Abstract: A method for bonding a cubic boron nitride sintered compact to other cubic boron nitride sintered compact or to a body of shank material is disclosed. The method comprises forming a Ti layer of 0.01-1 .mu.m in thickness over a bonding interface between two cubic boron nitride sintered compacts or between a cubic boron nitride sintered compact and a body of shank material, forming a layer of Ni or Cu over the Ti layer to a thickness of 0.01-5 .mu.n, putting together the two cubic boron nitride sintered compacts or the cubic boron nitride sintered compact and the body of shank material with a 10-1,000 .mu.m foil of Al, Al-Ni alloy or Ag--Cu--In alloy being placed over the boding interface, and heating the cubic boron nitride sintered compact structure to temperatures above the meeting point of the metal foil and not exceeding 750.degree. C. in an inert atmosphere or in a vacuum.

Abstract: Disclosed is a method for bonding thermally-stable polycrystalline diamond or CBN compacts to carbide supports wherein the carbide support is placed in thermal contact with a heat sink and the thermally-stable compact is placed in thermal contact with a heat source during the brazing operation.

Abstract: A process of bonding crystalline quartz plates in a plate assembly of a quartz crystal resonator is provided. The plate assembly includes a base plate, a resonator plate, a cover plate, a first silver and indium alloy layer between the base plate and the resonator plate, and a second silver and indium alloy layer between the resonator plate and the cover plate. The process of bonding the plates in the plate assembly includes the steps of depositing in sequence on base plate face and on the cover plate face, a layer of chromium, a layer of silver, and a layer if indium, and also includes the steps of depositing in sequence on two opposite faces of the resonator plate, a layer of chromium, and a layer of silver, and also includes the steps in sequence of sandwiching the resonator plate between the base plate and the cover plate to form a plate assembly, then evacuating the plate assembly, compressing the plate assembly, and heating the plate assembly to about 310 degrees centigrade for several hours.

Abstract: A method or joining ceramics comprising the steps: of preparing a ceramics body and another body to be connected with the ceramics body; of interposing a layer of ultra-fine particles having smaller size than the surface roughnesses of the contact surfaces of the ceramics body and the other body, the layer having larger thickness than the surface roughnesses, and the ultra-fine particles being reactive with the ceramics body and the other body and forming a reaction produce which has a strong bonding power to the ceramics body and the other body; and then of pressing and heating the piled composition of the ceramics body, other body and layer.

Abstract: A method of diffusion bonding of aluminum or an alumina ceramic to aluminum, an alumina ceramic or a metal other than aluminum, which comprises interposing an aluminum alloy prepared by including 0.2 to 3% by weight of magnesium and/or 0.1 to 1.5% by weight of lithium into aluminum or an aluminum alloy between the surfaces of materials to be bonded, and heating said surfaces to be bonded of these materials under pressure at a temperature at which magnesium or lithium diffuses.

Abstract: An airtight packaging apparatus for covering with a cap a multichip module having LSI chips mounted on a ceramic substrate and for sealing the cap and substrate by means of solder includes a receptacle for accommodating the multichip module, valves for supplying gas to the receptacle and exhausting the receptacle, a retainer for holding the cap and adjusting the positional relation with respect to the multichip module, and a heater for heating solder of the junction between the multichip module and the cap. After solder has been heated and melted, the multichip module and the cap are sealed to each other.

Abstract: Ceramic bodies are bonded together via a layer of an oxidation reaction product of a molten metal, which metal is present in one or both of the ceramic bodies prior to bonding. At least one of the ceramic bodies comprises a ceramic product formed by the oxidation reaction of molten parent metal (e.g., alumina from molten aluminum) and grown as molten metal is transported through, and oxidized on the surface of, its own oxidation product. One or both of the ceramic bodies used in the bonding process contains surface-accessible channels of residual metal, i.e., metal channels which have resulted from molten-metal transport during the ceramic growth process. When the suitably assembled ceramic bodies are heated in an oxidizing atmosphere at a temperature above the melting point of the residual metal, molten metal at the surface of the ceramic body reacts with the atmosphereic oxidant so as to bond the facing surfaces together by a layer of the oxidation reaction product of the molten metal formed therebetween.

