Abstract: A power cable assembly includes a power cable core. The power cable core has a longitudinally extending cooling tube comprising a thermally conductive wall defining an interior channel for circulating, between a coolant inlet and a coolant outlet of the cooling tube, a coolant medium; a longitudinally extending electrical conductor configured to be coupled via first and second connectors to respective electrical connections of a power distribution system; and a first insulating layer surrounding the power cable core. The electrical conductor is arranged to surround the cooling tube at least partially such that at least a portion of an external surface of the thermally conductive wall is provided in direct contact with a corresponding portion of the electrical conductor over a heat exchange region so as to transfer heat from the electrical conductor to the coolant medium circulating in the interior channel of the cooling tube.

Abstract: A press-fit terminal for insertion into a conductive through-hole of a substrate includes an elastic deformation part with an outer and inner surface, the press-fit terminal includes, in sequence, a copper or copper alloy base, nickel or a nickel alloy barrier layer, a tin or tin alloy layer and an indium top layer. The press-fit terminal shows reduced whisker formation.

Abstract: The present invention relates to a radiation generating tube. The radiation generating tube includes an envelope including an insulating tubular member having at least two openings, a cathode connected to one of the openings of the insulating tubular member, and an anode connected to the other of the openings of the insulating tubular member. At least one of the cathode and the anode and the insulating tubular member are bonded at a bonded portion with an electrically conductive bonding member; and the bonded portion bonded with the electrically conductive bonding member is coated with a dielectric layer.

Abstract: One aspect provides a feedthrough device for an implantable medical device. The feedthrough includes a ferrule having a metal that is configured to be welded to a case of the implantable device. An insulator is substantially surrounded by the ferrule and shares an interface therewith, the insulator being a glass or ceramic material. Conductive elements are formed through the insulator providing an electrically conductive path through the insulator. There is no braze, solder, or weld joint at the interface between the ferrule and the insulator and that there is no braze or solder at interfaces between the insulator and the conductive elements.

Abstract: There are provided a press-fit terminal which has an excellent whisker resistance and a low inserting force, is unlikely to cause shaving of plating when the press-fit terminal is inserted into a substrate, and has a high heat resistance, and an electronic component using the same. A press-fit terminal comprises: a female terminal connection part provided at one side of an attached part to be attached to a housing; and a substrate connection part provided at the other side and attached to a substrate by press-fitting the substrate connection part into a through-hole formed in the substrate. At least the substrate connection part has the surface structure described below, and the press-fit terminal has an excellent whisker resistance.

Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.

Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.

Abstract: A process for producing a fleece having metallic wire filaments, includes at least the following steps: a) forming a layer including wire filaments; b) producing first cohesive connections between at least some of the metallic wire filaments in a first joining process; and c) producing second cohesive connections between metallic wire filaments in a second joining process. A process for producing a honeycomb body having at least one fleece, a fleece, a honeycomb body, an apparatus and a vehicle using fleeces in the treatment of exhaust gas from motor vehicles, are also provided.

Abstract: In various embodiments, a metallic structure includes first and second clad structures each comprising a protective layer disposed over a steel layer, a joint joining the steel layers of first and second clad structures, and, directly connecting the protective layers of the first and second clad structures, a layer of metal powder disposed in contact with (i) the joint, (ii) the protective layers of the first and second clad structures, and (iii) a portion of at least one of the steel layers proximate the joint.

Abstract: In various embodiments, a method of joining clad structures includes providing first and second clad structures each comprising a protective layer disposed only partially over a steel layer such that an edge region of the steel layer is exposed, joining the first and second clad structures at their respective edge regions, thereby forming a joint, and cold spraying a metal powder over and in contact with (i) the joint, (ii) the edge regions, and (iii) the protective layers of the first and second clad structures, thereby directly connecting the protective layers of the first and second clad structures with a layer of unmelted metal powder.

