Abstract: An apparatus and method for cutting a LCD panel is provided. The apparatus comprises a first scribing unit for forming first scribing lines and second scribing lines for dividing LCD panels on a substrate having a plurality of LCD panels. The apparatus also has a first flipping unit for flipping the substrate, a first breaking unit having a breaking bar for striking the flipped substrate along the first scribing lines to form a crack on the substrate, and a plurality of breaking rollers for pressing the flipped substrate along the second scribing lines to form a crack on the substrate. A breaking process of an LCD panel may be performed without rotating the substrate by using the breaking bar and the breaking rollers. Also, the breaking process may be performed without damaging image display regions of LCD panels where different sized LCD panels are on the substrate.

Abstract: An apparatus for cutting liquid crystal display panels is disclosed in the present invention. The apparatus includes at least one table receiving bonded mother substrates having a plurality of unit liquid crystal display panels, at least one cutting wheel forming a scribing line on a surface of the bonded mother substrates, and a suction unit coupled to the at least one cutting wheel and sucking in glass debris on the surface of the bonded mother substrates.

Abstract: Glass substrate cutting apparatuses using lasers are disclosed, where a laser cutting head is moved. A glass substrate cutting apparatus includes two parts for a laser cutting head: heavy laser beam generators fixed to respective ends of a gantry structure moving in parallel along two gantry stages located on either side of a cutting table, and relatively lightweight laser irradiation heads moving horizontally in parallel with the gantry structure. The glass substrate cutting apparatus includes a cutting table for maintaining a glass substrate in a horizontal state; biaxial gantry stages for moving a gantry structure along the cutting table; the gantry structure moving in between an upper part of the biaxial gantry stages; laser beam generators fixed to respective ends of the gantry structure for oscillating the laser; and laser irradiation heads that move horizontally on respective ends of the gantry structure and irradiate the laser upon the glass substrate.

Abstract: Disclosed herein are apparatuses for breaking a glass panel unified with a process table which break the glass panel formed with scribing lines along the scribing lines by irradiating laser beams. The apparatuses for breaking a glass panel unified with a process table to conduct breaking operations of the glass panel after scribing work of the glass panel as one body with the process table are installed on both sides of the process table included in a transfer-type cutting head laser cutting device. Each apparatus for breaking the glass panel unified with the process table comprises: breaking bars for cutting the glass panel by applying pressure to cutting sections of the glass panel; rotating devices for rotating the breaking bars by combining with both ends of the breaking bars; and a support equipped with cylinders for vertically moving the rotating devices in both sections.

Abstract: A method of cleaving an optical fiber and apparatus therefor including a hand tool wherein the optical fiber to be cleaved (6) has a natural path. The method of cleaving includes deflecting the optical fiber (6) away from its natural path in a first direction and at a point spaced longitudinal along the length of the fiber deflecting the optical fiber in a second direction opposed to the first direction. The opposing deflection induce internal stresses in the fiber that extend substantially across the core of the optical fiber over a region of the length of the optical fiber. The fiber may then be scratched in this region with a cleaving blade (5) so as to induce cleaving of the optical fiber. The cleaving is controlled by controlling the internal stresses induced in the fiber by in turn controlling the degree of deflection induced in the fiber. Further the fiber (6) may be placed under extension to assist in the control of the stresses induced.

Abstract: A method and apparatus for breaking a semiconductor substrate along a predetermined area over which a split groove is formed. The breaking apparatus includes a table for placing a portion of the semiconductor substrate inside the predetermined area and a breaking blade being operable to move downward from a position above the semiconductor substrate placed on the table to thereby compress a portion of the semiconductor substrate outside the predetermined area so that the semiconductor substrate is broken along the split groove. The predetermined area of the semiconductor substrate has at least a neighboring pair of sides intersecting at an angle of less than 180 degrees, and the breaking blade has a projection which, when the semiconductor substrate is broken, compresses a portion of the semiconductor substrate outside the one side so that the one side is compressed ahead of the other side.

Abstract: A center-pull dispenser for dispensing paper towels from a continuous roll, wherein each individual towel is separated from an adjoining towel by a plurality of perforations. The dispenser comprises a housing having a housing back and a detachable front cover hingedly connected thereto at the lower periphery of said housing back and front cover for opening and closing the housing, a paper support tray removably connected to a lower portion of the housing back and having a centrally located dispensing nozzle, an opening in the lower periphery of the housing through which the towels are dispensed, a detachable wall-mounting member for removably mounting the housing back to a wall, and a locking member for releasably locking the front cover to the housing back and the housing back to the wall-mounting member.

