Abstract: This invention provides a manufacturing method of printed wiring board which enables a plate-like substrate to be carried and processed without any contact to its product surface. End portions of plate-like copper clad laminates are overlapped vertically and then joined linearly by rotating an ultrasonic horn along the end portions. Consequently, copper foils can be metal-joined and a joining strength necessary for transportation with a roller is obtained. Because belt-like copper clad laminate is obtained by joining the plate-like copper clad laminates and after that, processed, thus, the belt-like copper clad laminate can be carried without any contact to its product surface as it is carried with the roller, and then processed.

Abstract: A method of forming a composite sheet includes the steps of: providing a first sheet having a surface and including a metal or alloy, the first sheet having a given strength characteristic; providing a second sheet having a surface and a strength characteristic that is superior to the given strength characteristic of the first sheet; disposing the first sheet and the second sheet in an aligned opposing position with at least a portion of the surface of the first sheet touching the surface of the first sheet to form a contact area; and bonding the first sheet to the second sheet at least in part by applying an oscillating ultrasonic force to at least one of the first sheet and the second sheet to form a composite sheet, the first sheet having a cube texture characterized by a ?-scan having a FWHM of no more than 15° in all directions.

Abstract: An ultrasonic welding system and a method are provided. The system includes an ultrasonic welding device and a controller that generates control signals for inducing the device to form a first weld joint. The system further includes a power adjusting unit having a desired output power level curve indicating desired power levels over time for obtaining a desired weld joint. The unit receives data from the controller indicating power levels when forming the first weld joint. The unit compares a power level output by the controller at a first time with an associated power level of the curve at the first time, and induces the controller to increase the power level at a second time if the power level output by the controller at the first time is less than the associated power level of the curve at the first time.

Abstract: A resonator for joining metal members utilizing ultrasonic vibration includes an ultrasonic horn having a length of at least half wavelength of a resonance frequency of ultrasonic vibration transmitted from a vibrator, and a joining tool provided on the ultrasonic horn so as to project in a direction normal to a vibration transmission direction of the ultrasonic horn at a position of a point of a maximum vibration amplitude of the ultrasonic horn. The joining tool is formed into a linear bar made of a material excellent in acoustic property and is provided on a distal end thereof with a tool head projecting laterally.

Abstract: An ultrasonic welding tool fabricated of powder metal material includes a body and a welding tip extending axially from the body to a working end. The powder metal material can be ferrous-based and admixed with additives, such as alumina, carbide, ferro-molybdenum, ferro-nickel, chrome or tribaloy. An exposed surface of the welding tip can comprise Fe3O4 oxides. The tool is compacted to the desired shape and sintered. The body can include a different second material compacted separately from the welding tip and then joined to the tip and sintered.

Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.

Abstract: A synchronous ultrasonic metal welding device with double-heads has two sets of ultrasonic welding mechanisms which are installed side by side on a middle frame (18). The middle frame (18) is composed of assembling flanges (19) and two sliding stop rods (11) which are in parallel each other. The ultrasonic welding mechanisms are located on the assembling flanges (19) which are connected with driving devices (3) respectively. The driving devices (3) drive the ultrasonic welding mechanisms moving toward each other and welding synchronously. By using the welding device of the invention, multi-layer metal pieces of the power battery can be double-sided welded simultaneously by way of spot welding or roll welding, so the work efficiency can be improved, and the welding layer can be strong in one time.

Abstract: According to an aspect of an embodiment, a wire bonding method includes vibrating a capillary of a bonding head, the capillary having a heater attached thereto at a position corresponding to a node of vibration of the capillary generated by the vibration heating the capillary with the heater and performing a wire bonding operation while heating the capillary with the heater.

Abstract: A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.

Abstract: A process for reducing aluminum pick-up and adherence during the ultrasonic welding of aluminum braids which are welded in a vertically and/or horizontally adjustable compression chamber of an ultrasonic welding device. The static tool parts which delimit the compression chamber have working surfaces made from polycrystalline diamond (PCD).

Abstract: An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At least one additional second electrical conductor (9) is bonded to the first electrical conductor (8) via at least one second bond connection (10, 13), the two bond connections (10) being offset from one another. The present invention also relates to a method for manufacturing an electrical bond connection system existing between a first electrical contact surface and a second electrical contact surface.

