Abstract: In a process for continuous production of longitudinally welded metal tubing, in which a metal strip is withdrawn from a strip supply, gradually shaped into a tubing with an open longitudinal slit, and the longitudinal slit is sealed by soldering or welding, a lubricant is introduced into the open slit tubing before sealing.

Abstract: A holder secured to the tip of a cutting torch supports a guide about which a hole is to be cut in a steel pipe or sheet. A fixture, magnetically attached to the pipe or sheet supports a magnetically retained fitting to be tack welded to the cut hole at the desired angular orientation relative to the pipe or sheet. After the fitting is tack welded, the fixture is removed and the weld is completed.

Abstract: A method including the acts of providing a semiconductor device having a plurality of misalignment ruler markers formed therein for measuring removable layer opening misalignment in the X and Y directions, a bond pad and the passivation layer with an opening therein down to the bond pad. A removable layer is formed over the semiconductor device and includes an opening therein down to the bond pad. Preferably this action includes depositing, patterning and developing a dry photoresist film layer over the semiconductor device with an opening therein down to the bond pad. The next act includes measuring the misalignment of the opening in the passivation layer by counting the number of misalignment ruler markers visibly exposed by the opening in the X-direction and also the Y-direction.

Abstract: Two members 10 and 20 are welded together by cutting a groove 41 having a determined cross-sectional shape using a cutting tool 60 along the abutted portion between the two members 10 and 20, inserting a filler member 30 substantially having the same cross-sectional shape to the groove so as to substantially eliminate the gap at the abutted portion, temporarily welding together the projections 12, 22 and the filler member 30, and thereafter, friction stir welding the members 10, 20 and the filler member 30 together completely using a rotary tool 81.

Abstract: A steel pipe is welded to a threaded connector that has an end with a desired nominal inner diameter. Initially, the inner diameter of the steel pipe may be out of a tolerance range of the nominal inner diameter of the connector. A swage is forced over an end of the pipe, reducing an outer diameter and an initial inner diameter of the end of the pipe. The swage is dimensioned to provide the end of the pipe with an inner diameter that is less than the nominal inner diameter of end of the connector. A die is then forced into the end of the pipe, the die having an outer diameter sized to increase the inner diameter of the end of the first tubular member to the nominal inner diameter of the end of the second tubular member. A weld groove is machined on the end of the pipe and the ends are abutted and welded at the weld grooves.

Abstract: A method for joining a first part to a second part wherein the first part comprises machine cast iron and the second part comprises case-hardened steel comprises abrading a surface on each of the parts which are to be welded together with a groove, fitting the abraded surfaces together to form a welding groove and high-energy beam welding within austenitic welding wire for joining the parts together.

Abstract: In a fuel tank for a motor vehicle having shells tightly connected together, positioning aids are arranged in proximity to a weld. The positioning aids permit an accurately fitting assembly of the shells prior to welding. This makes the fuel tank particularly inexpensive to manufacture.

Abstract: An improved method for joining mating surfaces of a metallic sputter target and a backing plate of aluminum, aluminum alloy or aluminum matrix composite material to form a sputter target/backing plate assembly comprises the steps of roughening the mating surface of either the sputter target or the backing plate to form a plurality of salient portions; depositing an intermediate layer comprising nickel on that mating surface; pressing the sputter target and the backing plate together along the mating surfaces so as to disrupt the mating surfaces; and holding the sputter target and the backing plate in contact at a temperature just below the melting points of the sputter target and backing plate materials to promote diffusion bonding. In an especially preferred form of the invention, the mating surface on the harder of the sputter target or the backing plate is roughened by machining a series of concentric grooves.

Abstract: A method of manufacturing a hermetically sealed chamber, including preparing two aluminum or aluminum alloy material members which face each other, forming a first extending convex portion on a surface to be metal-bonded of one of the two aluminum or aluminum alloy material members, where the first convex portion extends in a manner to make an enclosure, forming a second extending convex portion on a surface to be metal-bonded of the other of the two aluminum or aluminum alloy material members, where the second convex portion extends in a manner to make a corresponding enclosure, and receiving internally packaged parts therebetween, fitting the first extending convex portion and the second extending convex portion, and causing the first extending convex portion and the second extending convex portion to be metal-bonded by press-forging.

