Abstract: Device for severing at least one optical fiber When severing optical fibers (1) with conventional severing devices, after the severing operation the severed fibers (1) are distributed in a disorderly manner on the second fixing element (26), with the result that they can only be removed with difficulty and laboriously. Using a bonding device (20, 21) in the form of a rocker (21) with an adhesive strip (20), the fiber ends are adhesively bonded on during the severing operation, with the result that they remain in an orderly manner on the adhesive strip after the severing operation. The rocker (21) is in this case mounted such that it can pivot between an inserting position and a severing position, in order to facilitate the insertion of the fibers (1).

Abstract: A process for cutting glass sheets (10) includes the steps of: scoring each glass sheet on an automatic scoring table (12) having a scoring head (14) moveable on a bridge (16) and a track (18); transporting each scored glass sheet to a breaking table (22) via conveyor (20); floating each scored sheet on a fluid medium on the breaking table; and impacting each scored sheet from above the floated scored sheet to fracture the scored sheet along the score lines (40 and 44). An apparatus for cutting glass sheets includes mechanisms for performing the steps of this process. The fluid medium may be air with the impacting performed by a vacuum workholder (26) consisting of an arm (30) raised and lowered by pneumatic cylinders (32), the arm supporting a plurality of vacuum cups (28) engaging the workpiece (42) for subsequent transportation.

Abstract: The invention relates to a device for cutting slabs or tiles, comprising a frame which has a support surface for the slabs or tiles and a cutting mechanism which is displaceably mounted on the frame, above the support surface, in order to produce a point of break in the surface of the slab or tile. According to the invention, guiding elements are provided for guiding the cutting mechanism along a curved path while it is displaced on the frame.

Abstract: A degater for degating a member from a runner is provided, the degater having a platform. The platform includes a first platform member and a second platform member. The first platform member is positioned adjacent the second platform member along a pivot axis, the first platform member and the second platform member being pivotable about the pivot axis from a respective first position, through an angle to a second position, and through a second angle to a third position. The first position is between the second position and third position. A hold-down member holds the member to the platform as at least one of the first platform member and second platform member move between the first, second and third positions.

Abstract: A method of cutting a wafer of a semiconductor material, including breaking the wafer along cutting paths using a knife hitting a sheet supporting the wafer in a frame. The method includes using knives of different lengths according to the wafer region in which the cutting path is located using a tool block including apparatus for receiving at least two knives of different lengths and for rotating step-by-step around an axis to change the knife that is active in the wafer cutting.

Abstract: An apparatus for separating individual circuit boards from a multiple board array with pre-scored planes 10 is provided. The apparatus includes a splitting element 36, positioned along one of the pre-scored planes 28, and a torque inducing element 38 mechanically forcing the multiple board array 20 onto the splitting element 36 thereby breaking the board array 20 along the pre-scored plane 28.

Abstract: There is disclosed a method of cutting a plate glass mother material in which a plurality of grooves are scribed/processed beforehand on one main surface, and appropriate pressing is constantly performed, so that more preferable materials to be pressed can be formed. When a plate glass mother material 20 is pressurized by an indenter 191, and cut in a portion of groove D1, vibration is momentarily generated. The vibration is transmitted to a vibration sensor 193 via an indenter base 190. Subsequently, at the time when the vibration sensor 193 detects the vibration, a Z-axis servo motor 192 of a pressing device 19 stops, and pressing by the indenter 191 stops. Therefore, the indenter 191 does not advance by more strokes than necessary, glass in a cut portion can be prevented from being chipped.

Abstract: A tool for separating a common printed wiring board substrate into a plurality of substrates where, prior to separation, the plurality of substrates are connected by at least one circuit connector. The purpose of the tool is to apply pressure along a dividing line to break the common substrate into separate boards without crimping or breaking the connectors between the boards. In a preferred embodiment, the tool has a beveled edge for contacting the common substrate with mechanism for adjusting the location of notches in the beveled edge. The notches are for alignment with the location of the connectors between the boards.

Abstract: The present invention provides an optical fiber cutting device in which a scratch is formed in an outer peripheral surface of a clamped optical fiber, and the optical fiber is broken along the scratch by applying a tension force or bending stress to the optical fiber so that a cut surface becomes a mirror surface, the optical fiber cutting device comprising a collecting container capable of containing a waste fiber obtained by the cutting, pinch rollers for conveying and collecting the waste fiber into the collecting container, and a drive mechanism for rotatingly driving the pinch rollers in response to a movement of a portion movable when cutting the optical fiber. The collecting container can be mounted and dismounted with respect to the outer container integrally formed with a device body. A slit through for setting the optical fiber is formed in the collecting container. Guide surfaces for guiding the optical fiber are formed on both outer sides of the slit.