Abstract: The present invention relates to an ultrasound welding device for welding material webs, for example, films, having an anvil (1) with an anvil welding surface, and a sonotrode (2) with a sonotrode welding surface, wherein the anvil is movable relative to the sonotrode.

Abstract: A method and a device is provided for levelling an area region on the surface of a metal or metallization layer of a carrier. The area region is made planar by the action of a stamp or of a roller.

Abstract: Some embodiments include in-process welding devices to compensate for error associated with detected weld penetration depth. Exemplary devices can generally include an ultrasonic energy source, an ultrasonic receiving sensor, and a controller. The ultrasonic energy source can be disposed to generate ultrasonic energy through a first specimen being welded to a second specimen. A weld seam can be used to join the first specimen to the second specimen. The ultrasonic sensor can be disposed on an opposite side of the weld seam from the ultrasonic energy source, and configured to detect ultrasonic energy propagated from the first specimen side of the weld seam to the second specimen side of the weld seam.

Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.

Abstract: An ultrasonic welding method includes pressing an ultrasonic welding stack mounted for linear movement against a first workpiece using an electrical servo motor, applying a predetermined initial load to the first workpiece, and initiating a weld, comprising outputting energy from the ultrasonic welding stack to the first workpiece. The method includes sensing, with at least one sensor, a control variable, outputting a signal corresponding to the sensed control variable to a controller, simultaneously outputting energy from the ultrasonic welding stack to the first workpiece and maintaining a weld distance at or near zero until the signal corresponding to the sensed control variable satisfies a predetermined condition, and applying a controlled force, speed, or a combination thereof to said first workpiece with an electrically powered linear actuator to urge the first workpiece against a second workpiece to which the first workpiece is to be joined following satisfaction of the predetermined condition.

Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.

Abstract: A welding tool, such as a vibration welding tool, includes one or more relief areas for material to flow into during a welding process to help prevent deformation of a substrate that a component is being attached to.

Abstract: A capillary is attached to an ultrasonic transducer of a wire-bonding apparatus. The capillary includes a first part configured to be attached to the ultrasonic transducer, and a second part other than the first part and extending from the first part. The first part has a shape different from a shape of the second part so that the first part has a flexure rigidity larger than the second part.

Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.

Abstract: A transducer is provided that comprises a horn having a longitudinal axis, a bonding tool attached to the horn, and an ultrasonic generator attached to the horn and spaced from the bonding tool along the longitudinal axis of the horn. A flexure is attached to the horn between the bonding tool and the ultrasonic generator for supporting the horn whereby to increase its dynamic rigidity in directions transverse to the longitudinal axis.

Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Abstract: A method of forming a metallic container by placing body and lid portions together, keeping parts of the body and lid portions in contact with one another, and vibrating the lid with respect to the body, thereby generating frictional heat to form a friction metallic weld therebetween. Apparatus for attaching the lid and body portions of the metallic container includes a body supporting base, an assembly to support a flange of the body, a sonotrode to contact a flange of the lid so that wherein the flanges of the lid and body are held together between the support assembly and the sonotrode. A motor vibrates the sonotrode relative to the support assembly to thereby move the flanges relative to one another generating sufficient frictional heat to create a friction metallic weld therebetween.

Abstract: A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract: Provided is a wire bonding apparatus including: a wire cutting unit configured to cut a wire by bonding the wire using a capillary and then moving the capillary and a first clamper upward while the first clamper remains closed; and a wire extending unit configured to extend a tail wire from a tip end of the capillary by moving the capillary upward and then moving the capillary and the first clamper upward in a state in which the first clamper is opened and a second clamper is closed. The wire bonding apparatus having such a structure effectively prevents the wire from falling out and bending.

Abstract: An ergonomic horn for use in an ultrasonic welder having a base structure defining a first longitudinal axis, where the base structuring is connectable to the ultrasonic welder, and a tip mounting head defining a second longitudinal axis. The second longitudinal axis is angled relative to the first longitudinal axis to permit an ergonomic positioning of the item to be welded. The tip mounting head is operable to support a removable ultrasonic welding tip member. The ergonomic horn further having a reduced thickness neck portion interconnecting the base structure and the tip mounting head, such that the base structure, tip mounting head, and reduced thickness neck portion together transmit ultrasonic energy in the range of approximately 10 kHz to approximately 60 kHz for ultrasonic welding.

