Abstract: A computer-implemented method is described for detecting, identifying and locating an object feature in a ferromagnetic object. At least one hardware processor executes program instructions to: define a planned scan trajectory for scanning the ferromagnetic object with a sensor array comprising a plurality of magnetometer sensors, measure magnetic fields of the ferromagnetic object with the sensor array along an actual scan trajectory at locations adjacent to the ferromagnetic material to produce object scanning data representing magnetic characteristics of the ferromagnetic object along the actual scan trajectory. The actual scan trajectory includes deviation motion of the scanning array from the planned scan trajectory. The deviation motion is then compensated for to identify and locate the object feature in the ferromagnetic object. The compensation includes adjusting the object scanning data for the deviation motion and/or using a feature model that reflects the deviation motion.

Abstract: A multi-layered brazing sheet material including an aluminum core alloy layer, a brazing clad layer material on one face of the core layer, an inter-layer between the core layer and brazing clad layer material, and a water-side layer on the other face of the core layer. The core layer made from aluminum alloy having, in wt. %, up to 0.6% Si, up to 0.45% Fe, 0.6% to 1.25% Cu, 0.6% to 1.4% Mn, 0.08% to 0.4% Mg, up to 0.2% Cr, up to 0.25% Zr, up to 0.2% Ti, up to 0.3% Zn, balance aluminum and impurities. The brazing layer made from aluminum alloy having 6% to 14% Si and up to 2% Mg, balance aluminum and impurities. The inter-layer made from 1xxx-series aluminum alloy. The water-side layer made from 3xxx-series aluminum alloy having 0.5% to 1.8% Mn and 1% to 3.5% Zn.

Abstract: A weldment in which a first component defines a bore, a second component is received in the bore and a weld is employed to couple the second component to the first component. The first component has an isolation pocket formed about the bore such that an annular projection having an annular collar portion is formed. The isolation pocket is sized and positioned relative to the weld such that the annular collar portion is deflected about the base into a position that is radially inwardly from a position of the annular collar portion prior to the formation of the weld such that the isolation pocket controls axial shrinkage associated with the formation and cooling of the weld.

Abstract: Methods for forming a stacking interposer are provided that create a more compact and/or reliable interposer cavity. According to one method, a segmentation process that partially cuts a multi-cell, multi-layer PCB panel to a controlled depth along the internal walls/edges of a cavity region with each of the interposer cell sites defined within the PCB panel is used. The material within the cavity region is then removed (by routing) to a controlled depth to form the internal cavity for each interposer cell site. Pillars may then be removed from the PCB panel. As a result of the initial partial cuts of the internal walls of the cavity region, the corners of the cavities may have a square configuration for fitting over the top of a BGA/memory device (which has very square corners).

Abstract: A process for closing an opening in a surface of a component, and components formed thereby. The process entails forming a channel in the component surface so that the channel at least partially surrounds an opening at the component surface. An alloy is then deposited in the channel to form a crack-free deposit in the channel. A step is then machined that intersects the opening and is at least partially formed in the deposit. The step defines a recess that is at least partially surrounded by a peripheral portion of the deposit and has a surface recessed into the component surface. A cap is placed in the recess and welded to the peripheral portion of the deposit to define a weld joint that completely closes the opening. The surface of the weld joint is then machined to form a machined surface that is substantially flush with the component surface.

Abstract: Disclosed is a coupling member that enables a joint between a wooden member and a mating member to absorb vibration energy, and a method for producing the same and a joint structure using the same. The metal coupling member is embedded in the wooden member. The wooden member is connected with a mating member by the coupling member. The coupling member includes a metal rod-like main body portion to be embedded in the wooden member, and an inner rod portion protruding from the main body portion. The inner rod portion axially extends from a protruding portion thereof to a predetermined depth in the main body portion, has a periphery separated from the main body portion to allow axial displacement of the inner rod portion relative to the main body portion, and is integrally connected to the main body portion at the deepest part thereof.

