Abstract: An integrated circuit system is provided including forming a wire ball on a bond wire; forming a shaped ball from the wire ball; and attaching the shaped ball on an integrated circuit die.

Abstract: A de-soldering tool includes an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in an electrical connecter soldered to a printed wiring board; a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching the solder connections on the underside of the PWB; a controller applying power to the upper heating element and the lower heating element to liquefy solder on the contacts in the electrical connecter.

Abstract: A weld fairing apparatus and a welding method using the apparatus effectively prevent a weld metal zone from forming a humping bead. The welding method includes: butting first and second object pieces together; heating the butted first and second object pieces using a heating device, thus forming a weld metal zone; and placing a fairing device such that the fairing device comes into contact with the weld metal zone and fairs the weld metal zone.

Abstract: This invention provides a system capable of melting solder and removing the melted solder from a substrate. The heating system includes a desoldering tool having at least two handles, a first handle and a second handle. This way, an operator may grip the first handle or the second handle depending on the operator's preference of gripping the desoldering tool. The first handle has a cavity adapted to releaseably receive a storage where the melted solder can be deposited and stored. The storage may have a divot adapted to receive a key from the first handle so that the storage may be orientated in a predetermined position relative to the cavity. The cavity in the first handle is exposed so that the storage can be readily inserted or replaced. This allows the operator to easily replace and maintain the desoldering tool without a significant downtime.

Abstract: An auxiliary soldering tool includes a first jaw plate having a first holding portion and a first holding portion, a second jaw plate having a second holding portion and a second holding portion, and two elastic press plates each respectively rested on the first holding portion of the first jaw plate and the second holding portion of the second jaw plate. Thus, the auxiliary soldering tool facilitates the soldering work of two wires, so that the worker can solder and connect the two wires easily and conveniently.

Abstract: A desoldering sheath that comprises at least one hollow metal wire molded to conform to the tip of a desoldering tool. In one implementation, the desoldering sheath is formed using a hollow metal wire that is coiled around a male cone-shaped mold. The coiled, hollow metal wire is then compressed between the male cone-shaped mold and a female cone-shaped mold to cause the hollow wire to retain the coiled shape. In use, the desoldering sheath is placed on the tip of a desoldering gun or iron and then heated. The heated desoldering sheath, while still on the tip of the desoldering gun or iron, is then placed into contact with solder. This causes the solder to melt and the desoldering sheath captures the molten solder by using capillary action to draw the molten solder into the hollow metal wire.

Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

Abstract: The present invention provides an electronic component mounting apparatus, wherein a high speed operation can be provided by simplifying the structure of a mounting head and wherein the working efficiency can be improved by eliminating the use of the mounting head for a coating process. In the electronic component mounting apparatus, a flux is coated on chips supplied to an electronic component feeding unit while bump formation faces are directed upward. The chips are mounted on a substrate. A holding head receives the chips extracted from an adhesive sheet by a mounting head and is inverted relative to a stage on which a flux is spread. As a result, the bumps of the chips are covered with the flux and are flattened, and after the holding head is returned to the original stage, the chips on the stage are extracted and mounted on the substrate by the mounting head.

Abstract: A filtering apparatus for a reflow oven includes a contaminated-gas inlet for receiving contaminated gas from a reflow oven; a filtering device configured to filter the received contaminated gas; a returned gas outlet for returning filtered gas to the reflow oven; a gas removal arrangement for allowing gas to escape from the apparatus; and a control arrangement for controlling the rate of gas flow through the gas removal arrangement such that in use the flow rate of contaminated gas flowing from a hotter region of the reflow oven to a cooler region of the reflow oven is controlled.

Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

Abstract: A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply a loading force to the semiconductor device. The assembly of the substrate and the semiconductor device are loaded into the fixture with the shearing element proximate the semiconductor device, and heating the solder connections of the assembly in the fixture are heated proximate the substrate to a predetermined temperature by applying a heat source to a surface of the substrate distal from the semiconductor device.

