Bonding Nonmetals With Metallic Filler Patents (Class 228/121)
  • Patent number: 6279811
    Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: August 28, 2001
    Assignee: McGraw-Edison Company
    Inventors: Michael M. Ramarge, David P. Bailey, Thomas C. Hartman
  • Patent number: 6276592
    Abstract: A process for the production of a device is disclosed which is suitable for holding semiconductor disks (wafers) during diverse, preferably thermal, machining processes and for transporting semiconductor disks between different machining stations and which is formed of a plurality of individually pre-manufactured device parts that are assembled and connected with one another. The invention is further directed to a holding device for semiconductor disks which is manufactured by the production process according to the invention. In a process of the type described above, the device parts are first pre-manufactured separately and independent from one another from single-crystal or polycrystalline silicon and, in so doing, are provided with fitting surfaces which correspond to one another.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: August 21, 2001
    Assignee: Sico Jena GmbH Quarzschmelze
    Inventors: Peter Jochmann, Walter Nadrag, Klaus Sivec, Edith Zimmermann
  • Patent number: 6268069
    Abstract: A process is disclosed for producing a joined article between a ceramic member and another member, which process includes the steps of brazing the ceramic member with another member by using a brazing material composed of 50 to 99 wt % of copper, 0.5 to 20 wt % of aluminum, 0.5 to 5 wt % of at least one kind of active metal selected from the group consisting of titanium, zirconium, hafnium, vanadium and niobium, thereby obtaining a joined body including the ceramic member, another member and a layer of the brazing material, and heating the brazing material layer in an oxidative atmosphere.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: July 31, 2001
    Assignee: NGK Insulators, Ltd.
    Inventors: Tsuneaki Ohashi, Tomoyuki Fujii
  • Patent number: 6223972
    Abstract: A method and apparatus for constructing a metal foil and solder assembled object (10), is described. The apparatus includes a final mold (400) having a recessed final pattern (408). The sides (408A) of the final pattern form an obtuse angle with the floor (408B) of the final pattern. To create the object, material pieces (12), rods (14) and accessory pieces (16) are positioned in the final pattern. Prior to positioning the material pieces in the pattern, the edges (12A) of the material pieces are covered by foil (18). Once the material pieces, rods and accessory pieces are in place in the pattern, the pieces and rods are soldered together using conventional soldering techniques. The material pieces are positioned adjacent the sides of the pattern such that when the edges of the pieces are soldered, the solder (20) comes in contact with the sides of the pattern approximately half the distance up the edge of the material pieces.
    Type: Grant
    Filed: July 21, 1999
    Date of Patent: May 1, 2001
    Inventor: Richard E. Hanley
  • Patent number: 6216941
    Abstract: A method for forming high frequency connections between a fragile chip and a substrate is described, wherein metal is selectively deposited on a surface of a chip and a surface of a substrate, and corresponding patterns of electrically conductive bumps are selectively evaporated on the surface of the chip and the surface of the substrate over the metal layers, to form a pattern of electrically conductive bumps having spongy and dendritic properties, placing the chip in aligned contact with the substrate where each electrically conductive chip bump mates with each corresponding electrically conductive substrate bump, and selectively applying heat and pressure to the chip and substrate causing each chip bump to fuse together with each corresponding substrate bump to form an electromechanical bond.
    Type: Grant
    Filed: January 6, 2000
    Date of Patent: April 17, 2001
    Assignee: TRW Inc.
    Inventors: Karen E. Yokoyama, Gershon Akerling, Moshe Sergant
  • Patent number: 6213380
    Abstract: A method of bonding a diamond compact comprising a polycrystalline mass of diamond and a bonding phase which contains free-silicon to a substrate is provided. The method includes the steps of contacting a surface of the compact with carbon or nitrogen or a mixture thereof under conditions suitable to cause free-silicon in the surface to react with the carbon and/or nitrogen and thereafter bonding that surface to the substrate, preferably by means of a braze. In a preferred form of the invention, the surface which is bonded to the substrate is acid cleaned after contact of that surface with carbon or nitrogen or a mixture thereof.
