Applying Flux Patents (Class 228/207)
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Patent number: 11534872Abstract: In a mixed composition coating material for brazing, when a total mass of a solid material, an organic solvent, and water is defined as 100 mass %, the solid material are contained in an amount of 30 mass % or greater and 80 mass % or less with respect to the whole coating material, the organic solvent and the water is contained in a total amount of 20 mass % or greater and 70 mass % or less with respect to the whole coating material, and the water is contained in an amount of 0.4 mass % or greater and 2.5 mass % or less with respect to the whole coating material.Type: GrantFiled: January 22, 2018Date of Patent: December 27, 2022Assignee: MA Aluminum CorporationInventors: Masaya Katsumata, Yasunori Hyogo
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Patent number: 11140788Abstract: In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.Type: GrantFiled: February 6, 2019Date of Patent: October 5, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tetsuya Tanaka, Masahiko Akasaka, Koji Sakurai, Toshihiko Nagaya
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Patent number: 11089685Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: GrantFiled: January 28, 2020Date of Patent: August 10, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 10864096Abstract: A method of manufacturing three-dimensional thin-film nitinol (NiTi) devices includes: depositing multiple layers of nitinol and sacrificial material on a substrate. A three-dimensional thin-film nitinol device may include a first layer of nitinol and a second layer of nitinol bonded to the first layer at an area masked and not covered by the sacrificial material during deposition of the second layer.Type: GrantFiled: March 11, 2019Date of Patent: December 15, 2020Assignee: MONARCH BIOSCIENCES, INC.Inventors: Alfred David Johnson, Colin Kealey
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Patent number: 10821557Abstract: Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.Type: GrantFiled: May 2, 2017Date of Patent: November 3, 2020Assignee: Alpha Assembly Solutions Inc.Inventors: Morgana De Avila Ribas, Suresh Telu, Pritha Choudhury, Anil K. N. Kumar, Siuli Sarkar
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Patent number: 10804239Abstract: Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.Type: GrantFiled: March 22, 2019Date of Patent: October 13, 2020Assignee: PROTEC CO., LTD.Inventors: Youn Sung Ko, Yoshiaki Yukimori
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Patent number: 10804240Abstract: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.Type: GrantFiled: March 27, 2019Date of Patent: October 13, 2020Assignee: PROTEC CO., LTD.Inventors: Youn Sung Ko, Yoshiaki Yukimori
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Patent number: 10384312Abstract: The present invention relates to an aluminum alloy brazing sheet with a thickness of 0.30 nm or less, including: a core material; a sacrificial material cladding one surface of the core material; and a brazing material cladding the other surface of the core material, in which the core material is made of A1—Mn—Si-based aluminum alloy containing by mass %, Cu: 0.5 to 1.3%, the sacrificial material is made of aluminum alloy containing, by mass %, Zn: 4.0 to 7.0%, the brazing material is made of aluminum alloy containing, by mass %, Si: 6.0 to 11.0% and Zn: 0.1 to 3.0%, in a pitting potential after brazing beat treatment, a thickness of a region in which a potential difference from the noblest potential in the core material is 100 mV or more is 10% to 50% of the thickness of the brazing sheet.Type: GrantFiled: March 12, 2015Date of Patent: August 20, 2019Assignee: Mitsubishi Aluminum Co., Ltd.Inventors: Sho Ishigami, Shohei Iwao
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Patent number: 10137519Abstract: A flux reservoir apparatus (100, 200) includes a stage (12) having a recessed portion (13) for reserving flux (51, 52, 53) therein and a flux pot (20) composed of an annular member having a through hole (30) through which the flux (51, 52, 53) flows, the flux pot arranged to move back and forth on the surface (14) of the stage (12) to feed the flux (51, 52, 53) into the recessed portion (13) and to smooth the surface of the flux (51, 52, 53), in which the through hole (30) is an elongated hexagonal hole with a length greater than the width of the recessed portion (13) in the direction perpendicular to the back-and-forth direction, and in which the bottom surface of a flux pot main body (21) is a chevron surface. This reduces leakage of the flux (51, 52, 53) in the flux reservoir apparatus (100, 200).Type: GrantFiled: May 10, 2017Date of Patent: November 27, 2018Assignee: SHINKAWA LTD.Inventors: Kohei Seyama, Shoji Wada
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Patent number: 9561120Abstract: The invention relates to a method of manufacture of an intravascular functional element that can be introduced into a hollow organ and that comprises at least one wire (10) of an alloy having nickel and titanium as alloying elements, with the following steps: preparation of a metal body of the wire (10) with a metallic surface, then formation of a first oxide layer on the metallic surface of the metal body, then performance of a heat treatment of the wire (10) in a nitrogen-containing salt bath for thermal formation of a second mixed oxide layer on the first oxide layer, wherein the total layer thickness is 15 nm to 100 nm and the mixed oxide layer contains TiO2 and at least one nitride, especially titanium oxynitride and/or titanium nitride.Type: GrantFiled: February 11, 2014Date of Patent: February 7, 2017Assignee: ADMEDES INC.Inventors: Andreas Schüβler, Gerd Siekmeyer, Giorgio Cattaneo, Werner Mailänder
