Means To Apply Vibratory Solid-state Bonding Energy (e.g., Ultrasonic, Etc.) To Work Patents (Class 228/1.1)
  • Patent number: 11504800
    Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: November 22, 2022
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Theodore J. Copperthite, Hans H. Von Tresckow, Christopher R. Longley, Siddharth D. Kataria
  • Patent number: 11462506
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: October 4, 2022
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Dominick A. DeAngelis
  • Patent number: 11446757
    Abstract: There is provided a friction stir welding method in which, when double-sided friction stir welding is performed, enough plastic flow to obtain a welded state uniform in the thickness direction of metal sheets can be obtained, in which an increase in welding speed is achieved while the occurrence of defects during welding is prevented, and in which sufficient strength and improvement in welding workability can be achieved. There is also provided a friction stir welding device suitable for the friction stir welding.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: September 20, 2022
    Assignee: JFE STEEL CORPORATION
    Inventors: Muneo Matsushita, Rinsei Ikeda
  • Patent number: 11437343
    Abstract: The present disclosure relates to a full-automatic deep access ball bonding head device includes: a Z-axis base; a Z-axis sliding stage, which is connected to the Z-axis base in a sliding manner along Z-axis; an EFO mechanism; and a bonding mechanism, which is fixed on the Z-axis sliding stage. The EFO mechanism includes an EFO sliding block, an EFO wand, and a compressed spring. The EFO sliding block is located on the side of the Z-axis sliding stage and connected to the Z-axis base in a sliding manner. The compressed spring is connected between the upper end of the Z-axis sliding stage and the upper end of the EFO sliding block, and the EFO wand is connected to the lower end of the EFO sliding block.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: September 6, 2022
    Assignee: ZHEJIANG RUIQUN TECHNOLOGY CO., LTD.
    Inventors: Wen Chen, Weiguang Niu, Bing Pan
  • Patent number: 11424585
    Abstract: The invention relates to a method and to an arrangement for electrically conductive connecting, by means of ultrasonic welding, of first electric conductors (140, 142) and second electric conductors (144, 146) in a compression space the cross section of which can be changed and which comprises at least one lateral slide, a sonotrode and a counter electrode, wherein firstly, blank ends of the first electric conductors (140, 142) are introduced into the compression space and are welded by means of ultrasonic action to form a first connection (148) and then after the first connection has been removed from the compression space, blank ends of the second electric conductors (144, 146) are introduced into same and are welded by means of ultrasonic action to form a second connection, wherein the first connection is fed to a retaining device (182, 184) before the second connection is welded.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: August 23, 2022
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventors: Reiner Schmidt, Udo Wagenbach, Bastian Gilbert
  • Patent number: 11404393
    Abstract: A wire bonding method includes bringing a capillary and a wire inserted through the capillary into pressure contact with a bonding point of a lead placed on an XY stage to bond the wire to the lead, including moving the XY stage in a state in which the capillary is in pressure contact with the lead to move the capillary along a movement locus including a plurality of arc portions.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: August 2, 2022
    Assignee: KAIJO CORPORATION
    Inventors: Eiji Kimura, Hiroaki Suzuki, Yoshikazu Tashiro
  • Patent number: 11370056
    Abstract: An ultrasonic welding apparatus (50) includes a sonotrode (8) with a working surface (10), an anvil (4) with a working surface (11), which lies opposite the working surface (10) of the sonotrode (8), and two side delimiters (5, 6) with respective side delimiting surfaces (12, 13). The working surfaces (10, 11) and the side delimiting surfaces (12, 13) delimit a compression chamber (9) for placing an elongated welding material (60) in a welding material direction (B). The ultrasonic welding apparatus (50) has a clamping device (14), by which the anvil (4) is clamped at least in a welding position (S) by a clamping force, which acts on at least part of a side (15) of the engaging surface (26) of the anvil (4) that lies opposite the working surface (11) of the anvil (4), in the direction of the sonotrode (8). A method for ultrasonic welding is also disclosed.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: June 28, 2022
    Assignee: TELSONIC HOLDING AG
    Inventor: Peter Solenthaler
  • Patent number: 11370180
