Means To Apply Vibratory Solid-state Bonding Energy (e.g., Ultrasonic, Etc.) To Work Patents (Class 228/1.1)
  • Patent number: 11045897
    Abstract: A workpiece is described, and includes a substrate, a cable, and a cover piece. A portion of the cable is joined to the substrate employing a vibration welding tool, and the cover piece is interposed between the portion of the cable and the vibration welding tool during the joining.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: June 29, 2021
    Assignee: GM Global Technology Operations LLC
    Inventors: Teresa J. Rinker, Wayne W. Cai, Michael P. Balogh, Nicholas W. Pinto
  • Patent number: 11031367
    Abstract: A bond head assembly for a bonding machine is provided. The bond head assembly includes a body portion and a bonding tool for bonding a semiconductor element to a substrate. The bonding tool is secured to the body portion. The bond head assembly also includes at least one reflective optical element carried by the bond head assembly. The at least one reflective optical element is configured to be positioned along an optical path of the bonding machine such that a vision system of the bonding machine is configured to view a portion of the semiconductor element while being carried by the bonding tool prior to bonding of the semiconductor element to the substrate.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: June 8, 2021
    Assignee: Kulicke and Soffa Industries, In.
    Inventor: Matthew B. Wasserman
  • Patent number: 11007602
    Abstract: An ultrasonic welding jig includes: an anvil that supports a plate-like electric cable connection portion of a terminal; and a welding horn that is disposed so as to oppose the anvil, and in which a fitting groove is formed in an opposing surface, the fitting groove being a groove in which a portion of a core wire of an electric cable is fitted. In a state in which the core wire and the electric cable connection portion are clamped between the welding horn and the anvil, ultrasonic welding is performed by ultrasonically vibrating the welding horn in an axial direction of the core wire. In a bottom surface of the fitting groove of the welding horn, a plurality of slippage prevention grooves that are obliquely oriented and intersect an axis of the fitting groove are formed spaced apart in a direction of the axis of the fitting groove.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: May 18, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tomoki Idota, Ryouya Okamoto, Hiroshi Shimizu, Hitoshi Takeda
  • Patent number: 10987753
    Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: April 27, 2021
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Dominick A. DeAngelis
  • Patent number: 10967583
    Abstract: The present disclosure provides an apparatus that includes a fiber gun. In an embodiment, the apparatus may controllably cut one or more fibers into one or more fiber segments. In an embodiment, the apparatus may controllably shape one or more fibers into different shapes (e.g., from loops into substantially straight fibers). In an embodiment, the apparatus may controllably position the one or more fiber segments onto a supporting member (e.g., a composite component). For example, the apparatus may include a robot that may controllably move the fiber gun relative to a supporting member and align the fiber gun such that the one or more fiber segments are controllably positioned on the supporting member. The apparatus may further include a controller that at least partially controls operation of the apparatus.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: April 6, 2021
    Assignee: BRIGHT LITE STRUCTURES LLC
    Inventor: Antony Dodworth
  • Patent number: 10960489
    Abstract: An ultrasonic welding assembly joins bare ends of an insulated wire bundle to a wire terminal in a weldment zone by intimate contact with a sonotrode of an ultrasonic stack. A door allows the operator to place the terminal into the nest within the weldment zone. One operator hand holds the wire bundle while one contacts an external sensor. A pair of terminal clamps extend inwardly and down to secure the terminal and create a taller capture area for the loose bare wire ends. A pair of clamp finger assemblies reversibly extend towards the insulated wires away from the weldment zone for securing the wires. A wire gatherer descends upon and captures all of the wire bare ends and secures them until the horn descends, captures, and holds the wire ends in place, then extends away from the weldment zone for ultrasonic welding to commence.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: March 30, 2021
    Assignee: TechSonic, Inc.