Abstract: A method for fabricating a composite structure, in which an intermediate member is sandwiched between first and second members, is disclosed. In this method, the intermediate member is disposed along the periphery of a spatial region formed between facing surfaces of the first and second members so that the spatial region is enclosed by the intermediate member, the fluidity of the intermediate member is enhanced under an atmosphere having a predetermined pressure, and then the pressure of the atmosphere is increased to make the intermediate member flow into the spatial region.

Abstract: In order to accommodate post-manufacturing, or secondary operations in precision assemblies using composite materials, where the secondary operations consist of drilling, machining, grinding, lapping, or other material-removing processing, without the need to resort to expensive diamond tooling and while maintaining needed structural integrity, a composite formed of a base material, a matrix, and a machineable material is provided. The matrix is bonded to the base material and the machineable material is rendered integral with the matrix and sufficiently thick to accommodate subsequent material-removing processing to a precision dimension.

Abstract: To alter the surface qualities of nonreactive materials, such as polypropylene and polyethylene in order to provide a means for bonding the plastic to metal, hard granular materials of oxides or carbides are partially impregnated into the surface of the plastic by application of heat and pressure so that granular edges remain exposed. Thereafter, a silver coating is applied over the impregnated plastic to interlock with the granules. The composite layered plastic then provides a means for soldering or bonding the plastic to a metallic coupling using either a bonding cement or a low temperature solder such as bismuth, lead, or tin based solder. Abrasion-resistant qualities also are improved by impregnating the internal surfaces of a plastic tube in order to improve its wear-resistance during transporting abrasive slurries of sand, coal, and the like.

Abstract: In order to secure electronic components, and particularly large-area power semiconductors, to a substrate, first a paste formed of metal powder and a solvent is applied in the form of a layer to a contacting layer of the component and/or a contact surface of the substrate. The layer of paste is then dried. When the paste has dried, the component is placed onto the substrate, whereupon the entire arrangement is heated to a relatively low sintering temperature preferably between 180.degree. C. and 250.degree. C., and with simultaneous application of a mechanical pressure of at least 900 N/cm.sup.2. A connection which is thus achieved by such a pressure sintering at relatively low sintering temperatures is particularly suitable for securing power semiconductors produced in MOS-technology to a substrate.

Abstract: In a method of dust-free and vacuum-tight interconnecting of ceramic aluminum-oxide components in a protective gas atmosphere the components are interconnected by heating and the use of a solder. Soldering the components is effected in a protective gas consisting of a mixture of air and nitrogen. A copper/silver solder from which individual constituents diffuse into the surfaces of the components during the soldering procedure is used as the soldering material.

Abstract: Soft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium.

Abstract: A power component such as a power transistor is mounted on an insulating substrate of, e.g., beryllia by using a thick film deposition technique. A first layer (2) is deposited and a second layer (3) is deposited over the first layer to produce a regular series of troughs and lands, in the preferred embodiment troughs and ridges, whereby voiding in the solder bond is minimized if not eliminated to thus maintain a good thermal conductivity between the component and the substrate.

Abstract: A process for bonding silicon die to a package. This process comprises the following steps: (a) providing to the back surface of the die an adhesion layer of material which exhibits superior adhesion to both the silicon die and a subsequently applied barrier layer; (b) providing to the adhesion layer a barrier layer which is impervious to silicon; (c) providing to the barrier layer a bonding layer; and (d) bonding the die to the package by activating a binder composition disposed at the interface of the package and the bonding layer. The barrier layer prevents the migration of silicon to the bonding layer, both at the time of application of the bonding layer to the die and at the time of bonding the die to the package. The adhesion layer enhances the adhesion of the barrier layer material to the back surface of the die. Titanium is the preferred adhesion layer material while tungsten is the preferred barrier layer material.

Abstract: An electron tube comprising a window having a radiation-sensitive layer. The window is laid on a bearing surface of an envelope, normal to the tube axis. There is no sealing material in the seam between the bearing surface and the window. The seam is sealed hermetically by a mass of indium or an indium alloy in which a metal wire is embedded along the circumference or the seam. The wire can be soldered with indium or an indium alloy. The seal is made by locally melting the indium or the indium alloy by a heated ultrasonically vibrating heat transfer member. The heat transfer member traverses the circumference of the seam.