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Patent number: 9263414Abstract: Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.Type: GrantFiled: December 17, 2013Date of Patent: February 16, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyeong Min Yeo, Seung Min Ryu, Dae Jung Kim, Ji Ho Uh, Suk Won Lee
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Publication number: 20150122876Abstract: The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion.Type: ApplicationFiled: November 3, 2014Publication date: May 7, 2015Inventors: William Gilbert Breingan, Lev Rappaport, John Clark, John Taddei, Laura Mauer
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Patent number: 9013029Abstract: A joined body which is formed by, first, an aqueous solution containing an oxide film remover is disposed on a junction region of a first metal plate. Then, with the aqueous solution remaining on the first metal plate, a second metal plate is placed on the first metal plate. Thereafter, a load is applied to junction regions of the first metal plate and the second metal plate in the vertical direction, thereby joining the first metal plate and the second metal plate together to form a junction portion.Type: GrantFiled: August 8, 2012Date of Patent: April 21, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Masanori Minamio, Tatsuo Sasaoka
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Patent number: 8978962Abstract: A fine particulate flux, an aqueous flux preparation comprising this flux, a method for the manufacture of a coated part of aluminum, aluminum alloys, steel, copper or titanium using such flux, and a method for brazing parts of aluminum or aluminum alloys to parts of aluminum, aluminum alloys, steel, copper or titanium using such flux. The flux can be obtained by sieving, or it can be obtained by removing solids, e.g., in a cyclone, from the drying gases obtained when wet fluxes are dried, especially after their manufacture. Fine particulate flux increases the viscosity of flux preparations comprising the flux dispersed in water or an aqueous or liquid organic carrier.Type: GrantFiled: March 8, 2011Date of Patent: March 17, 2015Assignee: Solvay Fluor GmbHInventors: Placido Garcia-Juan, Hans-Walter Swidersky, Andreas Becker
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Patent number: 8960526Abstract: There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1% and 9% by volume based on a volume of the flux.Type: GrantFiled: January 27, 2005Date of Patent: February 24, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Tadashi Maeda, Tadahiko Sakai
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Publication number: 20140374469Abstract: Systems and methods for evenly applying a flux coating to any number of different shaped parts with a single machine are described. The systems and methods provide advantages in that the flux coating may be applied accurately within 2% to 4% of desired thickness with 85% to 95% of the total yield of flux being applied, this minimizing waste. Thousands of parts may be batch treated with a single, machine without operator input.Type: ApplicationFiled: May 30, 2014Publication date: December 25, 2014Applicant: Lucas-Milhaupt, Inc.Inventor: Daniel J. Jossick
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Patent number: 8770462Abstract: A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.Type: GrantFiled: March 14, 2012Date of Patent: July 8, 2014Assignee: Raytheon CompanyInventors: William D. Beair, Michael R. Williams, Eric Gilley
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Publication number: 20140187103Abstract: Presented herein are an interconnect and method for forming the same, the method comprising forming an interconnect on a mounting surface of a mounting pad disposed on a first surface of a first substrate, the interconnect comprising a conductive material, optionally solder or metal, the interconnect avoiding the sides of the mounting pad. A molding compound is applied to the first surface of the first substrate and molded around the interconnect to covering at least a lower portion of the interconnect and a second substrate may be mounted on the interconnect. The interconnect may comprise an interconnect material disposed between a first and second substrate and a molding compound disposed on a surface of the first substrate, and exposing a portion of the interconnect. A sidewall of the interconnect material contacts the mounting pad at an angle less than about 30 degrees from a plane perpendicular to the first substrate.Type: ApplicationFiled: January 28, 2013Publication date: July 3, 2014Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Ting Chen, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii
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Publication number: 20130221502Abstract: First, an aqueous solution (103) containing an oxide film remover is disposed on a junction region of a first metal plate (101). Then, with the aqueous solution (103) remaining on the first metal plate (101), a second metal plate (102) is placed on the first metal plate (101). Thereafter, a load is applied to junction regions of the first metal plate (101) and the second metal plate (102) in the vertical direction, thereby joining the first metal plate (101) and the second metal plate (102) together to form a junction portion (110). In this manner, a joined body is manufactured.Type: ApplicationFiled: August 8, 2012Publication date: August 29, 2013Applicant: PANASONIC CORPORATIONInventors: Masanori Minamio, Tatsuo Sasaoka