    Inventors: Byoung Soo Ou, David Lee Cyphert
  • Patent number: 10818514
    Abstract: A system for manipulating a filament can include a filament supply from which a filament can be drawn, the filament supply being positioned along an axis, a vacuum manipulator assembly positioned along the axis, wherein the vacuum manipulator assembly is configured to engage the filament when a vacuum is drawn through the vacuum manipulator assembly and draw the filament along the axis to a workpiece, and a welding tool comprising a welding head positioned along the axis between the filament supply and the vacuum manipulator assembly, the welding tool being configured to weld the filament to the workpiece.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: October 27, 2020
    Assignee: Triad National Security, LLC
    Inventor: Kyle B. Christensen
  • Patent number: 10775701
    Abstract: A capillary formed from a unitary manufactured glass includes a main portion and an end portion. The main portion is elongated and has a first aperture with a first inner diameter. The end portion, which can have a knob-like shape, has a second aperture that tapers from a second inner diameter to a third inner diameter and the third inner aperture joins to the first aperture. The second inner diameter is larger than the first inner diameter. If desired, the third inner diameter can be smaller than the first inner diameter.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: September 15, 2020
    Assignee: Molex, LLC
    Inventor: Robert Acuna
  • Patent number: 10756045
    Abstract: A connecting device for connecting a circuit chip to a substrate is provided. The connecting device includes: a main body having a first opening and a second opening; a vibration part on the main body, the vibration part being configured to vibrate the main body; and an intake part coupled with the first and second openings to adsorb the circuit chip to the main body. Both the first and second openings are open at a surface of the main body to which the circuit chip is adsorbed, and the second opening is arranged in the first opening on a plane.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: August 25, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seung Hwa Ha, Seung Soo Ryu, Jeong Ho Hwang
  • Patent number: 10743902
    Abstract: A vibrating body unit includes a vibration generator, a vibration transmitter and first amplitude enlarger. The vibration generator generates ultrasonic vibration whose amplitude has a predetermined correlation with a frequency. The vibration transmitter has a proximal end and a distal end while the vibration generator is attached from a proximal side, and transmits the ultrasonic vibration to a distal side in a longitudinal axis direction. At least one first amplitude enlarger is provided in the vibration transmitter, and enlarges the amplitude of the ultrasonic vibration at a first amplitude enlargement rate in a direction of transmission of the ultrasonic vibration, the first amplitude enlargement rate having a correlation with the frequency opposite to the predetermined correlation.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: August 18, 2020
    Assignee: OLYMPUS CORPORATION
    Inventors: Masashi Yamada, Hideto Yoshimine
  • Patent number: 10722965
    Abstract: A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 ?m, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 ?m are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: July 28, 2020
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Kaichi Tsuruta, Takeo Saito, Manabu Muraoka, Hiroki Oshima
  • Patent number: 10689731
    Abstract: The device comprises a sonotrode (102) which can produce an oscillatory movement by means of a transducer (101) in order to generate ultrasound oscillation waves in said light alloy melt, when said sonotrode (102) and said melt are in contact, so as to perform the degassing; and an electronic-mechanical component (104) embedded in part of the sonotrode (102) for detecting the state of the service life or an anomaly of the sonotrode (102). The electronic-mechanical component (104) includes means for sending at least one notification signal to an electronic remote control equipment (103), forming a system together with the device. The electronic control device (103) is configured for sending an activation or deactivation signal for activation or deactivation of said transducer (101), taking into account said at least one notification signal.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: June 23, 2020
    Assignee: ULTRASION S.L.
    Inventors: Antoli Fauria Torrent, Manel Da Silva Lopez, Francisco Javier Plantà Torralba
  • Patent number: 10677763
    Abstract: The method comprising the following steps: a) Providing a first bath of a liquid metal (1) comprising aluminium with a content X and magnesium with a content Y, the magnesium content Y being different to zero, b) Immersing at least partially a sonotrode (3) formed from a material inert to liquid aluminium, in the first bath of liquid metal (1), and c) Applying power ultrasounds to the sonotrode (3) so as to excite the liquid metal (1) until wetting (5) of the sonotrode (3) by the liquid metal (1) is obtained. d) Cooling the first liquid metal (1) of the first bath until solidification of the first liquid metal (1) around the sonotrode (3) is obtained, generating an intimate bond (6) between the sonotrode (3) and the solidified first liquid metal (1) having a bonding strength substantially equal to that of brazing between two metals. e) Machining the solidified first metal (1) in the form of a flange (7) configured for the attachment of a mechanical amplifier and/or of a transducer (4).