Abstract: A carbon-carbon composite friction disc is formed from two or more carbon-based structural components secured together by an interface layer which is not itself a structural member but is fusion-bonded to both of the structural components to secure them together. The interface layer may be of metallic material such as a brazing compound, or may be of non-metallic material such as pitch.

Abstract: A pyrolytic boron nitride article is joined to a metal or ceramic member by use of a brazing alloy containing titanium as an active metal.

Abstract: A new and efficient method for attaching an optical fiber to a substrate to form a structurally secure optical fiber package is disclosed. The method first involves coating an optical fiber with an external layer of gold. A silicon retaining member is then provided having a groove therein sized to retain and receive the coated optical fiber. The silicon retaining member and optical fiber are then positioned on a substrate preferably constructed of alumina. Deposited on the substrate is at least one metal pad having an external gold layer on which the silicon retaining member is placed. The optical fiber, silicon retaining member, and substrate are then heated at a temperature sufficient to form a silicon/gold eutectic alloy between th silicon of the retaining member and the gold layers of the optical fiber and pad. Such heating involves a temperature of at least 370.degree. C. Heating is preferably accomplished using a resistor secured to the underside of the substrate.

Abstract: A method of joining ceramics and metals to themselves and to one another is described using a brazing filler metal consisting essentially of 35 to 50 atomic percent copper, 15 to 50 atomic percent silver and 10 to 45 atomic percent titanium. This method produces strong joints that can withstand high service temperatures and oxidizing environments.

Abstract: A polycrystalline diamond disk is bonded to a substrate by forming layers of powdered diamond material and then pressing and sintering the layers to bond the diamond material and to form disks thereof. A surface of one such disk is ground or lapped flat and then placed on a substrate with a disk of a brazing alloy therebetween. The diamond disk is then brazed to the substrate at a brazing temperature of about 730.degree. to 740.degree. C.

Abstract: Seal (40) between travelling-wave tube electrodes (32 and 34) includes an inner hermetic seal ring (50) for providing vacuum sealing and an outer ring (52) which shares the mechanical stresses due to changes in temperature.

Abstract: Fast union of a ceramic article to an opposed material is attained by a method which comprises forming a film of metal on the surface of the ceramic article, irradiating the surface of the metallic film with high-energy ions to bind the metallic film fast to the ceramic article, and supplying solder or brazing alloy to the surface of the metallic film and soldering or brazing the ceramic article to the opposed article. The high-energy ions for the irradiation has a magnitude of 30 to 800 keV and the dosage of the high-energy ions is in the range of 5.times.10.sup.15 to 2.times.10.sup.18 ions/cm.sup.2.

Abstract: A method for preparing a highly heat conductive substrate which comprises interposing an active layer with a thickness of 0.5 to 10 .mu.m comprising silver (Ag) and an active metal selected from the group consisting of titanium, zirconium and hafnium, and also copper (Cu) optionally, between an aluminium nitride (AlN) substrate and a copper member; and joining said aluminium nitride (AlN) substrate and said copper (Cu) member with each other by heating. A copper wiring sheet comprising the above active layer is also usable in the method.

Abstract: The direct liquid phase bonding of ceramics to metals or other ceramics in an inert atmosphere without prior metallization wherein a nickel-plated aluminum-silicon brazing alloy or aluminum or aluminum alloy filler material between the ceramic and metal layers provides a joint of high strength at a low bonding temperature without affecting the ceramic microstructure or the mechanical properties of the materials. This technique is also useful for fabricating composite laminates.

Abstract: A cubic boron nitride compact is bonded to a cemented carbide support through an alloy bonding layer which contains 40 to 70 percent by weight silver, gold or a combination thereof and 1 to 10 percent by weight of a high melting metal selected from the group of titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium and molybdenum. Bonding may be achieved by first metallizing a surface of the cubic boron nitride compact with a layer of gold or silver or a gold or silver based alloy and then bonding the metallized layer to the carbide support by means of a braze alloy having a liquidus temperature above 700.degree. C.