Abstract: A method of glass frit bonding wafers to form a package, in which the width of the glass bond line between the wafers is minimized to reduce package size. The method entails the use of a glass frit material containing a particulate filler material that establishes the stand-off distance between wafers, instead of relying on discrete structural features on one of the wafers dedicated to this function. In addition, the amount of glass frit material used to form the glass bond line between wafers is reduced to such levels as to reduce the width of the glass bond line, allowing the overall size of the package to be minimized. To accommodate the variability associated with screening processes when low volume lines of paste are printed, the invention further entails the use of storage regions defined by walls adjacent the glass bond line to accommodate excess glass frit material without significantly increasing the width of the bond line.

Abstract: Low temperature diffusion bonding methods and target/backing plate assemblies bonded by the methods are disclosed. In accordance with the methods, copper and/or cobalt targets are bonded to backing plate members via the use of an interlayer selected from the group consisting of group Ib or group VIII metals. The interlayer is interposed between intended bonding surfaces of the target and the backing plate, and the assembly is diffusion bonded at low temperatures of about 190° C.-400° C. The method results in increased tensile strength of the bonded assembly while not, in the case of copper targets, resulting in undesirable grain growth. When cobalt targets are bonded in accordance with the invention, desirable magnetic properties, such as magnetic pass through flux, are maintained while a strong bond is achieved.

Abstract: Methods of forming mold cavities suitable for hook and loop fastening are disclosed, along with effective hook construction and hook and loop fastener products that have an ultrathin cross-section. Photochemical techniques are employed to form plates that define hook-form mold cavities, and, alternatively, chemical etching is employed following preforming of the cavities and machining. Hooks having three-dimensional tapers with enhanced loop engaging characteristics are disclosed. By utilization of special surface finishes and tolerances, hook fasteners, having ultrathin cross-sections are realized, that pave the way for practical use of touch fasteners in a wide range of new areas.

Abstract: A spark plug includes a metal shell, an insulator coaxially disposed within the metal shell, and a center electrode coaxially disposed in the insulator. The metal shell has a substantially cylindrical base portion, and the base portion has a lower surface with a recess formed therein. A bimetallic ground electrode is affixed to the lower surface of the base portion at the recess thereof. The ground electrode has a central core formed of a first thermally conductive metal which may include copper, and an external sheath surrounding the core, the sheath being made of a second metal which includes nickel. The recess in the lower surface of the metal shell is preferred to be provided as an annular grove extending therearound. The present invention also encompasses a method of making a spark plug, including a step of placing a ground electrode adjacent a lower surface of a spark plug shell, aligned with a recess thereof, such that a tip end of the ground electrode enters into the recess.

Abstract: In apparatus and method for shaping a lead frame for a semiconductor device, there are provided a lower die having a concave shape for forming a step portion on the lower surface of the lead frame through a slope shape, an upper die having a convex shape which is downwardly moved to press a part of the lead frame in cooperation with the lower die and form a step portion through a slope shape on the upper surface of the lead frame, and a press portion which is disposed around the upper die and presses the outer portion of the lead frame at the outside from the semiconductor element mount portion, wherein the lower die is divided into an outside portion having an inside surface whose outlook is coincident with that of the inside surface of the press portion, and an inside portion located so as to be adjacent to and extend inwardly from the outer portion, and the outside portion and the inside portion are designed so as to be relatively movable in up-and-down direction.

Abstract: A tubular part is brazed into coaxial relationship with the bore in a metal body part having a counterbore for receiving the tubular part. In a first embodiment a tubular sleeve is fitted within the bores of the metal body and the tubular part. The parts are then heated and vibrated while the braze material is melted. In a second embodiment a frustoconical plug is inserted into the coaxial bores of the parts and the parts are again heated and vibrated. The parts are allowed to cool until the braze material hardens, after which the vibration is terminated. The remaining sleeve or plug is then machined out of the two bores leaving the tubular part brazed to the metal body.

Abstract: Multi-layer injection molding apparatus having integral multi-layer melt dividing bushings seated in the melt distribution manifold for dividing a first melt passage extending to annular melt channels in heated nozzles. Matching melt channels machined in the front face of the first layer and the rear face of the second layer of each melt dividing bushing form a melt conduit which branches from an inlet to two spaced holes extending through the second layer. A pair of matching melt channels machined in the front face of the second layer and the rear face of the third layer of each melt dividing bushing form two melt conduits, each of which branch from one of the holes through the second layer to two of four spaced holes through the third layer. The four holes through the third layer align with four melt bores leading to the annular melt channel in one of the heated nozzles. A second melt passage may extend through a central bore in each melt dividing bushing to a central melt channel in the heated nozzle.

