Rod, Bar, Or Wirelike Object Patents (Class 228/173.5)
  • Patent number: 11021775
    Abstract: In one aspect, cobalt-based alloys are described herein comprising composition and microstructure permitting a balance of hardness, toughness and wear resistance desirable for wood cutting applications. A cobalt-based alloy comprises a chromium rich carbide phase in an amount of 15-30 volume percent, a tungsten-rich phase in an amount of 9-15 volume percent and a balance of cobalt-rich solid solution matrix comprising nickel, chromium, vanadium and tungsten.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: June 1, 2021
    Assignee: KENNAMETAL INC.
    Inventors: Matthew Yao, Abdelhakim Belhadjhamida, Brad McLane
  • Patent number: 10384095
    Abstract: An exercise equipment with an improved connecting bar connecting an exercise foot retaining device to a resistance, wherein a first longitudinal pedal bar is connected to a first bent longitudinal pedal connector bar and a second longitudinal pedal bar connected to a second bent longitudinal pedal connector bar, the bent first and second longitudinal connector bars each having a bent angle greater than zero and less than ninety degrees to thereby prevent the occurrence of a dead angle.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: August 20, 2019
    Assignee: Hupa International Inc.
    Inventor: Bob Hsiung
  • Patent number: 9949375
    Abstract: A method for preventing a molded body made of low melting point resin from being thermally damaged when external connection terminals provided on the molded body and external connection terminals provided on a flexible sheet are joined together via soldering. The method includes arranging the connection terminal of the molded body and the connection terminal of the flexible sheet such that the connection terminals face each other, and an electromagnetic induction heating performing electromagnetic induction heating after the arranging.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: April 17, 2018
    Assignee: WONDER FUTURE CORPORATION
    Inventors: Akira Sato, Koki Fukuda, Kazuhiro Sugiyama
  • Patent number: 9714775
    Abstract: Systems, tools, and methods are presented that enable a plurality of turbulators to enhance heat transfer within a heat exchanger of a heating, ventilating, and air conditioning (HVAC) system. The plurality of turbulators each include a ribbon member having a variable pattern formed over a length. In one instance, the variable pattern of the ribbon member includes a plurality of bends defining intervals of alternating pitch. The intervals progressively increase in dimension as the ribbon member is traversed over the length. In another embodiment, the intervals contain apertures whose area increases as the length is traversed. Other systems, tools and methods are presented.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: July 25, 2017
    Assignee: Lennox Industries Inc.
    Inventors: Kirankumar Muley, Kapil Sahu, Glenn W. Kowald, Ajay C. P. Swornalatha, Ian Burmania, John Whitesitt, Donald Zimmer
  • Patent number: 9327360
    Abstract: The invention relates to a method and a device for contacting a solder ball formation, in which a plurality of contact mouthpieces arranged in a formation is used to pick up a solder ball formation with a composition reflecting the relative arrangement of the contact mouthpieces from a solder ball reservoir comprising a multitude of randomly distributed solder balls, the solder ball formation is placed on contact points by means of the contact mouthpieces for subsequently contacting, and subsequently the solder balls are impinged with laser energy by means of the contact mouthpieces for thermal connection with the contact points.
    Type: Grant
    Filed: January 24, 2008
    Date of Patent: May 3, 2016
    Assignee: Pac Tech—Packaging Technologies GMBH
    Inventor: Ghassem Azdasht
  • Patent number: 9293838
    Abstract: A crimping portion includes a first crimping portion including a conductor crimping portion and a conductor enveloping portion that is integrally connected to the conductor crimping portion and envelops a portion of a conductor in the vicinity of an insulating covering portion, and a second crimping portion that is separate from the first crimping portion and crimped to the insulating covering portion in the vicinity of the conductor. A gap between the first crimping portion and the second crimping portion is sealed with a sealer, and thus the first crimping portion and the second crimping portion are integrally interconnected to each other.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: March 22, 2016
    Assignee: Yazaki Corporation
    Inventor: Tadahisa Sakaguchi
  • Patent number: 8991030
    Abstract: A method for making a projection on a metal panel includes providing a lower die having a recess in the shape of the desired projection, laying the metal panel atop the lower die, positioning a filler material atop the metal panel, and lowering an upper die onto the filler material so that the filler material is forced into the metal panel and in turn forces the metal panel into the recess of the lower die whereby a projection is formed and the projection is filled with the filler material.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: March 31, 2015
    Assignee: GM Global Technology Operations LLC
    Inventors: Mark D. Gugel, Bradley J. Blaski
  • Patent number: 8943691
    Abstract: A method of manufacturing a furcated composite post (1) comprising at least two strips (7, 8) that are joined together along their length in a furcated manner. The method comprises the steps of feeding one or more of the strips (7, 8) at a set rate to working rolls of a roll mill for profile rolling to a desired cross section/profile, feeding the strips (7, 8) at the same set rate to positioning rolls for holding the strips (7, 8) in a correct orientation for joining, and joining the strips together, preferably by welding the strips (7, 8) along their length.