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: June 9, 2020
    Assignee: CONSTELLIUM ISSOIRE
    Inventors: Jean-Louis Achard, Philippe Jarry
  • Patent number: 10658328
    Abstract: A method of bonding wires onto surfaces, an apparatus and a computer program product are disclosed. The method of bonding wires onto surfaces, comprises the steps of: collecting operating characteristics of a bonding tool while forming a wire bond which bonds a wire to a surface; determining whether a possible bonding failure of the wire bond has occurred as indicated by the operating characteristics; and capturing an image of the wire bond to identify whether a foreign body is present on the surface if it is determined that a possible bonding failure has occurred. In this way, imaging of the wire bond is only necessary when the operating characteristics indicate a suspect bonding failure has occurred. This avoids the need to image every bond, while still imaging suspect bonds. This approach helps to significantly increase the throughput of the wire bonding apparatus whilst still identifying and classifying bonding defects due to the presence of a foreign body.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: May 19, 2020
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Tact Lee, Chin Kei Lai, Chung Yan Lau
  • Patent number: 10647064
    Abstract: An apparatus for use in a friction stir operation, such as friction stir welding (FSW) or friction stir processing (FSP). The apparatus may have a rotating tool adapted to be plunged into a material, where the material is susceptible to being softened by heating. The rotating tool may further be adapted to be advanced along a surface of the material. An optical energy generating subsystem may be used to heat a portion of the material using optical energy as the tool is advanced along the material.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: May 12, 2020
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Joseph C. Farmer, Alexander M. Rubenchik, Raymond J. Beach, Robert J. Deri, Edward I. Moses, Bassem S. El-Dasher, Sarath K. Menon, Terry McNelley
  • Patent number: 10601404
    Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: March 24, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen P. Ayotte, Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan
  • Patent number: 10562127
    Abstract: A ribbon bonding tool is provided. The ribbon bonding tool includes a body portion including a tip portion, the tip portion defining a working surface. The ribbon bonding tool includes a group of four protrusions extending from the working surface, wherein the working surface defines four quadrants in a horizontal plane by extending an imaginary line at a midpoint along each of a length and a width of the working surface. Each of the four protrusions is arranged in one of four quadrants.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: February 18, 2020
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Bernard Poncelet, Todd James Walker, Christoph Benno Luechinger
  • Patent number: 10554004
    Abstract: A sonotrode (18) for producing a welded and/or soldered join between a cable (17) and a sheath (17), covering the cable (17), comprising at least one working surface (2). The working surface (2) is curved in a concave manner, at least in sections. An anvil (10) comprises at least one counter surface (11) which is curved in a concave manner, at least in sections. The device for producing the join between a cable (17) and a sheath (17), covering the cable (17), comprises a sonotrode (18) joined to an ultrasound source (8) at least at a joining surface (5), and comprising an anvil (10) arranged opposite the working surface (2) of the sonotrode (18). A method for producing a join between a cable (17) and a sheath (17) covering the cable (17) is also disclosed.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: February 4, 2020
    Assignee: TELSONIC HOLDING AG
    Inventors: Markus Böhm, Thomas Hünig
  • Patent number: 10485699
    Abstract: The invention is generally directed to phacoemulsification systems and methods, and more particularly to systems and methods for providing transverse phacoemulsification. In accordance with one embodiment, a phacoemulsification system is provided having a handpiece with a needle, wherein the phacoemulsification system is configured to vibrate the distal end of the needle in both an effective transverse direction and an effective longitudinal direction when power, having a single effective operating frequency is applied to the handpiece.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: November 26, 2019
    Assignee: Johnson & Johnson Surgical Vision, Inc.
    Inventors: Mark Steen, Rob Raney, John Muri, George Bromfield
  • Patent number: 10449627
    Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: October 22, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventor: Dominick A. DeAngelis
  • Patent number: 10381321
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: August 13, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC
    Inventor: Dominick A. DeAngelis
  • Patent number: 10307968
    Abstract: A holding structure (2) in an ultrasonic vibration welding device that welds workpieces by applying ultrasonic waves to the workpieces holds an ultrasonic vibration transmitter (horn) (5) bearing the transmission of longitudinally vibrating ultrasonic waves in holding members (8, 8). The horn comprises a horn body (51) having the length of one-half the wavelength ? of the ultra-sonic vibration. Holding structure (2) includes holders (7x, 7y) having a prescribed volume and thin sheet connectors (6a, 6b) placed at different positions (Pa, Pb) on the horn body (51). The horn body (51) is fixed to holding members (8, 8) by means of the respective holders (7x, 7y).
