Abstract: A method for manufacturing a vaporizer device for an inhaler, preferably for an electronic cigarette product, comprising at least one electric vaporizer, at least one electrical line for supplying the vaporizer with electric current, and a carrier for supporting the vaporizer, comprising the application of an electrically conductive adhesive between the vaporizer and the carrier to form an electrical connection of the vaporizer to the electrical line, wherein an additional heating step is carried out to form a eutectic connection between the vaporizer and the adhesive.

Abstract: Methods for forming a unitary ceramic component are provided. The method may include: positioning a braze reactant layer in a contact area between a first densified ceramic component and a second densified ceramic component; positioning a pack material around at least a portion of the first densified ceramic component or the second densified ceramic component; positioning at least one infiltrate source in fluid communication with the braze reactant layer; and thereafter, heating the at least one infiltrate source, the pack material, the first densified ceramic component, and the second densified ceramic component to a braze temperature that is at or above a melting point of at least one phase of the infiltrate composition such that at least one phase of infiltrate composition melts and flows into the braze reactant layer and reacts with a ceramic precursor compound therein to form a ceramic material.

Abstract: A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.

Abstract: A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces the time needed for the bonding process of both sides. This process allows for various TLP bonding parameters while being compatible with conventional fabrication systems.

Abstract: During implementing a composite metal part by compaction of an insert having reinforcing fibers in a metal body or container, gas used for compaction may enter the cavity formed in the container for receiving the insert between a lid covering the insert and the container, which can prevent or degrade compaction and diffusion welding of fiber sheaths of the insert therebetween and/or with walls of the cavity. To solve this problem, the present method includes initiating isostatic compaction by a phase including raising and maintaining temperature, followed by a phase including hot-feeding pressurized gas, and machining an assembly to obtain the part. The temperature raising phase includes a diffusion pre-welding of material rigidly connecting the pressure-adjusted walls of the lid and the container. The method can be used for designing parts having a tensile and compression resistance, such as parts for aircraft landing gear.

Abstract: A process for manufacturing a metal part reinforced with ceramic fibers including machining at least one housing for an insert in a metal body having an upper face. At least one insert formed from ceramic fibers in a metal matrix is placed in the housing. The insert is covered with a cover. A vacuum is created in the interstitial space around the insert and the interstitial space is hermetically sealed under vacuum. The assembly, namely the metal body with the cover, is treated by hot isostatic pressure. The treated assembly is machined in order to obtain the part. The cover includes an element covering the insert in the slot and projecting from the upper face, and a sheet covering the upper face with said element. In particular, the insert is straight and the housing for the insert in the metal body forms a straight slot.

Abstract: The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Abstract: A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

Abstract: A method for bonding a composite multi-layer shell having complex curvature by the delta-alpha high temperature bonding process uses a novel tool. The tool includes a plurality of segments that combine to form a mandrel assembly having a substantially continuous outer surface. The outer surface has a substantially axisymmetric shape including a complex curvature. When the segments are combined to form the mandrel assembly, at least one of the segments is configured to be movable in a substantially inward direction without substantial obstruction by any other segment. The segments are constructed of a first material have a first coefficient of thermal expansion that is greater than a second coefficient of thermal expansion of a second material of a composite multi-layer shell to be bonded together using the tool.

Abstract: A body comprising a steel substrate and a hard face structure fused to the steel substrate, the hard face structure comprising a core region and an intermediate region, the intermediate region at least partially enclosing the core region and comprising at least about 0.

Abstract: In a method of applying a firmly adhering metallic coating onto a steel sheet product, a steel sheet product is inserted into a film bag which contains at least a coating material. Subsequently, the film bag is evacuated to cause the film to evenly bear upon the outer surface of the steel sheet product. This state is fixed by sealing the film bag. The film bag and the steel sheet product are then subjected to a heat treatment to thereby form a coating of the coating material on the steel sheet product.

Abstract: Methods and apparatus are provided for forming a diffusion bonded composite structure. The composite structure includes at least one internal void or feature. Surfaces to be bonded are cleaned and prepared for bonding. The exposed joints of the composite structure where the surfaces interface are sealed. The composite structure is placed in hot isostatic process furnace. The furnace is pressurized to a low pressure below 1500 pounds per square inch that forces the surfaces to be bonded in intimate contact with one another. The composite structure is heated to promote diffusion bonding at the interface of surfaces in contact with one another.

