Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.

Abstract: A bonding method involving detection of non-bonding of a bonding wire to a first bonding point, the method including an electrical non-bonding detection step and an optical non-bonding detection step, wherein data on whether the respective first bonding points are predetermined bonding points where an electrical non-bonding detection is not applicable are acquired from a memory unit; and when it is determined that a first bonding point is the predetermined bonding point, a non-bonding verification on the first bonding point is executed in the optical non-bonding detection step, and when the first bonding point is not the predetermined bonding point, then non-bonding detection on the first bonding point is executed in the electrical non-bonding detection step.

Abstract: A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value.

Abstract: A soldering iron control module applied to a soldering iron and a soldering iron stand is provided. The soldering iron stand accommodates the soldering iron which has a soldering iron bit. The soldering iron control module includes a sensing unit and a soldering iron control system. The sensing unit provides a sensing signal indicating whether the soldering iron is accommodated in the soldering iron stand. The soldering iron control system includes a tin supply unit and a control unit. The control unit determines whether the soldering iron has been accommodated in the soldering iron stand for a first time period according to the sensing signal. When the control unit determines that the soldering iron has been accommodated in the soldering iron stand for the first time period, the tin supply unit provides the tin to the soldering iron bit and the power of the soldering iron is turned off.

Abstract: A new control variable is introduced, that when combined with previous dependent control criteria on other variables results in a control program that can create a superior weld while minimizing wear on the FSW tool, wherein the tool repeatedly experiences the same thermal and mechanical loading within specified control windows during every repeated weld sequence because flow stresses and tool loads are driven by temperature, and dependent control loops account for differences in material and heat that is transferred at different rates in varying locations throughout a friction stir weld.

Abstract: Friction stirred welding equipment, developed according to requirements of high reliability, robustness, precision and low cost, weld lap and butt joints in complex surfaces with fixed pin tool under controlled downforce. Exemplary equipment comprises a control force orbital spindle, wherein a coaxial sensor measures the downforce and simultaneously the axial electrical actuator corrects axial tool position along the welding, by a direct axial force system control, in order to maintain controlled downforce according to previously set parameters. The equipment sets up, monitors and controls the spindle rotation speed, welding speed, acceleration speed and downforce and can record in a database the downforce and tool welding position during the welding.

Abstract: A wire bonding method capable of further improving accuracy in wire bonding and realizing faster wire bonding including: transferring a semiconductor chip to a bonding center; capturing an image of a bonding point on the semiconductor chip; recognizing a position of the bonding point; performing wire bonding to the bonding point that has been corrected; capturing a post-bonding image of the semiconductor chip; transferring a next semiconductor chip to the bonding center; capturing an image of a bonding point on the next semiconductor chip; recognizing a position of the bonding point of the next semiconductor chip; and then recognizing an amount of displacement in the post-bonding image of the semiconductor chip during wire bonding to the bonding point that is of the next semiconductor chip and has been corrected.

Abstract: A wire bonding device conducts: detecting Z-axis moving speed of the capillary in a predetermined bonding position on a coupling terminal and controlling the Z-axis movement of the capillary by a moving mechanism if the Z-axis moving speed of the capillary is equal to or lower than a predetermined threshold; calculating a displacement in the Z-axis position after the Z-axis moving speed of the capillary reaches equal to or lower than the threshold on the basis of time-dependent change of the Z-axis position of the capillary; detecting a non-stick of the wire on the basis of a conducting condition between the wire and the coupling terminal, and judging whether a difference between the reference displacement and the displacement when a non-stick of the wire is detected by a non-stick detecting unit on the basis of the conducting condition is within a predetermined range or not; and correcting any one of the threshold and the oscillation output of the ultrasonic wave if a correction/judging unit judges with the

Abstract: A procedure for squeezing off and sealing a tube, in which the tube is positioned between a sonotrode and an associated anvil, counter electrode, of an ultrasonic device, and the sonotrode is activated and displaced relative to the counter electrode for squeezing off and sealing the tube. In order to enable automatic squeezing off and sealing of a tube without individually entering the data of the tube into an ultrasonic welding device in advance, the invention proposes positioning the tube and fixing it between the sonotrode and the counter electrode, retrieving stored welding parameters on the basis of the characteristic variable and activating the sonotrode and moving the sonotrode and counter electrode in relation towards each other for consolidating and sealing the tube.