Abstract: A particular plastic material is formed into the desired component shape and then is plated by a process comprising; a particular surface preparation step, electroless deposition and electrolytic deposition which results in excellent plating adhesion. The plated component is then assembled with other components manufactured in the same manner or with compatible metal components such as aluminum and soldered together in a disclosed hot oil dip soldering process. In the soldering process, the plated plastic substrate is completely immersed in a hot oil medium at a temperature of approximately 243.degree. C. (470.degree. F.) for a time of approximately 60 seconds for solder reflow.

Abstract: A method for intermetallic diffusion bonding of piezoelectric components, wherein ceramic pieces with fired-on silver electrodes are stacked with a thin shim of solid indium alloy therebetween. The indium alloy preferably comprises 25% indium, 37.5% lead and 37.5% tin. The stack is placed under 150 psi compression and heated at a temperature of about 350.degree. for 30-48 hours in an inert gas. Almost immediately upon being heated, a liquid-solid diffusion takes place in which a small amount of the silver diffuses from the electrodes into the now liquid indium alloy. The alloy in the interface becomes saturated with silver producing a new quaternary alloy which has a higher melting point than the previous indium alloy shim. Thus, there is a gradual solidification of the alloy as the concentration of silver increases. After solidification of the new alloy during the remainder of the heating time, there is a gradual diffusion of the indium into the silver and vice versa.

Abstract: The invention provides a hard solder alloy for bonding oxide ceramics to each other or to metal, particularly to alloy steels. The hard solder alloy comprises 65-80% copper, 15-35% titanium, 0.5-5% aluminum and 0.5-5% vanadium. The invention also provides a method of bonding the surfaces utilizing said hard solder alloy as the soldering alloy. The invention further provides a preferred method in which the said hard solder alloy is provided in the form of two components, namely copper and the alloy TiAl.sub.6 V.sub.4.

Abstract: The invention is a method of soldering a light emitting device to a substrate which uses a vee-groove to hold the substrate, solder and light emitting device in accurate alignment to one another during the melting and solidification of the solder.

Abstract: The invention relates to the use of ternary alloys in brazing ceramics.Brazing is a process of limited usefulness in the fabrication of ceramic components because of the inability of many alloys to wet industrially important ceramics. A possible solution is the metallizing of ceramics but this has technical and economic disadvantages. Alloys are known which wet ceramics but they do not necessarily give good bond strength. The following alloys have now been devised which both wet ceramics and give good bond strength, e.g., greater than 40 MNm.sup.-2 at room temperature, with unmetallized ceramics. The alloys are:Cu: 16 to 28 Ti: 6.5 to 14 SnCu: 15 to 25 Ti: 10 to 25 AuCu: 15 to 50 Ti: 3 to 10 AgCu: 25 to 35 Ti: 3 to 8 Inwherein the compositions are in atom percent.

Abstract: A method for positioning and fixing optical components relative to one another which comprises the steps of providing a carrier plate having an optical component, securing an optical component on a retainer plate having at least one solderable area, positioning the retainer plate above the carrier plate with a reference mark on said plates being aligned and the solderable area on each of the two plates being disposed in aligned pairs of solderable areas, applying at least one solder piece to each pair of solderable areas as the plates are held in the position, melting the solder pieces, allowing the molten metal to solidify to secure the aligned plates together and then releasing the secured aligned plates.

Abstract: A method is provided for electrically interconnecting a plurality of varistors of the type formed predominantly of metal oxide. Molten solder is first applied to the receiving surfaces provided on opposite sides of each of the varistors. The molten solder is then subjected to vibrations of from 5,000 to 35,000 hertz, causing the solder to strongly adhere to the receiving surfaces. The varistor bodies are then soldered to one another along their receiving surfaces to electrically interconnect the varistor bodies. In one embodiment of the method, the applying of molten solder, vibrating the molten solder, and soldering the varistor bodies to one another are all performed substantially simultaneously by means of a vibrating solder bath.

