Abstract: In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.

Abstract: A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor element on the substrate. For the carrying direction in the reflow furnace using a carrying belt, temperature analysis for time duration is performed for the solder bumps at both the front and rear, and then the condition of the reflow furnace is determined so as to close at both the times for reaching the solder melting temperature and the times for maintaining the solder melting temperature.

Abstract: A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of the adhesive sheet and the adhesive kept constant when the pushing-up pressure for pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion.

Abstract: A method of measuring solder bumps formed on a substrate mounting a semiconductor element thereon includes mounting a work to be measured on a work position mechanism, and scanning the work by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be satisfactory.

Abstract: A bump bonding apparatus comprising: a loader section that holds trays which accommodate semiconductor pellets and an unloader section that holds trays which accommodate semiconductor pellets to which bumps have been applied, the loader and unloader sections being provided next to each other on one side of a bonding stage; a buffer station and a supply and holding station provided so as to positionally correspond to the loader section and unloader section, respectively; a first pusher for sending trays from the loader section to the buffer station, a second pusher for sending trays from the supply and holding station to the unloader section, a third pusher for sending trays from the buffer station to the supply and holding station, and a pellet transfer mechanism for picking up a semiconductor pellet in the tray in the supply and holding station, transferring it to the bonding stages and then returning the semiconductor pellets to which bumps have been applied on the bonding stages back to the tray in which t

Abstract: The present invention is to provide an apparatus and a method for detecting a double bonding error that a wire ball is in contact with a wire loop previously formed between a pad and a lead, by using the position of the wire ball and comparing a reference voltage with the voltage on a wire when the wire ball is in contact with either the pad or the wire loop.

Abstract: A ultrasonic horn attached to a bonding arm of a bonding apparatus via two horn supporting members. These horn supporting members, preferably made from a resin material, are separate components from the ultrasonic horn, and the ultrasonic horn and the two horn supporting members are provided so that their positional relationship in the axial direction of the ultrasonic horn can be adjusted.

Abstract: A method and apparatus for monitoring the presence of a bonding wire in a wire bonding machine. The apparatus generates an AC signal which is coupled to the bonding tool. A sensor senses a current of the AC signal flowing to the bonding tool and a current of the AC signal returned from the bonding tool. The current flows are compared to one another to determine the presence or absence of the bonding wire in the bonding tool.

Abstract: A method of making low profile wire connection comprising steps of: connecting a wire to a first bonding point, moving a capillary straight up a first length, moving the capillary away from a second bonding point thus making the first reverse action to bend the wire in an appropriate angle so as to form the first bent point, again raising the capillary a second length, again moving the capillary in the direction of the second bonding point to bend the wire in an appropriate angle so as to form the second bent point, again raising the capillary a third length, moving the capillary to the second bonding point thus making an action to bend the wire in an appropriate angle so as to form the third bent point, raising the capillary a fourth length by feeding out the wire to a length which is enough to make a wire loop, and then moving the capillary down to the second bonding point where the bonding is performed.

Abstract: A workpiece is held at a welding station by several clamps during welding. After welding, the workpiece is transferred to a checking station where a determination is made of the actual location of critical points on the workpiece. The actual critical point locations are compared with ideal critical point locations to determine if there is any error in the manner in which the workpiece was held by the clamps. If an error is determined, one or more of the clamps are adjusted to compensate for the error when holding a subsequent workpiece for welding. Apparatus is also provided for carrying out the method of this invention.

Abstract: A friction welding method and apparatus for holding and joining thermo-plastic resin elements together by rotational torque friction. The method includes precise orientation of the joined surfaces together, applying pressure to the elements and precisely controlling a pre-determined rotation of the rotatable element against the fixed element within a fraction of a second achieving welding of the thermo-plastic part. Precise starting and stopping of the rotatable element achieves a rapid superior weld joint between the elements. Control parameter inputs are defined by selective feedback of positioning and rotation motors to achieve repeatable control in the welding sequence.