Abstract: The present invention is directed to a method of cutting glass mother material involving preparing the plate glass mother material in which a plurality of grooves are scribed, disposing the plate glass mother material with the grooves turned inward; and pressing an outer surface of the plate glass mother material with a cushioning member having a thickness not to be protruded downward from a lowermost portion of an indenter, with the cushioning member being attached onto an under surface of an indenter base excluding the indenter, pressing a portion opposite to the groove on the outer surface with the indenter having a stretched shape, and cutting the plate glass mother material.

Abstract: The present invention is directed to a single hand, paper towel sheet dispenser comprising a base and a core holder operable to hold a roll of paper towel segments. A paper towel dispensing bale is pivotally connected to the base, the dispensing bale includes in inner brake bar and an outer tear bar such that a roll of paper towel sheets mounted upon the core holder can be generally trained in an under/over path for braking rotation of the roll during a one handed dispensing operation.

Abstract: A device is for fixating a fiber ribbon cable in a ribbon fiber cutting machine. A fixture or jig holding a stripped fiber ribbon cable is placed on the cutting machine in a predetermined position, by placing the jig in a machine-mounted holder and pressing the jig against one side thereof. The jig is positioned so that the ribbon fibers will enter respective V-grooves on a first support and engage a resilient surface on a second support. The fibers can be linearised in the grooves on said support surface, despite possibly being deformed when stripping the cable, by angling the jig in relation to said V-grooves on said support surface. The fibers are pressed down into the grooves, thereby fixating the fibers in both a vertical and a lateral direction. The fibers will also be parallel with one another in the space between said support. Arranged in said space is a knife by means of which a fracture line or weakening is made on the fibers.

Abstract: A method of producing a semiconductor device of the present invention is applicable to a multilayer wafer for leadless chip carrier packages and breaks it on a package basis. The method begins with a step of forming a generally V-shaped groove in one major surfaces of the wafer in the direction of thickness of the wafer. A weak, cleaving portion is formed in the other major surface of the wafer in alignment with the groove. A cleaving force is exerted on the wafer to thereby form a break in the cleaving portion, so that the wafer is caused to break from the groove toward the cleaving portion in the direction of thickness of the wafer. The cleaving portion may be replaced with a strong, non-cleaving portion, in which case the break is formed in the interface between the non-cleaving portion and the wafer due to a difference in cleaving force.

Abstract: A device for forming two triangular glass knives from a glass square, such as for ultramicrotomy, has a rotary table and a holding device for receiving, aligning, and fixing the glass square to be broken positioned on the rotary table. The holding device has two opposingly arranged clamping jaws of U-shaped profile for holding the glass square therebetween arranged on the rotary table. The rotary table's axis of rotation is aligned with the center of the glass square held between the clamping jaws. A scoring and breaking device is positioned above the table alignable with the glass square.

Abstract: An apparatus for separating pre-scribed glass shapes 10 from a glass sheet 12 includes a conveyor 22 for transporting the glass sheet parallel to its edges 14 with the margins 18 of the sheet accessible from both sides of the sheet. A pair of glass-cracking devices 24 are located substantially directly opposite one another on opposite sides of the conveyor respectively. Each glass-cracking devices 24 is arranged to bear repetitively on opposite sides of the respective margin 18 as the sheet is conveyed past thereby to break the sheet progressively along its margins to cause the glass sheet to fracture along scribe lines 16 defining the glass shapes. Each glass-cracking devices may comprise a pair of jaws which open and close on the respective margin or a pair of toothed wheels between which the margin passes.

Abstract: A manual tile cutter includes a base adapted to support a tile, a rail connected to the base above the tile and a carriage slidably mounted on the rail. A manually operated lever and a cutting toolholder are independently pivotally mounted to the carriage at a common pivot point. A shaft has one end mechanically coupled to the cutting toolholder and an opposite end extending through the carriage and connected to a manually adjustable knob. A biasing element applies a force on the cutting toolholder toward the tile. A height adjusting device in mechanical communication with the knob and the cutting toolholder adjusts the height of the cutting tool with respect to the tile but independent of the lever to accommodate different tile thicknesses.

Abstract: Disclosed is an accessory mounted on a cutting device including two mutually parallel guide bars. The accessory includes a first channel formed in the accessory for receiving one of the two mutually parallel guide bars. A second channel is formed to receive the other of the two mutually parallel guide bars in such manner that the second guide bar is freely translatable in the second channel. An affixation device is firmly affixes the accessory to one of two mutually parallel guide bars.

Abstract: A concrete or other roofing tile is provided which simulates wood shake roofing, and which may be used in either a direct deck or batten configuration. The simulated wood shake configuration includes an angled cut portion by means of a butt treatment, and also includes the use of an elongate medial slot which has a rectangular configuration.