Abstract: A novel method for attaching a hosel to a putter head is disclosed. A hosel having a hole is inserted into a putter head cavity and the cavity and hole in the hosel are filled with a fixative configured to permanently attach the hosel shaft to the putter head.

Abstract: A method for producing a hermetically gastight optoelectronic or electro-optical component with great robustness to heat and moisture is described. A housing cap is connected to a carrier in a hermetically gastight manner. Orifices in the housing cap are closed in a hermetically gastight manner by a window element. An electronic component with a housing has a housing cap, a carrier as base plate of the housing, and an interior space enclosed by the housing cap and the carrier. An optoelectronic or electro-optical converter element is arranged in the interior space. The housing cap is closed in a hermetically gastight manner by the carrier through a bonding connection of fused metal. The orifice is connected to the housing cap in a hermetically gastight manner by a window element along an edge metallization of the window element by a circumferential first seam of a fused metallic material.

Abstract: A conformal cooling method and mold includes a part producing mold having a fluid passage defined therein that includes a channel defined in a surface of the mold, a weld support received in the channel, and a bridge welded across the channel above the weld support for closing the channel and defining the fluid passage. To form the fluid passage, the weld support is installed in the channel defined in the mold surface and the bridge is welded across the channel above the weld support for closing the channel.

Abstract: An arrangement is provided for a helically undulated pipe made of metal, which has an end face extending along a turn of the thread of its undulation and a connecting element to be fastened to the pipe. The connecting element includes a pipe piece which has a helically extending inner surface corresponding to the turn of the thread of the undulation of the pipe. The pipe piece is mounted on the pipe in the undulation of the pipe. A metal ring is arranged on the pipe piece, where the pipe piece has sections with different inner diameters arranged one behind the other in the axial direction.

Abstract: Methods for providing a near-surface cooling microchannel in a component include forming a near-surface cooling microchannel in a first surface of a pre-sintered preform, disposing the first surface of the pre-sintered preform onto an outer surface of the base article such that an opening of the outer surface of the base article is aligned with the near-surface cooling microchannel in the first surface of the pre-sintered preform, and, heating the pre-sintered preform to bond it to the base article, wherein the opening of the outer surface of the base article remains aligned with the near-surface cooling microchannel in the first surface of the pre-sintered preform.

Abstract: A method of construction of a tungsten carbide/TSP insert for hard facing a wear surface comprises the steps of forming a tungsten carbide body (12) in a mold. After the molding step, a channel section slot (24) or pocket (24?) is created in the body before it has hardened substantially. The body is then heat-treated to harden it. A TSP body (32) is fitted in the slot/pocket (24/24?) so that it is a close sliding fit between the sides (18) of the slot, and is of the same depth as the slot. The TSP is (preferably) brazed into the slot. The insert has pips (30) on its edges (18) to facilitate welding to a substrate prior to a final brazing step.

Abstract: A crack-resistant member for preventing crack propagation, a method of preventing crack propagation, and method of assembly a tower are provided. The crack-resistant member includes at least one insert attached to at least one removed portion at a predetermined location along a girth weld and adjacent a heat affected zone of the tower. The at least one insert is positioned perpendicular to a weld direction and intersecting the girth weld. The at least one insert prevents crack propagation in the girth weld of the tower.

Abstract: A method for coating the base element of a cooling element used in connection with a metallurgical furnace or the like, said base element being mainly made of copper, at least partly with a metal coating involves a step wherein the metal coating is explosion welded to the base element of a cooling element mainly made of copper. A cooling element, particularly to be used in connection with metallurgical furnaces or the like, includes a base element mainly made of copper, in which base element there is arranged a cooling water channel system, said base element of the cooling element being at least partly coated with a metal coating. The metal coating is explosion welded to the base element that is mainly made of copper.