Abstract: A seam (16) between juxtaposed workpieces (14) is welded or heat-treated by friction-stir using a pin tool (12) driven by an apparatus (18) which controllably positions the pin tool (12) in the vertical direction (8). The workpiece (14) is supported by an anvil (22). The joint is heated by rotation of the pin tool (12) inserted into the joint from the obverse side. In order to provide a good weld through the thickness of the workpiece, a sensor (34, 310) senses electrical characteristics near the heated or welded region, and generates a control signal which tends to control the position of the pin tool near the reverse side of the weld. The sensor is located adjacent the weld (16s) on the obverse side, and is preferably protected by mounting in a depression (22c) in the anvil (22). In one embodiment, the sensor (34) senses magnetic characteristics near the weld. In another embodiment, the sensor (310) senses conduction, conductivity, or eddy currents in the vicinity of the weld.

Abstract: So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as a reference bonding position; and during the looping for the remaining wires, the bonding tool is moved in accordance with an amount of movement stored beforehand in the memory with the reference bonding position used as a reference.

Abstract: A method and apparatus are provided for flash butt weld joining adjacent rail ends on site during initial field installation where at least one of the rails is fastened to the roadbed, and inclosure butt welding rails as in de-stressing long sections of rail track where both rails are fastened to the roadbed. The method and apparatus apply electrical power to the adjacent rail ends while simultaneously effecting relative closing movement between the rails ends through actuating means so as to bring the rail ends into position to effect current flow between the rail ends, and determining a force necessary to move the adjacent ends into a welding position under varying environmental conditions of the rails as the adjacent rail ends close and during flashing of the adjacent rail ends due to the current flow.

Abstract: It is an object of the invention to provide a method and a device which can manufacture, by ultrasonic welding, a reel for use in a magnetic tape cartridge with an improved yield rate, while not only restricting the deformation of workpieces but also preventing the products from varying in quality. At least one of the amplitude of an oscillator power source 80 and pressure to be applied to workpieces in an ultrasonic welding operation are set high in the early stage of the ultrasonic welding operation and are then switched into lower levels in the middle of the ultrasonic welding operation when the workpieces, that is, upper and lower reels 4 and 5, begin to melt together.

Abstract: A system and method for wiring electronic components in a three-dimensional manner. The wiring system includes a means for temporarily placing components on a substrate, a means for directly or indirectly connecting electrodes of the components together with wires, a means for removing the temporarily-placed components from the substrate, and a means for rearranging the components in a three-dimensional manner. The movable section permits the means for bonding to bond the wires to the components from any direction in the three-dimensional space. The means for directly or indirectly connecting the electrodes of the components together with wires includes a means for placing a wiring-branch pad in a space between the electrodes of the components to be indirectly connected together, and a means for bonding the electrodes of the components to the wiring-branch pad.

Abstract: A method and a system for controlling the path of movement of an orbital motion welding system are provided. The locus path of a voltage space vector of a frequency converter feeding the electromechanical system is adjusted by an oscillation amplitude controller with respect to amplitude by using a path controller working in a rotating coordinate system, and a voltage generator. The adjustment is done with respect to the spectro-composition (relative amplitude and phase of the harmonic oscillations) so that the resulting path of movement equals the desired path of movement. The paths of movement obtainable with the invention include all kinds of ellipses including circular and linear paths of movement along one axis as extremes.

Abstract: A method and an arrangement for measuring the cooling rate and thermal gradient between the top and bottom surfaces of a printed circuit board. Moreover, it is intended to facilitate control over the temperature gradient which is encountered between the top and bottom of the PCB so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.

Abstract: A method for mounting an integrated circuit having a plurality of leads on a PCB. In order to mount the integrated circuit having a plurality of leads on the PCB, foreign substance on the PCB is first removed and a flux is simultaneously spread over the lead patterns formed on the PCB. After that, by aligning the leads of the integrated circuit with lead patterns on the PCB on which the flux is spread, some leads of the integrated circuit is temporarily fixed to the corresponding lead patterns of the PCB. After soldering the leads of the integrated circuit to the lead patterns of the PCB by radiating an optical beam on the entire whole surface, the soldered PCB is cooled, thereby mounting the integrated circuit on the PCB.