Abstract: A robotic welding system is provided that includes multiple welding cells equidistantly spaced in a circular arrangement, multiple perimeter light curtains to provide safety protection around the welding cells, a turntable centrally located in the circular arrangement, and multiple welding robots attached to the turntable. The welding system further includes a first welding process and a second welding process whereby both the first welding process and the second welding process each include a primary welding operation and a secondary welding operation whereby the turntable rotates between the welding cells to perform the primary and secondary welding operations.

Abstract: In the friction stir joining apparatus of the present invention, a rotation control unit variably controls a rotational speed of a rotor; and a straight movement control unit controls a straight movement of the rotor so as to control a pressure applied by the rotor to the object. The tip portion of the rotating rotor is pressed against a workpiece, thus spot joining is executed. The apparatus can execute frictional stirring joining without practical trouble under simple control.

Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

Abstract: The invention relates to a method for measuring and/or regulating the oscillation amplitude of an ultrasound oscillator of an ultrasound device. In order to be able to measure or regulate the oscillation amplitude of the ultrasound oscillator in a simple manner, it is proposed that a sensor capturing the oscillation amplitude be associated with at least one component element of the ultrasound oscillator.

Abstract: Along with miniaturization of a solder connection portion in a bump repair or a local reflow, a void generated at the time of soldering remains in a solder to remarkably reduce connection strength, and there occurs a non-connection phenomenon in which the solder connection portion and a solder paste are melted, but are not fused with each other. During melting of a solder, a target component is clamped, ultrasonic oscillation is directly applied only to the target component. Further, start of solidification of the solder connection portion is detected by change of an electric impedance of a transducer while applying the ultrasonic oscillation, and the clamp is released before a substrate is warped.

Abstract: The electronic component mounting line includes computing unit for calculating a print position of solder paste printed on board-side electrodes, electronic component placement device for placing an electronic component onto the board-side electrodes by referencing the print position of the solder paste, placement position control device for controlling the placement position of the electronic component by referencing the print position of the solder paste, bonding device for melting the solder paste to bond the electronic component and the board-side electrodes to each other, and mounting-position control device for controlling the mounting position of the electronic component by referencing the board-side electrode position. In this configuration, position control responsive to a displacement of the electronic component by the self alignment effect exerted by the molten solder paste is fulfilled.

Abstract: The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.

Abstract: A method of determining a trajectory of an arc motion of a wire used in the formation of a wire loop is provided. The arc motion is between a first point and a second point of the trajectory. The method includes: (1) defining a pivot point with respect to the first point and the second point; (2) determining a plurality of data points for generating the trajectory, each of the data points including a radius value and an angle value as a function of time, each of the angle values being between (a) a first angle defined by the pivot point and the first point, and (b) a second angle defined by the pivot point and the second point; and (3) converting the plurality of data points into trajectory data that may be used by a wire bonding machine.

Abstract: The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.

Abstract: A chip mounting apparatus is provided with a drive control means. The drive control means is provided with a tool holder whereupon a tool for applying pressure to a chip is mounted, a holder supporting means for supporting the tool holder to be vertically moved, a drive means for vertically moving the holder supporting means, and a position detecting means for detecting a relative position of the tool holder to the holder supporting means. The drive control means controls the height and the pressurizing force of the tool, based on the position of the tool holder when the tool and the chip are one over another and brought into contact with a substrate. A chip mounting method is also provided. Short-circuit failures between adjacent solder bumps can be prevented and chips can be mounted with high yield and reliability.

