Abstract: A pressure gauge or monitor is attached to a soldering iron so that the pressure with which the iron is being applied can be precisely monitored. Such a pressure monitor on a soldering iron can be used to monitor the pressure applied with the soldering iron when forming a solder electrode on an anti-reflective film of a cathode ray tube. This allows such electrodes to be consistently and optimally formed for grounding the anti-reflective film.

Abstract: A positioning device in which an operating member is solid with a mechanical touching member and is displaced together with it by computer controlled displacement devices; both the operating and the touching members are mounted on a common supporting member, thus forming a touching and operating unit on which act the computer controlled displacement devices. The computer is programmed in order to determine by means of the touching member, and to memorize, the positions of a plurality of points on which the operating member should perform its operation, then determining by interpolation the entire work trajectory of the operating member, which may particularly be a welding head; in this case, several touching and operating units form part of a welding apparatus, and particularly of a so-called coupler, intended to automatically perform the inner weldings between the sections of a piping, such as an oil pipeline or the like.

Abstract: Method and apparatus for suction-holding a semiconductor pellet on a positioning stage of a bonding apparatus without causing the pellet to be misaligned after positioning thereof including a suction force control device. The suction force control device comprises a suction-switching electromagnetic valve, a suction force-adjusting electromagnetic valve, a vacuum source, a compressed air source and a throttle valve so that a semiconductor pellet is held on a positioning stage by a suction force that is weak enough that a positioning claw can move the semiconductor pellet for positioning; and upon completion of the positioning, the semiconductor pellet is held to the positioning stage by a suction force that is stronger than the weak suction force used for positioning.

Abstract: With the mounting of semiconductor chips on a substrate having a solder portion a semiconductor chip held by a gripper spring mounted on a bondhead is lowered onto the substrate. In doing so, the gripper is deflected towards the bondhead. Subsequently, the semiconductor chip is raised by a predetermined distance and then released. Optionally, the semiconductor chip is moved up and down before being released. With this method, the semiconductor chip is under mechanical control until the solder has taken up a stable form and the semiconductor chip has achieved its final position.

Abstract: An ultrasonic wire bonder is disclosed having a bonding head for bonding wire to an electrical or electronic component with a bonding tool. A flexible support formed from at least one arcuate arm, supports the bonding tool for flexible movement of the bonding tool in the Z axis. A pair of arms form a wire clamp supported on the flexible support and are articulated by a link connected for moving one of the arms with respect to the other by an electrical drive having a coil. A wire cutter is connected to the bonding head and a pusher pushes the wire cutter toward the bonding tool before wire is to be cut after bonding.

Abstract: A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking method, first, a first position of the bonding tool is detected when the bonding of the wire is completed. Then, a pulling force, which is small enough to prevent breakage of the wire, is applied to the wire. In this state, a second position of the bonding tool is detected. Finally, the first and the second positions of the bonding tool are compared with each other.

Abstract: A second substrate is positioned relative to a first substrate having phase-changeable bumps, such as solder bumps, between them, wherein the second substrate has a first face adjacent the first substrate, a second face remote from the first substrate, and at least one edge wall between the first and second faces. The phase-changeable bumps are liquefied to establish an equilibrium position of the first and second substrates relative to one another. At least a portion of the second face is pushed away from the equilibrium position towards the first substrate, to a new position, without applying external force to the first face other than spring forces of the phase-changeable bumps that are liquefied, and without applying external force to any edge wall. Thus, only spring forces of the phase-changeable bumps that are liquefied oppose the pushing. The phase-changeable bumps that are liquefied then are solidified, to maintain the new position.

Abstract: Force sensing apparatus is provided for sensing deflection of a transducer in an ultrasonic welding machine. The apparatus includes a body member, a transducer holder and a force sensor. The transducer holder is adapted to hold an ultrasonic transducer and the transducer holder is fixed to the body member. The force sensor is located between adjacent surfaces of the body member and the transducer holder to sense a force applied between the surfaces.