Abstract: A method of bonding a plurality of thermally stable high strength graphite fiber reinforced glass matrix composite pieces is described. The process comprises applying to the surfaces to be bonded at least one layer of a metal which is highly adherent to the composite and the solder and is oxidatively stable. A tie layer may be used between the composite bond surface and the metal layer to better bond the metal layer to the composite. Following application of the metal layer, the composite pieces are stacked with the metal layers facing each other and a solder layer in between. The temperature of the assembly is raised to melt the solder and form the bond. The melting temperature of the solder and the metal layers are chosen so as to be higher than the use temperature of the bonded composite. A bonded composite article thus formed is also described.

Abstract: An ink jet tip assembly in which the individual jets are comprised of a piezoelectric cylinder having a longitudinally through bore, a glass ink nozzle disposed in the cylinder bore and a low melting temperature alloy interposed between the bore and the nozzle for anchoring the nozzle to the piezoelectric cylinder. The method of assembly for the individual jet tip assemblies comprises inserting the glass ink nozzle into the cylinder bore which contains the anchoring alloy in a molten form. A method of checking for flaws in the cylinder comprises fluxing the cylinder bore for allowing flux to pass through any cylinder pinholes or cracks. Upon introducing solder for coating the interior cylinder wall, some solder will appear as shining spots or areas on the cylinder exterior wall.

Abstract: A method of bonding a graphite fiber reinforced glass matrix composite to a metal structure comprising depositing a layer of eutectic alloy metal component to the bond surfaces of the metal and composite followed by placing the thus treated bond surfaces of the metal and composite together with a layer of eutectic alloy containing such metal therebetween. The metal-bond-composite is then heated to melt the alloy and bond the composite to the metal. Articles formed by such a process are also described. The method has particular utility in bonding cooling channel containing metal bases to graphite-glass composite laser mirrors.

Abstract: A conductive layer (13) adhesively joined to an electrically inert substrate (10) by an organic binder component. The organic binder consists of a resin not substantially less than 15% nor more than about 35% by weight of the composition which further includes dispersed metallic material within the binder and forming the electrically conductive component of the solderable material. A solderable surface layer (15) of the conductive layer (13) includes exposed metallic material suitable for solder bonding terminations (16) to the conductive layer (13), such solderable surface layer (15) being adhesively joined to the binder by means of the organic matrix.

Abstract: A structural joint wherein the intersecting members share at least one uninterrupted common surface to provide a particularly stable joint. In the preferred embodiment the composite material elements are protectively coated to prevent moisture absorption, and this coating is later utilized to bond the elements together to form the joint.

Abstract: An improved hermetically sealed container is disclosed having a receptacle ith at least one opening for mounting a desired element in the opening, a closure element covering each opening, a metallized seal between the closure element and the receptacle with the metallized seal peripherally surrounding the opening and hermetically sealing the closure element to the receptacle, and a sealing deposit electrolytically applied to the outer surface of the metallized seal. A method of making such a hermetically sealed container is also disclosed.

Abstract: A component comprised of a composite compact, preferably diamond, and a substrate bonded to the compact. A preferred embodiment of the component is a cutter for a drill bit. The compact is comprised of a layer of bonded diamond or boron nitride particles and a base layer of cemented carbide bonded, preferably under high temperatures and pressures, to the particulate layer. The particulate layer is degradable by expvsure to temperatures above a predetermined temperature. The substrate is bonded to the base layer of the compact with a filler metal which, to form a bond, requires the exposure of the surface to be bonded to a temperature substantially greater than the degradation temperature of the particulate layer. The component is fabricated by heating the base layer, filler metal and substrate to a temperature in excess of the degradation temperature while maintaining the temperature of the particulate layer below the degradation temperature via a heat sink.

Abstract: An ink jet tip assembly in which the individual jets are comprised of a piezoelectric cylinder having a longitudinally through bore, a glass ink nozzle disposed in the cylinder bore and a low melting temperature alloy interposed between the bore and the nozzle for anchoring the nozzle to the piezoelectric cylinder. The method of assembly for the individual jet tip assemblies comprises inserting the glass ink nozzle into the cylinder bore which contains the anchoring alloy in a molten form. A method of checking for flaws in the cylinder comprises fluxing the cylinder bore for allowing flux to pass through any cylinder pinholes or cracks. Upon introducing solder for coating the interior cylinder wall, some solder will appear as shining spots or areas on the cylinder exterior wall.