Abstract: Control systems, methods, and algorithms are provided for controlling the process parameters during FSW in order to repeatedly produce high quality welds for high temperature alloys such as titanium alloys and superalloys. In accordance with exemplary embodiments of the present invention, a desired range of forge load, pinch load, and/or travel load can be reliably maintained in a FSW system by adjusting the rotational speed thereof. In other embodiments, a desired temperature range of the tool or weld can be maintained by adjusting a plunge depth of pin tool for conventional FSW or distances between upper and lower shoulders for self-reacting FSW processes. Other embodiments of the present invention provide methods and/or apparatus suitable for rotational control and/or plunge depth control for FSW of titanium alloys and/or other high temperature alloys such as super alloys.

Abstract: The disclosure relates to the automatic selection of a set of candidate weld guns and candidate orientations for the weld guns from a library of existing weld guns. Minimum values for weld points and test orientations are calculated. The calculated minimum values are added to the library. As each point is added to the library, the set of weld guns that are candidates for the weld point at the tested orientation may be efficiently retrieved, and a matrix of candidate weld guns and orientations is produced.

Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

Abstract: A method is provided for a soldering process. The method can include receiving a liquid phase heat transfer medium at a preheating container. The heat transfer medium can be received from an external supply. The method can also include heating the heat transfer medium to or above a predefined temperature that maintains the liquid phase and directing the heated heat transfer medium from the preheating container to an evaporation container. In the evaporation container, the heat transfer medium can be vaporized to convert the heat transfer medium from the liquid phase to a gas phase. Further, the method can include directing the gas phase heat transfer medium from the evaporation container to a solder chamber. The soldering process occurs in the solder chamber.

Abstract: An ultrasonic welding method includes the acts of pressing an ultrasonic welding stack mounted for linear movement against a first workpiece using an electrical servo motor, applying a predetermined initial load to the first workpiece, and initiating a weld, the initiating of the weld comprising outputting energy from the ultrasonic welding stack to the first workpiece.

Abstract: A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, a temperature profile of the object heated under a modified heating condition may be simulated in a short period of time without actually heating and measuring the temperature of the object at a high accuracy level. By using such a simulation, an appropriate heating condition for heating an object in accordance with a desired heating condition may easily be determined.

Abstract: The invention refers to a procedure for consolidating and sealing a tube, whereby the tube is positioned between a sonotrode and an associated anvil of an ultrasonic welding device, the sonotrode being activated and displaced relative to the counter electrode for consolidating and sealing the tube. In order to enable automatic consolidating and sealing of a tube without individually entering the data of the tube into an ultrasonic welding device in advance, the following steps are proposed: positioning the tube and fixing it between the sonotrode and counter electrode, determining a characteristic variable of the tube with the tube being fixed between the sonotrode and counter electrode, retrieving stored welding parameters on the basis of the characteristic variable and activating the sonotrode and moving the sonotrode and counter electrode in relation towards each other for consolidating and sealing the tube.

Abstract: A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided, wherein at least one of the pre-soldering bumps has a defect. Then, a micro-electroplating process or a micro-electrolyzing process is performed by a micro-electrode nearby the defective pre-soldering bump, so as to repair the defective pre-soldering bump. Therefore, the present invention is able to enhance the process yield and reduce the production cost.

Abstract: An apparatus for manufacturing a semiconductor device is provided. The apparatus has a bonding head, a stage, and a system for appropriately setting the amount of a descending movement of the bonding head. The bonding head incorporates a heater. A camera is capable of capturing an image of a gap between the bonding head and the stage under the condition that the bonding head holds a first bonding object and the stage has a second bonding object mounted thereon and before the first and second bonding objects come in contact with each other. A controller calculates the amount of the descending movement of the bonding head based on the image captured by the camera, and causes the bonding head to descend based on the calculated amount of the descending movement.