Abstract: A transducer configured for use with a manual wire bonding machine includes a body portion including an end portion, the end portion defining a bonding tool aperture configured to receive at least a portion of a bonding tool. The transducer also includes a first tightening mechanism for securing a ball bonding tool in the bonding tool aperture, and a second tightening mechanism for securing a wedge bonding tool in the bonding tool aperture. The first tightening mechanism is distinct from the second tightening mechanism.

Abstract: The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

Abstract: An apparatus for attaching the lid and body portions of a metallic container includes a base to support the body, a support assembly to support a flange of the body, and a sonotrode for contacting a flange of the lid, wherein the flanges of the lid and body are held together between the support assembly and the sonotrode. A motor reciprocally rotates the sonotrode relative to the support assembly, thereby moving the flanges relative one another to generate frictional heat and create a friction weld therebetween.

Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Abstract: A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head (2) which can be rotated about a geometric axis of rotation (D), in particular a vertical axis, and on which a bonding tool (5) and an ultrasonic transducer (35) are disposed for ultrasonic vibration excitation of the bonding tool (5). It is proposed that the main direction of extension (36) of the ultrasonic transducer (35) and/or the direction of extension thereof in the direction of the axis of the minimum moment of inertia extends parallel to the geometric axis of rotation (D) of the bonding head (2). The invention further relates to a bonding device or an ultrasonic transducer.

Abstract: A method for production of a welded connection between at least one first electrical conductor and at least one second electrical conductor, in which the conductors are brought into a compression chamber enclosed by delimitation elements and welded therein by an ultrasound welding device, one of the delimitation elements forming a sonotrode which may be subjected to ultrasound vibration. According to the invention, in order to connect a first conductor in the desired circumference with second conductors, where the total cross-section of the second conductors for connection to the first conductor can optionally be greater than the usual cross-section with the ultrasound device used, the first conductor is welded sequentially with two or more second conductors in the compression chamber.

Abstract: A bonding tool is attached to a transducer of an ultrasonic bonder with several screws, at least two of which are advantageously disposed at different heights when the transducer is in its operating position. The transducer may comprise a bore in which the bonding tool is disposed. The bore may have a circumference that is expanded away from the transducer's free end.

Abstract: An ultrasonic device includes a coupler, a mounting sleeve and an exponential horn form by both the coupler and the mounting sleeve. A flange is located on the mounting sleeve for support at a node of minimum vibratory motion. The mounting sleeve and coupler are formed separately and then metallurgically attached so they vibrate together as a substantially unitary member. The formation of the horn by the two components in this manner allows the diameter at the start of the horn to be increased to the outer diameter of the mounting sleeve, thereby increasing cross-sectional area at the horn start and increasing amplitude at the horn tip. Preferably, the coupler and mounting sleeve are made from stainless steel alloy and attached using a silver braze alloy. The device may also include a support collar attached to the mounting sleeve flange to support the mounting sleeve and primary coupler.

Abstract: A weld pad for an ultrasonic welding horn for welding a battery cell tab is described. The weld pad includes a plurality of inner knurls having at least one sharp edge; and a plurality of outer knurls surrounding the plurality of inner knurls, the outer knurls being shorter than the inner knurls and having a rounded outer edge. A method of welding battery cell tabs using the weld pad is also described.

Abstract: A bonding tool comprises: a horn which transmits an ultrasonic vibration; a ultrasonic transducer which is provided on one end of the horn, and produces the ultrasonic vibration; a heater disposition part, in which a heater is disposed, which is provided between the one end of the horn and the other end of the horn; a bonding action part which is provided between the one end of the horn and the other end of the horn, holds an electronic component, and is heated by the heater; a first cooling part, through which a fluid flows, which is provided between the heater disposition part and the one end of the horn; and a second cooling part, through which a fluid flows, which is provided between the heater disposition part and the other end of the horn.