Abstract: A method and apparatus for separating a chip from substrate where the chip is attached to the substrate by solder connections to form an assembly involve applying a loading force to drive a coil spring biased shearing element comprising a slide block with carrying a shearing blade into a loading position. Load the assembly of the substrate and the chip into a fixture with a window therethrough for the chip with the shearing blade in contact with the chip. Remove the loading force to arm the shearing blade to apply a shearing force from the shearing blade to the chip. Heat the solder connections of the assembly in the fixture to a predetermined temperature, preferably below the melting temperature of the solder at which shearing of the solder connections occurs. The shearing blade comprises a slidable plastic blade backed up by a metal blade.

Abstract: A shielding gas filter that can be readily incorporated into a gas shielding system for an arc welding apparatus. The gas shielding filter is readily installed to the system upstream of a gas solenoid valve and removes any potentially harmful particles from the supply of the shielding gas to prevent those particles from entering the gas solenoid valve. The shielding gas filter includes a housing having an inlet and an outlet and a specially formed passageway that communicates between the inlet and the outlet. A filter screen is retained within the housing to filter out the particles larger than a predetermined size. Preferably, the filter screen is constructed of stainless steel and filters out particles larger than about 100 microns.

Abstract: A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently to cause fusing after which the tool is moved such that the treatment surface enters the fused material. The material is allowed to cool to permit re-solidification, after which the treatment surface is withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material that is not wettable by the solder.

Abstract: A rework nozzle comprises a rework duct adapted to direct a high temperature gas flow toward a rework component. The rework nozzle also comprises at least one cooling duct adapted to direct a low temperature gas flow to an area adjacent the component to maintain the adjacent area at a reduced temperature relative to a temperature of the high temperature gas flow.

Abstract: There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid supplying means for supplying a formic acid into the heating/melting area, an exhausting means for exhausting a gas from the heating/melting area and its neighboring area to create a lower pressure area in the heating/melting area as compared to the pressure of outside the chamber, heating means for heating directly or indirectly the solder-adhered object in the heating/melting area, and an air-stream suppressing means for disturbing a gas flow between the heating/melting area and the carrying areas.

Abstract: An effective method for cleaning flux residues produced in process of fabricating semiconductor devices, and a method of fabricating the semiconductor devices including this cleaning method are provided. The flux cleaning method for cleaning the solder bump electrodes formed using a flux comprises the steps of: applying a pretreatment process including coating of the solder bump electrode with the flux and applying a heat treatment thereto, and carrying out the flux cleaning to clean the heat-treated flux.

Abstract: Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected.

Abstract: A method and structure for a chip detach apparatus and method that limits the solder ball maximum shear rate and, more particularly, that delays the application of shear force until a minimum predefined temperature is reached. The chip detach apparatus and method can be applied to chips with high solder ball counts, chips with small solder ball sizes, and chips with weak surface strength. The chip detach apparatus and method measures and accounts for variability in the electronic module manufacturing and assembly.

Abstract: Apparatus and methods for removing excess solder from connections on electrical circuits is disclosed. The apparatus and methods comprise providing an enclosure in which the circuits with excess solder are heated to a temperature above the melting point of the excess solder. There is also provided a clamp or mounting device for securing the electrical circuits with the excess solder such that they can be spun up to a sufficient rotating speed to cause the excess solder to be spun off the connections by centrifugal force. The enclosure includes an annular solder collecting pan for collecting the excess solder as it is removed from the circuit board.

Abstract: The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P1, a bonding wedge 21 abuts the wire 71, whereby a load is exerted on the wire 71. The wire 71 transforms by an amount of transformation A, and the transformation stops at point P2. The transformation amount A varies greatly. At point P3 (T1), ultrasonic wave vibration is exerted and the transformation of the wire 71 is restarted. At this stage, a variation in the transformation amount A is absorbed by an amount of transformation B and therefore a variation in the transformation amount A+B becomes small. At point P4 (T1+T2), the transformation amount A+B is maintained substantially constant. At this point P4, the transformation amount of the wire 71 is set to 0 and the measurement of the transformation amount of the wire 71 is started.