    Abstract: An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: June 28, 2022
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takahiro Aizawa, Takashi Ito, Masatoshi Tanabe, Haruka Yamamoto
  • Patent number: 11311960
    Abstract: An ultrasonic welding assembly comprising a sonotrode having a first body portion, a first nodal region, a welding region, a second nodal region, and a second body portion; a transducer rotationally connected to the second body portion for transmitting acoustic vibrations to the welding region; a roller device connected to the transducer and sonotrode for permitting axial rotation of the transducer and sonotrode; a support device flexibly connected to the roller device for maintaining axial alignment of the transducer and sonotrode relative to a target welding area; a mount for supporting the sonotrode; and four frictionless bearings positioned around the nodal regions of the sonotrode, wherein the frictionless bearings are attached to the mount.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: April 26, 2022
    Inventors: Justin Wenning, Adam J. Hehr, Mark I. Norfolk
  • Patent number: 11292075
    Abstract: The present invention relates to a method for intermittent ultrasonic processing of a length of material, wherein a length of material is moved through between a sonotrode and a counter-tool and the length of material is processed intermittently. In order to specify a method for intermittent ultrasonic processing of a length of material by which the disadvantages of the prior art can be avoided or at least reduced, according to the invention it is suggested that in a processing interval the sonotrode is stimulated by an ultrasonic oscillation with an oscillation amplitude A and in a movement interval the sonotrode is stimulated with an oscillation amplitude B, wherein B<A and during the processing interval and during the movement interval the length of material touches both the sonotrode and also the counter-tool.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: April 5, 2022
    Assignee: HERRMANN ULTRASCHALLTECHNIK GMBH & CO. KG
    Inventors: Gerhard Gnad, Bastian Ewald, Armin Geiger
  • Patent number: 11285561
    Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: March 29, 2022
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Theodore J. Copperthite, Hans H. Von Tresckow, Christopher R. Longley, Siddharth D. Kataria
  • Patent number: 11239197
    Abstract: A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: February 1, 2022
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Keng Yew Song, Yue Zhang, Xiao Liang Chen, Yao Tong
  • Patent number: 11224935
    Abstract: A welding apparatus has a guide rail arrangement with at least one guide rail attachable to a welding target. A carriage has a carriage housing and a rail follower assembly that is movably mountable to the guide rail arrangement for relative movement along the at least one guide rail. A feedstock source is disposed within the carriage housing and configured to deposit a feedstock material on a target surface of the welding target. An ultrasonic weld head is partially disposed within the carriage housing and has a sonotrode that extends toward the target surface so as to engage the deposited feedstock material and apply a normal welding force to the deposited feedstock material and the target surface. The sonotrode is operable to conduct ultrasonic vibrations into the deposited feedstock material and the target surface to weld the feedstock material to the target surface.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: January 18, 2022
    Assignee: Huntington Ingalls Incorporated
    Inventors: John Walter Ralls, Daniel John Hebert, Kyle A. Wade
  • Patent number: 11219964
    Abstract: An ultrasonic welding device includes a sonotrode emitting longitudinal vibrations in the direction of a longitudinal sonotrode axis which comprises a work surface on a sonotrode head and an anvil. A weldment accommodation for a weld deposit is between the work surface ‘p’ and a counterface of the anvil. The ultrasonic welding device includes a stop device for defining the welding position with respect to the work surface. The counterface is disposed at an inclination ? towards the longitudinal sonotrode axis such that when the counterface is inclined downward towards a vibration node adjacent to the work surface, distance a between the work surface and the counterface continuously increases towards the vibration node, and when the counterface is inclined upward towards a vibration node adjacent to the work surface distance a is essentially constant.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: January 11, 2022
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventors: Stefan Mueller, Rainer Wagenbach
  • Patent number: 11213921
    Abstract: A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: January 4, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuji Uozumi, Kazuhiko Sakutani
  • Patent number: 11207750
    Abstract: A welding device with which two components can be pressed against each other comprises a static first section and a second section movable relative to the first section. At least one drive system is connected at a first end to the first section and at a second end to the second section, as well as at least one elastic guiding system by which the first section and the second section are connected to one another. The first section and the second section are movable relative to each other along only one axis due to at least one elastic guiding system, so that an axial length of the arrangement can be varied. A moving coil drive may be used or another drive without mechanical losses or with mechanical losses less than a clamping force to be applied during operation.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: December 28, 2021
    Assignee: BRANSON Ultraschall Niederlassung der Emerson Technologies GmbH & Co. OHG
    Inventor: Heiko Priem
  • Patent number: 11207846
    Abstract: A bonding device of a fuel cell part is disclosed. The bonding device of the fuel cell part may bond an upper gas diffusion layer and a lower gas diffusion layer to top and bottom surfaces of an MEA base material through adhesive layers, while disposing the MEA base material between the upper gas diffusion layer and the lower gas diffusion layer, and may include: a lower die that supports the MEA base material, the upper gas diffusion layer, and the lower gas diffusion layer to be bonded with each other; an upper die installed in an upper side of the lower die; and an ultrasonic wave vibration source that is installed to be capable of moving in a vertical direction at opposite sides of the upper die, compressing the upper gas diffusion layer, and applying ultrasonic wave vibration energy to the adhesive layer.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: December 28, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Min Pyo Kim
  • Patent number: 11205860
    Abstract: The present invention relates to an electrical connection between a flat part and a connecting part, in which the flat part and the connecting part are arranged one above the other in an overlap region, in which the contact surface of the flat part facing the connecting part in the overlap region is structured in relief-like fashion and that the flat part is friction-welded, in particular ultrasonically welded, to the connecting part via the structured contact surface.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: December 21, 2021
    Assignee: Auto-Kabel Management GmbH
    Inventor: Oliver Scharkowski
  • Patent number: 11161198
    Abstract: A high-frequency vibration welding conditioning system for achieving better metal material properties is disclosed, which comprises a host computer, a signal generator, a power amplifier, a high-frequency vibrator, a high-frequency vibration energy amplification and transfer device, an acceleration sensor, and a cooling module, the host computer controlling the signal generator to output a sinusoidal excitation signal which is independently and continuously adjustable in amplitude and frequency, the sinusoidal excitation signal being inputted to the high-frequency vibrator via the power amplifier.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: November 2, 2021
    Inventors: Bangping Gu, Xiaolan Yan, Xiong Hu, Wei Wang, Jian Zhu
  • Patent number: 11165211
    Abstract: The invention relates to a device and to a method for producing a tested weld joint between two contact elements (11, 12), which are joined together in a welding plane S, comprising a compressing space for accommodating the contact elements (11, 12), said compressing space being delimited by a work surface of a sonotrode, which transmits ultrasonic oscillations, and a counter-surface (15) of a counter-electrode (16) in a first axial direction at two opposing sides and by delimiting surfaces of opposing delimiting elements in a second axial direction at two opposing sides, said device comprising a test head (27) next to the compressing space, and said test head being able to be transferred from a position outside of the compressing space to a position within the compressing space in such a manner that the test head (27) is disposed within the open compressing space in a test mode of the device for subjecting a contact element (12) of the previously produced weld joint to a shear force essentially oriented para
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: November 2, 2021
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventors: Udo Wagenbach, Reiner Schmidt, Alexander Schuch, Sebastian Ruehl, Stephan Becker
  • Patent number: 11154953