Abstract: Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus 1, a capillary 5 is lowered to a bonding position to bond an initial ball 10 to a pad 104 on an overhanging die 100. Here, a position of the capillary 5 in a Z direction and a load detected by a load sensor 7 are detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillary 5 at the load change point, a movement amount Z of the capillary 5 from the load changing position to the bonding position is calculated. After the capillary 5 is lifted by the movement amount Z, a wire loop is formed between the pad 104 and a lead 105.

Abstract: A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.

Abstract: A wound electrode body is fabricated by laminating and winding positive and negative electrode sheets together with a separator therebetween for insulation. On both positive and negative electrode side ends of the wound electrode body, laminates of current-collecting foil layered portions of the electrode sheets are bent or folded f toward the outer peripheral side to be separated into two. The separated laminates and forked connector leaves are overlapped and clamped between an ultrasonic chip and an anvil. Then, they are welded. The forked connector leaves are arranged such that no opposing forked connector leaf is present in the direction of a line normal to the forked connector leaf, so that the anvil does not have to be cantilevered. This allows welding by using the ultrasonic chip and the anvil without interfering with the collector rs. As a result, the quality of welding is improved.

Abstract: A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point without cutting the wire and the additional wire loop is bonded to the second bonding point or to the vicinity thereof while part of the wire is crushed.

Abstract: A method for controlling welding forces of a weld tip to a work piece during a vibration-welding process includes positioning an Active Material (AM) element adjacently to a welding interface, and varying a property of the AM element to regulate the welding force. The AM element may be disposed between the weld tip and a weld face thereof, or between the work piece and an anvil. The property may be varied as a function of heat generated by the welding process. A property of each of a plurality of AM elements may be independently and selectively varied via an energy source, or passively. A vibration welding system includes a weld tip and an AM element connected adjacently to a welding interface. The system regulates a welding force applied by the weld tip to a work piece during the welding process by varying a property of the AM element.

Abstract: A transducer is provided that comprises a horn that is configured to transmit vibrations along its length during operation in the form of an oscillatory waveform, such oscillatory waveform having a plurality of vibration nodal points. An ultrasonic generator is coupled to one end of the horn and a bonding tool is coupled to an opposite end of the horn for performing bonding operations. A first flange structure is located along the length of the horn at a first vibration nodal point for mounting the transducer, and a second flange structure is located along the length of the horn at a second vibration nodal point for mounting the transducer, such that the second flange structure is separated from the first flange structure by a distance of at least two consecutive vibration nodal points.

Abstract: A welding assembly for forming a weld along a welding interface of a work piece(s) using vibrations includes a welding tool and a thermal barrier. The thermal barrier is at least a chemical and/or mechanical insulating layer positioned adjacent to the welding tool, which minimizes the rate of dissipation of heat generated by the vibrations at or along the welding interface. The welding assembly may also include a wear-resistant layer adjacent to the thermal barrier, which protects the thermal barrier from damage or wear. The welding tool is a portion an anvil assembly and/or a sonotrode assembly. A method of insulating a welding tool includes applying or connecting a thermal barrier to a surface of the welding tool, and minimizing the rate of dissipation of heat generated by the vibrations at or along the welding interface using the thermal barrier, which includes an insulating layer.

Abstract: An ultrasonic welding device for welding two components has a rod-shaped first sonotrode for the generation of longitudinal waves and is coupled on its first end to a first converter and on its second end opposite the first end to a second converter. A first welding surface is provided in the middle of the first sonotrode. To improve durability and welding performance, a second sonotrode which is coupled to at least one third converter and is configured as a torsion sonotrode, has a second welding surface arranged opposite the first welding surface. The first and second sonotrodes can be moved relatively to each other such that a clamping force between the first and the second welding surface can be applied to the components to be connected.

Abstract: The invention is a mounting system for a vibrational element. The vibrational element has a longitudinal axis, an outer surface and an axial displacement node. The mounting system includes an isolation member which has an isolation surface, an isolating body, and an engaging portion. The engaging portion is immovably secured to the isolation member and extends radially inward from the isolation body at a point radially opposite the isolation surface. The engaging portion is disposed so as to engage the outer surface of the vibrational element. Radial displacements of the vibration element are substantially decoupled from the isolation surface through the engaging portion.

Abstract: An electronic component mounting apparatus includes an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, and the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even when the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant.