Preforming Work Faying Surface Patents (Class 228/173.3)
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Patent number: 8991030Abstract: A method for making a projection on a metal panel includes providing a lower die having a recess in the shape of the desired projection, laying the metal panel atop the lower die, positioning a filler material atop the metal panel, and lowering an upper die onto the filler material so that the filler material is forced into the metal panel and in turn forces the metal panel into the recess of the lower die whereby a projection is formed and the projection is filled with the filler material.Type: GrantFiled: April 6, 2012Date of Patent: March 31, 2015Assignee: GM Global Technology Operations LLCInventors: Mark D. Gugel, Bradley J. Blaski
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Patent number: 8533957Abstract: A method of manufacturing bearing seal for use in a roller bearing is provided. A steel coil of a preselected width is fed into a ring rolling machine to form a closed coil ring. The closed coil ring is then welded along the butted joint. The welded closed coil ring is then fed to a series of pre-forming machines wherein the desired profiles of the final bearing seal are formed.Type: GrantFiled: June 14, 2011Date of Patent: September 17, 2013Assignee: Amsted Rail Company, Inc.Inventors: Bryan J. Spurlock, Dwight A. Marcellus
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Publication number: 20130062120Abstract: A process is disclosed, whereby soldered connections to electrical conductors incorporated on thin glass are achieved. Sufficient resistance to cracking is obtained by virtue of surface stresses induced locally in a region where soldering is to be done. In a preferred embodiment, surface stresses imparted during a press bending operation are relied upon.Type: ApplicationFiled: May 3, 2011Publication date: March 14, 2013Applicant: PILKINGTON GROUP LIMITEDInventors: Steffen Galonska, Matthias Kriegel-Gemmecke
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Patent number: 6953145Abstract: A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the solder is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometers.Type: GrantFiled: July 20, 2001Date of Patent: October 11, 2005Assignee: Robert Bosch GmbHInventors: Kuno Wolf, Alexander Wallrauch, Horst Meinders, Barbara Will, Peter Urbach
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Patent number: 6902095Abstract: A method of cold forming a two-part battery terminal and a two-part cold formed battery terminal comprising a cold formed lead or lead alloy slug having a male fastener protruding from a one side of the cold formed slug with a head portion of the fastener rotationally retained and embedded in the battery terminal by cold formed lead or lead alloy.Type: GrantFiled: July 3, 2003Date of Patent: June 7, 2005Assignee: Water Gremlin CompanyInventors: Robert W. Ratte, Norman E. Peterson
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Patent number: 6805277Abstract: In a process of soldering an electric connector on a circuit board, the connector has an insulator and a plurality of leads mounted inside the insulator. Each lead has a first end extending into a soldering terminal to a bonding surface of the insulator. A soft solder paste is dispensed over a bonding surface of the circuit board. The soldering process inserts the soldering terminal of each lead in the soft solder paste and applies heat to the soft solder paste to bond the soldering terminal and the circuit board together. The direct insertion of the soldering terminal of the lead into the soft paste on the circuit board minimizes the contact area between the lead and the circuit board and prevents the solder paste from being unduly spread, causing short circuit. Furthermore, the yield and soldering reliability are increased and the production cost is reduced.Type: GrantFiled: April 16, 2003Date of Patent: October 19, 2004Assignee: Lotes Co., Ltd.Inventor: Ted Ju
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Patent number: 6711803Abstract: The present invention enables to firmly assemble a steel-frame structure. To form a steel-frame structure or to join two steel members being reinforcing members thereof, a slip-proof surface having one or plural concentric higher parts and grooves is formed on the joined surface of one side or both sides of the steel members, and these two steel members are clamped by a connecting member that passes through connecting holes in the state where the first and the second slip-proof surfaces are mutually engaged or not engaged. Thus, joining force between the joined surfaces is increased.Type: GrantFiled: August 23, 2000Date of Patent: March 30, 2004Assignee: Takashima CorporationInventor: Kiyokazu Kobayashi
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Publication number: 20020179684Abstract: A liquefiable gas pressure cylinder and method for making the same with the cylinder including a cylindrical shell, and heads fusion welded at opposites ends of the shell. The side ends where the heads are joined to the shell are crimped radially inward to each end to form chimes. The welds are 100% radiographed and heat treated. The heads are dished to have a domed center portion which has a profile and thickness so that the domed center portions will reverse before any other part of the cylinder is stressed beyond a yield limit for such part.Type: ApplicationFiled: June 24, 2002Publication date: December 5, 2002Applicant: Indian Sugar and General Engineering Corp.Inventor: Ravi Jaidka
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Patent number: 6296171Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.Type: GrantFiled: October 12, 1999Date of Patent: October 2, 2001Assignee: Micron Technology, Inc.Inventors: David R. Hembree, Michael E. Hess, John O. Jacobson, Warren M. Farnworth, Alan G. Wood