Abstract: Force sensing apparatus is provided for sensing deflection of a transducer (8) in an ultrasonic welding machine. The apparatus includes a body member (2), a transducer holder (1) and a force sensor (4). The transducer holder (1) is adapted to hold an ultrasonic transducer (8) and the transducer holder (1) is fixed to the body member (2). The force sensor (4) is located between adjacent surfaces (11, 12) of the body member (2) and the transducer holder (1) to sense a force applied between the surfaces (11, 12).

Abstract: An automatic dross removal apparatus, which can be used with a solder wave apparatus, is provided, that generally includes a reservoir having a cavity for containing liquid solder, dross removal apparatus having a first end extending within the cavity of the reservoir for removing dross on the surface of the liquid solder, and a motor engaged with the dross removal apparatus. In one embodiment of the invention, the dross is automatically removed by a conveyor driven by a motor. In another embodiment of the invention, the dross is automatically removed by a motor driven receptacle. Means for moving the dross from one part of the solder reservoir to another, such as a pump, can be included. Preferably, a computer is used to control the automatic dross removal. The dross can be placed in a dross separation device which can include apparatus for processing the dross to remove any remaining solder.

Abstract: An apparatus for processing printed circuit boards including a system for measuring and controlling solder wave height generally comprises conveyor system for transporting printed circuit board through a number of processing stations. The system for measuring and controlling the wave height of solder includes a sensor which is mounted in close proximity to the interface defined between the surface of the solder wave and the bottom surface of the printed circuit board. The sensor is coupled to a micro-controller and the micro-controller is coupled to a pump motor. The pump motor is coupled to a solder bath which generates the solder wave and is controlled to operate at a predetermined speed to maintain a predetermined solder wave height during the process of wave soldering printed circuit boards. The sensor provides a number voltages to the micro-controller representing the distance between the sensor and the top surface of the solder wave. The voltages are converted into a number of values.

Abstract: A method of evaluating configuration of solder external terminals of a BGA-type tape-based semiconductor device mounted on a board such that the external terminals are joined to lands provided on the mounting board is provided. The method includes the step of obtaining geometric data related to opening of a tape substrate of the semiconductor device, solder balls to be placed at positions corresponding to the openings, and the lands of the mounting board and the step of deribing configuration of the solder external terminal based on the geometric date. The method further includes the step of calculating the volume of voids to be produced in the external terminals, so as to compensate for the geometric data related to the tape substrate.

Abstract: Articles to be brazed are preheated to an increased temperature in a preheating process and the temperature of the articles to be brazed is measured. Conversion data obtained and stored for different combinations of articles to be brazed is referred to on the basis of the measured temperature and a time for which brazing filler metal supply nozzles are kept in a wait state is set on the basis of the conversion data to define the timing for supplying the brazing filler metal wires (S40). A heating burner moves forward and then a timer starts counting the time for which the nozzles are kept in the wait state (S42). When the nozzle wait timer has counted the set time and expired, the brazing filler metal supply nozzles move forward and supply the wires to braze the articles (S43 to 45). In this way, the articles to be brazed, heated by the heating burner, are at an increased temperature suitable for brazing at the time when the brazing filler metal wires are supplied.

Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

Abstract: For facilitating and making more efficient the setting of the operating parameters of a bonding tool that is used to form a wire loop into a desired shape, when an editing handle is dragged, the loop shape of a wire loop line drawing displayed on a display screen is redrawn as a secondary loop line drawing. The values of the operating parameters corresponding to the loop shape of the drawn or redrawn secondary loop line drawing are calculated, and the results are displayed in a parameter list.

Abstract: A method of manufacturing a flip-chip semiconductor device by attaching a semiconductor die to a substrate using solder comprises the steps of applying a no-clean flux to the semiconductor die and the substrate; heating the solder and the flux in a furnace to bond the semiconductor die to the substrate; and underfilling between the semiconductor die and the substrate. While the solder and flux is being heated, a reducing atmosphere in the furnace is being measured to determine the moisture content. When the moisture content exceeds a threshold amount, a signal will be provided. A reflow furnace for practicing the method is also disclosed.

Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Abstract: The present invention provides a system and method for attaching a device to an inside wall of an enclosure. The device is removably attached to a positioner. Where the device includes a metal substance, it may be attached to the positioner by a magnet affixed to the positioner, for example. A first motor-operated moving device moves the enclosure such that the device abuts an inside wall of the enclosure. A second motor-operated moving device, for example a robot, then attaches the device to the inside wall of the enclosure. Where the enclosure and the device are composed of metal, the two may be welded together. In this instance, the first motor-operated moving device may be a non-robotic, motor-operated moving device that provides a ground path for the weld.

Abstract: The present invention is a method for solder joint integrity assessment. The invention comprises collecting data from one or more solder joint strain tests and characterizing the solder joint data integrity using a force-deflection graph. A force-deflection graph characterizes the response force of a solder joint to applied strain as a function of time. One embodiment of the invention uses the slope of the graph to characterize the integrity of the solder joint. Another embodiment uses the area below the graph to characterize the integrity of the solder joint. To generate the force-deflection graph, the invention applies one or more tests to the solder joint. In one embodiment, a shear test is applied to the solder joint. In another embodiment, a cold pull test is applied to the solder joint. In another embodiment, a hot pull test is applied to the solder joint.

Abstract: The invention is an apparatus and method for assessing the solderability of electronic component leads and adjacent mounting surfaces. The apparatus and method enables assessment of solderability of fine pitch surface mount components that may be “leadless” or have such small leads that other methods are unable to make measurements required for assessing solderability. The invention also provides a reliable automated test technology for electronic component solderability. It is based on the use of measurements of the distinctive changes in the IR radiation signal of a wetted soldered connection during the solder reflow process, resulting from rapid changes in emissivity of the materials. This is accomplished through the use of an IR camera connected to a computer, and a substrate heater controlled by the computer to achieve a predetermined temperature profile at the component leads.

Abstract: An induction heating system that can be used to braze metals and that overcomes many of the disadvantages of conventional brazing systems. The induction heating system improves quality and lowers production cost for many brazing requirements. The system is designed to quickly, accurately and cost effectively heat individual parts, and to replace flame brazing procedures and batch vacuum furnaces. Because the system can braze parts in an inert atmosphere or in no atmosphere (e.g., in a vacuum), no flux or acid cleaning bath is necessary and oxidation on the part is eliminated. Further, by including a gas quenching feature, the system prevents the annealing of parts and produces high quality brazed parts that meet desired hardness specifications.

Abstract: An apparatus and a method are disclosed for placing at least two elements on a surface. The apparatus comprises means for supplying a surface, means for transferring the two elements to the surface, means for adjusting the position of the surface in a first direction, and means for adjusting the position of the transferring means in a second direction and about a rotation axis parallel to a third direction, the first, second and third directions being mutually orthogonal. Recognizing means are provided on at least one of the transferring means for recognizing position alignment marks provided on the surface.

Abstract: A system (5) and method are used for predicting and controlling the temperature of a semiconductor wafer (10) during a solder reflow process by controlling the operating profile of a solder reflow furnace (14). The emissivity of the surface of the wafer (10) is measured using an infrared device (11) prior to the solder reflow process. Using the measured emissivity value of the wafer (10), the peak temperature of the wafer (10) is predicted, and the operating profile of the solder reflow furnace (14) is adjusted accordingly to achieve a desired temperature profile of the wafer (10). A process for reflowing solder on a semiconductor wafer calculates a predicted peak temperature of a semiconductor wafer (10) and controls the actual temperature of the wafer (10) during a solder reflow process by controlling the operating profile of a solder reflow furnace (14).

Abstract: A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.

