Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

Abstract: A mobile pipe fusion assembly system includes a fusion machine skid comprising a flat cross-sectional area whereon a pipe fusion machine rests, a forward skid comprising a flat cross-sectional area whereon a first pipe stand rests, and a rear skid comprising a flat cross-sectional area whereon a second pipe stand rests. The fusion machine skid is coupled to the forward skid by a first coupling. The fusion machine skid is coupled to the rear skid by a second coupling. The system is configured such that when the forward skid is pulled along a length of the pipe, the forward skid pulls the fusion machine skid via the first coupling and the fusion machine skid pulls the rear skid via the second coupling.

Abstract: A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.

Abstract: A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

Abstract: Provided is a method for removing an electronic socket from a printed wiring board. The method comprises placing an embrittlement sheet over an electronic socket on a printed wiring board. The electronic socket is mounted to the printed wiring board using a plurality of hidden solder joints. The method further comprises causing the embrittlement sheet to melt. The melted embrittlement sheet wets the plurality of hidden solder joints. The electronic socket is removed from the printed wiring board by breaking the embrittled solder joints.

Abstract: Disclosed are embodiments of forming porous copper on the end of a copper pillar. The embodiments may be used to remove solder from selected locations on a chip or laminate substrate.

Abstract: According to some embodiments, a method for processing an electronic component associated with a portable electronic device by a conveyor system subsequent to removing the electronic component from a housing of the portable electronic device, where the conveyor system includes a container that is capable of carrying the electronic component, is described. The method can include depositing, at a receiving station of the conveyor system, the electronic component within a cavity of the container. The method can further include while moving the container that carries the electronic component from the receiving station in a direction towards a removal station of the conveyor system: monitoring a temperature of the electronic component, and in response to determining that the temperature of the electronic component exceeds a temperature threshold range associated with a thermal event: cooling the electronic component by dissipating thermal energy associated with the thermal event.

Abstract: An apparatus for bonding a mask includes a body and a pressing unit on the body. The pressing unit has a gas outlet for spraying pressing gas toward the bonding area of the mask.

Abstract: A melting tool control apparatus comprises a drive mechanism, a melt processing assembly configured to perform a melt process, a receiving module that receives input of three-dimensional coordinate information of a first point where the melt process is to be performed and input of a position information indicating a position different from the first point, and a process control module configured to control the melt processing assembly to perform the melt process when the distal end is at the first point.

Abstract: Systems and methods for moving a substrate to a vision system using a robot; using the vision system to determine where a braze material is to be applied to the substrate; moving the substrate to a braze dispenser using the robot; applying a braze material to the substrate using the braze dispenser based on the determination from the vision system; and using the vison system to determine whether to apply additional braze to the substrate, including for the substrate of a component for gas turbine engine, such as configured for use in an aircraft.

Abstract: System (2) for automatically applying a coating element (4) to a support surface comprises a heating device (1) for applying the coating element (4) along an application path of the support surface, by administration of heat obtained by the Joule effect, comprising a first electrode (5) and a second electrode (6) which can be connected to an electric power generator and are configured to form a part of an electric circuit, a portion of the coating element (4) being able to be arranged between the first electrode (5) and the second electrode (6), so as to close the electric circuit, such that the Joule effect heats the portion of the coating element (4) following a flow of current in the electric circuit, the overall configuration of the heating device being such that the first electrode (5) and the second electrode (6) are able to be moved with respect to the coating element (4) during application of the coating element (4) to the support surface, and an automatic movement device (3) being able to move the de

Abstract: Disclosed is a solder punch tool and method of using the same. The solder punch tool includes an extensible rod, such as a graphite rod, extensible from a first end of the solder punch tool, and a metal punch on an opposite end of the solder punch tool. Optionally, an A/C power cord and a light may each be removably attachable to the solder punch tool. In use, a user may melt solder clogging a hole in a printed circuit board, push a portion of the extensible rod through the hole and the molten solder, break off a portion of the extensible rod extending through the hole in the printed circuit board, and push such broken portion of the extensible rod through the hole using the metal punch so as to clear the hole to receive a replacement component.

