Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.

Abstract: A method for quantitatively determining flux material residues remaining on a heat exchanger after a preceding soldering process is provided. To this end, a fluid is applied to the heat exchanger, wherein the remaining quantity of flux material on the heat exchanger after the preceding soldering process is derived from the concentration of soldering agent in the fluid.

Abstract: A method includes reflowing a solder region of a package structure, and performing a cleaning on the package structure at a cleaning temperature higher than a room temperature. Between the step of reflowing and the step of cleaning, the package structure is not cooled to temperatures close to the room temperature.

Abstract: According to one embodiment of the present invention, a method for preparing a brazed surface to receive a coating is disclosed. The method includes providing a brazed surface having a flux layer including a conversion coating and a powder component; and applying an aqueous solution containing a flux-removing agent to the surface to at least partially remove the powder component of the flux layer to obtain a treated brazed surface that is suitable for receiving a subsequent coating layer.

Abstract: A device for loading electro-conductive ball onto the terminal regions of a substrate more correctly and reliably is disclosed. Micro-ball loading device (200) may have the following parts: backing plate (220) supporting substrate (100) such that plural terminal regions (108) formed on one surface of substrate (100) are free, transfer mask (210), which contains a metal mask and has plural through-holes (216) formed corresponding to plural terminal regions (108) of the substrate, fixing block (230) onto which end portions (210a) of the transfer mask are fixed such that transfer mask (210) faces one surface of the substrate, and magnet part (240), which attaches transfer mask (210) by magnetic force to the side of backing plate (220); for magnet part (240), the attachment force to the center portion of the substrate is less than that of the peripheral edge portion.

Abstract: In the formation of sheet material from molten glass, molten glass is formed in a melting furnace and transported through a precious metal delivery system to the forming apparatus. Disclosed herein is a method to mitigate carbon contamination of individual components of the precious metal delivery system prior to and/or during their use. The method involves coating portions of the precious metal with an oxygen generating material prior to assembly of the component, and may comprise one or more heat treating steps of the component in an oxygen-containing atmosphere.

Abstract: A method for cleaning a thermode tip including applying an energy pulse to the thermode tip. The energy pulse involves raising the temperature of the thermode tip higher than the working temperature of the thermode tip. A method for cleaning a thermode tip may include periodically performing a predetermined number of soldering cycles at a working temperature; and applying an energy pulse to the thermode tip.

Abstract: A tin or solder alloy film is formed by ejecting molten tin liquid or molten solder alloy liquid in a jet state onto a copper surface of an electronic component. The overflowing molten tin or molten solder alloy liquid is transported to a stirrer. Then, cuprate and the like mixed in the overflowing molten tin or molten solder alloy liquid are taken in to the organic fatty acid solution by fiercely stirring and mixing the molten tin or molten solder alloy liquid in contact with a solution at a temperature of 180 to 350° C. containing 1 to 80 weight % of organic fatty acid having 12 to 20 carbon number that circulates in the stirrer to purify the overflowing molten tin or molten solder alloy liquid.

Abstract: A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed.

Abstract: A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, includes a first resin for providing the composition with adhesion to the electronic component, a curing agent for curing the first resin by heat treatment for soldering, and a second resin for facilitating removal of the composition from the electronic component.

Abstract: A filter is formed by a sintered non-woven metal fiber cloth adapted to be installed in a liquid passage, and, in the filter, a substance sticking to the surface of metal fibers which is present in the outermost part of the filter and in the vicinity thereof is removed together with the surface layer of the metal fibers.

Abstract: A method for correcting surface and near surface defects in metal components in which the component is first inspected to identify both the site and size of a component defect. Thereafter, it is determined if the defect is correctable by friction stir processing and, if so, the defect is corrected by performing friction stir processing on the component at the site of the defect. Optionally, one of several different sized friction stir processing tools is selected as a function of the size of the defect.