Abstract: A multi-chip stack structure and method of fabrication are provided utilizing self-aligning electrical contact arrays. Two or more arrays of interconnection contacts are provided, with one array being a rough aligned contact array, and a second array being a high bandwidth contact array. The rough aligned contact array has larger contacts and at least a portion thereof which melts at a substantially lower temperature than the melting temperature of the contacts of the high bandwidth contact array. By positioning two integrated circuit chips in opposing relation with the arrays mechanically aligned therebetween, and applying heat to melt the contacts of the rough aligned array, the two chips will rotate to align the respective contacts of the high bandwidth contact arrays, thereby achieving improved connection reliability between the structures.

Abstract: Selectively reinforced blanks are used in a hydroforming process to produce completed components having a predetermined shape and sufficient structural integrity to perform their desired function. To reinforce those components, reinforcing patches are added to the blank prior to hydroforming. Planar patches can be bonded to planar blanks or arcuate patches can be bonded to tubular blanks. In so doing, the hydroforming process produces a complete component, which does not require additional manufacturing steps to reinforce it. Additionally, by selectively using the reinforcing patches, the overall weight of the component is not unduly increased.

Abstract: A method for fabricating bumped semiconductor components and electronic assemblies, such as multi chip modules, is provided. The method includes forming semi cured, electrically conductive, elastomeric bumps on electrodes of a semiconductor component (e.g., die, chip scale package), or on electrodes of a mating component (e.g., PCB, MCM substrate). The bumps include an adhesive matrix material and dendritic metal particles. The adhesive matrix material is in a semi cured condition having adhesive qualities for bonding, but with a structural rigidity for supporting the dendritic particles to enable penetration of oxide layers on the electrodes. The semi cured adhesive bumps permit the bumps to be cured without the necessity of externally generated compressive forces.

Abstract: The invention relates to an oven for reflow soldering objects such as printed circuit boards. A temperature differential is established between the top and bottom surfaces of the board to allow gases liberated from solder paste within through-holes to escape, thereby preventing the formation of voids. The oven provides a flow of gas at a first temperature from an upper gas supplying means to the top side of the board. A flow of gas at a second temperature is directed at the bottom side of the board by a lower gas supplying means. According to one aspect of the invention, a portion of the gas supplied by the upper gas supplying means is captured by the lower gas supply means and is heated or cooled to the second temperature. According to another aspect of the invention, a number of pairs of independantly controllable upper and lower gas supplying means are arranged along a conveyor to provide a temperature profile to perform reflow soldering.

Abstract: The specification describes techniques for attaching double sided circuit boards having plated through holes to interconnection substrates using solder bump arrays. The through holes are filled with a high melting point solder which allows solder bumps to be located directly on the through hole thus saving board area and reducing the interconnection length.

Abstract: A method for manufacturing an X-ray tube that simplifies the manufacturing process, which method includes a stem unit assembly process, a high-temperature brazing process, an X-ray tube assembly process, and a low-temperature brazing process. In the stem unit assembly process, cathode pins are inserted through high-temperature brazing material and the cathode pin holes provided on the bottom plate member of the stem unit. In the high-temperature brazing process, the stem unit assembled in the above-described process is heated to the brazing temperature of the high-temperature brazing material used in the stem unit. In the X-ray tube assembly process, the focusing electrode, ceramic bulb, and output window are placed over the stem unit with low-temperature brazing material interposed between each component. In the low-temperature brazing process. the X-ray tube assembled in the above-described process Is heated to the brazing temperature of the low-temperature brazing material used in the X-ray tube assembly.

Abstract: A high temperature thick-film hybrid circuit is characterized by a surface-mount circuit component that is electrically interconnected with a conductor. The surface-mount circuit component of the thick-film hybrid circuit is bonded to the conductor with a soldering technique employing dual-solder layers. The dual-solder layers enable component attachment to the conductor at a temperature below the maximum processing temperature of the component, while forming a solder joint that exhibits suitable adhesion properties at temperatures in excess of 165.degree. C. The dual-solder layers can be chosen to inhibit tin diffusion from the solder, silver leaching from the conductor, and the formation of a brittle intermetallic at the solder-conductor interface.

Abstract: The method for soldering a chip to a substrate to form a module and then soldering the module to a circuit board includes selecting a three level hierarchy of solders by the temperature required to melt. By this method, a module can be soldered to and de-soldered from a circuit board without affecting adversely the solder between the chip and the substrate. The package formed by this method is free of faults that are caused frequently during both manufacture and service.