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: June 4, 2019
    Assignee: Branson Ultrasonics Corporation
    Inventors: Osamu Tamamoto, Jun Pang
  • Patent number: 10286470
    Abstract: The invention relates to a device (10) for the separate application of solder material deposits, in particular solder balls, comprising a conveying device for separately conveying the solder material deposits from a solder material reservoir toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position P1, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to the application device into an application position P3, wherein a removal device (46) for removing a solder material deposit from a transport holder arranged in a removal position P4 is arranged downstream of the transfer position in the conveying direction, the removal device being connected to a detector device for triggering the removal function, said detector device
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: May 14, 2019
    Assignee: PAC TECH—PACKAGING TECHNOLOGIES GMBH
    Inventor: Ghassem Azdasht
  • Patent number: 10262969
    Abstract: [Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: April 16, 2019
    Assignee: KAIJO CORPORATION
    Inventor: Akio Sugito
  • Patent number: 10232464
    Abstract: An ultrasonic bonding jig includes: a plurality of protrusions; a planar portion among protrusions formed among base ends of the protrusions; and recessed portions recessed to a side opposite to a projection direction of the protrusions, the recessed portions being formed on both sides in a vibration direction of the protrusions.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: March 19, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi Miyashiro, Yoichi Suruga, Shuhei Koyano
  • Patent number: 10200016
    Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 5, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen P. Ayotte, Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan
  • Patent number: 10192847
    Abstract: A bond head comprises an insulation block, a heater plate attached to the insulation block and a collet located on the heater plate for holding a semiconductor device. The heater plate is operative to heat the semiconductor device that is held by the collet. A flow generation plate that is detachably mounted between the insulation block and the heater plate is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: January 29, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Lu Ma, Cheuk Wah Tang, Pak Kin Leung
  • Patent number: 10052714
    Abstract: An ultrasonic welding device including a sonotrode having a central weld region adjacent to an anvil, a first converter providing mechanical vibrations to a proximal end of the sonotrode, a second converter providing mechanical vibrations to a distal end of the sonotrode in a direction opposite to the first converter, a power supply delivering electrical energy to each of the first and second converters, and the mechanical vibrations received by the sonotrode from the first converter being in phase with the mechanical vibrations received from the second converter.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: August 21, 2018
    Assignee: Sonics & Materials, Inc.
    Inventors: John Massa, William P. Simon
  • Patent number: 10012608
    Abstract: A method for manufacturing an inductive conductivity sensor, with coils on both sides of a circuit board are placed surrounding an opening of the circuit board. The circuit board with the coils is inserted into a housing, wherein a sleeve is inserted in the housing through a second opening of the housing through the opening of the circuit board out to a first opening. The first opening, the second opening and the opening of the circuit board are aligned with one another, wherein the sleeve includes a first end section and a second end section and the sleeve is inserted with the first end section first in the housing, and wherein the sleeve is welded with the housing by means of a sonotrode by ultrasonic welding. The first end section of the sleeve is welded with the housing and with a counterpart inserted into the first opening. The invention relates further to an inductive conductivity sensor.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: July 3, 2018
    Assignee: Endress+Hauser Conducta GmbH+Co. KG
    Inventors: Thomas Nagel, Andre Pfeifer, Christian Fanselow
  • Patent number: 9981337
    Abstract: A method for testing the integrity of a stack during ultrasonic welding, includes the steps of: (i) ultrasonically welding two or more work pieces with a stack, the stack including a convertor and a horn; (ii) measuring a frequency profile based on a vibration of the horn during the welding step; and (iii) comparing the measured frequency profile to a standard frequency profile to obtain an error rate, the error rate being indicative of a difference between the measured frequency profile and the standard frequency profile. A system employing the aforementioned method is also provided.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: May 29, 2018
    Assignee: Sonics & Materials, Inc.