Abstract: An improved anvil tool for use in laser bar or wafer cleaving comprises a relatively small cross section such that the anvil does not overhang the device edges in any direction. In one embodiment, the surface of the tool contacting the laser wafer or bar is compliant and contains a laterally disposed slit that aligns with the scribe mark on the top surface of the material to be cleaved. The anvil may be formed as a columnar tool or as a film deposited on a substrate. The compliant surface may be removable and in a preferred embodiment may comprise a continuous feed membrane tape so that a “clean” surface is used for each subsequent cleave operation.

Abstract: It is intended to provide an optical fiber-cutting method and an optical fiber-cutting machine, by which an optical fiber can be cut smoothly and perpendicularly to the axis of the optical fiber. A ferrule 21 is held by a holder 14 which is supported in a slantingly movable fashion relative to the main body 12 of a cutting machine 11, and an end portion of the optical fiber 20 projecting from an end face of the ferrule 21 is held by a clamp 16 to apply a pulling force to the optical fiber. The holder 14 is slanted to bend the optical fiber 20, and a cutting blade 28 is moved in an arc line along the circumference of a basal portion at the inner side of the bending portion of the optical fiber 20 while butting the cutting blade 28 to the optical fiber 20, to make a cut 20a of an arc shape, and then the holder 14 is slanted toward the direction opposite to the above direction to bend the optical fiber 20 toward the direction opposite to the above direction, thereby cutting the optical fiber 20.

Abstract: A tile cutter provided with a supporting rail of which cross section is inverted T having a straight supporting ridge portion in a longitudinal direction, a front fixation post having a tile contact portion in a direction at right angles with the supporting rail and attached to an end of the supporting rail, a rear fixation post attached to the other end of the supporting rail, a guide rail arranged on upper ends of the front and rear fixation posts and parallel to the supporting rail, a scale for measuring tile cutting dimension having a tile receiving plate of which upper face corresponds to a top portion of the supporting ridge portion and attached onto the supporting rail as to freely slide along the supporting rail, and a tile cutting operation unit attached to the guide rail as to freely slide along the guide rail.

Abstract: Apparatus for cleaving a crystalline segment, including a pair of aligning pins facing a first cleave plane formed on a first side of a crystalline segment, an impact pin facing a second cleave plane formed on a second side of the crystalline segment opposite to the first side, the crystalline segment having a cleave line extending between and generally perpendicular to the opposing cleave planes, and an actuator connected to at least one of the aligning pins and the impact pin, for causing relative movement of the aligning pins and the impact pin towards each other, such that the aligning pins abut against the first cleave plane and the impact pin abuts against the second cleave plane.

Abstract: A tile cutter provided with a supporting rail of which cross section is inverted T having a straight supporting ridge portion in a longitudinal direction, a front fixation post having a tile contact portion in a direction at right angles with the supporting rail and attached to an end of the supporting rail, a rear fixation post attached to the other end of the supporting rail, a guide rail arranged on upper ends of the front and rear fixation posts and parallel to the supporting rail, a scale for measuring tile cutting dimension having a tile receiving plate of which upper face corresponds to a top portion of the supporting ridge portion and attached onto the supporting rail as to freely slide along the supporting rail, and a tile cutting operation unit, which has an operation lever on an upper portion and a tile pressing leg and a circular cutting blade on a lower portion, attached to the guide rail as to freely slide along the guide rail.

Abstract: A machine for bend-breaking a glass plate 1 comprises: an endless belt 3 on which the glass plate 2 is placed; a supporting member 4 for supporting the endless belt 3; a glass plate receiving device 7 including a glass plate receiving surface 6 for receiving the glass plate 2 from a lower surface of the glass plate 2 by means of the endless belt 3; a moving device 8 for moving the glass plate receiving surface 6 of the glass plate receiving device 7; a press-breaking device 9 including a pressing surface 87 for press-breaking the glass plate 2; a moving device 10 for moving the pressing surface 87 of the press-breaking device 9; and a carrying-in and carrying-out means 11 for carrying the glass plate 2 to be subjected to bend-breaking in and for carrying the glass plate 2 subjected to bend-breaking out.

Abstract: A manual dispenser of material of indeterminate length, which is engaged on a rotating roller assembly, such that when the end of the material is pulled, the roller rotates with the material until reaching a stop, whereafter by slipping, additional material is advanced a length suitable to the user. The material is then forced to sever against a cutter, creating a useful material segment, and also releasing the roller assembly to rotate backwards, powered by a biasing spring. Upon return, the roller holds the remnant end of the material extended, readily accessible for grasping. An alternate embodiment comprises a movable cutter.