Abstract: A femoral component of a knee prosthesis, including a cobalt-based alloy substrate and a titanium fiber metal pad bonded thereto by means of an interlayer of a cobalt-based alloy including nickel. More specifically, a method of bonding a titanium porous surface to a cobalt-based alloy in an orthopaedic implant device, by first applying an interlayer of a cobalt-based alloy including nickel to the substrate and then bonding a porous structure to the interlayer. In one embodiment, an interlayer of L-605 is first applied to a substrate of Co--Cr--Mo by diffusion bonding at approximately 2200.degree. F. and then a fiber metal pad of CP-titanium is diffusion bonded to the interlayer at approximately 1650.degree. F. A layer of CP-titanium may optionally be placed intermediate the fiber metal pad and interlayer before the second diffusion step. In an alternative embodiment, MP-35N alloy may be substituted for the L-605 alloy.

Abstract: A method is provided for electrically connecting a first electronic component which is not resistant to a reflowing temperature and a second electronic component which is resistant to the reflowing temperature to a substrate.

Abstract: A method is provided for making a passenger car body structure which has a panel assembly forming at least part of a side, the roof, and end of the floorplate. Each panel has inner and outer spaced metal sheets and a cellular metal core brazed to the sheets and maintaining them spaced apart. To join the panels, a metal connecting member is joined to at least one of the inner and outer sheets and has a projection for use in welding the panel to the neighboring panel. The projection extends in the lateral direction of the panel and is preferably of material thicker than the general sheet thickness of the sheets. A frame member of the body structure may be welded to the panels at the joint.

Abstract: A method for making a gas chamber for photometric measuring equipment comprises providing a metal frame with recesses on opposite sides establishing a web and at least one opening in the web and having solder surface areas; providing at least two calcium fluoide panes, said panes each having a rim portion; is improved by providing rim surface portions of the panes about to face the recess-web portion of said metal frame with a plurality of layers, by (i) physical vapor depositing a thin chromium nickel layer, (ii) physical vapor depositing thereon a nickel layer, and (iii) by physical vapor depositing thereon a gold layer; vapor depositing on the web portion around the opening of said recesses a gold layer; providing at least two solder elements of basically ring-shaped configuration respectively to be interposed between the web and the panes, the soldering elements being configured so that between their respective outer contour and walls of the recesses a solder flow space obtains when the solder elements ar

Abstract: A process is disclosed from mounting through-hole components having closely-spaced electrical leads to a printed board (PCB) using solder paste. The process comprises applying conventional solder paste to alternating through-holes in an array of through-holes, inserting the through-hole component, applying solder paste to the remaining through holes on the opposite side of the circuit board and subsequently melting the solder (typically in a reflow oven) to form both a mechanical and an electrical connection of the through-hole component to the printed wiring board. Practice of this process alleviates the problem for solder bridges forming between adjacent leads or through-holes. Moreover, this process allows a PCB to be equipped with both surface mount and through-hole components without the need for a separate wave soldering operation to secure the through-hole devices.

Abstract: A method of producing a thermally stable diamond compact having a metal layer bonded to a surface thereof is provided. The thermally stable diamond compact comprises a mass of diamond particles containing diamond-to-diamond bonding and a second phase uniformly distributed through the diamond mass. The metal of the metallic layer is molybdenum, tantalum, titanium or like high melting refractory metal, nickel or an alloy containing a dominant amount of any one of these metals.

Abstract: In a sealed structure consisting of ceramic members opposing each other and a frame coupled to the ceramic members and defining an He-tight chamber with the ceramic members, the melting point of a joint member for bonding one of the ceramic members to the frame is lower than the melting point of another joint member for bonding the other of the ceramic members to the frame so that rebonding can be made.

Abstract: A package for enclosing, protecting and cooling semiconductor integrated circuit chips. The package includes a generally planar substrate with the chips positioned thereon. Signal connections are provided between at least some of the chips. A heat sink is positioned in contact with the chips and includes microchannels through which a cooling fluid flows for purposes of transferring heat generated by the chips to such fluid. Manifolds are provided to direct the fluid to and from the microchannels, and microcapillary slots may be formed on the heat sink surface adjacent the chips to receive liquid to generate attractive forces between the heat sink and chips to facilitate heat transfer. Circuitry is provided to distribute power through the package and to the chips.