    Inventors: William P. Simon, John Massa, James A. Markus
  • Patent number: 9929122
    Abstract: A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: March 27, 2018
    Assignee: Orthodyne Electronics Corporation
    Inventors: Mark A. Delsman, Theodore J. Copperthite, Garrett W. Jones, Todd J. Walker, Tick-Kwang Loh, Jay C. McCandless
  • Patent number: 9905530
    Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: February 27, 2018
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Robert N. Chylak, Dominick A. DeAngelis
  • Patent number: 9839983
    Abstract: A machine tool of high-frequency vibration is provided. A main shaft structure of the machine tool comprises a rotating shaft, the end of which is provided with a tool holder chuck for fixing a tool holder; the upper portion of which is provided with a rotating coil portion; the main shaft structure is correspondingly provided with a stationary coil portion; and the tool holder is provided with a high-frequency vibration module. By non-contact coils, an external electric power/signal can be transmitted into the high-frequency vibration module to avoid a wear phenomenon in a contact-rotating electrode. Because the inductive coil is arranged outside of the tool holder, the manufacturing cost of the tool holder is reduced, and the convenience of changing the tool holder is increased. Moreover, the machining stability and efficiency of the tool holder are improved by a control method of sensing/feedback signals with wireless transmission.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: December 12, 2017
    Assignee: Tongtai Machine & Tool Co., Ltd.
    Inventors: Hsin-Pao Chen, Chung-Kuang Lin, Jian-Tzung Ou, Jui-Hsiung Yen
  • Patent number: 9812835
    Abstract: In order to provide a method for establishing an electrically conductive connection between an electrical line which includes a plurality of individual conductors and an electrically conductive component which is easily realizable but nevertheless leads to a corrosion resistant connection between the individual conductors of the electrical line and the electrically conductive component, it is proposed that the method includes producing a crimping element that surrounds the individual conductors sectionally from a crimping element preform by means of a crimping tool, and connecting at least a portion of the individual conductors to the electrically conductive component by an ultrasonic welding process by means of a sonotrode.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: November 7, 2017
    Assignee: ElringKlinger AG
    Inventor: Stephanie Kern
  • Patent number: 9763688
    Abstract: An ultrasonic element comprises an ultrasonic transducer and a head or blade. The ultrasonic transducer is operable to convert electrical power into ultrasonic vibrations. The head or blade is in acoustic communication with the ultrasonic transducer such that the ultrasonic transducer is operable to drive the ultrasonic blade to vibrate ultrasonically. The head or blade has a curved distal face. The curved distal face defines a proximally extending concave curve. The transducer and head or blade may be driven using a control logic that is configured to cause the ultrasonic transducer to generate a first vibration set followed by a second vibration set. The first vibration set is configured to generate microbubbles in a fluid. The second vibration set is configured to grow microbubbles generated by the first vibration set. The control logic may provide a pause between the first vibration set and the second vibration set.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: September 19, 2017
    Assignee: Ethicon LLC
    Inventors: Foster B. Stulen, Timothy G. Dietz, Jeffrey D. Messerly
  • Patent number: 9659793
    Abstract: A method for producing a material-bonding connection between a semiconductor chip and a metal layer is disclosed. For this purpose, a semiconductor chip, a metal layer, which has a chip mounting portion, and also a bonding medium containing a metal powder are provided. The metal powder is sintered in a sintering process. In this case, throughout a prescribed sintering time, the prescribed requirements are met, that the bonding medium is arranged between the semiconductor chip and the metal layer and extends right through from the semiconductor chip to the metal layer, that the semiconductor chip and the metal layer are pressed against one another in a pressing-pressure range that lies above a minimum pressing pressure, that the bonding medium is kept in a temperature range that lies above a minimum temperature and that a sound signal is introduced into the bonding medium.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: May 23, 2017
    Assignee: Infineon Technologies AG
    Inventors: Nicolas Heuck, Frederik Otto, Christian Steininger
  • Patent number: 9640512
    Abstract: A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: May 2, 2017
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Keng Yew Song, Ka Shing Kwan, Yue Zhang, Yan Dong Sun, Xiao Liang Chen
  • Patent number: 9543267
    Abstract: An ultra-fine pitch wedge bonding tool and method for its manufacture are disclosed. The wedge tool is formed with a foot width calculated to enable accurate bonding of wires separated at an ultra-fine pitch. The wedge tool is made out of a tungsten carbide alloy having characteristics conforming to specified constraints that lead to improved performance and enable the use of thicker wire. A pocket is formed at the tip of the wedge tool and a wire feeding hole is formed from the rear side of the tool and exiting inside the pocket, at an elevation above the bonding foot. Side walls are provided on both sides of the pocket to guide the wire exiting the feed hole inside the pocket towards the bonding foot.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: January 10, 2017
    Assignee: MICRO POINT PRO LTD.