Abstract: A center-pull dispenser for dispensing paper towels from a continuous roll, wherein each individual towel is separated from an adjoining towel by a plurality of perforations. The dispenser comprises a housing having a housing back and a detachable front cover hingedly connected thereto at the lower periphery of said housing back and front cover for opening and closing the housing, a paper support tray removably connected to a lower portion of the housing back, the tray having a centrally located dispensing nozzle and at least one locking element for releasably locking at least one first hinge element on the lower periphery of the front cover to at least one second hinge element on the lower periphery of the housing back, an opening in the lower periphery of said housing through which the towels are dispensed, and a wall-mounting member for removably mounting the housing back to a wall.

Abstract: Apparatus and methods for resizing electronic displays are provided. The display includes a front plate, a back plate, a perimeter seal spacing the front and back plates apart, image-generating medium contained in an area between the plates, and polarizing layers and/or other films on the outer surfaces of the plates. A target portion of the display is identified, and a saw is passed along a cut line to create a channel that extends through the polarizer to the outer surface of the top plate. A scriber tool is passed along the cut line within the channel to create a scribe line in the outer surface of the top plate. The display is inverted, and the process repeated to cut a channel and scribe the bottom plate. The plates are broken along the scribe line, and a seal is applied along the exposed edge, which may penetrate between the plates.

Abstract: An apparatus for cutting a substrate includes first and second belt conveyers for conveying the substrate thereon, a scriber for scribing the substrate along a cutting-reserved line, the scriber provided between the first and second belt conveyers and being spaced apart from the first and second belt conveyers, and a substrate support for securing the substrate, the substrate support provided between the first and second belt conveyers along a scribing direction of the substrate.

Abstract: A disposable ampoule opener, in combination with ampoule, is disclosed, which may include a first housing section having a substantially convex outer surface and a substantially concave inner surface shaped to receive at least a portion of the ampoule and a second housing section having a substantially convex outer surface shaped to receive at least a portion of the ampoule, wherein the ampoule has a lower liquid portion capable of containing liquid and an upper tip portion that is narrower in diameter than the lower liquid portion, the ampoule further having a neck portion disposed between the lower liquid portion and the upper tip portion, and wherein the second housing section is coupled to the first housing section, and which may also include ribs along one of the inner concave surfaces and ridges alone one of the outer convex surfaces.

Abstract: Apparatus and methods for resizing electronic displays are provided. The display includes a front plate, a back plate, a perimeter seal spacing the front and back plates apart, image-generating medium contained in an area between the plates, and polarizing layers and/or other films on the outer surfaces of the plates. A target portion of the display is identified, and a saw is passed along a cut line to create a channel that extends through the polarizer to the outer surface of the top plate. A scriber tool is passed along the cut line within the channel to create a scribe line in the outer surface of the top plate. The display is inverted, and the process repeated to cut a channel and scribe the bottom plate. The plates are broken along the scribe line, and a seal is applied along the exposed edge, which may penetrate between the plates.

Abstract: A plate material vertical processing line that is capable of subjecting large-sized and thinned glass plates to scribing, venting, etc without degrading their quality, comprises a plurality of processing devices each having a modular structure; wherein each of the processing devices includes a platform; a belt conveyor that is mounted on the platform and is configured to convey a glass plate placed in a substantially upright position while supporting a lower end of the glass plate; and a fluid guide that is mounted on the platform and is configured to apply a fluid pressure to a surface of the glass plate to support the glass plate in the substantially upright position and in a non-contact state; and wherein the processing devices include a combination of at least two processing devices selected from a scribing device, a venting device, a chamfering device, a cleaning agent washing device, a water washing device, a high-pressure water spray device, and a glass plate turn device.

Abstract: A plate material cutting unit is equipped with: support devices for supporting the lower edge of an upright plate material; fluid guides for applying fluid pressure on a surface of the plate material which is held upright on the support devices, to support the plate material in a non-contact manner; a scribe forming device, equipped with a scribing blade for forming a scribe for cutting on the plate material, by moving along the surface of the plate material, which is supported by the fluid guides; a clamp, for gripping a portion of the plate material adjacent to the movement trajectory of the scribing blade along the plate material; and a cutting device, equipped with a pressing member for pressing a portion of the plate material opposite the scribe in a planar direction with respect to the portion of the plate material which is gripped by the clamp.