    Type: Grant
    Filed: January 25, 1999
    Date of Patent: April 10, 2001
    Inventors: John Lloyd Collins, Graeme David Dufferwiel, Christopher John Howard Wort, Charles Gerard Sweeney
  • Patent number: 6199748
    Abstract: A method of semiconductor eutectic alloy metal (SEAM) technology for integration of heterogeneous materials and fabrication of compliant composite substrates takes advantage of eutectic properties of alloys. Sub1 and Sub2 are used to represent the two heterogeneous materials to be bonded or composed into a compliant composite substrate. For the purpose of fabricating compliant composite substrate, the first substrate material (Sub1) combines with the second substrate material (Sub2) to form a composite substrate that controls the stress in the epitaxial layers during cooling. The second substrate material (Sub2) controls the stress in the epitaxial layer grown thereon so that it is compressive during annealing. A joint metal (JM) with a melting point of Tm is chosen to offer variable joint stiffness at different temperatures. JM and Sub1 form a first eutectic alloy at a first eutectic temperature Teu1 while JM and Sub2 form a second eutectic alloy at a second eutectic temperature Teu2.
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: March 13, 2001
    Assignee: Nova Crystals, Inc.
    Inventors: Zuhua Zhu, Tuoh-Bin Ng, Yu-Hwa Lo
  • Patent number: 6196440
    Abstract: A tool (40) for imprinting a pattern in a has a handle (42). A stamp (44), connected to the handle (42), has a pattern (54) formed on a face (52) of the stamp (44). The face (52) of the stamp (44) forms a concave surface.
    Type: Grant
    Filed: May 19, 2000
    Date of Patent: March 6, 2001
    Inventor: Georgia Lee Kennedy
  • Patent number: 6189766
    Abstract: A multi-layer structure including a first layer; a second layer, with a coefficient of thermal expansion different than a coefficient of thermal expansion of the first layer, a bulk modulus different than a bulk modulus of the first layer and a thermal conductivity different than a thermal conductivity of the first layer; a bonding layer, having an isostatic pressure versus temperature curve with one of the first layer and the second layer which is substantially similar to an isostatic pressure versus temperature curve of the first layer and the second layer, such that a substantially stress-free bond is formed between the first layer and the second layer; wherein the first layer, the second layer, and the bonding layer are arranged as a sandwich, with the bonding layer in between the first layer and the second layer.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: February 20, 2001
    Assignee: Northrop Grumman Corporation
    Inventors: Martin L. Baker, William F. Cashion, Fred B. Hagedorn
  • Patent number: 6173886
    Abstract: The present invention relates to an improved method for joining metals or alloys together. Specifically, the present invention relates to a method comprising the laser alloying of a first metal/alloy piece so that it can be joined with a second metal/alloy piece of a nonidentical composition.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: January 16, 2001
    Assignee: The University of Tennessee Research Corportion
    Inventors: Mary Helen McCay, T. Dwayne McCay, Narendra B. Dahotre, John A. Hopkins, Frederick A. Schwartz, John Brice Bible
  • Patent number: 6168069
    Abstract: Surprisingly, silver-copper-palladium brazing alloys, which have hitherto been used only for the brazing of components of the same material, are also very well suited for brazing directly titanium to stainless steel if, the latter component clasps the titanium component tightly, so that the cold joint is under constant compressive stress. In a method for forming the titanium-steel compound the titanium component is provided with a cylindrical end which has a smaller out-side diameter than an adjacent main portion whose external surface is a first surface to be brazed. The cylindrical steel component is a sleeve whose inside diameter is equal to the outside diameter of the main portion and whose internal surface is a second surface to be brazed. A silver-copper-palladium brazing alloy is placed around the end of the titanium component. The steel sleeve is slipped thereover.
    Type: Grant
    Filed: July 6, 1998
    Date of Patent: January 2, 2001
    Assignee: Endress +Hauser Flowtec AG
    Inventor: Rainer Lorenz
  • Patent number: 6162551
    Abstract: A joining alloy of the invention is based on Co, Ni, or their alloy, and contains 1.0 to 2.3% by mass of C and 15.5 to 34.7% by mass of W. Using HIP, the joining alloy in the form of a casting or powders is integrated with a WC--Co or WC--Ni type cemented carbide via diffusion joining. Using HIP, it is also possible to obtain a composite material having an integral structure in which a cemented carbide and the joining alloy, and the joining alloy and steel are joined together via diffusion joining. The joining alloy may additionally contain up to 30% by mass of Fe, up to 3% by mass of Si and up to 3% by mass of Mn as well as up to 10% by mass of at least one selected from Cr, Mo, V, Nb, Ti, Zr, and Ta. It is thus possible to obtain a joining alloy having an improved joining strength without producing a brittle phase therein even upon joined to the WC--Co or WC--Ni type cemented carbide, and its composite material.