Abstract: A thermal compression bonding method of an electronic part with a solder bump comprises the steps of, pressing the electronic part with the solder bump to a circuit board by a thermal compression bonding tool vertically moving by vertical moving means and thermally compression bonding said electronic part to the circuit board while detecting the pressing force by load detecting means. In this method, there is included the steps of descending the thermal compression bonding tool so as to press the solder bump of said electronic part to the electrode of the circuit board, and judging that the solder bump is melted when a load detected value by said load detecting means is reduced to a value equal to or less than a predetermined value after heating of said electronic part is started so as to ascend the thermal compression bonding tool.

Abstract: With the present invention, a circuit card assembly having a nonvertically approaching device may be manufactured with reflow soldering. The circuit card assembly includes a circuit card and a nonvertically approaching device such as an edge connector, which is soldered to the circuit card with reflowed solder. The device is soldered to the circuit card by initially heating the circuit card, along with included reflow solder, prior to mating the device to the circuit card. Once the solder has melted and while it is in a liquidus state, the device is mated with the circuit card. In this manner, the nonvertically approaching leads of the device slide into the solder as they are positioned onto their circuit card soldering surfaces. Once cooled, the solder solidifies to conductively mount the device to the circuit card.A mating pallet is provided for soldering a device having nonvertically approaching leads to a circuit card.

Abstract: A temperature control system for obtaining a desired soak temperature of a workpiece driven through the brazing and annealing system includes a convection muffle for heating the workpiece within a brazing zone of the brazing and annealing system. The temperature control system also includes a first thermocouple positioned above the workpiece and measures a first real-time temperature of an atmospheric convection current directed towards the workpiece before the workpiece absorbs heat from the atmospheric convection current. A second thermocouple is positioned beneath the workpiece and measures a second real-time temperature of the atmospheric convection current after the workpiece has absorbed the heat from the atmospheric convection current.

Abstract: A process, called Covered Trailing Edge of Weld (CTEW) that can be applied during fusion welding that produces a weld without cracks and porosity and reduced residual stress level, is described. The process eliminates or reduces the need of non-destructive testing, re-work and post weld heat treatments in weld manufacturing. It is known that in a normal unassisted solidification of a weld, numerous cooling gradients from solid-liquid interfaces come into effect, because of numerous and multi-directions of solid crystal faces that promote crystal growth in solidifying metal in different direction. Such micro cooling gradients in molten metal are in various directions also because of varying inclinations of the surface of the cup at each point where solid base of microstructure is exposed for crystal growth.

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: A bonding apparatus for manufacturing, for instance, a semiconductor device including a computer system which calculates a limit value of a driving current that flows to a linear motor controlling a bonding arm, and the computer system including a memory which stores correction current values that are used to correct the driving force of a plate spring at various height positions of the bonding arm, and limit values of the driving current according to a bonding load.

Abstract: A solder head control mechanism which uses a movable small size and simply structured acoustic coil linear servomotor to directly drive a solder head to perform soldering operation. The solder head links with a position sensor, a controller and a current output actuator to form a closed loop control mechanism which has small inertia, fast response time and great positioning accuracy. The controller may dynamically change amplifying value to actuate the solder head.

Abstract: A wire bonding method includes aligning the face of a capillary along a first direction to make a first wire bond at a first bond point. The capillary face is realigned to a second direction to make a second wire bond at a second bond point. The realignment may be achieved by a system including an wire bonding capillary having an indicator located thereon. A detector detects a signal from the indicator. The signal corresponds to a rotational alignment of the capillary and, therefore, to a direction of alignment of the capillary face. A first signal indicates a first alignment of the capillary face and a second signal indicates a second alignment of the capillary face. The signals may each have a relative signal strength which indicates rotational an offset of the capillary face from a given direction.

Abstract: The root shape of a flash formed in the friction-welded joint is controlled by introducing an upset delay time interposed between termination of the friction step and commencement of the upset step and by controlling the upset displacement speed. This provides a friction-welded joint having a tensile strength and a fatigue strength which are comparable with those of TIG- or MIG- welded joints and enables aluminum alloy hollow members to be produced by friction welding instead of TIG or MIG welding. Typically, the upset delay time is 0.4 to 0.8 sec and the upset displacement speed is 5.0 to 70.0 mn/sec to form a flash having a flash root radius of 0.5 mm or more and a flash root angle of 75.degree. or less.