Abstract: A rework process includes attaching a first bond head to a first semiconductor package. The contact pads of the first semiconductor package are bonded to contact pads of a second semiconductor package by solder joints. The rework process further includes performing a first local heating process to melt the solder joints, removing the first semiconductor package using the first bond head, and removing at least a portion of solder from the contact pads of the second semiconductor package.

Abstract: A system for disassembling a drive pinion assembly of a starter motor is disclosed. The drive pinion assembly includes a drive gear and a pinion member coupled to the drive gear through a mounting hole defined in the drive gear. The system includes a base member for supporting the drive pinion assembly. The base member includes a through hole to align with the mounting hole of the drive gear. The system further includes a pin member slidably received in the through hole and an actuating member disposed around the base member. The actuating member is rotatable about a rotational axis defined by the base member. The actuating member includes a cam lobe for moving the pin member towards the mounting hole of the drive gear based on movement of the actuating member about the rotational axis to disassemble the pinion member from the drive gear.

Abstract: A detaching apparatus includes a bench, a first supporting member attached to the bench, a convey system, a positioning member, a second supporting member, and a detaching member. The convey system is attached to the first supporting member for conveying a circuit board. The positioning member is attached to the first supporting member for positioning the circuit board. The second supporting member is attached to the bench and aligning with the first supporting member. The detaching member is attached to the second supporting member and includes a sliding bracket moving vertically relative to the bench, a moving block moving horizontally in the sliding bracket, a blade attached to the moving block, and a vacuum suction cup attached to the moving block and aligning with the blade.

Abstract: A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.

Abstract: A method of forming an integrated circuit (IC) package is disclosed comprising: (a) removing oxides from side surfaces of terminals of the IC package; (b) substantially covering an underside of the terminals of the IC package; and (c) forming a solder coating on the side surfaces of terminals of the IC packages while covering the underside of the terminals of the IC package. The solder coating on the side surfaces of the terminals protects the terminals from oxidation due to aging and subsequent processes. Additionally, the solder coating on the side surfaces of the terminals substantially improves the solderability of the IC package to printed circuit boards (PCBs) or other mountings. This further facilitates the inspection of the solder attachment using less expensive and complicated methods.

Abstract: The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion.

Abstract: A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

Abstract: Systems and methods for bonding include selectively heating an initial location of a sample to melt a bonding layer at an interface between a first layer and a second layer of the sample. The heating is propagated in a direction away from the initial location such that a melt front of the bonding layer is translated across the interface to provide a void free bond between the first layer and the second layer.

Abstract: A method of repairing a damaged notch fillet radius of a turbine blade shroud includes a replacement notch fillet radius and a hardface nugget. The damaged notch fillet radius is blended out and a hardface structure positioned proximate the damaged notch fillet radius is removed. A replacement notch fillet radius is formed with weld filler and the hardface nugget is welded to at least a portion of the replacement notch fillet radius.

Abstract: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

Abstract: A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.

Abstract: A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.

Abstract: A wheel resurfacing method and system for resurfacing a worn track wheel to its original profile are disclosed. The system comprises a support for maintaining the worn railway wheel, a welding device, a controller, and a surface processing device. The worn railway wheel's circumferential surface defining a flange and a tread surface is reconstituted using a welding material. The welding device and the worn railway wheel rotate one relative to the other at a predetermined rate to adaptively aggregate annular welding beads along the circumferential surface to form a curvilinear profile slanted away from the flange. A surface processing device is then applied to the welded layer to form a substantially uniform surface to reconstitute the worn railway wheel to its original profile.

Abstract: A method of laying a pipeline is described in which both internal and external weld passes are performed in order to weld together the pipe sections. The method includes arranging a pipe section adjacent to the end of a pipeline thereby defining a circumferential joint to be welded, performing an external weld pass, with for example GMAW—MIG torches, on the root of the joint to be welded during which weld material is deposited in the root of the joint to be welded, thereby forming a root weld, and then performing an internal weld pass, with for example a GTAW—TIG torch, on the root weld during which the root weld is melted and re-shaped. The method has particular application in relation to pipes clad with corrosion resistant alloy.

