Abstract: A valve seat-bonded cylinder head, in which a valve seat is bonded to a cylinder head unit, which valve seat is formed of material different from and harder than that of said cylinder head unit, wherein the valve seat is bonded to the cylinder head unit by solid-state diffusion, without forming a melting reaction layer therebetween, and a plastic deformation layer is formed on the bonding boundary at least on the cylinder head unit side, thereby allowing for an increase in the bonding strength, and reduction in the size of the valve seat area.

Abstract: Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprise 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vanadium, 0.02 to 1.0 percent niobium, 0.10 to 5.0 percent tungsten, 0.05 to 2.0 percent nitrogen, 0.50 to 20.0 percent phosphorus, plus 0.005 to 1.0 percent carbon, and/or either or both of 0.01 to 5.0 percent titanium and 0.01 to 5.0 percent zirconium, all by mass, with the balance comprising nickel and impurities, and have a thickness of 3.0 to 300 .mu.m. Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere are also available with substantially vitreous structures.

Abstract: A method of thin film patterning by reflow. A first metal trace is deposited onto a surface of a substrate in a predetermined pattern. A second metal trace is then deposited onto the deposited first metal trace. Next, a thin film of a third metal is deposited onto the entire surface of the substrate and onto the deposited first and second metal traces. The substrate and the associated deposited metals are then heated to cause the deposited thin film of the third metal to flow and bead onto the second metal trace.

Abstract: A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.

Abstract: A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au--Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, mulilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.

Abstract: Ceramics are joined to themselves or to metals using a transient liquid phase method employing three layers, one of which is a refractory metal, ceramic or alloy. The refractory layer is placed between two metal layers, each of which has a lower melting point than the refractory layer. The three layers are pressed between the two articles to be bonded to form an assembly. The assembly is heated to a bonding temperature at which the refractory layer remains solid, but the two metal layers melt to form a liquid. The refractory layer reacts with the surrounding liquid and a single solid bonding layer is eventually formed. The layers may be designed to react completely with each other and form refractory intermetallic bonding layers. Impurities incorporated into the refractory metal may react with the metal layers to form refractory compounds. Another method for joining ceramic articles employs a ceramic interlayer sandwiched between two metal layers.

Abstract: A solid state joint and a method of making a solid state joint between aluminum or magnesium alloys is provided. The joint consists of a diffusion bond with unmelted pieces of a fragmented foil dispersed along the diffusion bond. The joint is made by placing a friable foil between the parts being joined and pressing the parts together to crack the foil. The assembly is then heated and pressed together for a sufficient time, temperature, and pressure to cause the aluminum or magnesium alloy to flow into the cracks, across the foil, and then to diffusion bond together. The foil is made from a material which is harder than the alloy being joined and which will not melt at the bonding temperature.

Abstract: Ni-Ti intermetallic compounds are produced by subjecting a laminate of Ni foils and Ti foils to a rolling for thickness adjustment and then to a diffusion heat treatment at multistages within a particular temperature range for a particular time.

Abstract: A method is provided for fabricating metal matrix composites. Optical or reinforcing fibers, which may be in the form of monofilaments, mats, or tow, are consolidated into a metal matrix alloy. Grooves may be provided in the metal matrix material for holding and positioning the fibers. A transient liquid diffusion bonding agent in the form of a powder may be blended with powdered filler material, such as powdered matrix material, to provide a vehicle for consolidating the fibers into the metal matrix. The fibers and the blended powder are placed between layers of the metal matrix material and the whole structure is heated under minimal pressure to liquefy the bonding agent. The liquid bonding agent wets each fiber and interdiffuses with the matrix material, resulting in rapid isothermal solidification of the alloy and consolidation of the fibers in the matrix.

Abstract: An integrated circuit component is attached to a printed circuit board by solder bump interconnections that are formed between metal bumps on the component and a metal-plated terminal on the board. The metal plate overlies both a bond pad and an adjacent runner of each terminal and is formed of a first metal, which is preferably a tin-base alloy. The metal bumps on the component are formed of a second metal, which is preferably an indium-base alloy. The component and board are assembled and heated to a temperature less than the melting temperatures of the first and second metals. At the interface between the bumps and the plate, the first and second metals cooperate to form a liquid phase which, upon cooling and solidifying, completes the interconnection.