Abstract: The present invention is a method of sealing a metal vacuum structure (vacuum bottle) for evacuating a space S closed by component members (an inner shell 2 and an outer shell 3) through an evacuation port and then sealing the evacuation port.

Abstract: A tubular body having integral branch tubes for use in a distribution tank of a car air conditioner and a method for producing such tubular body. The tubular body is produced almost solely by a deformation process. The process for forming the tubular body includes a swelling step for swelling the sheet metal at predetermined positions to create cylindrically swelled portions by several stages, a boring step for boring the top end of the swelled portion to create branch tubes, a channel creating step for creating mating channel throughout the whole length of the sheet metal, a rounding step for rounding the sheet metal to form a tube having a desired sectional shape, and a mating step for mating the end of the rounded sheet metal with the mating channel. The production process further includes a divider creating step for dividing the space in the tubular body into a plurality of compartments by squeezing the tubular body.

Abstract: A tubular part is brazed into coaxial relationship with the bore of a second part having a counter bore for receiving the tubular part by providing a tubular sleeve within the bores of the two parts prior to brazing. After the braze material has cooled the tubular sleeve and any braze material around it is machined out of the bores. In a second embodiment a tubular part is brazed into a recess of the second part before a bore is drilled therein. After the parts are brazed together the bore is drilled through both the tubular part and the second part.

Abstract: A method and apparatus for constructing a metal foil and solder assembled object (10), is described. The apparatus includes a final mold (400) having a recessed final pattern (408). The sides (408A) of the final pattern form an obtuse angle with the floor (408B) of the final pattern. To create the object, material pieces (12), rods (14) and accessory pieces (16) are positioned in the final pattern. Prior to positioning the material pieces in the pattern, the edges (12A) of the material pieces are covered by foil (18). Once the material pieces, rods and accessory pieces are in place in the pattern, the pieces and rods are soldered together using conventional soldering techniques. The material pieces are positioned adjacent the sides of the pattern such that when the edges of the pieces are soldered, the solder (20) comes in contact with the sides of the pattern approximately half the distance up the edge of the material pieces.

Abstract: A laminated structural panel is formed of top, bottom, and one or more intermediate layers of material having low strength at high temperature and with perforated high temperature, high strength materials interleaved between the top, bottom and intermediate layers. Brazing material is clad on the top and bottom layers and the intermediate layer or layers may be entirely of brazing material or clad on both sizes with brazing material, such that when the assembled stack is subjected to high temperature in a high vacuum environment brazing material is caused to melt and fill the perforations in the high strength material. A particular application is for structural panels, used as shelves in manufacturing electronic chips or displays where aluminum is advantageous because it does not outgas or release particles under the high temperature, high vacuum environment used to make the product. Aluminum, however, does not maintain its strength and stiffness at the high temperatures involved.

Abstract: In a method for sealing a vacuum double wall container made of metal which the vacuum double wall container made of metal having a space portion is formed by joining the inner container and the outer container made of metal at respective mouths, an exhaust hole is pierced on an appropriate position of a frame on a bottom portion of the outer container of the vacuum double wall container made of metal in order to evacuate the space portion, and the exhaust hole is sealed with a brazing material in a vacuum heating furnace, a method for sealing a vacuum double wall container made of metal includes the steps of piercing an exhaust hole projected on an appropriate position of a frame of an outer container for evacuating a space portion, installing a member for inhibiting flow more projecting than the exhaust hole and a guide for covering the exhaust hole at a periphery thereof, mounting a brazing material which is melted at a medium temperature of 630˜750° C.

Abstract: A method for forming solder balls that have improved height on an electronic substrate such as a silicon wafer and devices formed are disclosed. In the method, after solder bumps are deposited by a conventional method such as evaporation, electroplating, electroless plating or solder paste screen printing, the solder bumps are reflown on the substrate in an upside down position such that the gravity of the solder material pulls down the solder ball and thereby increasing its height after the reflow process is completed. It has been found that a minimum of 5%, and preferably about 10% height increase has been achieved. Another benefit achieved by the present invention novel method which is associated with the increase in the solder ball height is a corresponding increase in the pitch distance between the solder balls by at least 5%.

Abstract: The present invention relates to vibration damped laminate articles having improved force (torque and/or pressure and/or stress) retention and decreased or eliminated spring back. An area defining a through hole and/or the periphery of the article is welded. Methods of making the articles and fastening assemblies including the articles are provided.