    Type: Grant
    Filed: July 16, 1998
    Date of Patent: December 19, 2000
    Assignee: Daido Tokushuko Kabushiki Kaisha
    Inventor: Yasushi Watanabe
  • Patent number: 6138897
    Abstract: Method of aligning a metallic solderable object to a glass plate comprising loading a solderable object onto an end effector of a robotically supported spindle of a spindle assembly, handing a support from the spindle assembly that extends beneath the axis of the spindle and has camming surfaces precisely aligned with the spindle axis, resiliently cradling a backing member on the support by use of a cam member adapted to fit against the support camming surface when the resiliency is overcome, positioning a glass plate on the backing member to overcome the resiliency of the backing member and cause the cam to engage the camming surfaces of the support and automatically obtain normality of the spindle axis with respect to the glass plate.
    Type: Grant
    Filed: August 20, 1998
    Date of Patent: October 31, 2000
    Assignee: Ford Global Technologies, Inc.
    Inventors: Richard Lawrence Allor, Samir Samir, Tyann Sue Chappell, Dawn Roberta White
  • Patent number: 6135342
    Abstract: A tool (40) for imprinting a pattern in a has a handle (42). A stamp (44), connected to the handle (42), has a pattern (54) formed on a face (52) of the stamp (44). The face (52) of the stamp (44) forms a concave surface.
    Type: Grant
    Filed: November 4, 1997
    Date of Patent: October 24, 2000
    Inventor: Georgia Lee Kennedy
  • Patent number: 6127253
    Abstract: An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer. The present invention is also directed to a method of making electrical interconnections to an electronic device by pressing a plurality of composite bumps of a polymeric based material against a substrate having an electrically conductive surface by mechanical means under a sufficient temperature and/or a sufficient pressure.
    Type: Grant
    Filed: August 14, 1998
    Date of Patent: October 3, 2000
    Assignee: International Business Machines Corporation
    Inventors: Judith Marie Roldan, Ravi F. Saraf
  • Patent number: 6050478
    Abstract: The invention relates to a composition and a process for the reactive brazing of ceramic materials containing alumina.This composition comprises at least one precious metal chosen from among Pd, Pt and Au, as well as magnesium, preferably at the most 5 wt. % magnesium. Brazing takes place at a temperature of 1300 to 1600.degree. C., in the absence of hydrogen.
    Type: Grant
    Filed: July 10, 1997
    Date of Patent: April 18, 2000
    Assignee: Commissariat A l'Energie Atomique
    Inventors: Fran.cedilla.ois Saint-Antonin, Gerard Bourgeois
  • Patent number: 6045030
    Abstract: A method of packaging hybrid wafers or die that are interconnected using soft metal bumps, such as indium, in a sealed ceramic package. The present invention passivates the hybrid die that are to be interconnected by way of the bumps, so that the metal in the bumps (indium) does not wet the surface of the hybrid die when the ceramic package is sealed at high temperature. Vias are formed in the passivated surfaces to expose underlying contact areas. Bumps are then formed on the contact areas, and the bumped and passivated hybrid die are electrically interconnected. The ceramic package containing the electrically interconnected hybrid die is processed at a temperature above the melting temperature of the bumps to attach a ceramic cover to the ceramic package. The method is performed at a temperature well in excess of the melting temperature of the bumps (.about.155.degree. Celsius for indium), typically on the order of 325.degree. Celsius.
    Type: Grant
    Filed: March 13, 1997
    Date of Patent: April 4, 2000
    Assignee: Raytheon Company
    Inventors: O. Glenn Ramer, John J. Drab, Venita L. Dyer
  • Patent number: 6042935
    Abstract: Disclosed is a friction element designed for frictional contact with a body and for use, in particular, in brakes or clutches. The friction element has at least one freely accessible surface formed by a carbon-fiber-reinforced porous carbon block, at least some pores of which are filled with silicon and silicon carbide. In order to provide a friction element of this kind, as well as a method of manufacturing the friction element, which gives the advantages associated with C/C--SiC materials and which can be manufactured inexpensively, thus making it suitable, from the cost point of view, for general use particularly in the automobile-construction industry, the friction element is made up of at least one core element and at least one friction block securely bonded to it, the friction block being bonded to the core element on the side remote from its friction surface and the two elements being joined to each other by a high-temperature-resistant bonding layer.
    Type: Grant
    Filed: July 23, 1997
    Date of Patent: March 28, 2000
    Assignee: Deutsche Forschungsanstalt fuer Luft-ung Raumfahrt e.V.