Abstract: In one disclosed embodiment, the present method for preventing void formation in a solder joint formed between two metallic surfaces includes forming at least one slit in a layer of solder to form a slit solder layer, positioning the slit solder layer between the two metallic surfaces, and heating the slit solder layer to form the solder joint, wherein the at least one slit forms an outgas alley to prevent void formation in the solder joint. Where solder joint width is a concern, the present method includes applying external pressure concurrently with heating. The outgas alley is formed to provide a ready avenue of escape for flux gasses produced during formation of the solder joint.

Abstract: A micro-electro-mechanical system (MEMS) microphone and a forming method therefore. The MEMS microphone comprises: a first substrate, the first substrate is provided with a first bonding face, the first substrate comprises an MEMS microphone component and a first conductive bonding structure arranged on the first bonding face, a second substrate, the second substrate is provided with a second bonding face, the second bonding substrate comprises a circuit and a second conductive bonding structure arranged on the second bonding face; the first substrate and the second substrate are oppositely fitted together via the first conductive bonding structure and the second conductive bonding structure.

Abstract: A method for beam welding a multi-sheet work stack includes providing a reduced thickness feature in a first sheet, positioning the first sheet adjacent to a second sheet to define a first welding interface, and positioning a third sheet adjacent to the second sheet to define a second welding interface. A laser or electron beam is directed through the first sheet at the feature to form a fusion weld at one of the welding interfaces. A second beam may be directed onto the other interface to form a second fusion weld. Providing a reduced thickness feature in the first sheet may include forming the feature with the beam and mechanically pre-forming the feature. One of the interfaces may be pre-heated using the beam, and the beam may be split using a beam splitter to form multiple beams. A welded assembly formed via the method is also disclosed.

Abstract: A double-walled tube includes: a plurality of double-walled tube forming members, each having an inner tube and an outer tube, connected by welding at welding portions of axis direction end portions thereof; and each of the welding portions of the double-walled tube forming members including a groove having a length in an axis direction set to be equal to or greater than ½ of a width of a weld bead formed by the welding at the welding portion.

Abstract: An assembly includes a first plate member with a first generally planar abutting surface and a second plate member with a second generally planar abutting surface. The first abutting surface being generally planar and having a plurality of micro reservoirs for storing brazing material. The first abutting surface and the second abutting surface being positioned adjacent each other and being joined by brazing material from the plurality of micro reservoirs.

Abstract: Provided are a side member from which a clad member for heat exchanger exhibiting excellent productivity and corrosion resistance while preventing poor adhesion can be produced in production of a clad member for heat exchanger by controlling the surface state and flatness, a method for producing the side member, and a method for producing a clad member for a heat exchanger by using the side member. A side member (A) consists of a core material and one or more layers of side member (A) applied onto one side or both sides thereof and being used in a clad member for a heat exchanger, wherein a plurality of periodic forms (B) of fine groove which become arcuate toward one direction of the side member (A) is formed on the surface of the side member (A).

Abstract: A sound-damped vehicle panel assembly, such as a dash panel, is attached to a structural member with one or more weld joints. The vehicle panel assembly may include a main panel member, a sound-damping patch, and a sound-damping adhesive layer arranged therebetween, where the patch covers at least a portion of an acoustically active region of the main panel member. The weld joints that attach the vehicle panel assembly to the structural member are preferably located at weld openings formed in the sound-damping patch and/or the sound-damping adhesive layer so that the weld joint can be formed without melting and vaporizing the adhesive during the welding operation, as such an operation would likely require additional ventilation equipment and could impact the quality of the weld joint.

Abstract: A target and backing plate assembly and method of making the same. The target and backing plate assembly provides a mechanical interlock between the target and backing plate in addition to diffusion bonding between dissimilar materials comprising the target and backing plate. An interlayer may also be used between the target and backing plate. A plurality of ridges, or other salient surface features on one of the target and backing plate are joined to corresponding members or channels on the other of the target and backing plate. The dissimilar materials of the target and backing plate fill negative angled cavities formed by the plurality of ridges and corresponding channels or members of the target and backing plate to accommodate the diffusion bonded dissimilar materials. A target and backing plate assembly with increased strength results.