Abstract: According to one embodiment of the present invention, a method for preparing a brazed surface to receive a coating is disclosed. The method includes providing a brazed surface having a flux layer including a conversion coating and a powder component; and applying an aqueous solution containing a flux-removing agent to the surface to at least partially remove the powder component of the flux layer to obtain a treated brazed surface that is suitable for receiving a subsequent coating layer.

Abstract: A method and apparatus are disclosed for improving a screen printing process by applying vibrational energy to assist in the print release, cleaning, and drying processes. The vibrational energy or acoustic pressure waves may be created by a transducer where the waves are transferred to the stencil or printable material through air or a vibrational interface medium. The vibrational energy in turn assists with separating the printable material from the side walls of the apertures of the stencil. The vibrational energy can further assist in the process of cleaning the stencil. The acoustic pressure can also be used in the drying process by having the waves impinge on the water droplets to atomize the droplets on the surface of the stencil. The technology can be used for the assembly of Printed Circuit Assemblies, Ball Grid Array IC Packages, Flip Chip, etc.

Abstract: There is provided a method for producing a bonded substrate comprising, at least, a process of joining two substrates and a process of subjecting the joined substrates to heat treatment to bond them firmly, wherein, at least, a process of cleaning for removing contaminants on the surface of the substrates is performed before joining the substrates, and then a process of drying the cleaned surface of the substrates is performed without using the water displacing method for the drying process, so that moisture is left on the substrates before joining to increase a joining strength after joining the substrates. Thereby, there can be provided a method for producing a bonded substrate wherein a joining strength of the joining interface of the substrates to be joined is improved, and thus the bonded substrate wherein there is no void failure and blister failure in the bonding interface of a bonded substrate after bonding heat treatment can be produced at high productivity and high yield.

Abstract: Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally insoluble corrosive residues that would occur when the attaching flux is subjected to reflow conditions with the preform and substrate. Alternatively, the attaching flux may be applied to the preform and substrate before undergoing reverse reflow conditions and then the finishing flux is applied to the solder deposit and substrate and the same subjected to second reflow conditions. After each method, the residues left from the attaching flux which are solubilized by the finishing flux, are cleaned by washing with a typical solvent.

Abstract: A method and apparatus are disclosed for improving a screen printing process by applying vibrational energy to assist in the print release, cleaning, and drying processes. The vibrational energy or acoustic pressure waves may be created by a transducer where the waves are transferred to the stencil or printable material through air or a vibrational interface medium. The vibrational energy in turn assists with separating the printable material from the side walls of the apertures of the stencil. The vibrational energy can further assist in the process of cleaning the stencil. The acoustic pressure can also be used in the drying process by having the waves impinge on the water droplets to atomize the droplets on the surface of the stencil. The technology can be used for the assembly of Printed Circuit Assemblies, Ball Grid Array IC Packages, Flip Chip, etc.

Abstract: The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

Abstract: A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A wiping blade is mounted in the blade holder. The blade holder, with the blade mounted thereon, is reciprocated back and forth when in communication with a stencil to be cleaned. The blade is moved from the wiping position in communication with the stencil into the cleaning solution in the container. A pneumatic piston and rotary actuator provides controlled movement of the wiping blade. The wiping blade may be vibrated during wiping to improve removal of solder paste from the stencil and the cleaning solution may be ultrasonically vibrated to improve removal of solder paste from the wiping blade. The wiping blade may also be pulsed into a sponge to remove excess cleaning solution prior to the next cleaning cycle.

Abstract: A method of cleaning residue on surfaces in a reflow furnace includes introducing a solvent into the furnace chamber; reacting the solvent with the residue to form a product; and, removing the product from the furnace chamber. The solvent is gaseous, such as an etch gas. Also, the product of the reaction between the residue and the solvent can is gaseous. The gaseous product can then be exhausted from the reflow furnace. A reflow furnace for practicing the method is also disclosed.