    Abstract: A clamping system for an ultrasonic welding apparatus configured to clamp a contact element in the ultrasonic welding apparatus is presented. The contact element has a flat elongate shape and a welding region, a clamping region, and a contacting region arranged along a longitudinal axis. The clamping system includes two clamping units mechanically connected to the ultrasonic welding apparatus which are arranged spaced apart from one another and are moveable toward one another. Each clamping unit defines a clamping finger which is movable to extend over the clamping region. Each clamping finger has a clamping face that is configured to press on a surface of the clamping region that is located opposite an anvil of the ultrasonic welding apparatus while in a clamped state.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: October 26, 2021
    Inventors: Swindhard Packebusch, Michael Kasser
  • Patent number: 11141925
    Abstract: A method of joining includes disposing a second workpiece adjacent to a first workpiece. The method further includes identifying a determined hardness parameter of at least one of the first and second workpieces at a welding position. The determined hardness parameter is determined by at least one of estimation, calculation, and measurement. The method includes selecting a weld schedule based on the determined hardness parameter and welding the first and second workpieces together using the selected weld schedule. A welding horn includes a shank and a tip having an end face, the tip being disposed at an end of the shank and configured to contact a workpiece and to transmit energy to the workpiece. Knurls are disposed on the end face, each knurl having a distal end. A curved indenter extends from the end face beyond the distal ends of the knurls.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: October 12, 2021
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Pei-chung Wang, Bradley J. Blaski, Athreya Nagesh
  • Patent number: 11121114
    Abstract: A bonding tool includes a wedge tool that presses a bonding wire against a principal plane of a structure such as an electrode to which the bonding wire is to be bonded. A groove formed in an end portion of a wedge tool body of the wedge tool is inclined along a longitudinal direction of the bonding wire so that a heel side of the groove is closer to the principal plane of the structure than a toe side of the groove. As a result, the wedge tool is inclined at a tilt angle and the bonding wire fits the groove in the end portion of the wedge tool body along the longitudinal direction of the bonding wire. Thus, a corner portion of the wedge tool does not contact the electrode.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: September 14, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Takanori Sugiyama, Yosuke Miyazawa
  • Patent number: 11075374
    Abstract: A method for producing an electrode assembly includes a step of ultrasonically welding an exposed portion where the surface of an electrode current collector is exposed and an electrode lead to each other. The ultrasonic welding is performed, while the exposed portion of the electrode current collector and the electrode lead are stacked on each other, with an ultrasonic horn pressed against a resin sheet disposed on the exposed portion or the electrode lead. The resin sheet includes a sheet base material and an adhesive layer formed on one surface of the base material and is bonded to a portion of the exposed portion that is to be in contact with the ultrasonic horn or to a portion of the electrode lead that is to be in contact with the ultrasonic horn.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: July 27, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Shinji Mino
  • Patent number: 11045897
    Abstract: A workpiece is described, and includes a substrate, a cable, and a cover piece. A portion of the cable is joined to the substrate employing a vibration welding tool, and the cover piece is interposed between the portion of the cable and the vibration welding tool during the joining.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: June 29, 2021
    Assignee: GM Global Technology Operations LLC
    Inventors: Teresa J. Rinker, Wayne W. Cai, Michael P. Balogh, Nicholas W. Pinto
  • Patent number: 11031367
    Abstract: A bond head assembly for a bonding machine is provided. The bond head assembly includes a body portion and a bonding tool for bonding a semiconductor element to a substrate. The bonding tool is secured to the body portion. The bond head assembly also includes at least one reflective optical element carried by the bond head assembly. The at least one reflective optical element is configured to be positioned along an optical path of the bonding machine such that a vision system of the bonding machine is configured to view a portion of the semiconductor element while being carried by the bonding tool prior to bonding of the semiconductor element to the substrate.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: June 8, 2021
    Assignee: Kulicke and Soffa Industries, In.