    Inventors: Uri Zaks, Irina Voskoboynikov, Yefim Prosso, Irina Sastiel
  • Patent number: 9530751
    Abstract: A die bonder and a bonding method are provided that are capable of surely mounting a die on an intermediate stage and surely picking up the die from the intermediate stage and thus, are high in reliability. The die bonder is provided with the intermediate stage for mounting thereon the die picked up by the pickup head from a die supply unit. A mounting portion of the intermediate stage is provided with an uneven pattern including a plurality of mounting support protrusions having contact surfaces that flush contact the back surface of the die for supporting the die not to slip out of place, and a plurality of recesses formed between the mounting support protrusions.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: December 27, 2016
    Assignee: Fasford Technology Co., Ltd.
    Inventors: Kazuo Nakano, Koji Nakamura, Shoji Kanai, Fukashi Tanaka
  • Patent number: 9505062
    Abstract: The invention relates to a method and device for producing an oscillatory motion of a mass, in particular of a tool, wherein the mass is mechanically connected to at least two clamping elements between said clamping elements in the direction of oscillation propagation and the mass (50) is clamped in by the two clamping elements (10, 20) under the application of pressing force (F), and at least the clamping elements are designed as components of a resonance system, and an excitation oscillation is introduced into the resonance system, the frequency of the excitation oscillation substantially corresponding to the resonance frequency of the resonance system so that the resonance system oscillates. The invention further relates to a method for processing solid or liquid material while using the method according to the invention in order to produce an oscillatory motion of a mass.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: November 29, 2016
    Assignee: DEVAD GmbH
    Inventors: Holger Hielscher, Harald Hielscher, Thomas Hielscher
  • Patent number: 9505083
    Abstract: The invention relates to a method for producing a node by welding at least one first stranded wire comprising individual wires to at least one second stranded wire comprising individual wires, the stranded wires being of different materials, in a compression chamber with adjustable height and width of an ultrasonic welding device, the width being adjusted by means of at least one lateral slide and the height by changing the distance between a sonotrode and a counter electrode of the ultrasonic welding device, the at least one first stranded wire being welded with a higher specific energy, under a higher pressure or with a greater ultrasonic vibration amplitude than the at least one second stranded.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: November 29, 2016
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventors: Sabastian Ruhl, Heiko Strobel, Tim Hanika
  • Patent number: 9434029
    Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: September 6, 2016
    Assignee: Intel Corporation
    Inventors: Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc, Pranav K. Desai, George S. Kostiew, Sanjoy K. Saha
  • Patent number: 9427250
    Abstract: Disclosed is an ultrasonic surgical instrument that combines blade end-effector geometry to best affect the multiple functions of a shears-type configuration. The shape of the blade is characterized by a radiused cut offset by some distance to form a curved geometry. The cut creates a curved surface with multiple asymmetries causing multiple imbalances within the blade. Imbalance due to the curve of the instrument is corrected by a non-functional asymmetry proximal to the functional asymmetry. Imbalance due to the asymmetric cross-section of the blade is corrected by the appropriate selection of the volume and location of material removed from a functional asymmetry. The shape of the blade in one embodiment of the present invention is characterized by two radiused cuts offset by some distance to form a curved and potentially tapered geometry. These two cuts create curved surfaces including a concave surface and a convex surface.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: August 30, 2016
    Assignee: Ethicon Endo-Surgery, Inc.