Abstract: In a manufacturing method for a semiconductor device, first, a diffused layer of a soldering material is provided previously either on the reverse surface of a die or on the obverse surface of a die pad. Then, a diffusing layer is formed on either surface of the diffused layer. The diffusing layer between the die and the die pad is brought into contact with the die and die pad, and then these components are heated. The die is thereby and fully bonded to the die pad, even when the diffusing layer, which is an initial bonding layer, is made thinner. Because the time for the diffusing layer to diffuse can be shortened, the time for installing the die can also be shortened.

Abstract: Ceramic and metal articles are joined using three metal layers one of which is a refractory metal or alloy. The refractory metal layer is placed between the other two layers, which each include a metal or alloy having a lower melting point than the refractory metal layer. The three metal layers are pressed between two articles to be bonded to form an assembly. The assembly is heated to a bonding temperature, at which the refractory metal layer remains solid, but the other two layers melt to form a liquid. The assembly is held at the bonding temperature. The refractory metal layer dissolves in surrounding liquid and a single solid bonding layer is eventually formed, at the bonding temperature, between the two articles. The bonding method may be referred to as a transient-liquid-phase or isothermal bonding method.

Abstract: A liquid phase diffusion bonding method using an insert material such as B,C,Si and Hf having a high diffusivity and a melting point higher than that of the base metal is disclosed. During the bonding, the insert material is not melted, but the insert material and the base metal are reacted with each other in such a manner that the diffusion bonding can be carried out under a non-oxidizing atmosphere at a temperature lower than the melting point of the insert material.

Abstract: A method and apparatus for bonding high temperature structures, such as face sheets to high performance honeycomb cores, using differential gas pressure at high temperatures. A high temperature resistant, foil sheet having a thickness of from about 0.0005 to 0.003 inch is welded to a support to form a vacuum bag to surround the structure to be bonded. A vacuum line is connected to the bag to allow evacuation of the bag. Typically, the structure is bonded in a vacuum furnace. Initially, the furnace is heated to the bonding temperature of the assembly while both the furnace chamber and the vacuum bag are substantially completely evacuated. Then slight pressure is allowed to return to the chamber to force the foil sheet into intimate presure contact with the structural assembly to bring the components tightly together, using the relative pressure different between the vacuum in the chamber and the vacuum within the bag.

Abstract: Ultrasonic blade coupler comprising a blade element composed of a material selected from aluminum and titanium rendered sharpenable by a surface hardening treatment. The blade coupler exhibits improved acoustical properties with reduced energy consumption.

Abstract: The present invention is a method of molding the cutter bars for refiner plates used in treating pulp slurry in the paper processing industry including impressing in a mold the form of a refiner plate or refiner plate segment, pouring the base plate or pouring the base of the refiner base plate segment. The sand surfaces in the mold which will be in contact with the metal to form the perpendicular surfaces of the cutter bars relative to the refiner plate are then treated with a slurry consisting of an alcohol or water carrier into which powdered brittle metal alloys have been introduced such as titanium, boron, carbon, vanadium, chromium, niobium, tungsten, molybdenum and cobalt 10 microns or less in size in the pure or ferro alloy state. The powdered metal alloy slurry is then dried in one of a number of acceptable ways and the cutter bar base metal is then superheated to a temperature higher than its melting point, after which the molten metal is poured into the mold.

Abstract: A method of joining components by soldering comprising forming discrete layers of silver (13, 17) and another metal (19), e.g. a tin or indium based material, the two layers having volumes in a ratio different from that in the eutectic alloy formed by silver and that metal, and raising the temperature of the layers above the melting point of the eutectic alloy for a period sufficient to cause initially formation of the eutectic alloy and then, by reaction between the eutectic alloy and one or other of silver and the other metal, formation of a material having a melting point higher than the eutectic alloy melting point. The method allows soldering, e.g. of a silicon wafer (1) to a header (3), at a relatively low temperature below that which the joint will withstand after formation.

Abstract: Two metallic surfaces are bonded together by coating each of the metallic surfaces with a layer of a first material and a layer of a second and different material contacting the layer of the first material. The first material and second material are chosen so that a eutectic liquid layer will form at the interface between them. The layers of the second material on each of the metallic surfaces are abutted together and then the layers are heated above the eutectic temperatures to form a localized liquid, which upon solidification results in an interconnection between the surfaces.