Abstract: A method and an apparatus process a substrate to divide a mother substrate into unit substrates. The apparatus is provided with a scribing portion for drawing a scribe line on a mother substrate, a breaking portion for breaking a mother substrate along the formed scribe line, and a portion for conveying a substrate for conveying a mother substrate or a unit substrate at least between the above described respective portions, wherein portion for conveying a substrate has a number of rotational supports and with a suction surface for sucking and holding each substrate from a main surface, rotational supports and have rotational axes, as well as suction members for respectively sucking and rotating a substrate which rotates substrates around rotational axes approximately simultaneously in such a manner that at least two main surfaces of each substrate are turned over in the upward and downward direction.

Abstract: The present invention provides assemblies and methods for selectively removing resin coatings from a radiation detector. A method includes positioning a cutting edge on a resin coating formed on a radiation detector. The method further includes positioning a bonding member on the resin coating, applying a force to the bonding member such that a portion of the resin coating is pulled away from the radiation detector, and cutting the resin coating so as to detach the portion of the resin coating pulled away from the detector, thereby selectively removing the portion of the resin coating from the radiation detector.

Abstract: A bladeless optical fiber cleaver is provided for cleaving an optical fiber connector in a straightforward manner. The bladeless optical fiber cleaver includes a generally planar body that includes a first body portion and a second body portion pivotably coupled to each other, where the second body portion is movable with respect to the first body portion. The fiber cleaver includes a mechanism to create a strain force in a stripped portion of the optical fiber, where the stripped portion under strain is exposed to receive contact from a flexible abrasive material, the flexible abrasive material introducing a flaw in the optical fiber where the cleave takes place.

Abstract: An optical fiber cutting device and method, and optical fiber cutting blade member in which excellent workability is obtained by a simple configuration, and a cost reduction can be attained are provided.

Abstract: In a method of cutting a plasma display panel, a front glass substrate and a rear glass substrate are sealed so as to face each other. The front glass substrate and the rear glass substrate are sandwiched between pairs of rotating cutters, and the pairs of rotating cutters are pressed onto the front glass substrate and the rear glass substrate to be in contact therewith so that the rotating cutters are run thereon in order to cut the substrates.

Abstract: This invention is related to an adaptable tile-cutter apparatus for scoring and breaking disparately-sized tiles. The apparatus broadly includes: a pair of end castings removably; a rigid crossbeam and a travel rail spanning the pair of end castings; vertical-adjustment mechanisms mounted to the travel rail; one or more platform assemblies each coupled to the rigid crossbeam; and a cutting mechanism slidably engaged to the travel rail. The vertical-adjustment mechanisms individually adjust a height of the travel rail with respect to the pair of end castings. In addition, the rigid crossbeam and the travel rail comprise a first matched set, and are each removably coupled to the pair of end castings. Accordingly, a second matched set that includes another rigid crossbeam and another travel rail possessing lengths at variance with the rigid crossbeam and the travel rail of the first matched set may be interchanged therewith.

Abstract: A method for producing glass plates of any desired contour from sheet glass, comprising the following steps: scribing scribe lines into a least one face of the sheet glass along the contour down to a depth, using a cutting device, and positioning the glass plate on a support. The method is further characterized in that a defined force F is applied to the sheet glass so that it breaks along the scribe lines, said break extending through the entire thickness of the sheet glass. The flat glass may be sandwiched between two flexible plates prior to being placed on a base pad and being subjected to the breaking force.

Abstract: A separation apparatus comprising a first and a second scribing devices for scribing front and rear surfaces of a first mother substrate made of a brittle material along first predetermined scribing lines previously provided on the front and rear surfaces of the first mother substrate, the first and second scribing devices being opposed to each other on an upper side and a lower side, and a holding and transferring device for holding and transferring the first mother substrate so that the first predetermined scribing lines of the first mother substrate are located between the first and second scribing devices.

Abstract: A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.

Abstract: A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented. A brittle material substrate cutting apparatus includes: a cutting section (112, 122) for applying a pressing force in a vicinity of a scribe line S formed on a substrate G and cutting the pressed portion of the substrate G; and a holding section moving parallel to the scribe line S while holding the cutting section. The brittle material substrate cutting apparatus continuously cuts the substrate G along the scribe line S.