Abstract: Brazed structures comprising hollow components having a closure component bonded thereto by a metallic brazing alloy for closing off an end of the hollow component are disassembled by locating a wire transport material in the hollow component and covering the open face of the hollow component with a wire fiber material. Heat is then applied to liquefy the brazing alloy which is drawn up into the metal wire fiber material by capillary affect created by the wire transport material.

Abstract: A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A wiping blade is mounted in the blade holder. The blade holder, with the blade mounted thereon, is reciprocated back and forth when in communication with a stencil to be cleaned. The blade is moved from the wiping position in communication with the stencil into the cleaning solution in the container. A pneumatic piston and rotary actuator provides controlled movement of the wiping blade. The wiping blade may be vibrated during wiping to improve removal of solder paste from the stencil and the cleaning solution may be ultrasonically vibrated to improve removal of solder paste from the wiping blade. The wiping blade may also be pulsed into a sponge to remove excess cleaning solution prior to the next cleaning cycle.

Abstract: A desoldering wick dispenser In an embodiment of combined package and tube, the package has a funnel shaped housing containing a coil of desoldering wick. An end portion of the desoldering wick extends through and beyond the outer end of a tube extending from the center of the housing. The coil of desoldering wick is a spiral having a conical shape approximately complementary to the end of the housing. Alternatively, the coil may be a helically wound spool of wick in a somewhat more elongated tubular housing. The end of the wick extending through the tube is drawn from the center of the coil. The tube may be metal or plastic and may be a continuous or split tube, or formed from a helically coiled wire. The wick is manipulated by the tube when used.

Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

Abstract: The invention provides an apparatus that separates solder from solder dross, comprising first and second rolls and a fixture. The first roll has a substantially cylindrical surface and is rotatable about a first longitudinal axis. The second roll has a substantially cylindrical surface and is rotatable about a second longitudinal axis parallel to the first longitudinal axis. The fixture is coupled to the first and second rolls and spaces the second roll apart from the first roll by a first distance, such as 0.001 to 0.015 inches, the first distance sufficient to separate a solder-dross mixture directed between the first roll and the second roll into a liquid solder and a dross powder when the first and second rolls are rotated in opposite directions.

Abstract: Apparatus and methods for removing solder ball connections from electrical circuits are disclosed. The apparatus and methods comprise a solder ball removing tool 20 having a multiplicity of raised ribs 22 defining a contact surface 24 and made up of heat conductive material having a melting point above the melting point of solder. There is also included a heating source 30 for heating at least a portion of the multiplicity of raised ribs 22 to a temperature sufficient to melt the solder and yet below the melting temperature of the conductive material. The tool 20 is preferably supported or constructed such that the contact surface is tilted so that the melted solder will run down the raised ribs into a collecting pan 46.

Abstract: A filtering apparatus for a reflow oven includes a contaminated-gas inlet for receiving contaminated gas from a reflow oven; a filtering device configured to filter the received contaminated gas; a returned gas outlet for returning filtered gas to the reflow oven; a gas removal arrangement for allowing gas to escape from the apparatus; and a control arrangement for controlling the rate of gas flow through the gas removal arrangement such that in use the flow rate of contaminated gas flowing from a hotter region of the reflow oven to a cooler region of the reflow oven is controlled.

Abstract: Damage in a blisk airfoil is machined away to create a notch. A repair is welded in the airfoil to fill the notch. The weld repair is then machined to restore the airfoil to a substantially original, pre-damaged configuration at the repair.

Abstract: A desoldering wick dispenser includes a conventional wick package in the form of a bowl with a central hub and a flat cover mounted on the hub and having a gap between the edge of the cover and the outer edge of the bowl. A desoldering wick is coiled in the bowl around the hub and an end portion passes through the gap is drawn through a tube so that an end of the wick extends beyond the end of the tube. The wick is manipulated by the tube when used. In an embodiment of combined package and tube, the package has a funnel shaped housing containing a coil of desoldering wick. An end portion of the desoldering wick extends through a tube extending from the center of the housing. The coil of desoldering wick is a spiral having a conical shape approximately complementary to the end of the housing. Alternatively, the coil may be a helically wound spool of wick in a somewhat more elongated tubular housing. The end of the wick extending through the tube is drawn from the center of the coil.