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: February 3, 2015
    Inventors: Ashley Dean Olsson, Ashley Norman Olsson, Nathanael Dean Olsson, Stafford James Olsson
  • Patent number: 8839499
    Abstract: A method for manufacturing a continuous sucker rod coil, wherein the method includes the step of selecting a plurality of input coils, each input coil having the same uniform hardness, and each input coil having two free ends. The method further includes the step of fusing adjacent free ends of adjacent input coils together to form one continuous length of rod, the fusing creating fused areas and a heat-affected zone at each fused area. The method also includes the step of treating each of the heat-affected zones to alleviate irregularities induced during fusing. Additionally, the method includes the step of winding the continuous length of rod into a finished coil.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: September 23, 2014
    Assignee: Weatherford Canada Partnership
    Inventors: David LaBonte, Ricky Gereluk
  • Publication number: 20140096999
    Abstract: A collective conductor includes a plurality of conductive wires that is arranged collectively; and a copper foil that is wound around the collectively-arranged conductive wires and fusion-bonded to the conductive wires, and the copper foil has a tin plating on the side in contact with the conductive wires.
    Type: Application
    Filed: September 5, 2013
    Publication date: April 10, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Ichiro OKADA, Hiroaki URANO
  • Patent number: 8578608
    Abstract: A rod-based well screen is formed in place on a perforated pipe base by wrapping wire around the pipe base and a plurality of rods located around the outside of the pipe. The wire is welded sequentially to each individual rod as it is wrapped around the pipe. The welding and ground electrodes engage the wire and the rods respectively. The rod engaging ground electrode is positioned a short distance ahead of the wire being wrapped around the rods and the pipe base. The ground electrode includes a plurality of contacts. Each contact is mounted to pivot toward and away from a rod. Springs urge each contact toward a rod to hold the rod against the outside surface of the pipe base and to maintain good electrical contact between the contact and the rod. Each contact has a groove to guide the rod into position for welding to the wire.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: November 12, 2013
    Assignee: Schlumberger Technology Corporation
    Inventor: Kjartan Roaldsnes
  • Publication number: 20130264102
    Abstract: A system provided with a solder joint includes: a circuit board (101) provided with an aperture (102), an electrical component (103) including a conductor foot (104) protruding through the aperture, and soldering metal (105) inside the aperture and in contact with the conductor foot. The system further includes a thermal conductor element (106) including a first portion outside the aperture and a second portion inside the aperture and in contact with the soldering metal. The thermal conductor element is capable of conducting heat and thereby it intensifies the heat transfer into the aperture during pre-heating which precedes the process phase when the molten soldering metal is enabled to be absorbed into the aperture. Thus the reliability of the solder joint is improved, i.e. a risk of a faulty “cold” solder is decreased.
    Type: Application
    Filed: March 27, 2013
    Publication date: October 10, 2013
    Applicant: TELLABS OY
    Inventors: Antti HOLMA, Jari-Pekka LAIHONEN
  • Patent number: 8540136
    Abstract: Methods for forming stud bumps and apparatuses for forming stud bumps are disclosed. According to an embodiment, a method includes clamping a wire with a clamp. The clamp includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method further includes bonding the wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface. The second notch is the notch pitch distance from the first notch along the wire.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: September 24, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu
  • Publication number: 20130091686
    Abstract: A guide wire includes a first wire disposed on the distal side of the guide wire and a second wire disposed on the proximal side. The second wire has an elastic modulus larger than the first wire. The first wire is joined to the second wire at a welded portion by welding. A coil is disposed on the distal side of the first wire. A cover layer is formed on the outer peripheral surface of the wire member in such a manner as to cover at least the welded portion. The cover layer is made from a material capable of reducing the friction of the cover layer, for example, a fluorocarbon resin or a hydrophilic material, to thereby improve the sliding performance of the guide wire. Such a guide wire is excellent in operationality and kink resistance.