Abstract: In a die bonding apparatus, above a work placing table shrouded in the atmosphere of an inert gas, there are provided a pair of gas injecting heads which can be separated from each other to enlarge the opening to the degree that the largest semiconductor package can be inserted through the opening and which can reduce the opening to the degree that a bonding head can be inserted through the opening. The pair of gas injecting heads form at least two layers of gas curtain by injecting an inert gas from the inner wall of the opening, so that the inert gas atmosphere is ensured within a space, so as to maintain the oxygen concentration at a low level thereby to prevent generation of an oxide film. Thus, the oxide film is prevented from generating at a surface of a bonding agent when the bonding agent is molten at the time of a die bonding.

Abstract: A bump forming method comprising a first step of forming a ball (5) at a distal end of a wire (4) which protrudes from a lower end of a capillary (12); a second step of opening a damper (11) which securely holds the wire (4) above the capillary (12) and bringing down the capillary (12) as well as the damper (11), in which an amount of movement of the damper (11) is smaller than that of the capillary (12) by such an amount as to be equivalent to a length of the wire (4) being protruded from the lower end of the capillary (12) in the first step; a third step of forming a bump (21) from the ball (5) by bonding; and a fourth step of separating the wire (4) from the bump (21) by closing the damper (11) and lifting up the damper (11) and the capillary (21) to an initial position of the first step as well as causing a distal end of the wire (4) to protrude from the lower end of the capillary (12) by a predetermined length, whereby a step of drawing out a leading end of the wire (4) from the capillary (12) is elimina

Abstract: An automated method of applying flux to substrate on which a semiconductor chip is to be assembled in a flip chip configuration by applying a controlled amount of flux to the substrate by a brush that applies the flux to the substrate in a programmed pattern of strokes thereby overcoming the surface tension of the flux/substrate surface. The programmed pattern of brush strokes is determined empirically for the specific combination of substrate and chip that is being assembled and is thus repeatable and operator independent. The empirically determined program also determines the amount of flux that will be applied to the substrate for the specific combination of substrate and chip being assembled. The empirically determined program is applied to a mechanical stage that moves the brush and to a flux reservoir by a CPU.

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: A vehicle assembly tool includes a base and a frame pivotably coupled to the base. The frame is configured for holding a plurality of vehicle parts to be welded together. A motor is coupled to the frame via a gear system to move the frame relative to the base. Per the present disclosure, the base can be juxtaposed with a plurality of robotic welders, each having an end effector with six degrees of freedom, and the frame then moved relative to the base to essentially provide a seventh degree of freedom for welding the parts together. Also, the frame can be programmed to return, after welding, to one of several user-defined load positions, each of which load positions can be tailored to a respective individual for facilitating ergonomic loading of parts into the frame by the particular individual.

Abstract: A method of forming a ball weld during the fabrication of a semiconductor device wherein a pad (3) and a gold ball (9) to be bonded to the pad is provided over the pad. Ultrasonic energy from an ultrasonic energy source (11) is applied to the ball to soften the ball while concurrently applying a compressive force to the ball to force the ball against the pad. Reflections of the ultrasonic energy are monitored to provides an indication of completion of the bond of the ball to the pad from the application of energy and compressive force to the ball. The application of energy to the ball is terminated responsive to detecting a parameter which provides an indication of completion of the bond. A preferred embodiment of the step of detecting includes providing a piezoelectric device (13) providing a current output responsive to the reflections of said ultrasonic energy and providing a monitor (21) to detect from the current output the indication of completion of the bond.

Abstract: In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.

Abstract: A continuous hot rolling method including the steps of: cutting the tail portion of a preceding material in a steel product and the front portion of a succeeding material in the steel product to form butt faces; previously determining the thickness of scale created on the butt faces to determine the proportion of the weight of the scale; calculating the amount of oxygen dissolved in a weld molten zone, determining a deoxidation capacity of a deoxidizer for deoxidizing the above amount of oxygen; allowing the butt faces to abut against each other to form a butt area; applying a laser beam to the butt area to form a weld molten zone; incorporating the deoxidizer having the above deoxidation capacity into the weld molten zone; and hot rolling the molten joined steel product.