Abstract: By pressing a wiping member 37 of a wiper 33 onto a concave curved surface 28 and an upper side flange portion 30 of a squeeze roll 8, spatter is wiped off by the rotation of the squeeze roll. In the wiper 33, the wiping member 37 is fixed to a base plate 36 that is linked via a rotatable arm 35 to a shaft body 34. The wiping member 37 is formed from flannel and an anchor member 39 is provided on the base plate 36 on which the wiping member 37 is fixed. The anchor members 39 of a pair of squeeze rolls are linked under tension by a coil spring 40 so as to press the wiping members 37 against the concave curved surfaces 28. A cooling tube 42 for discharging cooling water is provided to the rear of the squeeze roll in the rotation direction of the squeeze roll.

Abstract: A pin attachment method for mounting the pins on a wiring substrate for fabricating a pin grid array package is disclosed. There is provided an organic wiring board including a surface bearing electrical circuitry which includes at least one contact pad for receiving a pin. A solder mask layer which is placed on the board surface and patterned to expose the pad. The solder mask layer which does not cover any portion of the pad and forms a well by the perimeter of the solder mask layer around the pad. Subsequently, a pin and a solder material which are placed over said pad in the well. The pin which is soldered to the pad by a temperature sufficient to melt the solder material.

Abstract: A novel process for manufacturing Solid-Solder-Deposit Printed Circuit Boards (SSD-PCBs) by directly melting dry solder powder over a bare-PCB 230 consequently forming relatively thick individual layers of solid solder over each soldering pad of said bare-PCB 230. Solid Solder Deposit (SSD) refers to a relatively thick layer of solid solder metallurgically bonded over the soldering pads of a bare-PCB 230 such as that said SSD-PCB by itself is the source for solder alloy during a subsequent soldering operation. The manufacture of SSD-PCBs provides the electronic assembly industry with ready-to-solder PCBs consequently eliminates the need to use solder paste at the assembly floor. This invention, unlike the prior art for producing SSD-PCBs, utilizes a dry solder powder pile 232 that is melted by localized heating.

Abstract: A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

Abstract: A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

Abstract: A soldering flux includes a non-acidic resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting.

Abstract: The invention provides a new and improved process and exothermic reaction mixture for producing molten weld metal. The molten weld metal is used in joining one metallic piece with at least one other metallic piece. The process and exothermic reaction mixture have distinct advantages over the prior art. These advantages include a higher filler metal yield, an increased tensile strength, and a higher quality corrosion resistant weld. These advantages are accomplished by a process wherein a reactant mixture is provided which has a reducing agent, a metallic compound, and at least two filler metals that at least in part do not chemically react with the metallic compound, one of which is aluminum. The metallic compound subsequently forms, with the reducing agent, having a high heat of formation which provides an exothermic reaction with sufficient heat to melt the filler metals.

Abstract: A method of interconnecting components (10, 16) of aluminum having a purity of at least 95%, the method comprising brazing the components (10, 16) together and then surface treating the assembled components (10, 16) by subjecting them to a Bohmitting procedure.

Abstract: A method and assembly useful in metal joining processes is disclosed which blocks the deposition of molten metal in openings. The method and assembly employs mica material with a binder to block the flow of molten metal. In one detailed embodiment, the mica material supports elements of the articles being brazed.

Abstract: A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The debridging tool, which comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board, targets only those areas of the board where bridges or excess solder repeatedly forms during the soldering process without disturbing solder joints where no bridges or excess solder form. More than one movable nozzle may be used where warranted.

Abstract: A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.

Abstract: A method for cleaning and coating a conductor in a plasma reaction chamber utilizing a plasma gas mixture containing Argon and CF.sub.4 to clean and coat a conductor. The method for cleaning and coating a conductor includes the combination of cleaning processes including, physical reduction and chemical reaction and the formation of a polymerization passivation film formed on oxyfluoro metal compositions (SnO.sub.x F.sub.y) which occur during exposure of a conductor to the process of the invention. The polymerization passivation film is formed as a result of the combination of the degraded carbon Tetrafloride (CF.sub.4) gas and degraded environmental and casual hydrocarbons which are present in the form of a variety of unspecified organic contaminants to form crude polymeric molecules in the high energy environment of the plasma.