Abstract: A hydrogen purifier utilizing a hydrogen-permeable membrane to purify hydrogen from mixed gases containing hydrogen is disclosed. Improved mechanical support for the permeable membrane is described, enabling forward or reverse differential pressurization of the membrane, which further stabilizes the membrane from wrinkling upon hydrogen uptake.

Abstract: A hydrogen purifier utilizing a hydrogen permeable membrane, and a gas-tight seal, where the seal is uses a low temperature melting point metal, which upon heating above the melting point subsequently forms a seal alloy with adjacent metals, where the alloy has a melting point above the operational temperature of the purifier. The purifier further is constructed such that a degree of isolation exists between the metal that melts to form the seal and the active area of the purifier membrane, so that the active area of the purifier membrane is not corrupted. A method of forming a hydrogen purifier utilizing a hydrogen permeable membrane with a seal of the same type is also disclosed.

Abstract: A method for joining a plurality of single crystal members includes providing a bonding foil with a composition match with that of the members and with a bonding temperature within the gamma prime solution temperature range of the members, but below the melting temperature of the foil and below the incipient melting temperature of the members. The foil is disposed between and in contact with opposing members to be joined while heated to and held at the bonding temperature for at least 10 hours.

Abstract: This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near equiatomic titanium-nickel alloy) and related shape-memory and superelastic alloys. Nitinol shape memory alloys (SMAs), acquired in a form such as corrugated sheet, discrete tubes or wires, may be joined together using the newly discovered technique. Pure niobium when brought into contact with Nitinol at elevated temperature, liquefies at temperatures below the melting point and flows readily into capillary spaces between the elements to be joined, thus forming a strong joint. A series of diagrams of the interface at various stages of brazing is illustrated by FIG. 10.

Abstract: This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near-equiatomic titanium-nickel alloy) and related shape-memory and superelastic alloys. Nitinol shape memory alloys (SMAs), acquired in a form such as corrugated sheet, discrete tubes or wires, may be joined together using the newly discovered joining technique. Pure niobium when brought into contact with nitinol at elevated temperature, liquefies at temperatures below the melting point and flows readily into capillary spaces between the elements to be joined, thus forming a strong joint.

Abstract: A liquid phase diffusion bonding method for a metal machine part superior in the quality of the joint and the productivity enabling the bonding time to be shortened, achieving homogenization of the bonding structure and improving the tensile strength, fatigue strength, and joint quality and reliability. This liquid phase diffusion bonding method of a metal machine part is characterized interposing an amorphous alloy foil for liquid phase diffusion bonding at bevel faces of metal materials, performing primary bonding by melt bonding said amorphous alloy foil and said metal material by resistance welding to form a joint, then performing secondary bonding by liquid phase diffusion bonding by reheating said joint to at least the melting point of said amorphous alloy foil, then holding it there to complete the solidification process of said joint.

Abstract: A method for bonding nano-elements to a surface is described. The method includes applying a layer of a first metal to a first end of a plurality of substantially aligned nano-elements, positioning a layer of a second metal adjacent to the layer of the first metal, placing a compressive force across the nano-elements, the metal layers, and the substrate, and elevating the temperature of the nano-elements, the metal layers, and a substrate adjacent the layer of the second metal such that the metal layers form at least one of a eutectic bond, a metal solid solution, and an alloy bond between the nano-elements and the substrate.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: A joining of a titanium material with an aluminium material, wherein the parts made of the two substances are connected with each other in a substance-to-substance manner. Preferably, the joining is effected by a laser beam or an electron beam.

Abstract: A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.

Abstract: A joint having bond line grains that nucleate in the joint region and grow into the adjoined solid substrates. The resulting bond line grains have a size that is greater than a thickness of a molten region. The surfaces of the substrates are cold worked to a desired degree of residual stress prior to the bonding process so that the recrystallization of the substrate surface necessary for the grains to grow into the substrates results in a reduction in the local free energy.

Abstract: A radiator core reinforcement self shears in the braze oven as strategically placed voids in the reinforcement erode away under the flowing action of the melted surface braze layer.