Abstract: A method of fabricating an electric generator main lead bushing is provided for attaching a flange to a hollow conductor. In one application typically used for an air side flange, a gap is formed in the flange that is sized to receive an end of the conductor, a groove is formed in the conductor end, a braze alloy insert is placed into the groove, the conductor end is inserted into the gap, and the flange and the conductor are heated and cooled to provide a seal between the flange and the conductor. In another application typically used for a gas side flange, a counterbore is formed in an inner portion of the hollow conductor that is sized to receive the flange, a groove is formed in the counterbore, a braze alloy insert is placed into the groove, the flange is fitted into the counterbore, and the flange and the conductor are heated and cooled to provide a seal between the flange and the conductor.

Abstract: This invention is directed to an improved bonded sputter target/backing plate assembly and a method of making these assemblies. The assembly includes a sputter target having side and bottom bonding surfaces bonded within a recess in an underlying backing plate, the recess having top and side bonding surfaces. The method of forming the bonded assembly includes treating the bonding surfaces of either the sputter target or backing plate recess by roughening at least a portion of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro-inches. The method further includes orienting the sputter target within the backing plate recess to form one assembly having a parallel interface defined by the top and bottom bonding surfaces and a side interface defined by the side bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.

Abstract: A sputter target assembly includes a cobalt target diffusion bonded to an aluminum or copper backing plate by means of a titanium interlayer. The sputter target assembly may be made by hot vacuum pressing or, preferably, by hot isostatically pressing the target, interlayer and backing plate together. Preferably, the titanium interlayer is provided as a foil, but may also be formed on a mating surface of either the target or the backing plate by electroplating, sputtering, electroless plating, or plasma spraying. The target may be advantageously machined with grooves defining salient points prior to providing the interlayer.

Abstract: A method by which semiconductor wafers (10, 12) can be solder bonded to form a semiconductor device, such as a sensor with a micromachined structure (14). The method entails forming a solderable ring (18) on the mating surface of a device wafer (10), such that the solderable ring (18) circumscribes the micromachine (14) on the wafer (10). A solderable layer (20, 26, 28) is formed on a capping wafer (12), such that at least the mating surface (24) of the capping wafer (12) is entirely covered by the solderable layer (20, 26, 28). The solderable layer (20, 26, 28) can be formed by etching the mating surface (24) of the capping wafer (12) to form a recess (16) circumscribed by the mating surface (24), and then forming the solderable layer (26) to cover the mating surface (24) and the recess (16) of the capping wafer (12).

Abstract: Aluminum-lithium alloy sheets which are welded together are examined to identify regions requiring repair. A grid is applied to the sheet about the region requiring repair, and the region to be repaired is ground out and rewelded. Residual stresses are relieved by planishing yes to cause localized plastic deformation in the repaired region. The grid is used as a guide to restoring the original dimensions of the sheet in a manner which tends to reduce in-plane shrinkage. The reduced in-plane shrinkage in turn tends to reduce undesired tensile residual stresses. The planishing also tends to work-harden the weld filler.

Abstract: In a method for connecting two workpieces together by welding, the workpieces are placed on clamping tables by a feed unit (F) and are joined together by a welded seam. First, the workpieces are positioned in the feed unit (F). The feed unit (F) is then traversed between the clamping tables and deposits the workpieces on them. Simultaneously with its feed movement, the unit (F) expels the workpieces welded together in the preceding cycle.

Abstract: A tillage sweep assembly includes a base sweep with a central fore-and-aft slot. A support strap or stem includes a corresponding fore-and-aft extending protrusion which mates with the slot. A filet weld connects the top of the base sweep to the support strap with the weld extending around the strap. A plug weld is added to the underside of the sweep in an offset or lifted portion of the bottom of the base sweep above the cutting plane of the sweep. The extra plug weld adds strength to the existing filet weld joint and significantly reduces the chance of inadvertent base sweep loss. The location of the plug weld above the cutting plane protects the plug weld from wear. The strap or step of the sweep assembly is slotted for ease of pitch adjustment, and the base sweep has wings with substantial fore-and-aft extending end portions to retain working width over the life of the sweep.