Abstract: A method of assembling a substrate and die in a flip chip configuration uses a non-hazardous cleaning solvent to clean the flux residue. The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are: time 10-30 minutes, temperature 70-90.degree. C., pressure 40-70 psi, rotation speed and reversals 100-1000 rpm and 24-100 reversal cycles.

Abstract: A solder immersion chamber in a solder crater/leveler includes a solder manifold having upper and lower solder chambers, from which solder is directed onto the top and bottom surfaces of printed circuit boards conveyed therebetween. The solder immersion chamber has a pair of driven rollers at either end thereof for conveying the printed circuit boards through the solder immersion chamber, and for damming and holding the molten solder within the solder immersion chamber. A pair of oil weirs is provided adjacent either side of the upper solder chamber for continuously flowing oil to flood the top surface of the molten solder in the solder immersion chamber. A skimmer skims oil from the top surface of the molten solder, and returns the separated oil to the pair of oil weirs.

Abstract: A method for producing pore-free cast-on-strap joints for lead-acid batteries including the steps of cleaning a plurality of positive and negative plate lugs by a combined action of flux and ultrasonic vibration, water rinsing the plate lugs under ultrasonic vibration, and drying the plate lugs by gas blasting. The gas blasting occurs prior to the formation of the cast-on-strap joint. The cast-on-strap joint is formed by introducing the plate lugs into a molten lead-based strap alloy contained in a strap mold and solidifying the molten strap alloy in the strap mold.

Abstract: The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order to ensure that the solder beads are mechanically removed without damaging the printed circuit boards, the solder beads (14) are mechanically removed by means of at least one jet (50) of cold gas directed onto the surface.

Abstract: In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.

Abstract: A method for cleaning a bonding tool of a bonding apparatus includes a step of positioning a tip portion of the bonding tool between a pair of discharge electrodes, which are primarily used for removing a covering that covers a bonding wire, and a step of causing an electrical discharge across the discharge electrodes by applying a high voltage, such as of 3500 V, by connecting the discharge electrodes to positive and negative poles of a discharge power source, respectively. The electrical discharge is performed with the bonding wire kept inside the bonding tool so as not to project out of the bonding tool or after the bonding wire is removed from the bonding tool.

Abstract: An apparatus for heating a module mounted on a card includes a heating chamber adapted to receive the card and module, a nozzle adapted to surround the module and provide a flow of heated gas thereover, and a heated support surface for heating a bottom surface of a card immediately underlying the module. The method of removing and replacing a module on a card includes preheating the card and module prior to heating the contact sites to a solder reflow temperature and also preheating a card and a replacement module to an equilibrium temperature prior to increasing the temperature of the contact sites to the reflow temperature. The apparatus and method embodying the present invention effectively addresses the problem of providing a faster heating cycle, and a more even temperature distribution across the contact sites of the module and card.

Abstract: A liquid flux using water instead of a volatile organic compound as the liquid carrier is used in a wave soldering process. Undesirable formation of solder balls, solder bridges and solder webbing is prevented by using an air knife to direct a vigorous jet of gas at the dielectric substrate in the preheating section.

Abstract: In a compound panel welding line, the compound panels discharged from a welding machine are cooled by means of a cooling unit. In the cooling unit, the welded seam is treated with a cooling fluid, in particular a rust-preventative oil. This allows the panels to be cooled and oiled within a very short time and over a very short distance, thus substantially reducing the overall length of a welding line, and greatly facilitating the handling of the compound panels.

Abstract: Embodiments of a new apparatus for leveling solder contacts on printed circuit board panels are disclosed. A fluid is received by a platen and dispersed against a belt that engages the panel. A surface of the platen causes the pressure of the fluid to automatically adjust to the area of the panel by providing a series of parallel channels or holes in the surface.