Abstract: A method for producing a joined body comprising a supporting member made of a ceramic material for supporting a semiconductor wafer, a metal member and a joining layer for joining the supporting and metal members is provided. A first metal film is formed on a joining surface of the supporting member. A second metal film is formed on a joining surface of the metal member. A metal adhesive is placed between the first and second films to provide an assembly. The assembly is then heated at a temperature not higher than a melting point of the metal adhesive while the assembly is subjected to isostatic pressing, so that the supporting and metal members are joined by diffusion joining.

Abstract: Embodiments of the invention include a method comprising disposing a thin metallic layer having a low melting temperature between one end of a conductive post on a substrate and a conducting structure on an opposing substrate. Heated platens in contact with the substrates can apply pressure and heat to the thin metallic layer and cause it to be entirely consumed and subsequently transformed into a bonding layer having a melting temperature higher than the melting temperature of the original thin metallic layer. Prior to, during, or after the conductive post is bonded to the conducting structure, the region around the conductive post and between the substrates may be filled with a dielectric material, such as polyimide.

Abstract: The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and removing excess molten metal, thereupon dipping it into a molten metal bath comprising aluminum until it is coated with this metal, then promptly withdrawing it from the bath.

Abstract: A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding of a powder material to the component is accomplished by a heat cycle that is performed on the component for another purpose. A manufacturing solution heat treatment, a pre-weld heat treatment, a post-weld heat treatment, or a rejuvenating heat treatment may be used as the brazing heat treatment. The composition of the powder material is selected so that a desired set of material properties is achieved when the powder material is subjected to the dual-purpose heat cycle. In one embodiment, a 50/50 mixture of AM775 and IN939 powder is diffusion brazed to an IN939 superalloy component using a heat treatment which also functions as the post-casting solution heat treatment for the IN939 component.

Abstract: A titanium target assembly includes a titanium sputtering target, a copper or copper alloy backing plate and serving as a support member for the target and a silver or silver alloy coating film and formed between the target and backing plate. The coating film is formed on a surface subjected to cleaning treatment on the bonding side or sides of the target and backing plate by physical vapor deposition. The titanium target and backing plate are solid phase diffusion bonded. The face(s) serve as the bonding plane. The assembly can be manufactured by cleaning the surface(s) of the target and/or backing plate on bonding side(s), forming a coating film on the cleaned surface(s) on bonding side(s) and solid phase diffusion-bonding the target and backing plate, while using surface(s) provided with coated film as the bonding plane. The target assembly possesses high bonding strength and excellent bonding stability and reliability.

Abstract: A liquid interface diffusion bonded composition comprises a metal honeycomb core such as a nickel-alloy honeycomb core and a nickel-alloy facing sheet bonded thereto. The composition and method of this invention are useful in applications where high strength, heat resistant materials are required, such as in aircraft and aerospace-related structures.

Abstract: This disclosure describes a method for metallurgically bonding a complete leak-tight enclosure to a matrix-type fuel element penetrated longitudinally by a multiplicity of coolant channels. Coolant tubes containing solid filler pins are disposed in the coolant channels. A leak-tight metal enclosure is then formed about the entire assembly of fuel matrix, coolant tubes and pins. The completely enclosed and sealed assembly is exposed to a high temperature and pressure gas environment to effect a metallurgical bond between all contacting surfaces therein. The ends of the assembly are then machined away to expose the pin ends which are chemically leached from the coolant tubes to leave the coolant tubes with internal coolant passageways. The invention described herein was made in the course of, or under, a contract with the U.S. Atomic Energy Commission.

Abstract: A preferred sputter target assembly (10, 10′) comprises a target (12, 12′), a backing plate (14, 14′) bonded to the target (12, 12′) along an interface (22, 22′) and dielectric particles (20, 20′) between the target (12, 12′) and the backing plate (14, 14′). A preferred method for manufacturing the sputter target assembly (10, 10′) comprises the steps of providing the target (12, 12′) and the backing plate (14, 14′); distributing the dielectric particles (20, 20′) between mating surfaces (24, 26) of the target (12, 12′) and the backing plate (14, 14′), most preferably along a sputtering track pattern on one of the mating surfaces; and bonding the target (12, 12′) to the backing plate (14, 14′) along the mating surfaces (24, 26).