Abstract: A honeycomb structure-forming die 1 has a die substrate 22 including a first plate-shaped member 23 having back holes 6 for introducing a raw forming material and a second plate-shaped member 24 having slits 5 for forming the material into a lattice shape. The first plate-shaped member 23 has columnar portions 8 where at least a part is zoned by a slit-shaped groove portion 7 corresponding with a shape of the slit 5 on a bonding face side 28 where the first plate-shaped member 23 is bonded with the second plate-shaped member 24. In the columnar portions 8, the ratio (L/T) of the height L of the columnar portions 8 to the minimum width T in an end face on the bonding face side 28 is within 1/3 to 3.5. Thus constituted die realizes high formability, and two plate-shaped members constituting the die substrate are hardly peeled from each other.

Abstract: A wheel resurfacing method and system for resurfacing a worn track wheel to its original profile are disclosed. The system comprises a support for maintaining the worn railway wheel, a welding device, a controller, and a surface processing device. The worn railway wheel's circumferential surface defining a flange and a tread surface is reconstituted using a welding material. The welding device and the worn railway wheel rotate one relative to the other at a predetermined rate to adaptively aggregate annular welding beads along the circumferential surface to form a curvilinear profile slanted away from the flange. A surface processing device is then applied to the welded layer to form a substantially uniform surface to reconstitute the worn railway wheel to its original profile.

Abstract: This invention relates to semiconductor lasers, and more particularly, to a cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the present invention effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively elongates the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

Abstract: The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, attaches the insert to the backing plate and forms at least one cooling channel between the insert and the backing plate.

Abstract: Copper (Cu)-to-Cu bonding techniques are provided. In one aspect, a bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one copper pad embedded in a first insulator and at least one via in the first insulator over the copper pad, wherein the via has tapered sidewalls. A second bonding structure is provided having at least one copper stud embedded in a second insulator, wherein a portion of the copper stud is exposed for bonding and has a domed shape. The first bonding structure is bonded to the second bonding structure by way of a copper-to-copper bonding between the copper pad and the copper stud, wherein the via and the copper stud fit together like a lock-and-key. A bonded structure is also provided.

Abstract: Fabrication techniques for and examples of metallic composite materials with high toughness, high strength, and lightweight for various structural, armor, and structural-armor applications. For example, various advanced materials based on metallic-intermetallic laminate (MIL) composite materials are described, including materials with passive damping features and built-in sensors.

Abstract: The invention provides products of manufacture, e.g., biomaterials and implants, for cartilage maintenance and/or formation in-vivo, in-vitro, and ex-vivo, using nanotechnology, e.g., using nanotube, nanowire, nanopillar and/or nanodepots configured on surface structures of the products of manufacture.

Abstract: The invention concerns a process for joining a first member (1) comprising an aluminum alloy to a second member (2) comprising a titanium alloy and having at least one edge with a thickness e, comprising the steps of (i) chamfering said edge of said second member into a tapered truncated shape having on a first side a first tapering angle ?1, on a second side a second tapering angle ?2 and a minimum thickness t, wherein ?1 and ?2 are greater than or equal to zero, the sum of ?1 and ?2 is between 10° and 50° and t is between 0.05 e and 0.3 e, (ii) placing said first member and said chamfered edge of said second member (21) in an abutting relationship defining a geometry to be weld-brazed (3), (iii) heating the surface areas of said members adjacent the abutment to a temperature above the melting temperature of said aluminum alloy and below the melting temperature of said titanium alloy, in the presence of an inert gas (5) and of a filler metal (4) to obtain a weld-brazed joint.

Abstract: A method is provided for welding a laminated metal sheet to a workpiece. The laminated metal sheet includes an outer metal sheet and an inner metal sheet bonded together by a polymer material that impedes the flow of weld current. A punch is applied against the outer metal sheet and driven through the laminated metal sheet to create a hole and also create an annular metallic burr that bridges across the polymer material layer between the outer metal sheet and the inner metal sheet. A weld electrode is positioned against the outer metal sheet at the punched hole and weld current is conducted through the first annular metallic burr to create an electric resistance weld between the laminated metal and the workpiece.