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Patent number: 8499996Abstract: A method for quantitatively determining flux material residues remaining on a heat exchanger after a preceding soldering process is provided. To this end, a fluid is applied to the heat exchanger, wherein the remaining quantity of flux material on the heat exchanger after the preceding soldering process is derived from the concentration of soldering agent in the fluid.Type: GrantFiled: May 24, 2012Date of Patent: August 6, 2013Assignee: Behr GmbH & Co. KGInventors: Oliver Mamber, Hans Koch
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Patent number: 8434666Abstract: A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.Type: GrantFiled: September 30, 2011Date of Patent: May 7, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Kim S. Ho, Michael K. Gallagher, Avin V. Dhoble, Mark R. Winkle, Xiang-Qian Liu, David Fleming
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Patent number: 8434667Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.Type: GrantFiled: September 30, 2011Date of Patent: May 7, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Mark R. Winkle, Avin V. Dhoble, Kim S. Ho, Michael K. Gallagher, Xiang-Qian Liu, David Fleming
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Patent number: 8430293Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.Type: GrantFiled: September 30, 2011Date of Patent: April 30, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Avin V. Dhoble, Mark R. Winkle, Michael K. Gallagher, Kim S. Ho, Xiang-Qian Liu, Asghar A. Peera, Glenn N. Robinson, Ian A. Tomlinson, David Fleming
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Patent number: 8430294Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.Type: GrantFiled: September 30, 2011Date of Patent: April 30, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Kim S. Ho, Mark R. Winkle, Avin V. Dhoble, Michael K. Gallagher, Xiang-Qian Liu, Asghar A. Peera, Glenn N. Robinson, Ian A. Tomlinson, David Fleming
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Patent number: 8430295Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.Type: GrantFiled: September 30, 2011Date of Patent: April 30, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Michael K. Gallagher, Kim S. Ho, Avin V. Dhoble, Mark R. Winkle, Xiang-Qian Liu, David Fleming
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Patent number: 8411455Abstract: A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn—Ag—Bi—In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from ?40 to 150° C. has been suppressed.Type: GrantFiled: February 22, 2010Date of Patent: April 2, 2013Assignee: Panasonic CorporationInventors: Kenji Kondo, Masahito Hidaka, Koji Kuyama, Yutaka Kamogi
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Patent number: 8146793Abstract: A pin for allowing material having adhesive properties to adhere thereon, the pin comprising: a shaft having a longitudinal axis, a distal end and a proximal end opposite to the distal end; and a first tapered portion disposed on the longitudinal axis of the shaft, the tapered portion tapering from a first circumference to a second smaller circumference in a direction toward the proximal end of the shaft.Type: GrantFiled: April 19, 2005Date of Patent: April 3, 2012Assignee: Aurigin Technology Pte. Ltd.Inventors: Boon Chew Ng, Thian Seng Loo, Ee Teoh Lim
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Patent number: 8113414Abstract: A method of brazing an aluminum alloy material, which is a Nocolok brazing method of the aluminum alloy material, in which the method satisfies the condition: Ts?Tf?Ts+15° C. in which Tf represents an incipient fluidization temperature of a filler material, and Ts represents an incipient fluidization temperature of flux.Type: GrantFiled: March 20, 2007Date of Patent: February 14, 2012Assignee: Furukawa-Sky Alumnum Corp.Inventor: Noriyuki Yamada
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Patent number: 8083121Abstract: In the soldering method, metal-powder-contained flux is disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprising a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.Type: GrantFiled: October 27, 2005Date of Patent: December 27, 2011Assignee: Panasonic CorporationInventors: Tadashi Maeda, Tadahiko Sakai
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Patent number: 8070045Abstract: A curable amine flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 and R8 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R7 and R8, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; wherein R10 and R11 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R10 and R11, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted withType: GrantFiled: December 2, 2010Date of Patent: December 6, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: David D. Fleming, Mike K. Gallagher, Kim Sang Ho, Xiang-Qian Liu, Mark R. Winkle, Asghar Akber Peera, Glenn N. Robinson, Ian Tomlinson