    Inventors: Walter Krenkel, Richard Kochendorfer
  • Patent number: 6040065
    Abstract: A method for producing a metal matrix (32) which binds inclusions (12,15) in a stable structure (31) so that the surface areas of two opposing sides of each inclusion (12,15) are visible, thus enabling translucency. This method comprises the steps of securing inclusions (12,15) to a temporary backing (38) so that there are intervals (14) between the inclusions (12,15), depositing a metal fiber substrate (42) into the intervals (14) between the inclusions (12,15), and then melting a metal infiltrate (46) so that the infiltrate (46) coats the individual fibers and fills the spaces between the fibers. Upon cooling, the amalgam (48) of substrate (42) and infiltrate (46) thus formed constitutes the matrix (32) and border (34) of the structure (31). The inclusions (12,15) may be glass, marble, clay, metal, or other materials; the metal fiber substrate (42) is preferably fine bronze fiber and the infiltrate (46) is preferably conventional solder.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: March 21, 2000
    Inventor: Andrew Eisan
  • Patent number: 6033787
    Abstract: A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: March 7, 2000
    Assignee: Mitsubishi Materials Corporation
    Inventors: Toshiyuki Nagase, Yoshirou Kuromitsu, Kunio Sugamura, Yoshio Kanda, Masafumi Hatsushika, Masato Otsuki
  • Patent number: 6000117
    Abstract: A wear surface for helicopter shoes is constructed by forming a railed enclosure on a curved base plate, placing a mosaic of smooth-surfaced tungsten carbide blocks on the base plate within the enclosure, brazing the blocks to the plate and rails, and grinding the rails to form a smooth, edgeless transition between the wear surface and the plate surface.
    Type: Grant
    Filed: October 1, 1998
    Date of Patent: December 14, 1999
    Inventor: Roy L. Bain
  • Patent number: 5998041
    Abstract: A joined article includes a ceramic member, another member, and a joining layer which is formed between the ceramic member and another member and joins both the members together, wherein the joining layer is composed mainly of nickel, and the joining layer contains beryllium as an activating component.
    Type: Grant
    Filed: March 12, 1997
    Date of Patent: December 7, 1999
    Assignee: NGK Insulators, Ltd.
    Inventors: Takuma Makino, Masayuki Shinkai
  • Patent number: 5975407
    Abstract: A method of joining at least two parts in silicon carbide based material by refractory brazing in which these parts are brought into contact with an intermetallic braze alloy and said parts and braze alloy are heated to a braze temperature equivalent to the melting temperature of the braze alloy in order to form a refractory joint characterized in that the intermetallic braze alloy comprises 1 to 18% by weight of cobalt and from 82 to 99% by weight of silicon, and in that the joint obtained is a thick joint, that is to say with a thickness of generally from 0.1 to 0.5 mm, and a thick refractory joint obtained by this method, wherein bonds of silicon carbide parts with thick joints prepared using the method of the invention allow the production with great precision of structures, apparatus and components with complex shapes having high temperatures of use reaching as high as 1000.degree. C. and even higher.
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: November 2, 1999
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Adrien Gasse, Gisele Coing-Boyat, Gerard Bourgeois
  • Patent number: 5972157
    Abstract: Carbon--carbon composite parts are joined with minimum surface preparation. A reactive-bonding joint interlayer having thickness greater than 1 mil is formed of fine particles of carbide-forming metallic ingredients and carbon. The joint interlayer is sandwiched between the two carbon--carbon parts to be joined and the assembly is heated under a compressive pressure to a temperature sufficient to complete the bonding reaction. No special surface preparation is required for the carbon--carbon parts due to the nature of the reactive-bonding. The mechanical properties of the joint are assured by selecting the metal-carbon ingredients so that thermal expansion mismatch is minimized. Shear strength exhibited by the resulting joints is greater than the interlaminar shear strength of the carbon--carbon composite material.
    Type: Grant
    Filed: August 20, 1996
    Date of Patent: October 26, 1999
    Assignee: AlliedSignal Inc.
    Inventors: Liang An Xue, Dave Narasimhan
  • Patent number: 5967400
    Abstract: The method provides a process for fabricating metal matrix composites. First the process coats the fibers with nickel by electrodeposition or gaseous deposition to form nickel-coated fibers. Over-plating the nickel-coated fibers with aluminum by either electrodeposition in a non-aqueous electrolyte or gaseous deposition forms aluminum-coated-nickel-coated fibers. Sintering this product under compression, perpendicular to the fiber's central axis, forms the final metal matrix composite. The metal matrix composite has a nickel-aluminum matrix, very few voids and extended unbroken lengths of fibers within the nickel-aluminum matrix.