Abstract: A method and apparatus for making small ball size ratio air balls for use with fine pitch bonding tools includes programming an automatic wire bonder to make a predetermined diameter ball on a fine wire. The predetermined ball size, the diameter of the wire to be used is entered as input data in the wire bonder which makes a calculation of the time required to melt the volume of a fine wire tail necessary to create a spherical ball of predetermined size. The free end of the wire tail to be melted is positioned above an aperture in an EFO electrode wand. A predetermined current is applied across the gap between the aperture in the EFO wand to generate a ball on the end of the wire tail. If the ball size deviates from the preselected ball size, the ball may be increased or decreased by an incremental percentage to effect even greater ball size accuracy. Further, the spring force in the wire loop may be adjusted and/or controlled while maintaining the preselected ball size.

Abstract: A wire feed unit system including a base having a lower support surface positionable upon a recipient surface and an upper support surface. A housing is located on the upper support surface with a door mounted on one side face thereof supported by a hinge to allow access to an interior chamber therein. A plurality of wire feed wheels in rotatable driving contact with each other and an associated motor for effecting the rotation of one of the wheels with the filler wire therebetween to thereby feed the filler wire from the pulley to exterior of the housing. A whip hold down tube extends through the housing at the downstream end thereof with an intermediate tubular wire guide between the wheels and the whip hold down. A flexible cylindrical line extends from the whip hold down to the area to be welded with a cylindrical whip body at the end of the line.

Abstract: A method and apparatus for monitoring the presence of a bonding wire in a wire bonding machine. The apparatus generates an AC signal which is coupled to the bonding tool. A sensor senses a current of the AC signal flowing to the bonding tool and a current of the AC signal returned from the bonding tool. The current flows are compared to one another to determine the presence or absence of the bonding wire in the bonding tool.

Abstract: A wire bonding method for bonding a first bonding point and then a second bonding point by bonding wire that passes through a capillary including a reverse operation that moves the capillary in a direction opposite from a second bonding point after the bonding is done to the first bonding point, a damper is closed temporarily during the reverse operation so as to apply tension to the wire, thus forming a strong kink at an uppermost point of the neck height portion of a resulting wire loop between the first and second bonding points.

Abstract: A system of machined and welded pipe with no connectors or scarfed welds and method to provide a continuous section for pipe and pipe-like structures; displaying electron beam welding for constructing continuous pipe.

Abstract: A method for preparing and assembling a planar reinforcement for a concrete element according to a pre-determined design plan, wherein a full-sized plan including the position and type of each element in the reinforcent to be achieved is mapped onto a working surface (30) having two reference directions, a suitable reinforcement element is positioned in each of a plurality of crossing points. The method is characterised in that one or both of the mapping and assembling operations are performed by a tool attached to the carriage of a robot (10), said carriage (10) having at least two degrees of freedom parallel to the reference directions. The method further comprises storing all the design plan data in a storage area of the robot, and using the robot to move the carriage (10) automatically in accordance with said data.

Abstract: A device for internally butt-welding pipes (1), of the type comprising a support and guide frame (2) for an annular welding member rotatable coaxially to the pipes to be welded, and carrying a plurality of welding heads (4), the device comprising at least one sensor (15) connected to a unit for controlling the movement of said member and arranged to sense the presence of said heads at predetermined points. The sensor (15) comprises a first part (5) arranged to emit a signal and a second part (6) arranged to modify said signal, said two parts being provided respectively in seats (7) provided in said support and guide frame (2) and in said annular welding member (3) or vice versa, said two parts being arranged in such a manner as to remain permanently separated from each other.