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Patent number: 8070043Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.Type: GrantFiled: December 2, 2010Date of Patent: December 6, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: David D. Fleming, Mike K. Gallagher, Kim Sang Ho, Xiang-Qian Liu, Mark R. Winkle
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Patent number: 8070044Abstract: A polyamine flux composition is provided, comprising, as an initial component: a polyamine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 comprises at least two tertiary carbons and is selected from an unsubstituted C5-80 alkyl group, a substituted C5-80 alkyl group, an unsubstituted C12-80 arylalkyl group and a substituted C12-80 arylalkyl group; and, wherein the two nitrogens shown in formula I are each separately bound to one of the at least two tertiary carbons of R7; with the proviso that when the polyamine fluxing agent of formula I is represented by formula Ia: then zero to three of R1, R2, R3 and R4 is(are) hydrogen. Also provided is a method of soldering an electrical contact using the polyamine flux composition.Type: GrantFiled: December 2, 2010Date of Patent: December 6, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: David D. Fleming, Mike K. Gallagher, Kim Sang Ho, Xiang-Qian Liu, Mark R. Winkle
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Patent number: 8070047Abstract: A flux composition is provided, comprising, as an initial component: a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.Type: GrantFiled: December 2, 2010Date of Patent: December 6, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: David D. Fleming, Mike K. Gallagher, Kim Sang Ho, Xiang-Qian Liu, Mark R. Winkle
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Patent number: 8070046Abstract: An amine flux composition is provided, comprising, as an initial component: an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 and R8 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R7 and R8, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; wherein R10 and R11 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R10 and R11, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; and, wherein R9 is selected from a hydrogen, a C1-30Type: GrantFiled: December 2, 2010Date of Patent: December 6, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: David D. Fleming, Mike K. Gallagher, Kim Sang Ho, Xiang-Qian Liu, Mark R. Winkle, Asghar Akber Peera, Glenn N. Robinson, Ian Tomlinson
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Patent number: 7956114Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.Type: GrantFiled: March 9, 2009Date of Patent: June 7, 2011Assignee: Raytheon CompanyInventors: Luke M. Flaherty, Randal E. Knar, Tiffanie T. Masumoto
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Patent number: 7926697Abstract: An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.Type: GrantFiled: September 19, 2007Date of Patent: April 19, 2011Assignee: Intel CorporationInventors: Linda Shekhawat, Gregory S. Constable, Youzhi E. Xu, Nisha Ananthakrishan
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Patent number: 7828193Abstract: In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.Type: GrantFiled: December 14, 2007Date of Patent: November 9, 2010Assignee: Fujitsu LimitedInventors: Kuniko Ishikawa, Norio Kainuma, Hidehiko Kira
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Publication number: 20100270361Abstract: The invention relates to an apparatus and a process for the preferably uneven application of flux to a material surface, in particular to the finned side of a plate of a plate-type radiator.Type: ApplicationFiled: November 14, 2003Publication date: October 28, 2010Applicant: BEHR GMBH & CO.,Inventors: Peter Englert, Ingo Trautwein, Joan Ferrer, Vincenzo Sabetta
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Patent number: 7754105Abstract: It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux.Type: GrantFiled: May 23, 2006Date of Patent: July 13, 2010Assignee: Shikoku Chemicals CorporationInventors: Hirohiko Hirao, Yoshimasa Kikukawa, Takayuki Murai
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Patent number: 7735717Abstract: A method of manufacturing a semiconductor apparatus including a process of applying viscous liquid. The method applies viscous liquid onto a principal surface of a substrate, coats the viscous liquid closely with flexible coating material having a higher bonding strength with molecules of the viscous liquid than an intermolecular bonding strength of molecules of the viscous liquid, and then strips away the coating material together with part of the viscous liquid.Type: GrantFiled: November 9, 2005Date of Patent: June 15, 2010Assignee: NEC Electronics CorporationInventor: Toshiyuki Hara
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Patent number: 7735713Abstract: A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.Type: GrantFiled: November 22, 2006Date of Patent: June 15, 2010Assignee: TDK CorporationInventors: Naruki Kataoka, Taisuke Ahiko, Akitoshi Yoshii, Akira Goshima, Takashi Aoki, Tomohiro Sogabe
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Patent number: 7669752Abstract: A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.Type: GrantFiled: June 22, 2007Date of Patent: March 2, 2010Assignee: Harima Chemicals, Inc.Inventors: Kazuki Ikeda, Shunsuke Ishikawa, Takaaki Anada, Keigo Obata, Takao Takeuchi, Naoya Inoue
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Patent number: 7651020Abstract: Embodiments include materials which may be used during electronic device fabrication, including a flux material. The flux material comprises a solution including a plurality of micellar structures in a solvent, the micellar structures each including a plurality of amphiphilic block copolymer elements. The amphiphilic block copolymer elements each include at least one non-polar region and at least one polar region. A fluxing agent is contained within the micellar structures. Other embodiments are described and claimed.Type: GrantFiled: December 27, 2007Date of Patent: January 26, 2010Assignee: Intel CorporationInventors: Linda A. Shekhawat, Anna M. Prakash
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Patent number: 7575150Abstract: Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.Type: GrantFiled: September 24, 2007Date of Patent: August 18, 2009Assignee: NOF CorporationInventors: Shun Saito, Katsumi Nakasato, Yukihiro Kato, Isao Nakata
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Patent number: 7534309Abstract: An aqueous aluminum brazing composition containing an organic binder and a zinc-based flux which prevents the precipitation of the zinc-based flux having a large specific gravity while securing an excellent brazeability. The thixotropic index of the brazing composition is adjusted to 1.01-1.20 by adding a (meth)acrylic acid/(meth)acrylate copolymer emulsion to the brazing composition as a precipitation inhibitor in an amount of 0.03-1.50 wt % of 100 wt % of the brazing composition. Since the (meth)acrylic acid/(meth)acrylate copolymer emulsion is used as the precipitation inhibitor in a specific amount instead of other types of compounds used for a powder-containing paint, such as ultrafine particle silica, poly(meth)acrylate, or polyvinyl alcohol, the precipitation of the zinc-based flux can be prevented without impairing the brazeability.Type: GrantFiled: June 16, 2003Date of Patent: May 19, 2009Assignees: Sumitomo Light Metal Industries, Ltd., Harima Chemicals, Inc.Inventors: Taketoshi Toyama, Ryoichi Sanada, Takashi Hatori, Yoshiharu Hasegawa, Yuji Hisatomi, Ichiro Taninaka
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Patent number: 7481353Abstract: A hydrocarbon compound mixed with an organic peroxide is placed between a copper electrode and a solder-coated electrode, and is heated at a temperature of about 300° C. The organic peroxide is exposed to a heating energy and thermally decomposed into an organic peroxide radical whose oxygen-oxygen bond has been released. Since this organic peroxide radical is active, it abstracts hydrogen from the hydrocarbon compound. The formation of a hydrocarbon compound radical is accelerated by the organic peroxide so that even at a relatively low heating temperature, a sufficient amount of a hydrocarbon compound radical can be formed. As a result, an oxide film can be removed from the metal surface even at a relatively low heating temperature by the reduction caused by a hydrocarbon compound radical.Type: GrantFiled: August 4, 2005Date of Patent: January 27, 2009Assignee: Denso CorporationInventor: Toshihiro Miyake
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Patent number: 7407085Abstract: Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by a flux, the flux being subsequently removed prior to bonding. The apparatus may further include a number of registration elements to hold a heat spreader in a relative position over each die. Other embodiments are described and claimed.Type: GrantFiled: September 22, 2004Date of Patent: August 5, 2008Assignee: Intel CorporationInventors: Jadhav G. Susheel, Daoqiang Lu
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Patent number: 7401724Abstract: A flux based on alkali fluoroaluminate is described which is highly suitable for dry application (“dry fluxing”). This is a flux which is free of fine-grained fraction, which is defined by a range of grain-size distribution.Type: GrantFiled: February 25, 2004Date of Patent: July 22, 2008Assignee: Solvay Fluor und Derivate GmbHInventors: Hans-Walter Swidersky, Alfred Ottmann, Heinz-Joachim Belt
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Patent number: 7337941Abstract: A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the brazing sheet only where metallurgical bonds or joints are required, that is sufficiently durable to withstand processing operations and also provides good metallurgical bonds upon brazing.Type: GrantFiled: April 21, 2003Date of Patent: March 4, 2008Assignee: Alcoa Inc.Inventors: Deborah B. Scott, legal representative, Raymond J. Kilmer, Joseph R. Dougherty, Robert P. Anthony, Darwin H. Scott
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Patent number: 7168607Abstract: The invention relates to a method and to a device for cleaning and then bonding substrates. According to the invention, at least two opposite substrates are obliquely or vertically sprayed with a cleansing liquid by means of at least one nozzle and are preferably dried, aligned and directly bonded under micro-clean room conditions. The bonding process is preferably visually monitored during bonding in order to immediately remove insufficiently bonded substrates from the process. The inventive device is compact and allows integration of the process steps in a single installation without disruption. The invention is further characterized by an improved quality of the bonded layers and an improved productivity of the bonding process. It also allows the use of novel bonding processes.Type: GrantFiled: June 21, 2001Date of Patent: January 30, 2007Inventors: Hans-Ulrich Ehrke, Markus Gabriel, Richard Buttinger