    Type: Grant
    Filed: December 1, 1997
    Date of Patent: October 19, 1999
    Assignee: Inco Limited
    Inventors: James Alexander Evert Bell, Kirt Kenneth Cushnie, Anthony Edward Moline Warner, George Clayton Hansen
  • Patent number: 5932348
    Abstract: A method of making an improved composite containing substantially non-segregating solid reinforcing elements therein is disclosed. New composites and non-segregating solid reinforcing elements for these composites are also disclosed.
    Type: Grant
    Filed: February 25, 1997
    Date of Patent: August 3, 1999
    Inventor: Chou H. Li
  • Patent number: 5904993
    Abstract: A joint body in which aluminum and silicon nitride are strongly joined with each other is provided at a low cost, thereby providing a lightweight part which is excellent in sliding property as a mechanical part of an internal combustion engine of an automobile or the like. The joint body includes a base material which is mainly composed of aluminum, and a member consisting of a silicon nitride sintered body which is substantially directly joined to the base material. A powdery or bulky base material (2) mainly composed of aluminum, and a member (1) consisting of a silicon nitride sintered body are charged in a mold and heated under pressurization, thereby joining the same with each other.
    Type: Grant
    Filed: May 21, 1996
    Date of Patent: May 18, 1999
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hisao Takeuchi, Koichi Sogabe, Takao Nishioka, Takashi Matsuura, Akira Yamakawa
  • Patent number: 5860584
    Abstract: The object of the invention is to provide a bonding method for brazing an amorphous carbon (AC) material to a metal material or a ceramic material, and to provide an electron tube device having an input/output window made of the amorphous carbon material. The surface of the amorphous carbon (AC) material is roughened to form an irregularity. A brazing material is sandwiched between the amorphous carbon material and a metal material or ceramic material. The resultant structure is heated to braze the amorphous carbon material to the metal material or ceramic material. The electron tube device includes a sealed vessel having an opening portion, a peripheral portion of which is made of a metal material or a ceramic material. The electron tube device further includes a window, made of an amorphous carbon material and bonded to the peripheral portion of the opening portion with a brazing material, and having irregularity on a surface around the opening portion.
    Type: Grant
    Filed: June 20, 1997
    Date of Patent: January 19, 1999
    Assignee: Hamamtsu Photonics K.K.
    Inventor: Tutomu Inazuru
  • Patent number: 5851495
    Abstract: The electrically heated catalytic converter of the present invention has a substrate, for a catalyst, which is formed as a laminated assembly of corrugated metal sheets and plain metal sheets. The corrugated metal sheet has an insulating coating made of an alumina Al.sub.2 O.sub.3, and the plain metal sheet has no insulating coating. Local conductive connections are formed between the layers of the metal sheets by soldering the metal sheets using strips of zirconium solder foils interposed between the layers of the metal sheets. The strips of solder foils are arranged in such a manner that the strips of solder foil disposed on both sides of the corrugated metal sheet defines a single electric path in the corrugated metal sheet which connects the solder foils on both sides of the corrugated metal sheet.
    Type: Grant
    Filed: October 1, 1996
    Date of Patent: December 22, 1998
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Kouji Yoshizaki, Shogo Konya
  • Patent number: 5836505
    Abstract: The present invention relates to joining by brazing ceramic elements comprising SiC. The purpose of the invention is to provide a braze alloy which gives a brazed joint resistant to fluorine effluents and having controlled reactivity with SiC. This purpose is achieved using a braze alloy comprising Si and rhodium.
    Type: Grant
    Filed: May 7, 1997
    Date of Patent: November 17, 1998
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Gilles Chaumat, Gisele Coing-Boyat
  • Patent number: 5794838
    Abstract: Novel method of joining ceramics containing aluminum nitride and another member made of a metal or a ceramic is provided having an improved joining strength and a corrosion-resistant property by joining a first member made of a ceramics consisting of an aluminum compound. The second member is made of a ceramics or a metal, forming a metal film directly on a surface to be joined of the first member interposing a metallic joining material which is made of a different material from the metal film. The metallic joining material is between the metal film and the second member, and by heating at least the metallic joining material and the metal film in such an interposed state to form a joining layer made of the metallic joining material and an intermetallic compound between the first and second members, so as to join the two members.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: August 18, 1998
    Assignee: NGK Insulators, Ltd.
    Inventors: Ryusuke Ushikoshi, Hideyoshi Tsuruta, Tomoyuki Fujii
  • Patent number: 5758816
    Abstract: A method is provided to heat a plurality of components to a preselected temperature that creates a tackiness at the surface of a preformed solder component and permits the preformed solder component to adhere to a first metallic surface of a first component. When the preselected temperature is reached, the components are rapidly cooled to prevent diffusion that would result from further heating and melting of the preformed solder component. In a particularly preferred embodiment of the invention, the first component is a lens that has a first metallic surface rigidly attached thereto. A second metallic surface is attached to a ceramic body and a preformed solder component is disposed between the first and second metallic surfaces.