Abstract: Assuming that the processes of joining, rolling, coiling, etc. of a material is evaluated by a preset speed pattern after the extraction from a heating furnace, the required time is predicted and calculated for both of a preceding material and a following material. At the time when the following material can catch up with the preceding material at an aiming position on the line, the following material is extracted from the heating furnace according to the result of the above prediction calculation. Control is carried out so that both of the preceding material and the following material finish the process at a preset speed. Also, the traveling speed of the following material is controlled according to the position and the speed of the tail edge of the preceding material in a section close to the catch-up position so that a distance between the tail edge of the preceding material and the leading edge of the following material be closed.

Abstract: A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

Abstract: In a method of manufacturing multiple kinds of products in an arbitrarily selected order in one manufacturing apparatus, the rate of operation of the welding robots to be disposed in each of assembly lines for each of parts is improved, the cost for equipment investment is reduced, and the time required to introduce a new kind of motor vehicle into the manufacturing apparatus is shortened, whereby the productivity is improved. The manufacturing apparatus is made up of: a plurality of part assembly lines for assembling a plurality of parts; a combining station for tack-welding these parts to thereby assemble a product; and a reinforce-welding line for reinforce-welding the product. The number of welding points for welding each of the parts in the respective assembly lines is made equal to one another for all kinds of vehicles. Those welding points of each of the parts which fall short of a required number of welding points are welded in the reinforce-welding line.

Abstract: A reflow soldering apparatus for soldering a first component mounted on a substrate with a first solder having a first melting point and soldering a second component mounted on the substrate with a second solder having a second melting point higher than the first melting point. The reflow soldering apparatus includes a heat source for substantially uniformly heating the substrate, a capsule for enclosing the second component, and a vacuum pump for decreasing the pressure in the capsule. The melting point of the second solder can be lowered by operating the vacuum pump to decrease the pressure in the capsule by a given amount, so that the first component and the second component can be reflow-soldered at substantially the same temperature.

Abstract: An image pickup camera is mounted on a soldering head for projecting a laser beam in such a manner that its optical axis coincides with that of the laser beam. An image of the object to be soldered, which is taken by the camera, is displayed on a monitor screen, and a projection spot, which is positioned on an optical axis of the laser beam, is displayed on the screen. While the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen, the soldering head and the object to be soldered are moved relative to each other and the projection spot is positioned. Subsequently, the laser beam is projected from the soldering head, thus, performing soldering.

Abstract: The invention relates to an automatic welding machine comprising an X-Y-Z moving mechanism (100) with three linear motion devices each driven by a motor (101, 102, 103) with a self-locking drive. The X-Y-Z moving mechanism (100) has a handle (41) with integrated sensors (a . . . f) which is to be held by an operator. The sensors (a . . . f) are coupled to a control unit (300) and the motors (101, 102, 103) of the X-Y-Z moving mechanism (100) can be moved exclusively in accordance with the output signals of said sensors (a . . . f).

Abstract: A method and an arrangement for measuring the cooling rate and temperature differential between the top and bottom surfaces of a printed circuit board. The method is intended to facilitate control over the temperature differential which is encountered between the top and bottom of the printed circuit board so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.

Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined, with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.

Abstract: The invention relates to a control device (4) for a welding apparatus (1) or a welding facility, comprising a welding torch (10) connected to the welding apparatus (1) via connecting lines, wherein at least one input device (22) and/or a display device (23) are arranged on the welding torch (10). The control device (4) is connected to a serial data bus, in particular a field bus, to which the welding torch (10) and/or additional components of the welding apparatus (1) and/or the welding facility are attached.

Abstract: A quality control method for ultrasonic wire bonding is provided wherein the deformation of the wire to be bonded to a contact surface is substantially constantly monitored. The method includes generating an ultrasonic output table. In the table, the current status of the bonding process is represented as a function of the gradient of deformation of the wire, the impedance of the transducer-bond wedge unit, as well as the currently reached deformation of the wire. The desired gradient of deformation of the wire, a function of the particular status of the process, is specified as the desired value. A correcting variable for the ultrasonic generator is calculated by the addition of correction values formed in the controller to the respective current table values.

Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

Abstract: So as to confirm bonding precision for assuring accurate bonding, a precision confirmation substrate composed of a transparent sheet member and a precision confirmation chip composed of a transparent sheet member are used; and a precision confirmation substrate positioning component for positioning and fixing the precision confirmation substrate is provided on a bonding station, the precision confirmation chip is held by suction to a tool and disposed above the precision confirmation substrate, images of the precision confirmation substrate and precision confirmation chip are detected by an optical probe, the precision confirmation substrate and precision confirmation chip are moved and positioned relative to each other, the precision confirmation chip is then placed on the precision confirmation substrate, and the superimposed precision confirmation substrate and precision confirmation chip are again detected by the optical probe.

Abstract: A method and an arrangement for measuring the cooling rate and thermal gradient between the top and bottom surfaces of a printed circuit board. Moreover, it is intended to facilitate control over the temperature gradient which is encountered between the top and bottom of the PCB so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.

Abstract: An apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions according to the present invention comprises a linear guide member for guiding said bonding head in the X and Y axial directions, a XY moving means for providing a moving force in the horizontal (X and Y axial) directions to said linear guide member by causing an induced electromotive force, a Z moving means for providing a moving force in the vertical (Z axial) direction to a block of said bonding head by causing an induced electromotive force, a hinge means for converting said moving force of said Z moving means into a rotating force, and functioning as a rotation center so that the block is rotated in the direction to a wire clamp motion. Thus, the present invention is not necessary additional device, the assembly is simple and the volumn of entire apparatus is reduced. In this case, since weight to be moved is reduced due to the reduce of volumn, the position control of the bonding head is perfored accurately.

Abstract: A plurality of materials are rolled in an upstream stand. While transfer speed of a succeeding material and the front end position thereof are detected, the transfer speed and the rear end position of a preceding material are detected by a measuring roll. The transfer speed of the succeeding material is controlled by adjusting at least the drive speed of the pinch rolls so as the front end of the succeeding material to contact with the rear end of the preceding material at a specified position in a travelling welder. the rear end of the preceding material is joined with the front end of the succeeding material by flash-butt welding using the travelling welder to form a continuous material while letting the travelling welder move at a speed synchronous with the transfer speed of the continuous material. The welded portion on the continuous material is ground and/or cut to remove burr therefrom.

Abstract: A wire bonding method includes aligning the face of a capillary along a first direction to make a first wire bond at a first bond point. The capillary face is realigned to a second direction to make a second wire bond at a second bond point. The realignment may be achieved by a system including an wire bonding capillary having an indicator located thereon. A detector detects a signal from the indicator. The signal corresponds to a rotational alignment of the capillary and, therefore, to a direction of alignment of the capillary face. A first signal indicates a first alignment of the capillary face and a second signal indicates a second alignment of the capillary face. The signals may each have a relative signal strength which indicates rotational an offset of the capillary face from a given direction.

Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

Abstract: A method of monitoring the alignment of pipes to be welded end to end involves supporting a reference bar extending generally parallel to, and external of, the pipes so as to span a weld position of which the ends of two pipes are to be welded, performing measurements of perpendicular distance between the bar and each pipe at two predetermined distances from the end of each pipe, determining the thickness of the walls of the pipes, determining the slope of the exterior of each pipe with respect to the reference bar, calculating from the slopes the difference between the distances from the bar to the outer surface of each of the two pipes to the weld position, so as to provide a measure of the misalignment of the outer surface of the pipes at the weld position, differencing the wall thicknesses of the pipes to provide a wall thickness difference, and subtracting the wall thickness difference from the misalignment of the external walls of the pipe to determine the misalignment of the inner surfaces of the pipes

Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Abstract: A first embodiment includes a control system which operates a spray gun to apply an even coating of flux to a circuit board or a plurality of different length circuit boards irrespective of the speed that the circuit board(s) move through a coating chamber. In a second embodiment, the control system pulses the spray gun on and off with a pulsing pattern that coats a plurality of zones of a circuit board with spray patterns of different length and thickness.