Abstract: A bonded ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly bonded to one of the surfaces of the ceramic substrate, wherein the median surface roughness (R.sub.a) of the outer surface of the copper sheet is not greater than 3 .mu.m, and the maximum surface roughness (R.sub.max) of the outer surface of the copper sheet is not greater than 18 .mu.m. The invention improves the manufacturing reliability of various electronic devices such as semiconductor modules.

Abstract: An electrode is provided which is formed by the metallurgical bonding technique of diffusion bonding the backplate, conductor elements and electrode surface together, then applying the catalytic coating to the electrode surface, and bonding the backplate to an electrical conducting plate.

Abstract: A first surface of a first metal component of an ink jet print head is bonded to a second surface of a second metal component of the ink jet print head, the first and second surfaces being of materials having the same or similar coefficients of thermal expansion. A layer of filler material is electroplated or otherwise placed on at least one of these surfaces. The filler material has a melting point which is below the melting point of the first and second components, and the total thickness of the filler material on the surfaces together is in the range of from approximately one-sixteenth micron to approximately five microns, with one-eighth micron to two microns being a preferred range. These surfaces are placed together and brazed under low pressure. Preferably, the braze pressure is from about one-half psi to no more than about one hundred psi, with about ten psi being most preferred.

Abstract: Disclosed is a method for the direct bonding of a copper sheet to a substrate made of an electrically insulating material, with the heating of the copper/substrate set in order to obtain a eutectic mixture. The method according to the invention consists in cleaning the copper to eliminate traces of oxidation on its surface before placing said copper on the substrate, in heating the copper/substrate set under a neutral atmosphere until a temperature greater than the temperature for the formation of the eutectic mixture is reached, and in applying the oxidating reactive gas only after the temperature greater than the temperature for the formation of the eutectic mixture is reached, in such a way that this temperature is reached before any oxidation of the surface of the copper.

Abstract: A process of bonding crystalline quartz plates in a plate assembly of a quartz crystal resonator is provided. The plate assembly includes a base plate, a resonator plate, a cover plate, a first silver and indium alloy layer between the base plate and the resonator plate, and a second silver and indium alloy layer between the resonator plate and the cover plate. The process of bonding the plates in the plate assembly includes the steps of depositing in sequence on base plate face and on the cover plate face, a layer of chromium, a layer of silver, and a layer if indium, and also includes the steps of depositing in sequence on two opposite faces of the resonator plate, a layer of chromium, and a layer of silver, and also includes the steps in sequence of sandwiching the resonator plate between the base plate and the cover plate to form a plate assembly, then evacuating the plate assembly, compressing the plate assembly, and heating the plate assembly to about 310 degrees centigrade for several hours.

Abstract: A softer metal such as aluminum, or a metal forming a metal aluminide, or an alloy containing these metals is added to a metal aluminide composite during fabrication to promote easy consolidation of the metal aluminide matrix with the reinforcing phase. The metal aluminide may be titanium aluminide, nickel aluminide, or iron aluminide. The softer metal, the metal aluminide matrix, and the reinforcing phase are pressed together at a temperature above the softening temperature of the softer metal. The softened metal promotes flow and consolidation of the matrix and the reinforcement at relatively low temperatures. The composite is held at an elevated temperature to diffuse and convert the soft metal phase into the metal aluminide matrix. By consolidating at a lower temperature, cracking tendencies due to thermal expansion differences between the matrix and reinforcement is reduced. By consolidating at a lower pressure, mechanical damage to the fibers is avoided.

Abstract: A method of producing a reinforced duct structure for use with turbo-fan aircraft engines and the like. The duct is first cut from a flat metal sheet in a predetermined pattern. The sheet is rolled to form a tubular or conic structure of the approximate desired configuration and welded along the open seam. The welded tubular structure is then expanded to the exact required shape. The expanded tubular structure is cut out in selected areas to form a tubular grid structure. A tubular liner conforming to the inner surface of the tubular grid structure is installed and bonded to the grid structure forming an integral tubular structure of the desired configuration and strength and; attachment of any required mating flanges and structure bosses to the integral tubular structure.

Abstract: A method for the assembly and connection of bodies, massive parts or powder grains, of alloys comprising at least 50% of nickel, cobalt or iron, comprises a preliminary operation of deposition at the interface of the said bodies of a product of the type MBF.sub.x, x being equal to 3 or 4, M designating a radical of the type NH.sub.4 giving off when hot a gaseous component such as NH.sub.3 or a metallic element and a sequence of treatment of cleaning/activation by passage of the coated body at a temperature in excess of the temperature of sublimation of the said product.