    Type: Grant
    Filed: August 19, 1996
    Date of Patent: June 2, 1998
    Assignee: Honeywell Inc.
    Inventor: Simon M. Rabinovich
  • Patent number: 5683028
    Abstract: A method of bonding a first silicon carbide part to a second silicon carbide part is provided. The first silicon carbide part provides a receiving female joint member and the second silicon carbide part provides an insertion male joint member. The male and female members each have facing sidewalls substantially parallel to a direction in which the male member is inserted into the female member. The male and female joint members are configured to provide an average gap(s) between the facing sidewalls of the joint members which is up to about 0.003 inch (0.76 mm). The female joint member further has reservoir means for containing silicon when the male joint member is fully inserted into the female joint member, the reservoir means being in fluid communication with the gap(s). The reservoir means is filled with solid-state silicon, e.g., in powder form.
    Type: Grant
    Filed: May 3, 1996
    Date of Patent: November 4, 1997
    Assignee: CVD, Incorporated
    Inventors: Jitendra S. Goela, Lee E. Burns
  • Patent number: 5632436
    Abstract: A photomultiplier tube, image intensifier tube, or night vision device includes a cascade of plural microchannel plates which are physically and electrically connected together to provide an electron multiplication through the microchannel plate cascade. At least two adjacent microchannel plates in the cascade are also physically interbonded to one another. The bonding of the adjacent microchannel plates may be accomplished by use of a metallic interbonding layer covering all except a peripheral edge portion of at least one face of one or both of the bonded microchannel plates, which interbonding layer confronts and bonds with the other of the bonded microchannel plates. The interbonding layer may cover only a peripheral annular portion of the one face of the one bonded microchannel plate, or only sub-areas of this peripheral annular portion of this one microchannel plate. During manufacturing of such an image intensifier tube, the microchannel plates are initially fabricated and handled as individuals.
    Type: Grant
    Filed: October 31, 1995
    Date of Patent: May 27, 1997
    Assignee: Litton Systems
    Inventor: Andreas Niewold
  • Patent number: 5632435
    Abstract: Process for the production of a soldered joint. The invention pertains to a soldering process in which thin walled carbon parts are soldered, on a flat side, to silicon carbide parts, for the connection of mechanically and thermally highly stressed parts such as supporting and sliding rings that are utilized in dry gas seals, with the use of a pure silver-titanium solder, having a titanium content of 2-6% by weight, in combination with synthetic graphite and a silicon carbide comprised of silicon, silicon carbide and carbon, whose physical properties are well known, it is possible to produce a durable bond, in a vacuum furnace, by means of a predetermined time/temperature program under suitable conditions, which bond is particularly suitable for the noted supporting and sliding rings utilized in dry gas seals.
    Type: Grant
    Filed: January 26, 1995
    Date of Patent: May 27, 1997
    Assignee: Sulzer-Escher Wyss AG
    Inventors: Joachim Schmied, Karl Allenbach
  • Patent number: 5622305
    Abstract: A method for bonding one body to another, such as a laser device to a submount, uses a metallic layer composed of a Group VB metal, such as niobium, sandwiched between a non-metallic layer and solder layer formed by an approximate Au-Sn eutectic layer. Advantageously the Group VB layer is formed at a submount temperature of less than approximately 201.degree. C., advantageously less than approximately 125.degree. C., and preferably less than approximately 101.degree. C.--advantageously to a thickness in the approximate range 0.05 .mu.m to 0.2 .mu.m, or even thinner if pinholes do not develop. The non-metallic layer is located on one of the bodies, and the other body has a metallic coating advantageously capped with an Au layer.
    Type: Grant
    Filed: May 10, 1995
    Date of Patent: April 22, 1997
    Assignee: Lucent Technologies Inc.
    Inventors: Donald D. Bacon, Cheng-Hsuan Chen, Ho S. Chen, Avishay Katz, King L. Tai
  • Patent number: 5618498
    Abstract: The present invention aims to produce a metallic carrier which enables a catalyst to be activated in a short time. In mutually joining an insulated heat resisting alloy and a heat resisting alloy having an insulating film, particularly composed mainly of alumina, a joining material of a laminate, formed by laminating a strongly reducing metal, which can thermodynamically reduce alumina, and a brazing material to each other, is disposed so that the strongly reducing metal comes into contact with the insulated heat resisting alloy, and the resultant laminate is heated in a non-oxidizing atmosphere to carry out a brazing treatment. This enables only portions in the honeycomb structure, where electrically conductive paths are to be formed, can be joined, and, at the same time, heat resisting alloys having a surface covered with an insulating oxide film can be firmly joined with the resultant joint having an electrical conductivity.