    Inventor: Matthew B. Wasserman
  • Patent number: 11007602
    Abstract: An ultrasonic welding jig includes: an anvil that supports a plate-like electric cable connection portion of a terminal; and a welding horn that is disposed so as to oppose the anvil, and in which a fitting groove is formed in an opposing surface, the fitting groove being a groove in which a portion of a core wire of an electric cable is fitted. In a state in which the core wire and the electric cable connection portion are clamped between the welding horn and the anvil, ultrasonic welding is performed by ultrasonically vibrating the welding horn in an axial direction of the core wire. In a bottom surface of the fitting groove of the welding horn, a plurality of slippage prevention grooves that are obliquely oriented and intersect an axis of the fitting groove are formed spaced apart in a direction of the axis of the fitting groove.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: May 18, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tomoki Idota, Ryouya Okamoto, Hiroshi Shimizu, Hitoshi Takeda
  • Patent number: 10987753
    Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: April 27, 2021
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Dominick A. DeAngelis
  • Patent number: 10967583
    Abstract: The present disclosure provides an apparatus that includes a fiber gun. In an embodiment, the apparatus may controllably cut one or more fibers into one or more fiber segments. In an embodiment, the apparatus may controllably shape one or more fibers into different shapes (e.g., from loops into substantially straight fibers). In an embodiment, the apparatus may controllably position the one or more fiber segments onto a supporting member (e.g., a composite component). For example, the apparatus may include a robot that may controllably move the fiber gun relative to a supporting member and align the fiber gun such that the one or more fiber segments are controllably positioned on the supporting member. The apparatus may further include a controller that at least partially controls operation of the apparatus.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: April 6, 2021
    Assignee: BRIGHT LITE STRUCTURES LLC
    Inventor: Antony Dodworth
  • Patent number: 10960489
    Abstract: An ultrasonic welding assembly joins bare ends of an insulated wire bundle to a wire terminal in a weldment zone by intimate contact with a sonotrode of an ultrasonic stack. A door allows the operator to place the terminal into the nest within the weldment zone. One operator hand holds the wire bundle while one contacts an external sensor. A pair of terminal clamps extend inwardly and down to secure the terminal and create a taller capture area for the loose bare wire ends. A pair of clamp finger assemblies reversibly extend towards the insulated wires away from the weldment zone for securing the wires. A wire gatherer descends upon and captures all of the wire bare ends and secures them until the horn descends, captures, and holds the wire ends in place, then extends away from the weldment zone for ultrasonic welding to commence.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: March 30, 2021
    Assignee: TechSonic, Inc.
    Inventors: Byoung Soo Ou, David Lee Cyphert
  • Patent number: 10818514
    Abstract: A system for manipulating a filament can include a filament supply from which a filament can be drawn, the filament supply being positioned along an axis, a vacuum manipulator assembly positioned along the axis, wherein the vacuum manipulator assembly is configured to engage the filament when a vacuum is drawn through the vacuum manipulator assembly and draw the filament along the axis to a workpiece, and a welding tool comprising a welding head positioned along the axis between the filament supply and the vacuum manipulator assembly, the welding tool being configured to weld the filament to the workpiece.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: October 27, 2020
    Assignee: Triad National Security, LLC
    Inventor: Kyle B. Christensen
  • Patent number: 10775701
    Abstract: A capillary formed from a unitary manufactured glass includes a main portion and an end portion. The main portion is elongated and has a first aperture with a first inner diameter. The end portion, which can have a knob-like shape, has a second aperture that tapers from a second inner diameter to a third inner diameter and the third inner aperture joins to the first aperture. The second inner diameter is larger than the first inner diameter. If desired, the third inner diameter can be smaller than the first inner diameter.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: September 15, 2020
    Assignee: Molex, LLC
    Inventor: Robert Acuna
  • Patent number: 10756045
    Abstract: A connecting device for connecting a circuit chip to a substrate is provided. The connecting device includes: a main body having a first opening and a second opening; a vibration part on the main body, the vibration part being configured to vibrate the main body; and an intake part coupled with the first and second openings to adsorb the circuit chip to the main body. Both the first and second openings are open at a surface of the main body to which the circuit chip is adsorbed, and the second opening is arranged in the first opening on a plane.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: August 25, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seung Hwa Ha, Seung Soo Ryu, Jeong Ho Hwang
  • Patent number: 10743902
    Abstract: A vibrating body unit includes a vibration generator, a vibration transmitter and first amplitude enlarger. The vibration generator generates ultrasonic vibration whose amplitude has a predetermined correlation with a frequency. The vibration transmitter has a proximal end and a distal end while the vibration generator is attached from a proximal side, and transmits the ultrasonic vibration to a distal side in a longitudinal axis direction. At least one first amplitude enlarger is provided in the vibration transmitter, and enlarges the amplitude of the ultrasonic vibration at a first amplitude enlargement rate in a direction of transmission of the ultrasonic vibration, the first amplitude enlargement rate having a correlation with the frequency opposite to the predetermined correlation.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: August 18, 2020
    Assignee: OLYMPUS CORPORATION
    Inventors: Masashi Yamada, Hideto Yoshimine
  • Patent number: 10722965
    Abstract: A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 ?m, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 ?m are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: July 28, 2020
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Kaichi Tsuruta, Takeo Saito, Manabu Muraoka, Hiroki Oshima
  • Patent number: 10689731
    Abstract: The device comprises a sonotrode (102) which can produce an oscillatory movement by means of a transducer (101) in order to generate ultrasound oscillation waves in said light alloy melt, when said sonotrode (102) and said melt are in contact, so as to perform the degassing; and an electronic-mechanical component (104) embedded in part of the sonotrode (102) for detecting the state of the service life or an anomaly of the sonotrode (102). The electronic-mechanical component (104) includes means for sending at least one notification signal to an electronic remote control equipment (103), forming a system together with the device. The electronic control device (103) is configured for sending an activation or deactivation signal for activation or deactivation of said transducer (101), taking into account said at least one notification signal.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: June 23, 2020
    Assignee: ULTRASION S.L.