Abstract: Appropriately cleaned titanium or titanium alloy and iron-nickel alloy parts are bonded together to obtain a compound part by providing particular metallic layers in between them and diffusion welding the assembly together. The layer sequence is critical whereby vanadium is used always adjacent the titanium part and chromium or iron or nickel is used adjacent the iron-nickel part whereby chromium and iron can be directly bonded to the vanadium layer; in the case of nickel either chromium or tungsten and platinum are interposed.

Abstract: A ceramic evacuatable enclosure (10, 30, 42) such as a laser body is made by the following process. A first body portion (12, 41) is formed with a channel (18, 19, 20, 43, 45, 46) and second body portion (11, 31, 40) of the same ceramic material is provided. Mating surfaces are polished on the body portions (11, 12) for bonding together by thermocompression below the ceramic distortion temperature to achieve a vacuum seal. The ceramic may be alumina including 0.2 to 12% by weight of vitreous material. The thermocompression temperature may be in the range 1200.degree. C. to 1750.degree. C. Polishing is performed to a finish of from 0.01 .mu.m to 0.15 .mu.m. The body portions (11, 12) may have similar surface formations mutually aligned to provide a folded cavity (18, 19, 20) for an alumina waveguide CO.sub.2 laser.

Abstract: A method of assembly of at least two ceramic components each having at least one flat surface, as applicable in particular to microwave equipment and encapsulation modules for microwave semiconductors. The starting components are made of ceramic material which has been pre-fired, or in other words heated to about 1500.degree. C., and are therefore rigid. The components are no longer joined together by means of a glass paste or a brazed joint between metallized parts but are heated to over 1700.degree. C. The impurities which are present in the ceramic material in a proportion of 1 to 10% serve as a flux and produce an autogenous weld between the two components. Prior to assembly, the ceramic components can be provided with metallizations such as electric tracks on condition that these metallizations are refractory.

Abstract: Described is a method of manufacture of bond implant so to create a porous surface. The bone implant is made of titanium or titanium alloy. The porous surfaces are attached to a titanium substrate by use of a joinder agent including copper, nickel and indium, which is heated to temperatures less than the beta transus.

Abstract: A metallurgical bond at the interface between an aluminum-lithium core alloy and a metallic liner is achieved by first forming a mechanical bond along the interface between the core and liner under moderated temperature and reduction conditions, and then heating the composite without simultaneous reduction to cause diffusion of the elements across the core-liner interface. The result is a metallurgical bond securing the layers together to form a composite which can be worked, shaped, and fabricated by normal reduction techniques into a full range of products without the discoloration and fouling problems otherwise typical of aluminum-lithium alloys.

Abstract: The method of producing a metallic, ceramic, or metal ceramic, part, employing powdered material, that includes:(a) forming two or more oversize powder material preforms respectively corresponding to two or more sections of the ultimate part to be produced,(b) placing said preforms in side-by-side relation, and(c) consolidating said preforms at elevated temperature and pressure to weld said sections together and to reduce the sections to ultimate part size.

Abstract: The disclosure relates to a process for the fabrication of low cost dual property turbine rotors having blades that are diffusion bonded to a blade ring that is simultaneously diffusion bonded to a central hub.

Abstract: In directly bonding a metal to ceramics, in accordance with the invention, that surface of a metal component which is to be bonded by heating to a ceramic substrate is provided with parallel-running grooves before the preoxidation. The grooves make it possible to optimize the quantity of oxygen available at the bonding location and provide good flow behavior of the melt. As a result, a bond with good adhesion is obtained. Moreover, there is no formation of a thicker oxide layer on the free smooth surface of the metal component.

Abstract: Method of manufacturing structures from sheets of material having superplasticity as well as diffusion bonding capabilities wherein a combination of diffusion bonding and superplastic forming is performed concurrently with the use of low pressures and a simple heat furnace. The material to be formed and bonded is placed between and sealed in tooling constructed of materials having different degrees of thermal expansion. A low pressure from an external source is applied between the sheets of material to be formed during heating. Forming shims positioned within the tooling provide areas of diffusion bonding when the applied pressure and differential of tooling expansion force the sheets of material together at the shim locations.