    Type: Grant
    Filed: January 12, 1995
    Date of Patent: April 8, 1997
    Assignees: Nippon Steel Corporation, Toyota Jidosha Kabushiki Kaisha
    Inventors: Shogo Konya, Akira Okamoto, Kouji Yoshizaki
  • Patent number: 5589232
    Abstract: A method for making a wear component that includes providing a base surface, producing a synthetic diamond film by plasma jet CVD having at least a particular equivalent strain, and applying the diamond film to the base surface.
    Type: Grant
    Filed: September 19, 1994
    Date of Patent: December 31, 1996
    Assignee: Norton Company
    Inventor: Matthew Simpson
  • Patent number: 5573731
    Abstract: The electrically heated catalytic converter of the present invention includes a catalyst substrate, which is formed as a scroll-like cylindrical laminated assembly. The assembly is formed by laminating a thin corrugated and plain metal sheets and winding the metal sheets together around a center electrode. The outermost layer of the laminated assembly is connected to an outer electrode. The corrugated metal sheet has an insulating coating made of an alumina, and the plain metal sheet is uninsulated. Local conductive connections form between the thin metal sheets by soldering strips of zirconium solder foils between the layers of the thin metal sheets. Since zirconium has a larger reducing capability than aluminum, the alumina in the insulating coating is reduced by zirconium and precipitates at the local conductive connections. Therefore, the plain and corrugated metal sheet are electrically connected to each other at the local conductive connections.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: November 12, 1996
    Assignees: Toyota Jidosha Kabushiki Kaisha, Nippon Steel Corporation
    Inventors: Kouji Yoshizaki, Masahiko Ogai, Takuzou Kako, Yuuji Nakajima, Kenji Fujino, Kazunori Itoh, Shohgo Konya, Keiji Sato
  • Patent number: 5547120
    Abstract: A method of making a gastight connection between a conductor and an insulation in form of a tube made of a temperature-resistant material, includes the steps of inserting a conductor-forming wire of metal in the tube and heating the wire within the tube to a temperature above its melting point, whereby the tube essentially maintains its configuration.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: August 20, 1996
    Assignee: Electrovac, Fabrikation elektrotechnischer Spezialartikel Gesellschaft m.b.H.
    Inventor: Theodore Schmitt
  • Patent number: 5547121
    Abstract: The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vanadium containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15.degree..
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: August 20, 1996
    Assignee: Saint-Gobain/Norton Industrial Ceramics Corp.
    Inventors: Rakesh R. Kapoor, Bela G. Nagy, Louis K. Bigelow
  • Patent number: 5537001
    Abstract: A flat vacuum without pumping stem, for the manufacturing of display screens, comprises two plates made of glass, a sealing peripheral joint interrupted so as to provide an aperture for evacuation of the gases during manufacturing, a thin-film metallic pad disposed on each inner surface of the glass plates at the level of the aperture, and a sealing element made of metal having a low melting point disposed so as to contact the metallic pads.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: July 16, 1996
    Assignee: Pixtech S.A.
    Inventor: Jean-Frederic Clerc
  • Patent number: 5505364
    Abstract: Disclosed are an ink jet printhead and method of manufacturing the same.
    Type: Grant
    Filed: December 30, 1993
    Date of Patent: April 9, 1996
    Assignee: Compaq Computer Corporation
    Inventor: Boris Plesinger
  • Patent number: 5484096
    Abstract: A method of brazing a first body to a second body having particular application to the bonding of a composite abrasive compact to a substrate. The method involves the steps of providing a brazing shim comprising at least two zones having differing melting temperatures, placing the shim on a surface of the first body, placing a surface of the second body on the shim to form an unbonded assembly, applying heat to the assembly to cause the shim to melt and allowing the assembly to cool to a temperature at which all the zones of the shim become solid.
    Type: Grant
    Filed: June 24, 1994
    Date of Patent: January 16, 1996
    Inventor: Klaus Tank
  • Patent number: 5465897
    Abstract: An ultrasonic transducer is formed as a diffusion bonded assembly of piezoelectric crystal, backing material, and, optionally, a ceramic wear surface. The mating surfaces of each component are silver films that are diffusion bonded together under the application of pressure and heat. Each mating surface may also be coated with a reactive metal, such as hafnium, to increase the adhesion of the silver films to the component surfaces. Only thin silver films are deposited, e.g., a thickness of about 0.00635 mm, to form a substantially non-compliant bond between surfaces. The resulting transducer assembly is substantially free of self-resonances over normal operating ranges for taking resonant ultrasound measurements.