Abstract: An apparatus and a process for the manufacture of a solder-bump adhered wafer substrate for use in the semiconductor industry, comprising one or more of the following steps including: arranging a first compressive member and a second compressive member in an opposed, compressibly displaceable, spaced-apart relationship, with a pattern plate disposed therebetween with the pattern plate having a plurality of aligned through-holes arranged thereon; filling the through-holes with a molten solder; compressing the solder and the pattern plate between the first and second opposed compressive members to compact the solder therein and cleans the pattern plate of excess solder; chilling the pattern plate to solidify the molten solder in the through-holes; and removing the pattern plate from the spaced-apart compressive members to produce a wafer with solder bumps thereon.

Abstract: A wheel resurfacing method and system for resurfacing a worn track wheel to its original profile are provided. The system comprises a support for maintaining the worn railway wheel, a welding device, a controller, and a surface processing device. The worn railway wheel's circumferential surface defining a flange and a tread surface is reconstituted using a welding material. The welding device and the worn railway wheel rotate one relative to the other at a predetermined rate to adaptively aggregate annular welding beads along the circumferential surface to form a curvilinear profile slanted away from the flange. A surface processing device is then actuated to smooth the welded layer to form a substantially uniform surface to reconstitute the worn railway wheel to its original profile.

Abstract: The process for manufacturing the semiconductor device and the apparatus, which achieve stable production of semiconductor devices with improved connection reliability, is presented. First terminals of circuit boards 1 are arranged to face the corresponding bumps of semiconductor chips 2, respectively, and the resin layer 3 is disposed between the respective first terminals and the respective bumps to form laminates, and the laminates are simultaneously compressed from a direction of lamination, while heating a plurality of laminates. In such case, the diaphragm 54 disposed in a heating furnace 51 is abutted against a plurality of laminates or a member 531 to elastically deform the members while a plurality of laminates is heated in the heating furnace 51, so that laminates are simultaneously compressed from a direction of lamination, while heating thereof in a vacuum.

Abstract: A method of forming wafer level bump includes forming at least one pre-bump on a first surface of a wafer, and performing a bump reflow process to the pre-bump while the first surface faces downward, such that a bump is formed.

Abstract: A reflow oven chamber assembly that is configured to be installed within a reflow oven chamber of a reflow oven includes a chamber housing disposed within the reflow oven chamber, one or more heating elements disposed in the chamber housing, and one or more compression box assemblies disposed in the chamber housing. The compression box assembly includes a compression box housing having an intake port located adjacent the heating element, an intake duct disposed in the compression box, and a diffuser plate disposed above the intake duct. The intake duct has an inlet opening in fluid communication with the intake port of the compression box housing and an outlet opening. The compression box assembly is configured to draw heated air into the compression box housing from the reflow oven chamber through the intake port and into the inlet opening of the intake duct and exhaust air out of the outlet opening of the intake duct to the diffuser plate.

Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.

Abstract: Reflow soldering apparatus comprising a vapour chamber in communication with a reservoir of heat transfer fluid such that a volume of vaporised heat transfer fluid is created and held in the vapour chamber by heating of the heat transfer fluid. A heating chamber is provided for receiving a board and a transportation mechanism is provided to transport vapour, and condensate formed from the vapour, from the volume of vaporised heat transfer fluid to the heating chamber. The transported vapour and condensate applies heat to the heating chamber for the reflow soldering process.

Abstract: A method, apparatus, system, and device provide the ability to form one or more solder bumps on one or more materials. The solder bumps are reflowed. During the reflowing, the solder bumps are monitored in real time. The reflow is controlled in real time, thereby controlling a morphology of each of the solder bumps. Further, the wetting of the solder bumps to a surface of the materials is controlled in real time.

Abstract: A method of repairing a damaged notch fillet radius of a turbine blade shroud includes a replacement notch fillet radius and a hardface nugget. The damaged notch fillet radius is blended out and a hardface structure positioned proximate the damaged notch fillet radius is removed. A replacement notch fillet radius is formed with weld filler and the hardface nugget is welded to at least a portion of the replacement notch fillet radius.