Abstract: A tool for soldering pin-in-hole electronic circuit components includes a tool plate with a set of via holes corresponding to the holes of a circuit board on which a circuit component is soldered. The board is aligned with the tool plate and hot gas is supplied through the set of plate vias to reflow solder in the board holes. The tool is particularly suitable for use in removing and replacing pinned circuit components. Use of particular gases (e.g., nitrogen) allows soldering to be carried out without the use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board (by directing hot gas only substantially onto the circuit board's solder-containing holes).

Abstract: A superpure purity gas supply system adapted to prevent a semiconductor device of high cleanliness, into which a gas is introduced through a gas supply pipe system, from being contaminated with the metal s or the like deposited during the welding thereof, and a method of installing such a gas supply pipe system. The superhigh purity gas supply system according to the present invention is a pipe system consisting of gas supply pipe system parts welded portions, characterized in that the gas supply pipe system parts having such welded portions are washed with super high purity water before, during or after the installation of the pipe system.

Abstract: An apparatus comprises a current source, first and second wheels through which a current from the current source selectively flows, and a source of gas, wherein the first and second wheels receive first and second pieces of metal having overlapping portions, force the first and second pieces of metal together at said overlapping portions. The current from the current source flows through the first and second wheels in the overlapping portions of the first and second pieces of metal, generating heat in said first and second pieces of metal sufficient to melt a coating on the first and second sheets of metal where the first and second sheets of metal contact and overlap. The source of gas comprises removes said melted coatings away from the overlapping portions of metal to clean the metal surfaces in preparation for movement to a weld station where the pieces of metal are resistive seam welded or laser lap seam welded.

Abstract: A method and apparatus for soldering a workpiece in a non-oxidizing gas are achieved by comprising conveyors running in a substantially horizontal direction, for holding and moving a workpiece in the horizontal direction, a flux supplying unit for supplying flux to the workpiece, a solder bath including solder and disposed under the conveyors such that the workpiece with a parting portion parting from the top of solder flow is dipped in the top of solder flow, and jetting unit provided at an exit side of the solder bath with respect to the conveyors and connected to a non-oxidizing gas source, for jetting non-oxidizing gas from the non-oxidizing gas source into a region defined by the parting portion of the workpiece and a vicinity thereof.

Abstract: A hot air circulation apparatus and method for wave soldering machines which heats air from a high-pressure air source and directs it at the flux applied to a printed circuit board. The heated and pressurized air also circulates air within the wave soldering machine to force the moisture out. A plurality of hot air knives are mounted adjacent heaters within the wave soldering machine and are coupled to the pressurized air source. The hot air knives include a hollow metal cylindrical member which conducts heat from the heater, and contain a plurality of orifices which increase the pressure of the air and direct the air at the flux.

Abstract: Following soldering of electrical components on a circuit card in a soldering process that includes use of an aqueous-based flux, the circuit card, containing the soldered electrical components, is exposed to a dilute aqueous basic solution prior to a final hot water rinse. The dilute basic solution prevents the formation of a white residue commonly associated with the use of aqueous-based fluxes. For example, using a flux consisting essentially of an aqueous solution of citric acid, and rinsing in either an aqueous ammonia solution consisting essentially of about 20 to 250 ppm ammonium hydroxide or an aqueous solution of about 0.1 to 3 wt% sodium bicarbonate, prevents formation of the white residue.

Abstract: A desoldering tool for melting and collecting solder includes a heated desoldering tip connected to a suction tube. The tip and tube from a flow bore for the flow of melted solder. The suction tube projects into an elongated tin collecting container which in turn is connected to a vacuum tube connected to a vacuum source. The axis of the suction tube traverses the axis of the container such that the solder flowing rom the suction tube is directed toward the interior wall of the container. That portion of the suction tube extending into the container forms a tin collecting space therearound for collecting the melted tin flowing from the mouth of the suction tube.

Abstract: A replaceable tip for a hand held vacuum stroke desoldering tool. The tip or nozzle element is retained in a bore, in the otherwise closed front end of the tool, by a rear retaining shoulder and a forward compressible skirt-like barb which when radially compressed permits the removal or insertion of the tip element.