Abstract: A method is provided for use with non-contacting torque sensors. Many torque sensors use a sheet of magnetostrictive material wrapped about the shaft whose torque is to be measured. The methods used to wrap and affix the sheet of magnetostrictive material induce a prestress into the sheet, which leads to early saturation of the magnetostrictive material. The prestress diminishes the useful range of the torque sensor. As a solution, a method is provided for bonding a magnetostrictive material sheet to a shaft while minimizing stress of the magnetostrictive sheet. By bending a magnetostrictive material sheet and a carrier sheet about the mandrel and bonding the sheets together at a first preselected temperature, cooling them to form a cylinder having a magnetostrictive material outer layer and a carrier inner layer, and bonding the cylinder to a shaft at a second predetermined temperature, the stresses induced in the magnetostrictive sheet are minimized.

Abstract: A printing screen for screen printing fabrication substances such as solder paste has an aperture formed therein so that the screen may be placed on a substrate surface with a pre-mounted device extending through the aperture. A metal cap is bonded to the screen over the pre-mounted device to protect the device against damage during a subsequent screen printing operation. Different elements may, therefore, be bonded to a substrate in completely independent steps without the need for fluxing operations in later bonding operations.

Abstract: A method of providing improved electrical and physical connections between the electrically conducting terminals of an electronic component and the conductors of a printed circuit board by utilizing a high temperature solder material formed in mounds on defined areas of the conductors, coating the mounds with low temperature solder paste and mating the terminals of the component to the mounds by forcing them through the low temperature solder coatings prior to reflowing and cooling the low temperature solder.

Abstract: A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a first step; joining the semiconductor sandwiches and the carrier unit together with a low-melting solder in a second step; performing the first and second soldering steps without flux in a gas from the group consisting of hydrogen and forming gas; and preventing a mixture of the high-melting solder and the low-melting solder during the second step.

Abstract: Disclosed is a vacuum-heat-insulated cooking utensil and a method of manufacturing the same. Inner and outer containers are prepared each having a tubular side wall and an end wall closing the end of the side wall. The inner container is positioned in the outer container with the respective bottoms being in contact with each other through a first brazing material, with the other ends of the side walls fitted to each other with a gap which constitutes a vacuum sealing section, and with an annular space being defined between the side walls. A second brazing material having a melting point higher than that of the first brazing material is positioned at the vacuum sealing section. An assembly of the containers and the brazing materials is placed in a vacuum furnace. The furnace is evacuated to evacuate the annular space. Temperature within the furnace is raised above the melting point of the second brazing material to melt the first and second brazing materials.

Abstract: This is a process relating to improvements in the soldering of headers to conventional radiators. Tubular members of the radiator extend through holes in the header. The tubes are initially sealed to the header with a solder having a high temperature melting point T.sub.1. Infrared heat heats the header to a temperature T.sub.2 which is less than T.sub.1 but above a lower temperature T.sub.3 which is the melting temperature of a second solder. Upon the header reaching a selected temperature T.sub.2, a selected amount of the second solder in a molten state is poured in the header to puddle the entire pan area of the header, and allowed to cool to form a very strong soldered connection.

Abstract: An improved apparatus and method for mass soldering electrical and electronic components populating both the top and bottom surfaces of substrate circuit boards or the like in a single pass is described. The circuit boards pass through a mass soldering station first, and after a timed interval the circuit boards pass through a solder reflow station. The timed interval allows heat transfer through the circuit boards to reach its maximum.

Abstract: Mounting of leaded components on one side of a PCB and surface mounting components on the other side of the PCB creates problems. The pressure of the lead ends projecting through the PCB prevents the use of a mask for applying solder paste for the mounting of the surface mounting components. Attaching surface mounting components initially by adhesive prior to wave soldering also causes problems. In the present invention leaded components are inserted and the lead ends crimped. The board is then turned over, solder paste applied by individual applicator nozzles to the lead ends and to solder pads on the circuit pattern. The surface mounting components are then positioned with contact areas aligned with the solder pads and the whole reflow soldered. The process can be repeated for surface mounting components on the same side as the original leaded components, with or without the insertion of further leaded components on the same side as the original surface mounting components.