    Type: Application
    Filed: December 5, 2012
    Publication date: April 18, 2013
    Applicant: Terumo Kabushiki Kaisha
    Inventor: Terumo Kabushiki Kaisha
  • Publication number: 20130033352
    Abstract: An enameled aluminum wire winding includes a framework, a connection terminal, an enameled aluminum wire, and a protective cover. The connection terminal includes a fixed part, one end of which extends to form a welded part, and the other end of which extends to form an external connection part. The fixed part is fixed to the framework. The enameled aluminum wire is wound on the framework. A contact portion of the enameled aluminum wire is welded with the welded part to form a connection section. The protective cover is provided with a glue groove in which insulating glue is contained. The connection section is submerged in the insulating glue and the insulating glue is solidified. The protective cover and the solidified insulating glue therein doubly protect the connection section, so the problems of easy oxidation, corrosion, and cracking in the connection section are solved. The winding is safe and stable.
    Type: Application
    Filed: April 19, 2011
    Publication date: February 7, 2013
    Inventor: Kahong Wo
  • Patent number: 8346326
    Abstract: An electrical component comprises a superconductive wire, the wire comprising a first wire segment joined to a second wire segment, wherein the first wire segment and the second wire segment differ in at least one property selected from the group consisting of magnetic field tolerance, temperature tolerance, ac loss, and strain tolerance, and wherein the magnetic field tolerance is measured by the relationship of critical current Ic to magnetic field H at a given temperature T below critical temperature Tc, the temperature tolerance is measured by the relationship of critical current Ic to temperature T at a given magnetic field below critical magnetic field Hc, the ac loss is measured by the amount of ac loss versus the frequency and magnitude of applied ac currents and fields, and the strain tolerance is measured by critical current Ic degradation with strain.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: January 1, 2013
    Assignee: General Electric Company
    Inventors: James William Bray, Evangelos Trifon Laskaris, Kiruba Sivasubramaniam
  • Patent number: 8302310
    Abstract: A rod-based well screen is formed in place on a perforated pipe base by wrapping wire around the pipe base and a plurality of rods located around the outside of the pipe. The wire is welded sequentially to each individual rod as it is wrapped around the pipe. The welding and ground electrodes engage the wire and the rods respectively. The rod engaging ground electrode is positioned a short distance ahead of the wire being wrapped around the rods and the pipe base. The ground electrode includes a plurality of contacts. Each contact is mounted to pivot toward and away from a rod. Springs urge each contact toward a rod to hold the rod against the outside surface of the pipe base and to maintain good electrical contact between the contact and the rod. Each contact has a groove to guide the rod into position for welding to the wire.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: November 6, 2012
    Assignee: Schlumberger Technology Corporation
    Inventor: Kjartan Roaldsnes
  • Patent number: 8281472
    Abstract: A method for manufacturing a continuous sucker rod coil, wherein the method includes the step of selecting a plurality of input coils, each input coil having the same uniform hardness, and each input coil having two free ends. The method further includes the step of fusing adjacent free ends of adjacent input coils together to form one continuous length of rod, the fusing creating fused areas and a heat-affected zone at each fused area. The method also includes the step of treating each of the heat-affected zones to alleviate irregularities induced during fusing. Additionally, the method includes the step of winding the continuous length of rod into a finished coil.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: October 9, 2012
    Assignee: Weatherford Canada Partnership
    Inventors: David Labonte, Ricky Gereluk
  • Publication number: 20120193801
    Abstract: An RFID transponder having a semiconductor die with a solderable contact area and an antenna made from a winding wire, wherein the winding wire is soldered to the contact area, and the solderable contact area is made from a nickel based alloy.
    Type: Application
    Filed: January 16, 2012
    Publication date: August 2, 2012
    Applicant: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
    Inventors: Johann Gross, Bernhard Lange
  • Publication number: 20120116200
    Abstract: An EP catheter includes a tubular body having a proximal region, a neck region, and a distal portion predisposed into a single shallow helical fixed-diameter loop configuration and including a plurality of diagnostic electrodes. In deflectable catheter forms, at least one activation wire extends through at least a portion of the proximal region of the catheter body and is adapted to deflect the up to approximately 180 degrees relative to the proximal region. The catheter can be operated manually by a clinician or via a clinician-surrogate such as a computer processor-controlled surgical system. In addition, a variety of localization, visualization, and/or orientation-specific elements can be incorporated into the devices described, depicted, and claimed herein (e.g., metallic coil members, active impedance emitting or receiving electrodes, fluoroscopically opaque materials, and the like).
    Type: Application
    Filed: December 30, 2010
    Publication date: May 10, 2012
    Inventors: Pianka Roy, Alan de la Rama, Jennifer Velasco
  • Publication number: 20120116199
    Abstract: An EP catheter includes a tubular body having a proximal region, a neck region, and a distal portion predisposed into an in-plane dual loop (at least, approximately, more or less) configuration and including a plurality of diagnostic electrodes. In deflectable catheter forms, at least one activation wire extends through at least a portion of the proximal region of the catheter body and is adapted to deflect the distal portion up to approximately 180 degrees relative to the proximal region. The catheter can be operated manually by a clinician or via a clinician-surrogate such as a computer processor-controlled surgical system. In addition, a variety of localization, visualization, and/or orientation-specific elements can be incorporated into the devices described, depicted, and claimed herein (e.g., metallic coil members, active impedance emitting or receiving electrodes, fluoroscopically opaque materials, and the like).
    Type: Application
    Filed: December 30, 2010
    Publication date: May 10, 2012
    Inventors: Alan de la Rama, Jennifer Velasco, Kailing Chen
  • Publication number: 20120031955
    Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.
    Type: Application
    Filed: February 10, 2011
    Publication date: February 9, 2012
    Applicant: NATIONAL SEMICONDUCTOR CORPORATION
    Inventor: Ken Pham
  • Publication number: 20120018496
    Abstract: A method for forming a wave form for a stent includes clamping a formable material to a first die including a forming portion; drawing the formable material with the first die in a first direction; clamping the formable material to a second die at a location spaced from the first die, the second die including a forming surface; moving a forming member in between the first die and the second die in a second direction substantially perpendicular to the first direction and into contact with the formable material; and deforming the formable material by moving the forming member in the second direction while moving the first die towards the second die and/or moving the second die towards the first die.
    Type: Application
    Filed: July 26, 2010
    Publication date: January 26, 2012
    Applicant: Medtronic Vascular, Inc.
    Inventors: PJ CARMODY, Sean Moynihan, Gerard Clery, Erik Griswold
  • Patent number: 8100315
    Abstract: A method is provided for providing external insulation for an exhaust gas aftertreatment or acoustic device, including the steps of (a) securing an insulating blanket around the exterior of the device, (b) securing a sheet of foil around the insulating blanket, (c) interconnecting a plurality of wires into a sleeve oriented in an axial direction by knitting or interweaving, whereby extending the sleeve in the axial direction biases the sleeve radially inwardly, (d) positioning the wire sleeve around the foil sheet, (e) welding one end of the wire sleeve to the device adjacent one end of the insulating blanket, (f) pulling the other end of the sleeve in the axial direction to bias the sleeve radially inwardly sufficiently to apply a compressive force to the insulating blanket, and (g) welding the other end of the sleeve to the device adjacent the other end of the insulating blanket.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: January 24, 2012
    Assignee: Tennco Automotive Operating Company Inc.
    Inventor: Ruth Latham
  • Publication number: 20110258832
    Abstract: A method and apparatus for retaining an ornament, for example, an ornamental crystal, on a frame or plate is provided. The method includes providing a pin having a first end and a second end, opposite the first end, the second end comprising a projection, for example, a head; inserting the first end of the pin through an aperture in the ornament and through a hole in the frame wherein the projection obstructs the aperture in the ornament; deforming, for example, twisting, the second end of the pin to provide a deformation of the second end that obstructs passage of the second end through the hole in the frame; and retaining the ornament on the frame by the projection of the first end of the pin and the deformation of the second end of the pin. Aspects of the invention facilitate the mounting of ornaments to ornamental fixtures, for example, chandeliers.