Abstract: Process and device for the friction welding of workpieces that consist of different materials or possess different material properties, especially different hardnesses and/or melting points. The workpieces are rotated over a limited angle of rotation of less than 1,080.degree., preferably 290.degree. to 430.degree., relative to one another during the friction process. The angle of rotation is controlled via the friction time and the switching off of the rotating drive. The more resistant workpiece is preferably rotated and is leveled off on its face before the friction welding.

Abstract: A method of forming a ridge around the outer circumference of a spigot formed at an end of a pipe. A ring having a certain wall thickness in its radial direction and formed with a peripheral groove on its outer circumference is placed around the outer circumference of the spigot. Then molten metal is poured into the peripheral groove, so that the bottom of the peripheral groove and the surface of the spigot are melted, thus joining the ring and spigot together.

Abstract: The three dimensional probe device of the present invention is mountable on a working end of a fully automated and articulated robotic arm movable through at least five degrees of axial freedom in a global dimensional reference. The three dimensional probe device comprises a base, a carriage, a probe, a Z axis measuring apparatus and a tilt measuring apparatus. The probe tip contacts the work piece surface to be traced with deflections in the workpiece seam or path resulting in movement of the carriage and probe. The probe includes a plate and a ball which is pivotable in a ball socket portion of the carriage. Movement of the carriage in relation to the base provides measurement data for rotational change in the direction of the workpiece path or seam. Tilting of the probe provides measurement data for translational change in the direction of the workpiece path or seam.

Abstract: A pressure head (10) for contacting a contact area of workpiece (230) through relative movement in the vertical Z-direction includes a frame (20), a horn (100) for contacting the workpiece (230) and a gimbal (40) connected to the frame (20). The gimbal (40) supports the horn (100) such that the horn (100) can rotate about horizontal X and Y rotation axes and can translate in the Z-direction relative to the frame (20). A pivot rod (140) includes a bearing surface (144) bearing against horn (100) such that the horn may rotate about the X-axis and Y-axis and for applying downward pressure to the horn. The shape and orientation of the bearing surface (144) corresponding to the shape and orientation of the contact area of horn (100).

Abstract: In wire bonding a semiconductor chip to the lead frame or other substrate, increase of productivity is achieved by letting the capillary which guides the wire between the wiring points (4, 5) move faster along its trajectory in the two travel stages (s1, s2). The capillary's drives in the horizontal (x, y) and vertical (z) directions are programmed by presetting the speed (vH) of the horizontal component of the movement and then calculating the vertical speed (vV) as a dependent variable based on the given trajectory. In determining said horizontal speed (vH) to be preset, the maximum horizontal and/or vertical acceleration values (aH*, aV*) associated with the drive mechanism are taken into account. Further time can be saved by letting the horizontal travel begin during the first travel stage (s1) and, by simultaneous vertical and horizontal travel, producing a steady transition (point k') from the first stage (s1) to the second (s2).

Abstract: A pressure head (10) for contacting a workpiece (230) through relative movement in the vertical Z-direction includes a frame (20), a horn (100) for contacting the workpiece (230) and a gimbal (40) connected to the frame (20). The gimbal (40) supports the horn (100) such that the horn (100) can rotate about orthogonal X and Y rotation axes and can translate in the Z-direction relative to the frame (20). Three adjustment arms (170) movably connected to the frame (20) each apply a force on the horn (100) at points determining a plane for rotating the horn (100) about the X-axis or the Y-axis to a fixed position before contact with the workpiece (230). The adjustment arms (170) also provide electrical connection to electrical devices (136, 138) on the horn (100). A movable contact arm (190) connected to the frame (20) also contacts the horn (100) for providing an electrical connection.

Abstract: A steel mother pipe obtained by a solid phase butt-welding pipe-making process or a welding pipe-making process is reduced by heating the pipe prior to the reduction at a temperature exceeding 100.degree. C. and lower than 800.degree. C. wherein the temperature of the steel pipe being reduced is controlled within a defined range. The temperature difference along the circumferential direction of the mother pipe at the inlet side of a reducer is within a defined range, and the temperature of the steel pipe at interstand positions of the reducer is also controlled. By virtue of this control, the reduction becomes possible at low load while suppressing work hardening without degrading surface properties. The resultant product pipe has a dimensional accuracy maintained at a high level.