Abstract: The invention concerns a process for assembling aluminum-based members and steel members.This process is characterized by:covering the steel member with a metal film on the part of the surface to be assembled,disposing grains of silicon at the aluminium-steel interface,providing protection from oxidation for the faces to be assembled,heating the members so as to achieve an interface temeperature of from 500.degree. C. to 650.degree. C. and applying a pressure which is sufficient to totally or partially expel the liquid eutectic which is thus formed,cooling the assembly.The assembly which is produced in this way is used in particular in so-called `clad` connecting members for igneous electrolysis vessels, in armour plating requiring high mechanical strength and in all cases where connections are to be made, which have good electrical and mechanical properties, for continuous use in a temperature range from at least -200.degree. C. to at least +450.degree. C.

Abstract: An improved diffusion bonding fixture for holding workpiece surfaces in opposed contacting relation and exerting controlled pressure across the surfaces is disclosed. The fixture includes components having different thermal expansion characteristics which hold the workpiece surfaces together and generate pressure on the surfaces upon heating to the bonding temperature. The fixture also includes one or more pressure-controlling shim members disposed between the components of the fixture, the shim members being selectively and controllably deformed by the expanding components to control said bonding pressure at the desired value and to prevent unwanted distortion of the workpiece surfaces and fixture components. The fixture is especially useful in bonding workpiece surfaces of highly complex configurations, such as those associated with gas turbine blades, vanes and the like.

Abstract: The invention concerns a method of fabricating ceramic/metal or ceramic/ceramic composites. A porous surface region is produced on a ceramic material by sintering a granular substance onto the latter. Metal infiltrated into the porous region is then firmly mechanically bonded to the ceramic. Alternatively, the porous region provides a surface of large effective area to which another ceramic may be bonded chemically and mechanically.

Abstract: Bonded metallic structures comprising at least two pieces each of a metallic aluminous substance selected from the group consisting of aluminium and aluminium alloys are formed by bonding the pieces together by eutectic diffusion bonding using a metallic interlayer material which is applied between the surfaces to be joined, which forms a less stable oxide than that formed by the aluminous substance and which is preferably selected from the group consisting of copper and copper-rich alloys including at least about 95% copper.

Abstract: The diffusion brazing of members comprised of materials which are characterized by embrittlement as a result of exposure to excessive temperatures is accomplished with the aid of preforms consisting of a titanium-zirconium alloy foil coated with a plurality of eutectic depressant alloying agents. The depressant agents, in a preferred embodiment, are applied as layers and consist of beryllium and nickel. The preforms are sandwiched between surfaces to be joined and the resulting assemblies are heated in a non-reactive environment with light pressure loading whereby a liquid phase will result and diffusion of metal from the preform into the base metals will occur.

Abstract: For the diffusion bonding of members of titanium and some titanium alloys, layers of Cu, Ag and Ni are deposited by plating on both sides of a sheet of etched, chemically clean, titanium or titanium alloy foil of a thickness preferably less than 0.001 inch. The plated foil is interposed between faying surfaces of the members to be bonded together, and the members, with the interposed foil, are sealed under pressure, in an inert atmosphere and under partial vacuum or hard vacuum of, for example, 10.sup..sup.-4 Torr. The parts thus prepared are heated to brazing temperature to render liquidus plating material and thereby establish a diffusion bridge between each plated face of the foil and the adjacent faying surface of each of the members to promote atomic transport of titanium thereacross and established a joint therebetween.

Abstract: A liquid interface diffusion process for bonding titanium or titanium alloys wherein at least one of the titanium type materials to be fayed is sequentially plated with a total weight of from between 1 and 5 gms/ft.sup.2 of honeycomb core of layers of copper and nickel or an alloy made therefrom. The faying surfaces are then held together to maintain position on alignment, placed in a protective atmosphere, the temperature of the materials are then raised at a controlled rate causing sufficient solid state diffusion to occur and a liquid to form continuing to increase the temperature to a predetermined level and holding at this temperature until a solidification occurs and sufficient additional solid state diffusion occurs producing a desirable dilution of bridge material and titanium at the joint, and then reducing the temperature at a controlled rate to a lower temperature to complete the bonding cycle.

Abstract: Fiber reinforced metal sheets coated with an alloying material for use in forming fiber reinforced metal matrix composite structures by means of eutectic bonding processes and the structures formed by said sheets.