Abstract: An optical fiber cleaving device includes an auxiliary support section movably disposed on a base section independently from a blade section and a pusher section. The auxiliary support section can be selectively disposed at the operable position for supporting an unsheathed optical fiber in cooperation with a pair of clamp sections. The auxiliary support section is constituted by a thin plate member having fiber support faces locally located between the clamp sections at the operable position and a relief area formed adjacent to the fiber support faces. The fiber support faces come in contact with the portions of a local length of the unsheathed optical fiber extending between the clamp sections, the local length being located away from the fiber cleaving position, and the relief area is so arranged as to avoid the contact with a portion of a second local length of the unsheathed optical fiber, located at the fiber cleaving position.

Abstract: A method of opening an ampoule and an ampoule opening device are disclosed.

Abstract: A method of cutting an optical fiber easily on site such that its end face after being cut slants with respect to its optical axis A twist is applied to at least a portion of the optical fiber. A notch is formed in the coating and the fiber of the optical fiber at the cutting position, and an external force is applied to the optical fiber and cuts the optical fiber at the cutting position. The cutting device includes an optical fiber fixing means that fixes the optical fiber on one side of the cutting position of the optical fiber, optical fiber rotating means that fixes the optical fiber on its other side such that the optical fiber may freely rotate, and a blade that places the notch in the coating and the glass fiber.

Abstract: Disclosed herein are apparatuses for breaking a glass panel unified with a process table which break the glass panel formed with scribing lines along the scribing lines by irradiating laser beams. The apparatuses for breaking a glass panel unified with a process table to conduct breaking operations of the glass panel after scribing work of the glass panel as one body with the process table are installed on both sides of the process table included in a transfer-type cutting head laser cutting device. Each apparatus for breaking the glass panel unified with the process table comprises: breaking bars for cutting the glass panel by applying pressure to cutting sections of the glass panel; rotating devices for rotating the breaking bars by combining with both ends of the breaking bars; and a support equipped with cylinders for vertically moving the rotating devices in both sections.

Abstract: An apparatus for subdividing a sheet of brittle insulating material with a plurality of semiconductor chips disposed thereon. The chips are separated by row and column kerfs each of which contains a respective scribed line. The subdivision of the sheet is accomplished by placing the sheet in a flexible conformable carrier having an open grid, formed of ribs, with each rib positioned over a respective scribe line on the surface of the sheet and forcing the sheet against an arched anvil, thereby fracturing the sheet along the scribe lines.

Abstract: This invention is related to an adaptable tile-cutter apparatus for scoring and breaking disparately-sized tiles. The apparatus broadly includes: a pair of end castings removably; a rigid crossbeam and a travel rail spanning the pair of end castings; vertical-adjustment mechanisms mounted to the travel rail; one or more platform assemblies each coupled to the rigid crossbeam; and a cutting mechanism slidably engaged to the travel rail. The vertical-adjustment mechanisms individually adjust a height of the travel rail with respect to the pair of end castings. In addition, the rigid crossbeam and the travel rail comprise a first matched set, and are each removably coupled to the pair of end castings. Accordingly, a second matched set that includes another rigid crossbeam and another travel rail possessing lengths at variance with the rigid crossbeam and the travel rail of the first matched set may be interchanged therewith.

Abstract: The present invention generally relates to a sectioning module positioned within an automated solar cell device fabrication system. The solar cell device fabrication system is adapted to receive a single large substrate and form multiple silicon thin film solar cell devices from the single large substrate.

Abstract: A method for the singulation of hybrid circuits from a pre-scribed plate containing hybrid circuits or made of other brittle materials. The method includes the steps of providing a platen used to support the hybrid plate and which has a surface comprised of a series of sections each angled downward from its adjacent section, aligning the plate on the platen so that the scribe lines align with the surface discontinuities at the angles between the sections, securing the plate to the platen with vacuum pressure, creating a pressure differential between a space above the plate and a space below the plate, and applying the pressure differential to sequentially break the plate along the pre-scribed lines by forcing the plate against the angles.

Abstract: A wafer dividing apparatus for dividing a wafer whose strength is reduced along a plurality of dividing lines, along the dividing lines, which comprises a tape holding means for holding a protective tape affixed to one side of the wafer; and wafer dividing means, each comprising a plurality of tension application means comprising a first suction-holding member and a second suction-holding member for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line, and moving means for moving the first suction-holding members and the second suction-holding members in such directions that they separate from each other.