    Inventor: Jeffrey D. Messerly
  • Patent number: 9358633
    Abstract: The invention relates to an ultrasonic welding device having an oscillator, having a sonotrode, which can be caused to oscillate with a wavelength, and has a welding region in the vibration antinode of the sonotrode. The sonotrode is supported at the vibration node of the sonotrode in a first bearing. To enable both a radial and an axial alignment of the sonotrode, the first bearing has a projection, which has a U-shaped geometry in a section extending in a longitudinal direction of the sonotrode, which U-shaped geometry has side legs and a cross leg that connects the side legs, the projection engages in a recess in the sonotrode matched to the U-shaped geometry, the sonotrode is supported on the cross leg of the projection in a planar manner, and the sonotrode is axially aligned by means of at least one side leg of the projection.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: June 7, 2016
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventors: Heiko Stroh, Alexander Ziesler, Peter Wagner, Sinan Koc, Dieter Stroh
  • Patent number: 9339888
    Abstract: A bonding apparatus includes a bonding arm which has a receiving portion facing a center axis of a bonding tool; a pair of capillary holding portions in contact with the bonding tool; a pair of piezoelectric elements configured to generate an ultrasonic vibration in contact with the capillary holding portions; and a pressurizing device which has a pressurizing member arranged to face the receiving portion of the bonding arm and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm. The pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm to cause the bonding arm to hold the pair of capillary holding portion and the bonding tool.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: May 17, 2016
    Assignee: KAIJO CORPORATION
    Inventor: Shuichi Takanami
  • Patent number: 9326597
    Abstract: A device can be used for detecting a collision of a displaceable furniture part and an obstacle. The device includes a controller for a drive device for the displaceable furniture part, and a sensor having a first sensor range and a second sensor range. A force and/or a relative motion arising between the first and second sensor parts can be detected.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: May 3, 2016
    Assignee: LOGICDATA Electronic & Software Entwicklungs GmbH
    Inventors: Stefan Lukas, Guenter Mussbacher
  • Patent number: 9302323
    Abstract: An ultrasonic welding tool fabricated of powder metal material includes a body and a welding tip extending axially from the body to a working end. The powder metal material can be ferrous-based and admixed with additives, such as alumina, carbide, ferro-molybdenum, ferro-nickel, chrome or tribaloy. An exposed surface of the welding tip can comprise Fe3O4 oxides. The tool is compacted to the desired shape and sintered. The body can include a different second material compacted separately from the welding tip and then joined to the tip and sintered.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: April 5, 2016
    Assignee: Federal-Mogul Corporation
    Inventor: Denis Christopherson, Jr.
  • Patent number: 9296255
    Abstract: The present disclosure relates to a device for the ultrasonic processing of a workpiece using an ultrasonic resonator and optionally a counter-die, the workpiece lying against the ultrasonic resonator and the ultrasonic resonator having a converter, a booster and a sonotrode. According to the disclosure, an additional booster is provided between the converter and the sonotrode and both boosters carry a holder for the ultrasonic resonator.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: March 29, 2016
    Assignee: Herrmann Ultraschalltechnik GmbH & Co. KG
    Inventors: Ulrich Vogler, Klaus Schick
  • Patent number: 9275970
    Abstract: A circuit element includes a semiconductor chip and a wire for connecting between the semiconductor chip and an additional circuit element. A plurality of wire bond connections electrically connect the wire and the semiconductor chip. The plurality of wire bond connections can be disposed on a surface of the semiconductor chip and on a surface of the wire.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: March 1, 2016
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Yan Chen, Sergei F. Burlatsky, Mikhail B. Gorbounov
  • Patent number: 9259799
    Abstract: A welding horn for a secondary battery, used in ultrasonic welding includes a body portion having coupling portions respectively provided at one and the other ends thereof; and a tip portion provided at a central portion of the body portion and having protruding portions provided on a surface thereof. In the welding horn, a nitride is coated on at least one surface of the welding horn.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: February 16, 2016
    Assignee: SAMSUNG SDI CO. LTD.
    Inventors: Hyun-Jun Kim, Dong-Bin Min, Chea-Hyun Lim