    Type: Application
    Filed: April 26, 2010
    Publication date: October 27, 2011
    Applicant: SCHONBEK WORLDWIDE LIGHTING INC.
    Inventors: Tho LY, Andrew SCHUYLER
  • Publication number: 20110125142
    Abstract: A vacuum insulation tube assembly which is utilized as a component in a cryosurgical probe. The vacuum insulation tube assembly includes an inner tube; and, an outer tube concentrically positioned about the inner tube. The outer tube is securely soldered at end portions of the inner tube and forms a vacuum space between the inner tube and the outer tube. The vacuum tube assemblies may be conveniently mass produced using a special fixture.
    Type: Application
    Filed: February 4, 2011
    Publication date: May 26, 2011
    Applicant: ENDOCARE, INC.
    Inventors: THACH DUONG, JENNY C. LIU, JAY J. EUM
  • Publication number: 20100176094
    Abstract: A lead portion (25) of a heater coil (22) is constituted of a single coil wound into a coil and a bead portion (24) is constituted of a double coil formed by further winding the single coil into a coil. By constituting a detecting element (2) by burying the bead portion (24) in a heat conductive layer (21) and adhering a catalyst layer (23) on the surface of the heat conductive layer (21), improvement of the gas sensitivity and the response speed of a catalytic combustion gas sensor is facilitated. Zero point variation is reduced by improving impact resistance. When both ends of the heater coil are fixed to electrode pins, both ends of the heater coil are welded to the electrode pins using a resistance welding method, etc., with a platinum wire, etc., wound on a primary core wire, and thereafter, the primary core wire is melted and eliminated while leaving the platinum wire, etc., by a wet etching process.
    Type: Application
    Filed: March 24, 2010
    Publication date: July 15, 2010
    Inventors: Ikuo TAKAHASHI, Junji Satoh, Yoshirou Hirai
  • Publication number: 20100146922
    Abstract: A cylindrical wound wire filter with an inner bore, suitable for use with an airbag inflator, has at least two different outer diameters and/or at least two different inner diameters. Wires in adjacent layers can be bonded together by adhesive or brazing, or have a sheet-like material therebetween, such as a ceramic filter paper.
    Type: Application
    Filed: April 13, 2007
    Publication date: June 17, 2010
    Applicant: ACS Industries, Inc.
    Inventor: George Greenwood
  • Publication number: 20090250506
    Abstract: A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder balls, thereby removing at least a portion of the first solder paste and bringing the solder balls into electrical contact with the leadless contacts, the base of the solder balls being generally aligned in a plane, and bending the lead contacts into gull wings, with the base of the gull wings being substantially coplanar with the plane. The base of the gull wings and the base of the at least one of the solder balls collectively generally define a contact plane for potential future contact with the surface.
    Type: Application
    Filed: February 24, 2009
    Publication date: October 8, 2009
    Applicant: General Dynamics Advanced Information Systems
    Inventor: Deepak K. Pai
  • Publication number: 20090186769
    Abstract: An electrical component comprises a superconductive wire, the wire comprising a first wire segment joined to a second wire segment, wherein the first wire segment and the second wire segment differ in at least one property selected from the group consisting of magnetic field tolerance, temperature tolerance, ac loss, and strain tolerance, and wherein the magnetic field tolerance is measured by the relationship of critical current Ic to magnetic field H at a given temperature T below critical temperature Tc, the temperature tolerance is measured by the relationship of critical current Ic to temperature T at a given magnetic field below critical magnetic field Hc, the ac loss is measured by the amount of ac loss versus the frequency and magnitude of applied ac currents and fields, and the strain tolerance is measured by critical current Ic degradation with strain.