Abstract: Disclosed herein is glass cutting apparatuses and methods of cutting glass using the glass cutting apparatuses. More particularly, disclosed is a glass cutting apparatus which cuts a glass sheet (140) by forming a crack in the glass sheet using a laser beam and by lifting the glass sheet using a bending unit (160), and a method of cutting glass using the glass cutting apparatus.

Abstract: The invention concerns a method for separating plate-shaped workpieces of mechanically brittle and nonmetal materials along any contour desired, comprising the following steps: Scratching of separating lines along the contour up to a depth T by means of a cutting device in at least one side of the plate-shaped workpiece is hereby characterized in that the plate-shaped workpiece is stimulated to bending vibrations at a vibration amplitude along the separating lines, so that the plate-shaped workpiece is completely separated along the separating line.

Abstract: A mother substrate cutting method for cutting a plurality of unit substrates out of a mother substrate, comprises the steps of: (a) forming scribe lines on the mother substrate by scribe forming means; and (b) breaking the mother substrate along the scribe lines, wherein the step (a) includes a step of forming a first scribe line for cutting a first unit substrate out of the mother substrate and a second scribe line for cutting a second unit substrate out of the mother substrate by moving a pressure position to the mother substrate without a pressure to the mother substrate by the scribe forming means being interrupted.

Abstract: A method for producing glass plates of any desired contour from sheet glass, comprising the following steps: scribing scribe lines into a least one face of the sheet glass along the contour down to a depth, using a cutting device, and positioning the glass plate on a support. The method is further characterized in that a defined force F is applied to the sheet glass so that it breaks along the scribe lines, said break extending through the entire thickness of the sheet glass. The flat glass may be sandwiched between two flexible plates prior to being placed on a base pad and being subjected to the breaking force.

Abstract: A scribing unit is provided to perform a scribing process in which unit substrate are separated from a panel where the unit substrates are formed. The scribing unit includes a megasonic vibrator, which applies a megasonic vibration to a wheel to make fracture surfaces of the unit substrates smooth. Therefore, it is possible to omit a process of grinding the edges of the fracture surface of the unit substrates before cleaning the separated unit substrates.

Abstract: A cutting apparatus for cutting tiles has a base, a rail device, a cutting device, a positioning ruler and a clamping apparatus. The base has an elongated slot defined near the distal end of the base and having a setscrew hole. The rail device is connected to the base. The cutting device is connected to the base and has a mounting bracket, an operating shaft and a cutter. The mounting bracket is connected movably to the rail device. The operating shaft is connected pivotally to the mounting bracket. The cutter is connected to the operating shaft. The positioning ruler is mounted movably on the base. The clamping apparatus is connected securely to the base and has two connecting brackets, a handle and two pressing elements.

Abstract: An exemplary cutting system (1) for a master liquid crystal panel includes a master liquid crystal panel (10) and two charge-coupled devices (12). The master liquid crystal panel includes four corners, and four alignment marks respectively provided at the corners. At least two of the alignment marks at two diagonal corners are different from each other, and the difference are selected from the group consisting of a difference in shape and a difference in distance from a center of the master liquid crystal panel. The charge-coupled devices are positioned adjacent to two adjacent corners of the mother liquid crystal panel at any one time, and are configured to detect and identify the alignment marks at such two adjacent corners. A related method for cutting the master liquid crystal panel is also provided.

Abstract: Disclosed herein is a dividing apparatus for dividing a plate-like workpiece, which is put on the top surface of a protective tape affixed to an annular frame and which has reduced strength along dividing lines. The apparatus includes a frame holder for holding the annular frame, a tape expander for expanding the protective tape, a detector for detecting the plate-like workpiece, a divider for pressing dividing lines to divide the workpiece into chips along the lines detected by the detector, a device for pushing up divided chips through the protective tape, and a device for picking up pushed up chips.

Abstract: A dispenser for dispensing flexible web material from a center pull roll capable of accommodating different types of web material in the form of sheets separated by lines of perforation. The dispenser includes dispenser apparatus permitting the device to self-adjust to the different thicknesses, sizes and physical characteristics of different types of web material. In certain preferred embodiments, the dispenser comprises a housing, a web support within the housing and structure permitting the dispenser to self-adjust to the effective cross-sectional area of the web. The preferred dispenser structure includes elements positioned to receive the web between them. At least one of the elements is movable and is biased for displacement toward the other. Frictional force applied against the web by the elements resists pull force applied to the web by a user so that a single web sheet separates from the web along the perforation between the elements and the lead end when a user pulls on the web outside the housing.

