out of a supporting pin. The ceramic heater of the present invention comprises a ceramic substrate on a surface of which or inside which a heating element is formed, wherein the ceramic heater is constituted to have a structure that an object to be heated can be held apart from a surface of said ceramic substrate and heated.

Abstract: An object of the present invention is to provide a hot plate in which a transmittance of a ceramic substrate is not more than 10%, thereby measuring a temperature of a heating face by a thermoviewer more accurately, and the present invention is a hot plate comprising a ceramic substrate and a conductor layer formed on a surface of said ceramic substrate or inside said ceramic substrate, wherein a transmittance of an infrared ray wavelength, of said substrate, is 0% or not more than 10%.

Abstract: A heating apparatus includes a heater 6 which includes a first heating conductor pattern 1, a second heating conductor patterns 2 and an elongated plate-shaped member 3 made of heat-resistive and insulated material. The first heating conductor pattern 1 is disposed in the central portion in a longitudinal direction of the plate-shaped member 3. The second heating conductor patterns are disposed in both end portions of the plate-shaped member in the longitudinal direction. The first heating conductor pattern 1 and the second heating conductor patterns 2 are independently controlled their temperature. Current is first fed to the first heating conductor pattern 1, and the current feeding is stopped, and current is then fed to the second heating conductor patterns 2. Accordingly, the protective member placed on and along the heater 6 is gradually heated from the center to both ends.

Abstract: A ceramic heater comprises a ceramic substrate; and a heat-generation pattern on a surface of the ceramic substrate or within said ceramic substrate, wherein the ceramic substrate has a thickness of 18 mm or less and the ceramic substrate is made of at least one selected from the group consisting of aluminum nitride and ceramic carbide; and the heat-generation pattern has a bending portion which describes an arc.

Abstract: A ceramic heater in which a resistor is firmly fixed onto a ceramic substrate. The resistor comprises at least two or more kinds of noble metal particles, ruthenium dioxide, and a glass frit.

Abstract: In a ceramic heater comprising a heating body formed on a surface of a ceramic substrate, the heating body is made of a non-sintering type metal foil or an electrically conductive ceramic thin film, and the metal foil or electrically conductive ceramic thin film is adhered to the surface of the substrate through a heat-resistant resin layer or the like. The ceramic heater is less in the scattering of resistance resulted from the quality of the heating body and is possible to accurately and rapidly conduct temperature control.