    Type: Application
    Filed: January 17, 2008
    Publication date: July 23, 2009
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: James William Bray, Evangelos Trifon Laskaris, Kiruba Sivasubramaniam
  • Publication number: 20090173770
    Abstract: Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented. Solder attachment of connecting portions of insulation coated conductors having copper as a base material is carried out by melting lead-free solder alloy containing from 5.3 to 7.0 wt % copper (Cu), from 0.1 to less than 0.5 wt % nickel (Ni), with a remainder being tin (Sn), at a temperature ranging from 400° C. to 480° C.
    Type: Application
    Filed: February 17, 2009
    Publication date: July 9, 2009
    Inventors: Koichi Izumida, Yuki Takano, Hitoshi Abe, Toshiyuki Moribayashi, Koichi Hagio, Junichi Takenaka
  • Publication number: 20090151974
    Abstract: A coaxial cable may include an inner conductor, an outer conductor, and a dielectric material therebetween. The outer conductor may include a tubular bimetallic layer having a pair of opposing longitudinal edge portions at a longitudinal seam. The tubular bimetallic layer may include an inner metal layer and an outer metal layer bonded thereto. At least one of the opposing longitudinal edge portions may define at least one folded edge portion including an end portion of the outer metal layer extending beyond a corresponding end portion of the inner metal layer and being folded adjacent thereto and defining a non-joined interface therewith. The longitudinal seam may include a welded joint between at least portions of the outer metal layer.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Applicant: CommScope, Inc. of North Carolina
    Inventors: Alan N. Moe, Larry W. Nelson
  • Publication number: 20090072008
    Abstract: In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead. The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.
    Type: Application
    Filed: October 15, 2008
    Publication date: March 19, 2009
    Applicant: Mitsumi Electric Co. Ltd.
    Inventors: Itaru TAKEDA, Tomoyuki Kato, Yasuo Shoji
  • Publication number: 20080290141
    Abstract: This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near equiatomic titanium-nickel alloy) and related shape-memory and superelastic alloys. Nitinol shape memory alloys (SMAs), acquired in a form such as corrugated sheet, discrete tubes or wires, may be joined together using the newly discovered technique. Pure niobium when brought into contact with Nitinol at elevated temperature, liquefies at temperatures below the melting point and flows readily into capillary spaces between the elements to be joined, thus forming a strong joint. A series of diagrams of the interface at various stages of brazing is illustrated by FIG. 10.
    Type: Application
    Filed: September 30, 2005
    Publication date: November 27, 2008
    Applicants: The Regents of the University of Michigan, Board of Trustees of Michigan State University
    Inventors: John A. Shaw, David S. Grummon
  • Patent number: 6938816
    Abstract: A method is provided for diffusion bonding a first member (20) and a second member (3) to each other. According to this method, a first joint portion (24) of the first member and a second joint portion (34) of the second member are fitted to each other with a predetermined interference. Thereafter, the first and second members are heated under a condition substantially without oxygen, so that the first and second joint portions are diffusion bonded to each other.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: September 6, 2005
    Assignee: Asian Kogyo Kabushiki Kaisha
    Inventors: Tadayoshi Tominaga, Takio Suzuki
  • Patent number: 6821293
    Abstract: A patterned sheet having two long sides is wrapped around a mandrel. The mandrel is provided with at least one flat surface. The long sides of the sheet are secured adjacent to the flat surface of the mandrel and points along the long sides of the sheet are connected by laser welding or other connecting means. The laser beam is directed substantially perpendicular to the welding plane of the points to be welded, even if the weld points do not all lie on a single line parallel to the mandrel's longitudinal axis.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: November 23, 2004
    Assignee: Medinol Ltd.
    Inventor: Gregory Pinchasik
  • Patent number: 6805277
    Abstract: In a process of soldering an electric connector on a circuit board, the connector has an insulator and a plurality of leads mounted inside the insulator. Each lead has a first end extending into a soldering terminal to a bonding surface of the insulator. A soft solder paste is dispensed over a bonding surface of the circuit board. The soldering process inserts the soldering terminal of each lead in the soft solder paste and applies heat to the soft solder paste to bond the soldering terminal and the circuit board together. The direct insertion of the soldering terminal of the lead into the soft paste on the circuit board minimizes the contact area between the lead and the circuit board and prevents the solder paste from being unduly spread, causing short circuit. Furthermore, the yield and soldering reliability are increased and the production cost is reduced.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: October 19, 2004
    Assignee: Lotes Co., Ltd.