Abstract: In a temperature-controllable tool (11) or mould for producing plastic mouldings with at least one cavity (12) to accept the mould of the plastic moulding to be produced, at least one inlet or outlet aperture (13, 14) which are interconnected via channels (15) and form a temperature-control agent channel system for cooling or heating the mould cavity (12), the shot time (cycle time) is shortened, maintenance is made easier and higher quality injection-moulded components are obtained in that the run of the channels (15) is matched to the outer shape of the mould cavity (12) and the geometry of the channels (15) is matched to the temperature profile in the plastic moulding.

Abstract: This invention is directed to an improved method for making a bonded sputter target/backing plate assembly as well as assemblies produced therefrom. The assembly includes a sputter target having a bonding surface which is bonded to the bonding surface of an underlying backing plate. The method of forming the bonded assembly includes treating one of the bonding surfaces, either by roughening at least a portion of one of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro inches, or by drilling a plurality of holes in one of the bonding surfaces. The method further includes orienting the sputter target and backing plate to form an assembly having an interface defined by the bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.

Abstract: A control rod assembly for a nuclear reactor, wherein a plurality of absorber tubes are arranged and welded in a side-by-side array, the improvement wherein each absorber tube is formed with an elongated slot extending substantially the entire length of the absorber tube on one side of the tube, and with an elongated tab extending substantially the entire length of the absorber tube on a diametrically opposed side of the tube such that, for adjacent absorber tubes, a joint is formed wherein the tab of one tube is located within the slot of the other.

Abstract: Platelet assemblies are formed from bondable platelets, such as diffusion-bondable, brazable, or adhesive-bondable platelets, with void regions in the platelets to form channels or open spaces in the finished platelet assembly. To improve the response of the platelet assembly to pressure bonding as well as to post-bonding fabrication processes such as forming, machining and welding, the void regions are filled with a sacrificial material which transmits the load of the applied pressure in the same manner as the remainder of the platelet, and yet which is removable from the finished platelet assembly by either thermal or chemical liquefaction after all potentially damaging fabrication procedures have been performed on the platelet assembly.

Abstract: A die plate for the underwater granulation of thermoplastic material is formed with a base plate of an iron alloy, a hard annular cutting plate of titanium-carbide alloy, and an intermediate buffer layer containing nickel between the base plate and the cutting plate to equilibrate heat stresses due to different coefficient of thermal expansion of the base and the cutting plates. The intermediate layer is formed with a thickness of between 0.5 and 2 mm by hot-isostatic pressing a nickel-containing metal powder between the plates such that the intermediate layer is diffusion welded to the plates. Two nickel layers with an intermediate titanium-containing plate can also be formed. Also an ansenitic layer can be formed between the nickel layer and the base plate.

Abstract: A method of interconnecting circuit modules (30) to mother boards (50) each having a plurality of mating solder pads (32, 52) is available. The solder pads (32, 52) have respective pairs of arms (40, 42) and (54, 56) with a venting channel (36, 58) formed between each pair of arms to vent solder medium when the solder pads are reflowed to interconnect the circuit modules and mother boards.

Abstract: The connection of structural component parts in adjusting devices for seats, in particular for motor vehicle seats, is disclosed. In connecting structural component parts for adjusting devices for seats, the structural component parts to be rigidly connected with one another are welded in their connecting region. In order to prevent distortion of these structural component parts caused by the welding process, one structural component part has at least one bevel which projects toward the connection side and can be pressed into at least one recess of the other structural component part during a capacitor impulse welding process, this recess substantially conforming to the bevel with respect to shape and dimensions.

Abstract: A method of producing a circular metal article reinforced by fibres in selected parts of its cross-section is described in which a metal blank of the article is formed and provided with at least one annular groove opening in the axial direction, preforms of reinforcing fibre and filler metal are placed in the groove which is then closed by a metal plug, and the assembly is isothermally forged to produce the article in a single forging step which serves to compress the preforms, weld the assembly together, and shape the article. Such articles may be used for machining high performance rotors for turbojet engines. Apparatus for use in the method is also described.

Abstract: A mold (1) has two molding members (4, 6) each comprising two plates (11, 13; 15, 17) secured to one another. In the contact surface of one of the plates (13, 15) a groove (19) has been provided to form a cooling duct. In order to reduce the dimensions of such a molding member (4, 6) the two plates (11, 13; 15, 17) are secured to one another by means of a soldering process. In comparison with the known method of securing the plates of a molding member to one another by means of bolts this method has the advantage that no screwthread has to be provided in the plates and no additional sealing, for example by means of an O-ring, has to be provided between the plates in order to seal the cooling duct. As a result of this, the plates can be thinner so that the molding members (4, 6) and the mold (1) can be smaller.