Abstract: A method and apparatus for wire bonding that allows easy checking and correction of bonding point coordinates in which upon the registration of the coordinates of fixed points used for alignment in a fixed point standard pattern storage memory and the subsequent registration of the coordinates of bonding points in a bonding point coordinate memory, the coordinates of bonding points and the images of pads or leads obtained by a camera at the time of the registration of the coordinates are both registered in an image data storage memory, so that the registered images are displayed on a monitor in cases where bonding point coordinates are checked or corrected at a later time.

Abstract: A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking method, first, a first position of the bonding tool is detected when the bonding of the wire is completed. Then, a pulling force, which is small enough to prevent breakage of the wire, is applied to the wire. In this state, a second position of the bonding tool is detected. Finally, the first and the second positions of the bonding tool are compared with each other.

Abstract: The invention relates to a method for the temperature regulation of components, for example semiconductor circuits, printed circuit boards and the like, in which the components are conveyed on carriers through an inlet slot into a temperature-regulating housing provided with temperature-regulating members and are conveyed out through an outlet slot opposite the inlet slot. The carriers are accommodated by a magazine in the housing, which magazine is provided with adjacently arranged holders and, after the first holder has been loaded, is displaced progressively in one direction from a starting position into successive accommodating positions in which the individual holders of the magazine are loaded one after the other.

Abstract: A method and apparatus for selectively heating a structure capable of absorbing heat radiations in the 0.5 to 2 micron range relative to an adjacent structure wherein a first structure capable of absorbing heat radiations in the 0.5 to 2 micron range is disposed adjacent a second structure much less capable of absorbing heat radiations in the 0.5 to 2 micron range. An unfocused heat source which provides a major portion of its heat energy in the range of from about 0.5&mgr; to about 2&mgr; relative to heat energy above 2&mgr; and below 0.5 micron directs heat concurrently to the first and second structures to heat the first structure to a temperature sufficiently high and much higher then the second structure to permit a predetermined function to be performed in conjunction with the first structure while maintaining the second structure below a predetermined temperature. The function is then performed. The heat source preferably comprises an unfocused tungsten halogen lamp.

Abstract: A system for manufacturing an aluminum alloy roof for a railway car includes a welding station, a welding unit moveably coupled to the welding station, the welding unit for applying a weld, a roof retainer for selectively holding roof components thereto and for removably coupling to a portion of the welding station, and a rotator unit coupled to the roof retainer for selectively rotating the roof retainer to allow the welding unit to weld the roof components with an orientation substantially perpendicular with respect to gravity. A method of manufacturing a railcar roof includes placing roof carlines and roof sheets on a roof retainer, aligning and clamping the roof carlines and roof sheets to the roof retainer, rotating the roof retainer with respect to a welding to unit, and welding desired weld locations between the roof sheets and roof carlines during rotation of the roof retainer with a desired orientation.

Abstract: A method of using a robot to repeatedly manipulate a brazing nozzle is provided. In a preferred embodiment, the method includes using a pointer to teach the robot to manipulate the brazing nozzle at a preselected angle with respect to, and length away from, an instant surface along a multi-dimensional seam line on an automotive sheet metal body. The pointer includes a base portion for connection with an end of a robot arm. The pointer additionally has a main body having a length inclusive of the base portion approximating the length of the brazing nozzle and the preselected work distance of the brazing nozzle away from the work piece. A contact portion of the pointer is continuous with the main body and is provided for contacting the work piece. The contact portion has two small parallel-spaced surface flats. The surface flats of the contact portion are generally aligned in a common plane at a preselected angle with respect to the robot arm.