Abstract: An apparatus and method for breaking a semiconductor wafer along scribe lines to separate individual die. A scribe line of the wafer is aligned with a straight, elongated pyramid-shaped edge of a precision bending bar, and a compressive force is applied to the surface of the wafer by a compressive member to bend the wafer over the edge and break the wafer along the scribe line.

Abstract: A method of dividing glass plates for the purpose of reducing the required space in an interim buffer (80) reducing the transit times of different kinds of glasses, comprises generating a sequence of sub-plates (T) from the glass plates (P) stored in a blank plate storage (12), the consecutive sub-plates (T) of the sequence of sub-plates exhibiting identical or different material properties. Each sub-plate (T) is subdivided further by scribing and breaking-off until a desired cut piece has been attained. The generated cut pieces are deposited in a predetermined order in the interim buffer (80) and as called for are processed further. Equipment dividing glass plates into cut pieces accordingly entails that different cutting and breaking-off systems are preceded by at least one intermediate storage receiving at least two glass plates exhibiting different material properties and delivering a programmed sequence of sub-plates, the consecutive sub-plates exhibiting identical or different material properties.

Abstract: A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.

Abstract: Apparatus and methods are provided for separating a pane (11) of a brittle material from a moving ribbon (13) of the material without contact between the newly-formed leading edge of the ribbon and the newly-formed trailing edge of the pane. The apparatus includes a pane engaging assembly (15), a transporter (29), and a connector assembly (31) which together ensure that the pane (11) and the sheet (13) do not contact each other once separation occurs. In this way, edge chipping and the resulting occurrence of surface defects on the separated pane are decreased.

Abstract: In a system for cutting glass sheets into shapes there is at least one cutting site (A, B). In order to align the glass sheet which is to be cut or the glass sheet shape into a defined position, on the edge of the tables I and II there are contact edges (21, 44, 45). In order to move the glass sheets and the glass sheet shapes into contact with the contact edges (21, 44, 45) the tables I, II are aligned sloping down toward the contact edges (21, 44, 45) so that the glass sheets and glass sheet shapes slide on air cushions produced between the glass sheets or glass sheet shapes and the tables (I, II) in contact with the contact edges (21, 44, 45). The glass sheets or glass sheet shapes which adjoin the contact edges (21, 45) are coupled by force-fit to the conveyor belts (20) which are provided in the area of the contact edges (21, 45) and then moved to the cutting site (A, B) which is located following the table (I, II).

Abstract: A method and apparatus for separating glass panels that minimizes process failures and improves separation process consistency by utilizing a separation handle which applies the minimal pressure necessary to remove the edge portion from the glass panel. The glass panel is cut along the score line, which outlines the edge portions of the glass panel to be removed. The panel is placed upon the separating apparatus, which pumps nitrogen along the underside of the glass panel, causing the glass panel to float above the apparatus. Locating pins are inserted to position the panel on the stage. Once the glass panel is in place, a vacuum sucks the panel against the stage, holding the panel tightly against the stage. The separation handle is then inserted over the edge portion to be removed. A measured force is applied to the handle, with the force incrementally increased until the slow, controllable separation of the edge is achieved. This level of force is maintained until separation is complete.

Abstract: To realize a method of manufacturing an electro-optical device, which is capable of completely dividing a plurality of substrates used for the electro-optical device along division lines, in a method of manufacturing the electro-optical device, two or more substrates used for electro-optical devices, which are adhered to each other, are divided along division lines. The method includes adhering, a first substrate and a second substrate, on whose one surface a plurality of grooves or a groove is formed in a predetermined width along a division line, to each other on the surface of the second substrate where the plurality of grooves or the one groove is formed and dividing generated cracks in the other surface of the first substrate, which is opposite to the surface adhered to the second substrate, along the division line to divide the first substrate and the second substrate that are adhered to each other.

Abstract: An apparatus for separating a stock of semi-compliant material into discrete portions or tags includes a housing having a drive mechanism disposed therein for bending a portion of the semi-compliant material in a first direction thus forming a line of weakening along the material. The drive mechanism subsequently bends the portion of the material in a second direction, which causes the tag to separate from the remaining material along the line of weakening.