Abstract: A wall of a mold assembly for the continuous casting of steel has a steel back-up plate. A thermally conductive plate composed of copper or a copper alloy is bolted to the back-up plate and a relatively thin copper or copper alloy facing is soldered to that surface of the thermally conductive plate which faces away from the back-up plate. The thermally conductive plate may be omitted and the facing soldered to the back-up plate. The facing contacts and cools a continuously cast strand travelling through the mold. When the facing becomes cracked or worn beyond repair, the solder joint is melted to remove the facing and a fresh facing is soldered to the thermally conductive plate or back-up plate.

Abstract: Disclosed are an ink jet printhead and method of manufacturing the same.

Abstract: An article and a method for making contact areas (221, 222, 230) on an optical waveguide (100, 200) are provided. A waveguide (100, 200) having a first surface (112) and a second surface (113) with a first indent (101) located on the first surface (112) and a second indent (102) located on the second surface (113) and a groove (104) is made interconnecting the first and second indents (101, 102). A low temperature melting member (111) is placed in the first indent (101) on the first surface (112) and is melted, thereby flowing the low temperature melting member into the groove (104) and into the second indent (102) located on the second surface (113).

Abstract: A method of brazing a plurality of components by heating the components superposed on each other with a brazing material interposed between adjacent bonding surfaces of the components, wherein the brazing material has a relatively low degree of wettability with respect to the material of the components to be brazed, and is applied to a patterned film of a high-wettability metal having a relatively high degree of wettability with respect to the brazing material, which film is formed on at least one of bonding surfaces of the components, so as to cover predetermined areas of the bonding surface while leaving adjacent non-bonding areas of the bonding surface uncovered so as to restrict the flow of brazing material.

Abstract: The present invention is a brazed fitting suitable for use as a hydraulic coupling for pressurized fluids. A male component has a tapered surface which mates and creates an interface with a similarly tapered surface of a female component. A brazing material is heated to diffuse and alloy within the interface, forming a connection between the surface portions which is stronger than the metal being connected. A groove on the male component retains the brazing material in the middle of the surface portions so that after the components are joined in an interference fit, the assembly is heated and the brazing material melts in the middle of the interface and connects together the mating surfaces by diffusing and alloying. The counterbore of the female component does not require a base, and the resulting structure has improved fluid flow characteristics.

Abstract: A method of brazing and apparatus therefor wherein two elements are bonded together using pre-formed fillet material. In accordance with a first alternative embodiment, the pre-formed fillet material comprises a depression formed on a first surface of one of the elements by a punching operation. The preformed fillet material also comprises a protrusion formed on a second surface opposite the depression formed by the punching operation. The invention also comprises a method of reducing bending stress in a Coriolis flow tube by bonding the flow tube and a brace bar with preformed fillet material.

Abstract: Methods for and preforms for making fiber reinforced composites are disclosed. According to the invention, preforms which allow composites to be machined are provided. Also, preforms with a uniform debulking ratio are provided with non-uniform fiber placement. In addition, methods of forming composites have less material waste and allow more than one composite to be consolidated at one time.

Abstract: A method is provided for fabricating metal matrix composites. Optical or reinforcing fibers, which may be in the form of monofilaments, mats, or tow, are consolidated into a metal matrix alloy. Grooves may be provided in the metal matrix material for holding and positioning the fibers. A transient liquid diffusion bonding agent in the form of a powder may be blended with powdered filler material, such as powdered matrix material, to provide a vehicle for consolidating the fibers into the metal matrix. The fibers and the blended powder are placed between layers of the metal matrix material and the whole structure is heated under minimal pressure to liquefy the bonding agent. The liquid bonding agent wets each fiber and interdiffuses with the matrix material, resulting in rapid isothermal solidification of the alloy and consolidation of the fibers in the matrix.

Abstract: This invention relates to the solid state joining of metal alloy pieces in order to form an integral structure. Such structures of this type, generally, allow the metal alloy pieces to be joined by local interfacial strain control.

Abstract: A method of bending and soldering corners of a folding printed-circuit board in which holes are drilled on the printed-circuit board at points at where the circuits intersect the joints of segments of the folding printed-circuit board; V-shaped grooves are cut on the printed-circuit board along the joints of segments, permitting the printed-circuit board to be bent into a desired shape; and the drilled circuits are connected by soldering adequate amount of tin solder in the holes on the circuits.