    Inventors: Antoli Fauria Torrent, Manel Da Silva Lopez, Francisco Javier Plantà Torralba
  • Patent number: 10677763
    Abstract: The method comprising the following steps: a) Providing a first bath of a liquid metal (1) comprising aluminium with a content X and magnesium with a content Y, the magnesium content Y being different to zero, b) Immersing at least partially a sonotrode (3) formed from a material inert to liquid aluminium, in the first bath of liquid metal (1), and c) Applying power ultrasounds to the sonotrode (3) so as to excite the liquid metal (1) until wetting (5) of the sonotrode (3) by the liquid metal (1) is obtained. d) Cooling the first liquid metal (1) of the first bath until solidification of the first liquid metal (1) around the sonotrode (3) is obtained, generating an intimate bond (6) between the sonotrode (3) and the solidified first liquid metal (1) having a bonding strength substantially equal to that of brazing between two metals. e) Machining the solidified first metal (1) in the form of a flange (7) configured for the attachment of a mechanical amplifier and/or of a transducer (4).
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: June 9, 2020
    Assignee: CONSTELLIUM ISSOIRE
    Inventors: Jean-Louis Achard, Philippe Jarry
  • Patent number: 10658328
    Abstract: A method of bonding wires onto surfaces, an apparatus and a computer program product are disclosed. The method of bonding wires onto surfaces, comprises the steps of: collecting operating characteristics of a bonding tool while forming a wire bond which bonds a wire to a surface; determining whether a possible bonding failure of the wire bond has occurred as indicated by the operating characteristics; and capturing an image of the wire bond to identify whether a foreign body is present on the surface if it is determined that a possible bonding failure has occurred. In this way, imaging of the wire bond is only necessary when the operating characteristics indicate a suspect bonding failure has occurred. This avoids the need to image every bond, while still imaging suspect bonds. This approach helps to significantly increase the throughput of the wire bonding apparatus whilst still identifying and classifying bonding defects due to the presence of a foreign body.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: May 19, 2020
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Tact Lee, Chin Kei Lai, Chung Yan Lau
  • Patent number: 10647064
    Abstract: An apparatus for use in a friction stir operation, such as friction stir welding (FSW) or friction stir processing (FSP). The apparatus may have a rotating tool adapted to be plunged into a material, where the material is susceptible to being softened by heating. The rotating tool may further be adapted to be advanced along a surface of the material. An optical energy generating subsystem may be used to heat a portion of the material using optical energy as the tool is advanced along the material.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: May 12, 2020
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Joseph C. Farmer, Alexander M. Rubenchik, Raymond J. Beach, Robert J. Deri, Edward I. Moses, Bassem S. El-Dasher, Sarath K. Menon, Terry McNelley
  • Patent number: 10601404
    Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: March 24, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen P. Ayotte, Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan
  • Patent number: 10562127
    Abstract: A ribbon bonding tool is provided. The ribbon bonding tool includes a body portion including a tip portion, the tip portion defining a working surface. The ribbon bonding tool includes a group of four protrusions extending from the working surface, wherein the working surface defines four quadrants in a horizontal plane by extending an imaginary line at a midpoint along each of a length and a width of the working surface. Each of the four protrusions is arranged in one of four quadrants.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: February 18, 2020
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Bernard Poncelet, Todd James Walker, Christoph Benno Luechinger
  • Patent number: 10554004