Abstract: A device and a method for applying brazing material to an at least partially structured metal foil include a) providing at least one flat metal foil, b) shaping the at least one metal foil to produce a structure, and c) applying brazing material to the at least one metal foil. Steps b) and c) are carried out discontinuously and at least partially together. The device and method are preferably used in the production of metallic honeycomb bodies for the treatment of exhaust gases in vehicles.

Abstract: A method for processing elongate substrates, including forming a plurality of parallel elongate openings (102) through a semiconductor wafer (104) to form a corresponding plurality of elongate substrates (106) between the openings, each of the elongate substrates (106) having opposite edges coplanar with opposite surfaces of the wafer, opposite faces (112) orthogonal to the wafer surfaces, and opposite ends by which the elongate substrates are interconnected; and applying securing means (402) to at least one of the opposite edges of each elongate substrate to engage the edges and thereby inhibit relative movement of the elongate substrates.

Abstract: The present invention relates to an electronic device for providing improved heat transporting capability for protecting heat sensitive electronics and a method for producing the same. The present invention also relates to uses of the electronic device for various applications such as in LED lamps for signalizing, signage, automative and illumination applications or a display apparatus or any combinations thereof.

Abstract: A method of producing a welded joint between components of a turbomachine is described, in particular for the repair of components, wherein components are welded to one another along common edges in such a way that a pocket-like recess is incorporated in a first component, in particular in a replacement part, with which recess the first component is slipped onto a second component, in particular a component to be repaired, such that the second component bears with an end edge on a base of the pocket-like recess, and that the first component and the second component are then welded to one another. According to the invention, at least one cutout is incorporated in the first component in addition to the pocket-like recess in order to minimize heat transfer and the formation of component deformations during the subsequent welding of the components.

Abstract: Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB.

Abstract: The present disclosure is related to methods for bonding TPG elements to at least a first metal material for forming a heatsink. The heatsinks have an improved thermal conductivity in the X-Y plane.

Abstract: A die for forming a honeycomb structure may realize a sophisticated formability and superior resistance to wear. The die may be provided with a die base including two surfaces, one being provided with slits of honeycomb shape, and the other being provided with back holes through which a forming material may be introduced. The die base may include: a die precursor obtained by stacking and bonding a first member (one surface of the die base) and of tungsten carbide-based super hard alloy and a second member (the other surface of the die base) and of a metal material that causes at least up to three phase transformation of martensite transformation, bainite transformation, and pearlite transformation by cooling of an austenite phase together. Tensile and compressive stresses in a mutually bonded surface of the two plate-like members are 1000 MPa or less.

Abstract: A method of assembling two parts of which the dimensions of one of the parts or the final assembly are to be adhered to with precision. In the part whose dimensions are to be adhered to with the highest level of precision, a groove is machined to have a depth greater than a depth of a zone constituting a closed outline delimiting a space where the assembly exercises constraints, located between these dimensions and the zone, so as to introduce some elasticity.

Abstract: A mechanically welded structure comprising a first flat and thin metallic structural element extending in a plane and delimited by a straight edge on one side, and a second metallic structural element welded to the straight edge of the first structural element, or welded to an intermediate element connected to the straight edge and inserted between the first and second structural elements, the second structural element exerting, at least one point of the straight edge, a force resolving into at least one component extending in said plane perpendicularly to the straight edge, wherein the first structural element has a stress-relieving slit extending parallel to the straight edge and situated facing the point at which said force is exerted.

Abstract: A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Abstract: Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints are step or similar joints that self-center the case, provide lateral support during braze assembly, and provide increased surface area that prevents braze material from exuding from the joints. The end of the ceramic case that is brazed to the metal ring need not be specially machined. The shell has a reference electrode on one end and an active electrode on the other, and is externally coated on selected areas with conductive and non-conductive materials.