Abstract: The method manufactures sputter target assemblies. It first includes the step of manufacturing a target insert. The target insert has a yield strength, a diameter, a height, a planar top surface and a conical-shaped rear surface. Then a backing plate is manufactured. The backing plate has a cylindrical recess that corresponds to the diameter of the target insert. The cylindrical recess has a depth less than the height of the target insert and a yield strength less than the yield strength of the target insert. Finally, pressing the target insert into the cylindrical recess of the backing plate bonds the target insert to the backing plate to form a target assembly. The pressed target assembly contains the target insert with the conical-shaped rear surface.

Abstract: An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined at a bonded region to the first piece by a diffusion bond. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite. The second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The diffusion bond is formed from a first metallic element disposed on a first surface of the first piece and a second metallic element disposed on at least one of the first surface and a second surface of the second piece, the second surface contacting the first surface, wherein the first and second metal form a composition having a melting temperature less than about 1400° C. This abstract is submitted in compliance with 37 C.F.R. 1.

Abstract: The present invention relates to a diffusion welding assembly process between a martensitic stainless steel and a copper alloy, and in particular, to an assembly process of a martensitic stainless steel component with a component comprising copper. Said process may be used for example to produce a bimetal part designed to operate at high temperatures. It particularly comprises a step consisting of degreasing and stripping the surfaces of the components to be assembled, a step consisting of placing the degreased and stripped surfaces of the components to be assembled in direct contact and a step consisting of diffusion welding assembly.

Abstract: A liquid interface diffusion bonded composition comprises a metal honeycomb core such as a titanium honeycomb core and a metal facing sheet such as a titanium facing sheet bonded thereto. The composition is prepared by a method comprising: (a) providing a metal honeycomb core having a faying surface and a metal facing sheet having a faying surface; (b) placing together the honeycomb core faying surface and the facing sheet faying surface, and providing therebetween a metal foil typically formed by a rapid solidification process or a melt spinning process, with the metal foil comprising about 10.5-12.5 wt. % zirconium, about 20-24 wt. % copper, about 10.5-16 wt. % nickel, and the balance being titanium; (c) subjecting the faying surfaces and metal foil therebetween to sufficient positive pressure to maintain position and alignment for joining; and (d) heating the faying surfaces and metal foil therebetween in a protective atmosphere to a temperature in the range of 1700-1800 degrees F.

Abstract: A titanium target assembly comprises a sputtering target of titanium, a backing plate composed of copper or a copper alloy and serving as a support member for the target and a coating film composed of silver or a silver alloy and formed between the target and the backing plate, wherein the coating film is formed on the surface subjected to a cleaning treatment on the bonding side of the target or on the bonding sides of the target and the backing plate according to the physical vapor deposition technique and the titanium target and the backing plate are solid phase diffusion bonded, while the face(s) provided with the coating film serves as the bonding plane. The titanium target assembly can be manufactured by a method comprising the steps of cleaning the surface(s) of the target and/or the backing plate on the bonding side(s) thereof, forming a coating film on the cleaned surface(s) on the bonding side(s) and solid phase diffusion-bonding the target and the backing plate at a pressure of not more than 0.

Abstract: Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic material. A sputtering insert includes a substantially cylindrical side wall and is concentrically received within, and bonded to, the outer shell. The sputtering insert is composed of a relatively high purity metallic material as used for depositing a thin layer or film onto a desired substrate.

Abstract: A HIP-bonded body of a beryllium member and copper alloy member. Before subjecting the members to HIP processing, a diffusion inhibiting layer is deposited on the outer surface of the copper alloy member. A bond promoting layer of aluminum or aluminum alloy is then formed on the diffusion inhibiting layer. During the HIP bonding step, an insert composed of an aluminum-magnesium alloy is juxtaposed between the outer aluminum layer of the pre-treated copper alloy member and the beryllium member.

Abstract: A method of bonding two pieces of metal having a foil or layer of another metal, either of lower melting point or such that it forms a liquid layer at or near to the bonding temperature, disposed therebetween. The method comprises the steps of: bringing the pieces into contact; applying pressure across the area of contact; heating the area of contact; and providing a predetermined temperature gradient across the area of contact.