Abstract: A reflow module of a reflow oven including a reflow fixture housed within a compartment of the reflow oven, removable side ports attached to the reflow fixture for controlling air flow through the reflow module and a chamber housing encasing the reflow fixture within the compartment of the reflow oven. A reflow oven incorporating the reflow module may include a reflow fixture having a plurality of air tubes and at least one orifice fixture plate removably attached to the reflow fixture, wherein the at least one orifice fixture plate includes a plurality of orifices for directing airflow into the plurality of air tubes.

Abstract: In a basic variant of a soldering device whereby a laser device is used for melting solder material (3), a protective device is provided which protects the laser lens system (22) from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel (23) into an outlet channel (24) and/or by a diaphragm (39) arranged in front of the laser lens system.

Abstract: A desoldering device is configured for desoldering a multi-pin electronic element from a circuit board. The desoldering device includes an iron and an attachment. The attachment is attached to the iron. The attachment includes a plate. A number of through holes are defined in the plate to allow pins of the multi-pin element to extend therethrough. Heat is capable of being transmitted from the iron the plate to melt soldered tins around the pins of the multi-pin element.

Abstract: The present invention provides a reflow apparatus capable of precisely adjusting the heating temperature and heating time when heating a work for reflow. A work transfer conveyor for transferring a work into a furnace body is disposed, wherein a plurality of preheating zones through for preheating the work, a plurality of reflow zones for heating the work for reflow, and a plurality of cooling zones for cooling the work are successively arranged along the work transfer conveyor in the furnace body. The individual reflow zones are formed shorter than the individual preheating zones in the work transfer direction. It is preferable that the sizes of the individual reflow zones in the transfer direction are shortened to approximately 65% to 85% with respect to the individual preheating zones or the conventional individual reflow zones.

Abstract: A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.

Abstract: An external weld bead is removed and processed from a welded pipe traveling in a downstream direction. The weld bead is separated from the pipe, allowed to flow in a downstream direction, and is guided downstream and cut into chips at a location downstream of where the weld bead is separated from the pipe.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic component. Electrically-conductive terminals thus melt between the electronic component and the printed wiring board. An air discharge nozzle is located in the vicinity of the heating nozzle. The air discharge nozzle serve to generate airflow at a location distanced from the heating nozzle. The airflow serves to suppress rise in the temperature in the vicinity of the electronic component. Other electronic component in the vicinity of the electronic component is reliably prevented from rise in temperature. The other electronic component is thus prevented from destruction.

Abstract: A reflow furnace includes a suction pipe extending within a heating region along a rail on which a conveyor travels. Suction ports are formed on the inner side of the suction pipe. Flux fumes inside the reflow furnace are sucked into the suction ports and transported to the exterior of a tunnel of the furnace by the suction pipe. The flux fumes are removed by a flux fumes removal apparatus on the exterior of the tunnel, and cleaned gas is returned to the interior of the tunnel at the entrance and the exit of the tunnel, where it forms air curtains which prevent the ingress of outside air.

Abstract: A reflow furnace using a conventional heater for blowing hot air has difficulty in reducing ?t and in stabilizing the oxygen concentration at a low level. In addition, it is difficult to uniformly discharge hot air from the discharge holes in a perforated plate of a conventional heater for blowing hot air. In a reflow furnace according to the present invention, the total area per unit area of discharge holes formed in a perforated plate in a heater for blowing hot air installed in a main heating zone is 1.5-5 times the total area per unit area of the discharge holes formed in a perforated plate of a heater for blowing hot air installed in a preheating zone. A heater for blowing hot air has a body divided into three chambers by partitions.

Abstract: A conductive ball mounting apparatus and method for holding a conductive ball on the holding face, as has a suction port formed therein, of a holder head thereby to mount the held conductive ball, while interposing a flux therein, on a workpiece. After the end of the mounting action and before a next conductive ball is held, flux removing means for removing the flux adhered to the holding face is brought into abutment against the holding face of the holder head thereby to remove the flux from holding face.

Abstract: An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract: There are provided reflow apparatuses and a methods therefor. In some embodiments, a reflow apparatus includes a first heating unit capable of heating a solder on a substrate up to just below before a melting point of the solder at ambient pressure such that the solder on the substrate is melted and electronic components mounted on the substrate are then soldered to the substrate; and a second heating unit connected to the first heating unit, the second heating unit capable of heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state.

Abstract: An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.