Abstract: An integral heating nozzle and a syringe needle pickup vacuum tube where the nozzle moves relative to the pickup tube, FIG. 4, and where the nozzle does not move relative to the pickup tip, FIG. 1. The relative movement allows the heating gas to be directed to the solder connections while the vacuum tube may be independently moved so as to attach to the component body for removal and replacement, even when the component body is small and of different contours. In both cases the nozzle size allows components of cross section 0.01×0.01 inch to 0.05×0.05 inch to bereplaced. The opening of the nozzle accommodates removing and placing these smaller components through the nozzle. In some embodiments helium rather than air or nitrogen is used as a heating gas.

Abstract: Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate semiconductor devices. Residue build-up is monitored using a residue build-up monitoring device mounted on the furnace exhaust stack. When residue build-up reaches a predetermined level a signal is generated by the residue build-up monitoring device notifying technicians that furnace cleaning is required.

Abstract: The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P1, a bonding wedge 21 abuts the wire 71, whereby a load is exerted on the wire 71. The wire 71 transforms by an amount of transformation A, and the transformation stops at point P2. The transformation amount A varies greatly. At point P3 (T1), ultrasonic wave vibration is exerted and the transformation of the wire 71 is restarted. At this stage, a variation in the transformation amount A is absorbed by an amount of transformation B and therefore a variation in the transformation amount A+B becomes small. At point P4 (T1+T2), the transformation amount A+B is maintained substantially constant. At this point P4, the transformation amount of the wire 71 is set to 0 and the measurement of the transformation amount of the wire 71 is started.

Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

Abstract: The present invention relates to a solder ball shaping tool and a method for using the tool. In a substrate there is formed a series of depressions. The tool is pressed onto a ball grid array and the ball grid array is realigned either with simple pressure or pressure assisted by heating. Where a solder ball may have been deposited upon a die or a chip package in a diameter that exceeds that of the designed diameter, a corral tool is used to substantially conform the solder ball to design dimensions and a design location. As the corral tool is pressed against the solder ball, portions of the solder ball will reflow both into the substrate depression and into the corral. Where the total volume of the solder ball does not exceed that of both the corral and the substrate depression, the corral tool is adequate to achieve a designed solder ball height.

Abstract: A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

Abstract: Method and apparatus for desoldering electronic compo from a substrate. A vacuum is used, to enhance the f a hot gas under an electronic component to reflo solder connections attaching the electronic compo o a substrate. Water vapor is added to the hot gas t ease the heat capacity of the hot gas. A system for p cally changing the direction of flow of the hot gas a uum under the electronic component is used to unifo eat the solder connections.

Abstract: A method and apparatus for separating a chip from substrate where the chip is attached to the substrate by solder connections to form an assembly involve applying a loading force to drive a coil spring biased shearing element comprising a slide block with carrying a shearing blade into a loading position. Load the assembly of the substrate and the chip into a fixture with a window therethrough for the chip with the shearing blade in contact with the chip. Remove the loading force to arm the shearing blade to apply a shearing force from the shearing blade to the chip. Heat the solder connections of the assembly in the fixture to a predetermined temperature, preferably below the melting temperature of the solder at which shearing of the solder connections occurs. The shearing blade comprises a slidable plastic blade backed up by a metal blade.

Abstract: A safety switch device for a gas jet soldering gun includes a ignition push button having an outer periphery provided with a locking drive block, a housing having an inner wall defining an L-shaped drive slot mating with the locking drive block, and a spring mounted in the ignition push button for providing an axial thrust and a rotational torque. In such a manner, the user has to rotate the ignition push button to a proper position so that the ignition push button can be pressed to drive the igniter to ignite the fire, thereby preventing a child from freely opening the gas jet soldering gun.

Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.