Abstract: A quartz crystal oscillator package comprising a quartz crystal vibrator leaf enclosed in an evacuated housing. The vibrator leaf frame is sandwiched and sealed between a pair of housing elements formed by etching at one time the periphery of each housing element and at another time etching a concave portion in each housing element. Opposed concave portions provide the internal volume wherein the vibrator leaf is sealed under vacuum. Using heat and vacuum, a metal film deposited on the sealing surfaces of the housing elements fuses with a binder material to form a eutectic alloy seal. A flat package having small size, high structural strength, an excellent hermetic seal, and high internal vacuum is produced by this method.

Abstract: A liquid crystal display includes a substrate carrying display electrodes and an integrated circuit chip connected thereto. The display electrodes are made of appropriate transparent material such as InO.sub.2. Multiple soldering layers are provided on the extension of the display electrodes so that they are bonded with bumps formed on the integrated circuit chip by soldering technology. The multiple soldering layers are deposited by evaporation methods or sputtering techniques with a thickness of 3000 A to 5000 A. In a preferable form, the multiple soldering layers include three (3) layers made of Cr, Cr-Au alloy, Au, respectively. The multiple soldering layers may comprise two (2) layers made of Ni-Fe alloy and Au in another preferable form.

Abstract: A mosaic structure, flat or multi-dimensional, wherein any number of discrete members are soldered together, irrespective of whether such members are of conventionally solderable or conventionally unsolderable materials. The mosaic structures include glass and stained glass structures, such as windows and lampshades, wood mosaics, such as tabletops and other furniture, and hybrid structures, having glass and wood members, as well as members of most other materials. The mosaic structures may be produced by methods taught in copending applications.

Abstract: Two parts, such as a quartz part and piezo-electric part, are indirectly connected to one another by applying relatively thin metallic layers having a thickness of about 0.5 nm to 55 nm under vacuum conditions onto the surfaces of such parts to be joined and then without ventilation of the vacuum-chamber contacting the free surfaces of such metallic layers with one another under the maintained vacuum conditions whereby a substantially permanent bond is formed between such layer.

Abstract: A method of bonding a diamond or cubic boron nitride abrasive compact to a second such compact in which a braze alloy layer is deposited on a layer of a transition metal on the first compact, the second compact being then placed on the braze layer and the whole assembly being heated to effect bonding between the first and second compacts.

Abstract: A method of indirectly connecting two parts, such as an acousto-optical building component composed of lead glass and a piezo electric transducer composed of lead-zirconium titanate, whereby at least one mono-molecular layer (having a maximum thickness of 100 nm) composed of a lead-free glass is directly applied under vacuum onto the surfaces of the parts to be joined and metal layers are then applied under vacuuum onto such glass layer and/or the surfaces to be joined so that when the free surfaces of such free metal layers are brought into contact with one another under vacuum, a bond forms therebetween and such bonds indirectly connect the parts with one another. The glass layer prevents diffusion of atoms or ions from the materials (such as lead) on either side of such layer so that the parts so-joined and/or the bonds so-formed are not impaired in any way.

Abstract: A method is described for attaching sapphire, quartz, Spinel, etc. die to gold pads in a ceramic package. Because sapphire is not directly bondable to or alloyable with gold, while silicon is, silicon is either evaporated or deposited onto the backside of a sapphire or silicon-on-sapphire wafer. After the wafer has been scribed into die, the die are attached to the gold pads in the ceramic package using a gold-silicon preform as an intermediate layer.

Abstract: A method of joining ceramics and metals to themselves and to one another is escribed using essentially pure trinickel aluminide and trinickel aluminide containing small amounts of carbon. This method produces strong joints that can withstand high service temperatures and oxidizing environments.

Abstract: A method of joining ceramics and metals to themselves and to one another is escribed using essentially pure trinickel aluminide and trinickel aluminide containing small amounts of carbon. This method produces strong joints that can withstand high service temperatures and oxidizing environments.