Abstract: A system and method is disclosed for aligning an integrated circuit die on an integrated circuit substrate. A plurality of deposits of deformable material are placed on the substrate where the integrated circuit die is to be aligned. In one advantageous embodiment a stamping tool is indexed to a first tooling hole and to a second tooling hole in the substrate. The stamping tool imprints the deposits of deformable material to a tolerance of less than one hundred microns with respect to the first and second tooling holes. The imprinted portions of the deposits a form a pocket for receiving the integrated circuit die. This enables the integrated circuit die to be precisely aligned on the substrate in three dimensions.

Abstract: A method of connecting a metal (1) with a ceramic material (2) comprises the steps of providing a through-hole (3) in the ceramic material and positioning the metal (1) to be connected to the ceramic material (2) proximate to the ceramic material (2) with the through-hole (3). Subsequently, the metal (1) is melted (7) proximate to the through-hole (3). A pressure difference prevails between the side of the ceramic (2) remote from the metal and the side of the metal (1) remote from the ceramic material (2). A larger pressure prevails at the side of the metal (1) remote from the ceramic material (2). The pressure difference causes the melt (7) to be pressed into the through-hole (3) in the ceramic material (2). The through-hole (3) has such a shape that, after solidification, the solidified material (14) and the through-hole (3) have a complementary locking form.

Abstract: A method of forming a stress isolating joint on a dump body of on an off-highway rubber-tired haulage vehicle includes providing a first plate having an elongated edge, a top side, and a face, and providing a second plate including an elongated edge. Overlapping the first and second plates to define a widened seam bounded at least in part by the elongated edges of the respective plates, and welding along the elongated edge of the first plate to join the elongated edge of the first plate to an adjacent surface of the second plate. The weld and at least a portion of the second plate disposed along the widened seam cooperate to permit the second plate to apply a resisting load to the face of the first plate in response to the application of a load against an opposing face of the first plate.

Abstract: A method of manufacture of a body assembly of a refuse vehicle includes forming a first, second and third components of the assembly. A first and second locating constructions are formed in the first component. The second component is formed so as to have a first mating structure which is adapted to mate with the first locating construction in the first component so as to uniquely locate the second component with respect to the first component. The third component is formed so as to have a second mating structure which is adapted to mate with the second locating construction in the first component so as to uniquely locate the third component with respect to the first component.

Abstract: The present invention enables to firmly assemble a steel-frame structure. To form a steel-frame structure or to join two steel members being reinforcing members thereof, a slip-proof surface having one or plural concentric higher parts and grooves is formed on the joined surface of one side or both sides of the steel members, and these two steel members are clamped by a connecting member that passes through connecting holes in the state where the first and the second slip-proof surfaces are mutually engaged or not engaged. Thus, joining force between the joined surfaces is increased.

Abstract: A method for assembling a rigid industrial food-cooking container is disclosed wherein metal sheets respective recesses and projecting elements are first assembled and then shaped to a specific predetermined geometry for receiving the industrial food and the sheets temporarily connected and assembled at right angles, and welded or brazed to cover the entire contact surface between the sheets to provide a leak proof container for the industrial cooking of the food.

Abstract: The present invention pertains to low temperature pressure consolidation methods which provide for bonding of target material (10) to the backing plate material (15) capable of withstanding the stresses imposed by high sputtering rates. The sputter target assemblies (5) in accordance with the present invention are preferably comprised of target materials (10) and backing plate materials (15) having dissimilar thermal expansion coefficients and incorporate internal cooling channels (20). In the preferred embodiment, the resulting bond and the formation of the cooling channels (20) are cooperative.

Abstract: The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, attaches the insert to the backing plate and forms at least one cooling channel between the insert and the backing plate. A filler metal secures the outer perimeter of the insert to the backing plate in order to eliminate leakage from the cooling channel during sputtering of the sputter target.