Abstract: A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

Abstract: An annular facing is machined in an inside surface of the spherical wall around the periphery of a zone where the wall has a bore for securing the tube passing therethrough. A first welding material is deposited in the facing, and the bore is made by drilling through a portion of the spherical wall that is surrounded by the facing. The tube is engaged tightly in the bore, and a second welding material is deposited in the facing at the periphery of the tube in order to weld the tube to the first welding material. At least one of the operations of depositing the first and second welding materials in the facing is performed automatically by causing a welding torch to turn around the axis of the bore while moving the torch in a direction that is parallel to the axis of the bore and while causing it to pivot about an axis that is orthogonal to the axis of the bore while rotation is taking place.

Abstract: In this soldering method, a laser is directed onto an end face of the stack in such a manner that the laser heats the stack. At least one parameter of the laser is adjusted to a value that is the image by means of a mathematical model of at least one thermal characteristic of the stack. The parameter of the laser is a parameter selected from an irradiation duration, a surface area of the end face of the stack that is irradiated by the laser, and an irradiating power of the laser.

Abstract: The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.

Abstract: An apparatus and method for non-destructive solder interconnect integrity monitoring that can detect existing fracture damage, identify new or incipient fractures, and be implemented across multiple component configurations. Said components can be implemented to detect, on a continuous basis, solder interconnect fractures as they occur during actual end-use, throughout the lifecycle of monitored components, rather than relying on a one-time electrical check prior to shipment.

Abstract: The present invention relates to a weight balancer (100) and a pipe joining method that is capable of reducing a load of pipes when arranging and welding the pipes in ships, plants, piping work sites and the like.

Abstract: Systems and methods for automatically attaching preforms to substrates. An example system includes a nest, a first component that places a substrate into the nest, a second component that places a preform on the substrate in the nest, a tacking device that tacks the preform to the substrate, a plurality of sensors that sense operational states of the components and the tacking device, and a controller that automatically controls operations of the components and the tacking device based on the sensed operational states.

Abstract: An invention providing improvement in integrity testing of wire bonds between an IC die and a BGA substrate. The invention includes a BGA integrated circuit package comprising: 1) a BGA substrate having conducting bond fingers and a grounded feature on a first side thereof; 2) an IC die electrically connected to the conducting bond fingers with wire bonds; the BGA substrate configured to be formed into a singulated unit with the IC die; wherein the BGA substrate does not have direct electrical connection on the first side thereof between the bond fingers and the grounded feature; 4) the BGA substrate including an indirect electrical connection pathway from each wire bond to the grounded feature that enables electrical integrity testing for the wire bonds; the indirect electrical connection pathway configured so that at least a portion of each indirect electrical connection pathway is not present on the singulated unit.

Abstract: Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is determined. This permits bonding to be finished, corresponding to each wire bonding section at all times, in a shortest time without need of application of unnecessary ultrasonic vibration and pressing force after completion of welding in spite of dispersion of the welding characteristic of the individual bonding pads.

Abstract: To hard-solder parts to be joined along a common joint, the parts are heated by a heat source e.g. a laser beam (3). Melted solder (7) that is stored in a container (6) is then introduced into the joint. Joints can be filled with solder in this manner at higher speed and the solidified solder surface is practically devoid of pores, thus permitting the priming or painting of said parts without the need for subsequent treatment.

Abstract: The invention includes a method of joining two components. The method includes providing at least two components to be joined, a reactive multilayer foil, and a compliant element, placing the reactive multilayer foil between the at least two components, applying pressure on the two components in contact with the reactive multilayer foil via a compliant element, and initiating a chemical transformation of the reactive multilayer foil so as to physically join the at least two components. The invention also includes two components joined using the aforementioned method.

Abstract: A method for monitoring the quality of a machining operation, such as a friction stir welding operation, in which a tool is rotatably driven by a motor during the machining operation. The energy consumption of the motor is determined from the initiation and to the completion of the machining operation. That energy consumption is then compared against a predetermined energy threshold. In the event that the energy consumed during the machining operation is less than the predetermined threshold, an error signal is generated.