Abstract: A joining method using lead-free solder which can produce a good joint through a heating process. A first lead-free alloy layer is formed on surfaces of all parts to be mounted on a board at a temperature equal to or lower than the melting point of the first alloy layer. A second lead-free alloy layer having a melting point lower than the first alloy layer is formed on surface of the board. The first and second alloy layers are placed in contact with each other and heated to a predetermined temperature.

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase.

Abstract: According to the present invention, an insert material is laid between metal beryllium and copper alloy, wherein the insert material has the minimum, solidus temperature of not lower than 870° C. to the metal beryllium and copper alloy, respectively, and a single diffusion bonding process is performed under the condition that the temperature is not lower than 850° C. and less than the minimum solidus temperature, and the pressure is 20 to 30O MPa, so that the metal beryllium, copper alloy and stainless steel can be effectively bonded without deterioration of corrosion resistance for sensitizing of the stainless steel.

Abstract: A method for joining two elements using a silver-based alloy having a germanium content is described. The method comprises providing two elements to be joined together, at least one of the elements comprising a silver/copper/germanium alloy having a silver content of at least 77% by weight, a germanium content of between 0.4 and 7% by weight, typically from about 0.5% to about 3%, the remainder principally being copper apart from any impurities. The alloy also contains boron as a grain refiner at a concentration of greater than 0 parts per million and less than 20 parts per million, more typically less than about 10 parts per million, with working embodiments including boron in an amount of about 2 parts per million. The two elements are placed adjacent one another such that a portion of a free surface of the silver/copper/germanium alloy contacts a portion of a free surface of the other element without interposing a filler material between the two free surfaces.

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase.

Abstract: A sputter target assembly includes a cobalt target diffusion bonded to an aluminum or copper backing plate by means of a titanium interlayer. The sputter target assembly may be made by hot vacuum pressing or, preferably, by hot isostatically pressing the target, interlayer and backing plate together. Preferably, the titanium interlayer is provided as a foil, but may also be formed on a mating surface of either the target or the backing plate by electroplating, sputtering, electroless plating, or plasma spraying. The target may be advantageously machined with grooves defining salient points prior to providing the interlayer.

Abstract: A method is provided for the bonding of ceramics to metals for the production of semiconductor packages. The method includes forming a copper-copper oxide eutectic on a substantially planar copper shim. The shim and its copper-copper oxide eutectic are placed in contact with a ceramic layer and metal layer. The assembly, so formed, is then heated to a temperature at least equal to the melting point of the eutectic and no greater than the melting temperature of copper. Upon cooling of the eutectic, a bond forms bond the ceramic layer to the metal layer.

Abstract: A method for use with a direct metal bonding type process in which a metal layer is bonded to an insulating layer. The metal layer is applied to the insulating layer to enable a direct metal bond to be formed between the layers. The integrity of the bond between a portion of the layers is reduced by providing, prior to bonding, an interrupter between the portion of the layers. A structure in which a metal layer is directly metal bonded to an insulating layer and includes an interrupter between a portion of the metal layer and a portion of the insulating layer. The interrupter reduces the integrity of the bond between the portion of the metal layer and the portion of the insulating layer. The structure includes other features similar to those set forth with respect to the above described method.

Abstract: Target members of titanium or a titanium alloy with melting point M are bonded together by first forming a bonding layer with melting point J lower than M on at least one of the bonding surfaces over which the target members are to be joined together. While the target members are pressed against each other over the bonding surfaces, end parts of the target members adjacent the bonding surfaces are heated to an intermediate temperature T such that J<T<M and is kept at this intermediate temperature for a specified length of time to effect liquid-phase diffusion bonding. Alternatively, an insert member of titanium or a titanium alloy may be inserted between the bounding surfaces of the target members to form liquid-phase diffusion bonding by first forming bonding layers of the type described above on mutually opposite end surfaces of the insert member and then inserting the insert member between the target members.

Abstract: An improved, light weight tappet and method of manufacturing such a tappet. The tappet is comprised of a light weight sleeve to which a hardened disk is metallurgically bonded.