    Abstract: A sonotrode (18) for producing a welded and/or soldered join between a cable (17) and a sheath (17), covering the cable (17), comprising at least one working surface (2). The working surface (2) is curved in a concave manner, at least in sections. An anvil (10) comprises at least one counter surface (11) which is curved in a concave manner, at least in sections. The device for producing the join between a cable (17) and a sheath (17), covering the cable (17), comprises a sonotrode (18) joined to an ultrasound source (8) at least at a joining surface (5), and comprising an anvil (10) arranged opposite the working surface (2) of the sonotrode (18). A method for producing a join between a cable (17) and a sheath (17) covering the cable (17) is also disclosed.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: February 4, 2020
    Assignee: TELSONIC HOLDING AG
    Inventors: Markus Böhm, Thomas Hünig
  • Patent number: 10485699
    Abstract: The invention is generally directed to phacoemulsification systems and methods, and more particularly to systems and methods for providing transverse phacoemulsification. In accordance with one embodiment, a phacoemulsification system is provided having a handpiece with a needle, wherein the phacoemulsification system is configured to vibrate the distal end of the needle in both an effective transverse direction and an effective longitudinal direction when power, having a single effective operating frequency is applied to the handpiece.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: November 26, 2019
    Assignee: Johnson & Johnson Surgical Vision, Inc.
    Inventors: Mark Steen, Rob Raney, John Muri, George Bromfield
  • Patent number: 10449627
    Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: October 22, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventor: Dominick A. DeAngelis
  • Patent number: 10381321
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: August 13, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC
    Inventor: Dominick A. DeAngelis
  • Patent number: 10307968
    Abstract: A holding structure (2) in an ultrasonic vibration welding device that welds workpieces by applying ultrasonic waves to the workpieces holds an ultrasonic vibration transmitter (horn) (5) bearing the transmission of longitudinally vibrating ultrasonic waves in holding members (8, 8). The horn comprises a horn body (51) having the length of one-half the wavelength ? of the ultra-sonic vibration. Holding structure (2) includes holders (7x, 7y) having a prescribed volume and thin sheet connectors (6a, 6b) placed at different positions (Pa, Pb) on the horn body (51). The horn body (51) is fixed to holding members (8, 8) by means of the respective holders (7x, 7y).
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: June 4, 2019
    Assignee: Branson Ultrasonics Corporation
    Inventors: Osamu Tamamoto, Jun Pang
  • Patent number: 10286470
    Abstract: The invention relates to a device (10) for the separate application of solder material deposits, in particular solder balls, comprising a conveying device for separately conveying the solder material deposits from a solder material reservoir toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position P1, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to the application device into an application position P3, wherein a removal device (46) for removing a solder material deposit from a transport holder arranged in a removal position P4 is arranged downstream of the transfer position in the conveying direction, the removal device being connected to a detector device for triggering the removal function, said detector device
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: May 14, 2019
    Assignee: PAC TECH—PACKAGING TECHNOLOGIES GMBH
    Inventor: Ghassem Azdasht
  • Patent number: 10262969
    Abstract: [Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: April 16, 2019
    Assignee: KAIJO CORPORATION
    Inventor: Akio Sugito
  • Patent number: 10232464
    Abstract: An ultrasonic bonding jig includes: a plurality of protrusions; a planar portion among protrusions formed among base ends of the protrusions; and recessed portions recessed to a side opposite to a projection direction of the protrusions, the recessed portions being formed on both sides in a vibration direction of the protrusions.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: March 19, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi Miyashiro, Yoichi Suruga, Shuhei Koyano
  • Patent number: 10200016
    Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 5, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen P. Ayotte, Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan