Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.

Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.

Abstract: The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Abstract: A method includes reflowing a solder region of a package structure, and performing a cleaning on the package structure at a cleaning temperature higher than a room temperature. Between the step of reflowing and the step of cleaning, the package structure is not cooled to temperatures close to the room temperature.

Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.

Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.

Abstract: A filter is formed by a sintered non-woven metal fiber cloth adapted to be installed in a liquid passage, and, in the filter, a substance sticking to the surface of metal fibers which is present in the outermost part of the filter and in the vicinity thereof is removed together with the surface layer of the metal fibers.

Abstract: A method for manufacturing an air compressor assembly including, between a tank welding step and a final assembling step, a step of submerging a welded tank into a dip tank that contains cooling liquid treated with a corrosion inhibitor. In a preferred embodiment, in the submerging step, all air access ports of the welded tank are open to allow the cooling liquid to coat both the inside and outside surfaces of the air tank to maximize corrosion inhibitor protection and increase tank cooling rate. The method for manufacturing an air compressor assembly according to the present invention may be used in manufacturing air compressor assemblies in various styles.

Abstract: The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.

Abstract: There is provided a semiconductor device manufacturing method which comprising the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing a formic acid to heat the solder bumps. Accordingly, the solder bumps can be formed without the use of flux not to generate voids in the solder layer, and also the cleaning required after the solder bumps are formed can be omitted.

Abstract: The present invention relates to a method for producing a tin-silver alloy plating film having an excellent wettability and improved in solderability and said method comprises a step of heat treating the surface of the tin-silver alloy plating film preferably the heat treating temperature is 70-210° C.

Abstract: A directionally solidified nickel-base superalloy article has a defect therein extending parallel to the solidification direction. The article is repaired by removing any foreign matter present in the defect, and then heating the article to a repair temperature of from about 60 to about 98 percent of the solidus temperature of the base material in a chamber containing a protective gas that inhibits oxidation of the base material. The defect is filled with a filler metal while maintaining the article at the repair temperature. The filling is accomplished by providing a source of the filler metal of substantially the same composition as the base material of the directionally solidified article, and melting the filler metal into the defect progressively while moving the source of the filler metal relative to the article in a direction parallel to the solidification direction.

Abstract: A soldering flux includes a non-acidic resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting.

Abstract: A method of interconnecting components (10, 16) of aluminum having a purity of at least 95%, the method comprising brazing the components (10, 16) together and then surface treating the assembled components (10, 16) by subjecting them to a Bohmitting procedure.

Abstract: The method for coating the seam of a welded tube of this invention includes applying a mixture of the desired protective metal coating in powdered form and a liquid flux over the internal surface of the welded seam with the welded seam located in a lower portion of the tube, then heating the welded seam to the melting temperature of the protective metal coating, melting the metal coating which flows over the seam forming an adherent metallurgical bond. The preferred apparatus includes a wand which extends between the opposed edges of the open seam tube in the welding apparatus and extends axially through the tube to overlie the welded seam spaced from the welding apparatus. The wand includes three conduits transmitting the powdered protective metal coating, liquid flux and nonoxidizing gas to the applicator which includes a nozzle which atomizes and sprays the liquid flux over the internal surface of the seam and which combines with the powdered protective metal coating to form a paste.

Abstract: A process for the production of a homogenized material of metals and alloys from a slab, and the material has a fine microstructure or fine nonmetallic inclusions and has less segregation of alloying elements.

Abstract: A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pattern is mated to the carrier plate with its holes aligned with the predetermine pattern on the substrate. Solder balls are loaded into each hole of the alignment plate. The solder balls may be loaded with a vacuum plate which uses vacuum to pick up solder balls in the predetermined pattern and place them over the holes on the alignment plate. The vacuum is released for dropping the balls in the holes of the alignment plate. Alternatively a shutter plate having holes corresponding to the holes on the alignment plate is fitted on the alignment plate and afforded slidable movement between an offset position and an aligned position. A ball is loaded in each hole in the shutter plate when it is in its offset position.

Abstract: The defluxing agent for flux residue after soldering contains an acid (preferably an organic acid, and particularly an acid stronger than abietic acid; for example, acrylic acid, acetic acid, propionic acid, benzoic acid) and an organic solvent (for example, xylene, benzyl acetate, methyl .alpha.-hydroxyisobutyrate, cyclohexanone, methyl .beta.-methoxyisobutyrate), and if necessary it further contains a monohydric alcohol, a surfactant and a corrosion inhibitor. Rinsing is preferably performed after the cleaning, using a solvent which is miscible with the defluxing agent, in order to completely remove the acid. There is also disclosed a cleaning apparatus which may be generally used for this and other cleaning.

Abstract: An improved method of coating the welded seam of a metal tube comprising heating the weld area only of the metal tube to a first temperature which is less than the melting temperature of the protective metal coating, applying the protective metal coating over the seam and heating the entire tube preferably with a full body induction coil to a second temperature which is at least equal to the difference between the first temperature and the melting temperature of the metal coating, such that the temperature of the seam area is heated to a temperature equal to or greater than the melting temperature of the metal coating, whereby the metal coating firmly adheres to the welded seam.

Abstract: A method of assembling a substrate and die in a flip chip configuration uses a non-hazardous cleaning solvent to clean the flux residue. The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are: time 10-30 minutes, temperature 70-90.degree. C., pressure 40-70 psi, rotation speed and reversals 100-1000 rpm and 24-100 reversal cycles.

Abstract: Following soldering of electrical components on a circuit card in a soldering process that includes use of an aqueous-based flux, the circuit card, containing the soldered electrical components, is exposed to a dilute aqueous basic solution prior to a final hot water rinse. The dilute basic solution prevents the formation of a white residue commonly associated with the use of aqueous-based fluxes. For example, using a flux consisting essentially of an aqueous solution of citric acid, and rinsing in either an aqueous ammonia solution consisting essentially of about 20 to 250 ppm ammonium hydroxide or an aqueous solution of about 0.1 to 3 wt% sodium bicarbonate, prevents formation of the white residue.

Abstract: An improved method of manufacturing galvanized steel tubing from steel strip having at least one galvanized surface, which surface becomes the exterior surface of the tubing is provided. In the method of the invention, after the steel strip is roll-formed and welded to complete the tubing and the welded seam is scarfed to remove irregularities, a quantity of an acid solution is applied to substantially only the scarfed area to react with oxidized metal, and then rinsed, leaving the non-scarfed galvanized exterior surface intact. The tubing is then heated to a temperature sufficient to cause the galvanized coating of the exterior surface to begin to flow and the tubing is regalvanized to produce an improved galvanized exterior surface, which is resistant to cracking along the scarfed area.

Abstract: An improved copper radiator for motor cars comprising a plurality of tubes adapted for the flow of a heat-exchanging medium therethrough, fins bonded directly with solder to said tubes to form a copper core and wherein said core is bonded with solder to at least one seat plate, the improvement in that the surface of the fins of said copper radiator has an oxidized layer of a thickness of not more than 1200 .ANG..