Abstract: When soldering semiconductor devices in a solder reflow furnace flux is vaporized and carried to the furnace exhaust pipe. The flux condenses on the walls of the exhaust pipe and drips back into the furnace contaminating production parts. A solder reflow furnace with a flux effluent collector prevents flux drip-back. The flux effluent collector has an exhaust gas heater that maintains flux effluent in a gaseous state, a flux cooler, to subsequently condense flux, and a flux condensation region where the flux condenses. The flux condensation region is offset from the furnace's exhaust opening so that condensed flux cannot drip back into the furnace.

Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

Abstract: The invention relates to a method and an apparatus (22) for removing solder from a circuit board (5) from which electrical or electronic components have been removed at soldering points. The invention is addressed to the problem of offering a method and an apparatus by which the residual solder can be entirely removed from the circuit board (5) and by which even a large area on the circuit board (5) can be freed quickly and easily of the residual solder. This problem is solved by a method in which the solder after melting is pushed away from the soldering points by at least one pushing means (13a) or displaced therefrom by a plunger element, and is then removed from the circuit board (5). The apparatus (22) according to the invention makes available the means needed for the purpose.

Abstract: A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

Abstract: A solder removing apparatus comprises a stage and a head portion. A top face of the stage is a flat surface, and the stage can arbitrarily move in a direction parallel to the top face. On the stage are arranged a first member supplying portion on which one or more first members are located, a second member supplying portion on which one or more second members are located, and a heating portion for heating a member located thereon at an arbitrary temperature. The head comprises a first head and a second head. The first head and the second head can move along the same moving axis in a direction vertical to the top face of the stage independently from each other. The first head adsorbs the first member located on the first member supplying portion and locates the first member on the heating portion. The second head adsorbs the second member located on the second member supplying portion and locates the second member on the first member located on the heating portion.

Abstract: The present invention relates to a solder ball shaping tool and a method for using the tool. In a substrate there is formed a series of depressions. The tool is pressed onto a ball grid array and the ball grid array is realigned either with simple pressure or pressure assisted by heating. Where a solder ball may have been deposited upon a die or a chip package in a diameter that exceeds that of the designed diameter, a corral tool is used to substantially conform the solder ball to design dimensions and a design location. As the corral tool is pressed against the solder ball, portions of the solder ball will reflow both into the substrate depression and into the corral. Where the total volume of the solder ball does not exceed that of both the corral and the substrate depression, the corral tool is adequate to achieve a designed solder ball height.

Abstract: A plant for friction stir welding, comprising a welding probe, a drive unit driving the welding probe, a work table supporting the workpiece or workpieces to be welded, and at least one clamping means for clamping the workpieces to one another or to the work table, or the workpieces to the work table, respectively, during the welding operation. The plant likewise comprises a milling tool.

Abstract: An apparatus and a method for attaching conductive balls by which the tact time necessary for the positional recognition of a substrate before the conductive balls are attached onto a substrate can be greatly reduced. A first camera and a second camera are moved together a suction head. After the suction head picks up the conductive balls in a conductive ball supply section, the suction head is moved to a position above a flux supply section so that flux can be attached to the conductive balls 10, and concurrently the first camera recognizes a positional recognition mark on a substrate. Then, during when the suction head is moved to a position above the substrate, the second camera recognizes another positional recognition mark on the substrate. In accordance with the positional recognition conducted above, the suction head is positioned accurately with respect to the substrate, and then the conductive balls are attached onto the electrodes on the substrate.

Abstract: In a jet soldering method, a substrate is held by an actuator and pre-heated by a pre-heater. The pre-heater has a shield member or the substrate is swung to equalize temperature distribution in the substrate. The substrate is then transferred over a primary jet soldering bath while dipping a treatment surface of the substrate in a primary solder jet, so that solder stick to the treatment surface of the substrate. Then, the substrate is transferred over a secondary jet soldering bath while dipping the treatment surface in a secondary solder jet, so that the solder sticking to the substrate is shaped. The transfer conditions of the substrate are differentiated between transfers over the primary jet soldering bath and the secondary jet soldering bath.