    Type: Grant
    Filed: March 29, 1994
    Date of Patent: November 14, 1995
    Assignee: The Regents of the University of California, Office of Technology Transfer
    Inventors: Raymond D. Dixon, Lawrence H. Roe, Albert Migliori
  • Patent number: 5452843
    Abstract: The present system is directed to both a method and apparatus for manufacture of teeth for use in drill bits. The desired tooth is formed by a hard carbide, a protective disc placed on the end of the support, the joinder being accomplished by a braze metal layer. The process contemplates positioning the disc in a matching receptacle within the head of a molding apparatus wherein the head and cavity of the head are exposed to the terminus of several coolant flow lines through the head so that the disc is brought into contact with flowing coolant. The fluid coolant is delivered by a compressor at elevated pressure and is a flow of cooled gas after dehydration. Rapid flow of heat into cooled support at the base prevent deterioration of the diamond layer while allowing use of higher temperature braze metals.
    Type: Grant
    Filed: January 25, 1994
    Date of Patent: September 26, 1995
    Assignee: Dennis Tool Company
    Inventor: Thomas M. Dennis
  • Patent number: 5451279
    Abstract: A method for joining two ceramic sintered bodies with a joining layer. A magnesium layer is deposited on the ceramic sintered bodies to form a magnesium nitride layer. The joining layer has a component in common with a base component of the ceramic sintered bodies. The laminate is heat treated under conditions that convert the joining layer into a material substantially identical to that of the ceramic sintered bodies, whereby a homogeneous strong laminate results. The ceramic sintered body may be either an oxide, carbide or nitride. The joining layer is a metal corresponding to the base material of the ceramic sintered bodies. After joining, the joining layer is then nitrided. The resulting laminate has improved strength, and heat and corrosion resistance properties.
    Type: Grant
    Filed: September 28, 1993
    Date of Patent: September 19, 1995
    Assignee: Mitsubishi Materials Corporation
    Inventors: Masayoshi Kohinata, Makoto Toriumi, Hirokazu Tanaka, Hideaki Yoshida
  • Patent number: 5447683
    Abstract: Dense monolithic SiC or SiC ceramic composites are strongly bonded using brazing compositions which, in their preferred composition, include a braze alloy consisting essentially of less than 50 weight percent silicon and at least two metals from the group of Fe, Cr, Co and V and produce a joint suitable for use in a high neutron flux environment. Brazing is carried out at a temperature of about 1200.degree. to 1500.degree. C. in an inert atmosphere and is complete in about 15 minutes. Broadly, a genus of brazing compounds are disclosed which include between about 10 and about 45 weight percent silicon and at least two elements selected from the following group: Li, Be, B, Na, Mg, P, Sc, Ti, V, Cr, Mn, Fe, Co, Zn, Ga, Ge, As, Rb, Y, Sb, Te, Cs, Pr, Nd, Ta, W and Tl.
    Type: Grant
    Filed: November 8, 1993
    Date of Patent: September 5, 1995
    Assignee: General Atomics
    Inventors: Frederick C. Montgomery, Holger H. Streckert
  • Patent number: 5445308
    Abstract: A method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced non-solidified regions of filler within the unhardened matrix material to the surfaces. A solid mechanical bond may be provided by hardening the matrix material or by providing a separate adhesive between the surfaces. Preferably, the regions of filler form separate spaced continuous thermally and electrically conductive paths between the surfaces.
    Type: Grant
    Filed: June 22, 1994
    Date of Patent: August 29, 1995
    Inventors: Richard D. Nelson, Thomas P. Dolbear, Robert W. Froehlich
  • Patent number: 5400489
    Abstract: To avoid any deterioration of the surface properties of objects of ceramic, glass, or a single-crystal insulating material which are subjected to a vacuum temperature process, a thin layer of a spin-on glass solution with a silicon-dioxide equivalent of not more than 10% is applied to the objects by spinning or spraying prior to the vacuum temperature process. This is particularly important to avoid the strong moisture dependence of capacitive or resistive pressure sensors having a substrate and a diaphragm to be joined together, forming a chamber sealed at least at the edge.
    Type: Grant
    Filed: October 30, 1992
    Date of Patent: March 28, 1995
    Inventors: Frank Hegner, Ulfert Drewes