Abstract: A plasma arc spray overlay of cladding metals is used over joints between clad metal pieces to provide a continuous cladding metal surface. The technique permits applying an overlay of a high melting point cladding metal to a cladding metal surface without excessive heating of the backing metal.

Abstract: Method of manufacturing a blade wheel including setting a plurality of blades into a first jig, positioning an annular core member thereover with mating projections on the blades with slits on the core member, welding at the mating points, setting the sub-assembly thus produced onto a shell member held in another jig with claw members of the blades engaging peripherally located slots in the shell member, and securing the two together with an annular retainer member with grooves engaging other claw members on the blades being spot welded to the shell member.

Abstract: A method of butt welding titanium-clad steel plates whereby the steel portions of the abutting plates are first welded together, then the portions of the steel plates adjacent to the titanium portions are metallized with a refractory metal coating, which coating is compatible both with the steel layer and with the titanium portions, then titanium is cast into the space between the titanium plates by a known method to complete a butt weld between the titanium clad steel plates, having continuous titanium and steel segments.

Abstract: There is disclosed a process and apparatus for manufacturing flexible, shielded coaxial cable exhibiting improved magnetical screening capabilities wherein a tubular outer conductor is concentrically formed about an inner conductor with spacer means being disposed in the annulus between conductors. Accordingly, about the inner conductor including spacer means therefore, there is formed an inner component tube of a conductive material by the continuous forming in a lengthwise direction of a metal band into a tube having longitudinal edges welded together in a continuous, longitudinal welded joint. Concurrently, at least one further component tube is formed concentrically about the inner component tube by the lengthwise deformation of a second metal band of a ferromagnetic material into a second tube having opposed longitudinal edges which are also welded in a longitudinal direction in a continuous, longitudinal welded joint.

Abstract: An improved wall construction and method of fabrication is disclosed in which a wall assembly is comprised of a base metal layer of mild steel with a bonded intermediate layer of copper and a bonded layer of corrosion resistant material containing a fusion weld joining the steel base metal members with the root of the fusion weld abutting an inlaid insert of the corrosion resistant material, a fusion weld joining the layer of corrosion resistant material of the members to each other and to the inlaid insert of corrosion resistant material to provide a relatively smooth surface in the corrosion resistant layer, with the intermediate copper layer removed from the weld areas.

Abstract: A housing for circular piston combustion engines of trochoid type is produced with at least one annular shell having an inner peripheral wall in the shape of a multi-arcuate trochoid, an outer peripheral wall, and end walls parallel to each other and adjoined to the ends of the shell, end pieces parallel to each other having end walls parallel to each other and an inner and an outer peripheral wall. In the case of a multiple engine at least one end piece constitutes a middle piece between neighboring shells.

Abstract: A metal composite material having an aluminium surface layer firmly bonded on a substrate material consisting of a metal other than aluminium is produced by cold pressure bonding the metal substrate material to an aluminium foil superimposed thereon, subjecting the bonded material to a diffusion heat treatment at a temperature lower than the melting points of both the aluminium foil and the substrate material and, if desired, hot pressure bonding the bonded material to an aluminium material superimposed on the aluminium foil layer of the bonded material at a temperature lower than the melting point but not lower than the recrystallizing point of the aluminium material.

Abstract: A cable includes a tubular multi-layer electric conductor, electric insulation surrounding the electric conductor, and an outer cable jacket surrounding the electric insulation. An inner tubular member of titanium or alloyed stainless steel is accommodated in the electric conductor and defines a channel for a cooling medium such as water. At least one of the layers constituting the electric conductor is a circumferentially complete tubular element surrounding or surrounded by a layer comprising a plurality of juxtaposed elongated electric conductor elements. In the region of contact of the electric conductor with the inner tubular member, there is provided at least one groove extending longitudinally of the cable for conducting the cooling medium which escapes from the cooling channel in case of damage to the inner tubular member to the ends of the cable so as to indicate the occurrence of such damage.