    Inventor: Ted Ju
  • Patent number: 6644535
    Abstract: A structural material includes a plurality of discrete, interwoven wires disposed between and fastened to two solid face sheets. Each of the plurality of wires further includes at least two points of contact with each of the two face sheets. Methods for fabricating the aforementioned structural material include an automated methodology for fabricating a relatively inexpensive truss core sandwich panel.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: November 11, 2003
    Assignee: Massachusetts Institute of Technology
    Inventors: Jeremy C. Wallach, Lorna J. Gibson
  • Patent number: 6637091
    Abstract: A method of making a face mask including the steps of providing a plurality of lengths of Grade 2, commercially pure titanium wire, having a diameter of from about 0.21 to about 0.24 inches; forming each length at room temperature to a desired bend angle by bending the member at room temperature using rotary bending apparatus to a first bend angle that is from about 1.25 to about 1.35 times greater than the desired bend angle; and welding each of the thus formed lengths to at least one other of the lengths in an ambient, oxygen containing environment.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: October 28, 2003
    Assignee: Mad Partners
    Inventors: P. David Halstead, Garry W. McNabb, David E. Wright
  • Patent number: 6629632
    Abstract: An apparatus and method for welding a shaft having an open seam defined between opposed longitudinal edges. The method comprising passing the shaft along its longitudinal axis through an array of pressure rollers which contact the surface of the shaft at a plurality of discrete points and compress the shaft by applying inwardly directed radial forces to the shaft. An electrical resistance welding assembly welds the seam while closed by the pressure rollers.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: October 7, 2003
    Assignee: IUSRD (Ireland) Limited
    Inventors: Robert G. J. Jack, Geoffrey Brook
  • Patent number: 6588648
    Abstract: During manufacture of certain hollow profiles suitable for use in car body construction the welded profiles are subjected to a further deformation process, namely hydroforming. At present the corresponding welding machines are charged manually. The invention relates to a method and a device for transferring hollow-profile blanks, characterized in that during transfer the positioned fusion faces of the blanks are pressed against each other at least in the area of the weld.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: July 8, 2003
    Assignee: Elpatronic AG
    Inventor: Peter Gysi
  • Publication number: 20030111512
    Abstract: A method of connecting a generally flat battery lead to at least one flat current collector of a polymer battery, comprising the steps of: bending a generally planar lead about at least one generally planar current collector tab to form a layered area, wherein at least one planar tab is disposed between planar portions of the lead with the lead wrapped around one edge of at least one tab; clamping the layered area between two weld fixtures of an ultrasonic welder; and vibrating the weld fixtures to ultrasonically weld together the battery lead and at least one current collector tab.
    Type: Application
    Filed: December 18, 2001
    Publication date: June 19, 2003
    Applicant: NTK Powerdex, Inc.
    Inventors: Ronald V. O'Connell, Mark L. Daroux, Shawn E. Thomas, Xuekun Xing
  • Patent number: 6568583
    Abstract: A conductive element having good solderability and the manufacturing method thereof. A metal wire having a circular section and tin-plated along its whole circumference is prepared and pressed by a pressing machine from the side directions until the metal wire becomes almost flat. By this, a strip of thin plate-like member is formed. Then, a conductive silicone base adhesive is applied to one surface (one pressed surface) of the plate-like member and dried. Thus, the conductive element comprising the plate-like member and the conductive elastomer joined to the pressed surface thereof is obtained.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: May 27, 2003
    Assignee: Kitagawa Industries Co., Ltd.
    Inventors: Hideo Yumi, Masaru Yagi
  • Publication number: 20020170940
    Abstract: This apparatus manufactures a welded tube by curling a metal strip T into a tube shape, heating the two edges thereof using an induction heating coil 6, and pressure welding the two edges using squeeze rolls 8. A ferrite core 21 for increasing heating efficiency that has a substantially circular arc shaped cross section is provided at a position on the top surface portion 25 of an impeder body 24 directly below the induction heating coil 6. A protective layer 29 formed from fluororesin is provided on the top surface of the impeder body and this protective layer catches spatter “c” generated during welding. The distal end of a cooling water supply tube 27 is embedded in a concave groove 26 in the impeder body 24 and the ferrite core 21 is cooled via a through passage 21a formed between the ferrite core 21 and a flat surface portion.