Abstract: A multi-function digital pressure measuring device and welding torch having an outlet nozzle with first and second gas inlets with valves. The pressure measuring device having a body with a first gas chamber and a first inlet and a first outlet where the first inlet is connectable to a first gas supply line and the first outlet is connectable to the first gas inlet of the nozzle to permit gas to pass through. The body further having a second gas chamber with a second inlet and a second outlet where the second inlet is connectable to a second different gas supply line and the second outlet is connectable to the second gas inlet of the nozzle to permit gas to pass through. A display attached to the body and a sensor for measuring pressure associated with the first and second gas chamber.

Abstract: The invention relates to a device for centring and clamping conduits which are preferably made from alloy steel and which are positioned end to end in order to be welded to form a pipeline. The invention comprises: means for centring and clamping two conduits that are to be welded, optional leak-tight patition means which define an inerting chamber at the mating surface, and inert gas distribution means for creating a protective atmosphere at the mating surface. The inventive device also comprises at least means for the real-time measurement of the moisture content of the protective atmosphere and means (3) for the real-time regulation of the moisture content as a function of said measurements, such that the moisture content of the atmosphere is maintained below a pre-determined threshold value.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: A semi-automatic welding work cell, including a welding job sequencer that automatically selects a welding schedule for use by an operator in the semi-automatic welding work cell. The automatic selection may be by way of elapsed time, a detection of welding operations, a detection of the amount of welding wire supplied for the welding operation, or a detection of the amount of energy supplied for the welding operation.

Abstract: The present invention provides an apparatus and improved method of friction stir spot welding that assures a predetermined bottom thickness and a reduction in variation in a series of resultant spot welds. The advantage of the present invention lies in that the plunge distance is controlled from the top plane of the anvil against which the bottom thickness is specified, and systematically adjusted to account for changing system parameters, such as, but not limited to, deflection and thermal expansion of the weld gun. The present invention also provides for improved and controlled weld quality through implementation of a dwell operation or dwell operations, whereby weld heat input is manipulated by causing the weld tool to dwell in a dwell region or at a desired depth or depths within the workpiece(s) for a predetermined time interval to achieve desired mechanical properties of the resultant weld joint.

Abstract: A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark portion. The monitoring device selectively emphasizes the outputs of the image sensor for any of luminance areas of the image taken by the image sensor using a sensor output characteristic table and can provide an image clearly showing both the very bright welding portion and the dark bead portion with a sufficient contrast allowing an observer to reliably recognize the objects in the image.

Abstract: A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position sensor 29 that detects the position of the bonding arm 20 in the vertical direction. This computer 41 includes a memory 60, which stores the detected position of the capillary 5 at the time that secondary bonding is performed on a bump that is formed in a normal manner on the second conductor, and a comparator circuit 61, which outputs a “bump not-adhered” signal in cases where the output value of the height position counter 44 is outside the permissible error range of the detected position that is stored in the memory 60.

Abstract: A wire bonding apparatus comprising: a capillary configured to have inserted therethrough a wire; a damper provided above the capillary and able to clamp hold the wire; and a load sensor configured to measure load incurred on the wire.

Abstract: In accordance with one aspect of the present exemplary embodiment, set forth is a welding system including a plurality of adjustable welding support structures positioned in relationship to each other to permit welding of a workpiece held by a plurality of adjustable welding support structures, each of the support structures having a movable platform. The control system individually controls the position of the movable platform for each of the adjustable welding structures. In another embodiment of the present application, provided is a method for increasing the accuracy at which an adjustable support structure control system positions at least one adjustable support structure. Included in the process is the generation of a model of the adjustable support structure having an initial set of parameters, including structural position parameters and corresponding control element position parameters.

Abstract: Methods and systems for improving a solder paste stenciling process include obtaining data pertaining to solder paste deposits on a printed circuit board, the solder paste deposits deposited by a solder paste stenciling process through multiple identical apertures of a solder paste stencil, statistically analyzing the data, and correlating the data with a plurality of solder paste stenciling process problems to identify at least one solder paste stenciling process problem in the solder paste stenciling process.