    Type: Application
    Filed: May 17, 2002
    Publication date: November 21, 2002
    Inventors: Takashi Kazama, Kazunori Ozaki
  • Publication number: 20020170941
    Abstract: A structural material includes a plurality of discrete, interwoven wires disposed between and fastened to two solid face sheets. Each of the plurality of wires further includes at least two points of contact with each of the two face sheets. Methods for fabricating the aforementioned structural material include an automated methodology for fabricating a relatively inexpensive truss core sandwich panel.
    Type: Application
    Filed: May 18, 2001
    Publication date: November 21, 2002
    Inventors: Jeremy C. Wallach, Lorna J. Gibson
  • Patent number: 6474532
    Abstract: The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The semiconductor chip has bonding regions thereon. A plurality of wires join to the circuitry and extend over the bonding regions of the semiconductor chip. The wires are pressed down to about the bonding regions of the semiconductor chip with a tool. The tool is lifted from the wires, and subsequently the wires are adhered to the bonding regions of the semiconductor chip. The invention also encompasses an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip joined to the substrate. Such apparatus comprises a support for supporting the substrate and the semiconductor chip.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: November 5, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Michael Bettinger, Ronald W. Ellis, Tracy Reynolds
  • Patent number: 6449834
    Abstract: Methods of making electrical conductors by twisting a plurality of strands to form a bundle, winding the bundle to form a coil, fusing some of the strands together, optionally drawing the bundle prior to winding and fusing utilising materials and coatings disclosed.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: September 17, 2002
    Assignee: Scilogy Corp.
    Inventors: Thomas O. Bales, Jr., Francisco Avellanet
  • Publication number: 20020092899
    Abstract: A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The applicator (60) and the solder depositing units (7, 8) are attachable to and removable from a placement section (13a) and are interchangeable with each other. Each of the solder depositing units (7, 8) includes a flux bath (15) for storing a flux liquid therein, a solder bath (16) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein and capable of releasably receiving the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath 16, whereby the solder is deposited on the core.
    Type: Application
    Filed: December 12, 2001
    Publication date: July 18, 2002
    Applicant: ShinMaywa Industries, Ltd.
    Inventors: Akira Miyoshi, Masahiro Ikeji, Nobuo Satou, Shigeru Sakaue, Tadashi Taniguchi
  • Patent number: 6367684
    Abstract: A method for smoothing and compacting a weld on a cylindrical support sleeve includes mounting the support sleeve on an abutment and moving a device across the support sleeve such that a roller on the support sleeve rolls on the weld under pressure so that it smooths and levels the weld. An arrangement for smoothing and compacting a weld on a cylindrical support sleeve includes, the abutment on which the support sleeve may be mounted, the device, and the roller.
    Type: Grant
    Filed: May 6, 1999
    Date of Patent: April 9, 2002
    Assignee: MAN Roland Druckmaschinen AG
    Inventors: Eduard Hoffmann, Alfons Grieser, Johann Winterholler
  • Publication number: 20010017312
    Abstract: An upper shearing blade 3 equipped with a protrusion 30 of a triangle-columnar shape and a lower shearing blade 4 equipped with a protrusion 40 of the same shape are applied onto the overlapped portion of metal plates 1 and 2 to be bonded, and then pressed into the metal plates 1 and 2 in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates 1 and 2 are not completely cut off. The operating loci of the upper shearing blade 3 and the lower shearing blade 4 are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates 1 and 2 are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.
    Type: Application
    Filed: December 14, 2000
    Publication date: August 30, 2001
    Applicant: HITACHI, LTD., POHANG IRON & STEEL CO., LTD.
    Inventors: kenji Horii, Yasutsugu Yoshimura, Tadashi Nishino, Takashi Kamoshita, Takayoshi Tomino, Fuminori Ishikawa, Takao Funamoto, Takashi Mashiko, Kenjiro Narita, Jong-Keun Kim, Ki-Chol Kim, Jong-Sub Lee, Hwang-Kyu Hwang, Jung-Sik Lee, Jin-Hee kim