With Pretreating Other Than Heating Or Cooling Of Work Part Of Filler Prior To Bonding And Any Application Of Filler Patents (Class 228/203)
  • Patent number: 11282801
    Abstract: A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: March 22, 2022
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Viorel Dragoi, Markus Wimplinger
  • Patent number: 11028276
    Abstract: Provided are a surface-treated metal sheet excellent in the adhesiveness to a coating treatment film and weldability and a coated member.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: June 8, 2021
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Yasuaki Kawamura, Koji Akioka, Akihiro Sengoku, Yoichiro Mori
  • Patent number: 10737998
    Abstract: Methods of converting a fluorinated compound into a fluorinated acyl fluoride or derivative thereof, the method including reacting the fluorinated compound with a catalytic amount of at least one transition metal compound and an oxygen-containing compound to form the fluorinated acyl fluoride or derivative thereof. Compounds formed using such methods are also included, including for example <Insert chemical formulas here as they appear in the electronic copy.> and derivatives thereof, or combinations thereof.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: August 11, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Markus E. Hirschberg, Klaus Hintzer, Zai-Ming Qiu, Gerd-Volker Röschenthaler, Romana Pajkert, Sergey Tverdomed
  • Patent number: 10580621
    Abstract: An electrode plate includes: a plurality of plate-like electrode members; and a joining part joining the electrode members to each other in a thickness direction. The joining part has a heat resistance to withstand a temperature of at least 150° C., melts at 700° C. or below.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: March 3, 2020
    Assignee: THINKON NEW TECHNOLOGY JAPAN CORPORATION
    Inventors: Atsushi Ikari, Satoshi Fujii
  • Patent number: 10037967
    Abstract: Methods for depositing material on a chip include forming a mold layer on a substrate. The mold layer has one or more openings over respective contact areas on the substrate. The one or more openings are formed from an upper volume and a lower volume, the upper volume having a smaller diameter than a diameter of the lower volume. A material is injected into the one or more openings under pressure, such that gas trapped in the one or more openings displaces into the lower volume until the injected material in the one or more openings makes contact with each respective contact area.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: July 31, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Toyohiro Aoki, Takashi Hisada, Eiji Nakamura, Kuniaki Sueoka
  • Patent number: 9512512
    Abstract: A method for coating a component, in particular a component of a gas turbine or of an aircraft engine, is disclosed. The coating is applied to the component by kinetic cold gas spraying, where prior to the deposition of the coating, the surface of the component to be coated is cleaned and compacted by shot peening with a blasting media. A component produced in this manner is also disclosed.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: December 6, 2016
    Assignee: MTU Aero Engines GmbH
    Inventors: Joachim Bamberg, Roland Hessert, Manuel Hertter
  • Publication number: 20150116689
    Abstract: Provided is a method of manufacturing a support unit that supports a substrate. The method includes: providing a support plate formed of a non-conductive material and supporting a substrate; providing a base plate disposed below the support plate and formed of a material including a conductive material; and depositing a metallic layer at a bottom of the support plate and coupling the metallic layer and the base plate through brazing.
    Type: Application
    Filed: October 29, 2014
    Publication date: April 30, 2015
    Applicant: SEMES CO., LTD.
    Inventors: Wonhaeng Lee, Kangrae Ha
  • Publication number: 20150101416
    Abstract: A header assembly for a pressure sensor and methods for manufacturing and using the same are provided. In one example embodiment, a header insert may include a base; a hollow protrusion coupled to the base and having a metalized inner surface and a metalized outer surface, wherein the metalized outer surface of the hollow protrusion is used to couple to a header and the metalized inner surface of the hollow protrusion is used to couple to a header pin; and wherein a seal is formed between the header, the header insert and the header pin.
    Type: Application
    Filed: June 11, 2014
    Publication date: April 16, 2015
    Inventors: Richard Martin, Louis DeRosa, Robert Gardner
  • Publication number: 20150090774
    Abstract: According to this brazing method, a first base member having a non-plated surface, a metal layer for functioning as a diffusion barrier layer, a brazing foil, and a second base member having a surface are arranged in this order so that the non-plated surface of the first base member and the surface of the second base member are faced with each other. The first base member and the second base member are brazed by using the brazing foil. The cost of providing a diffusion barrier layer between the first base member and the brazing foil is thereby reduced.
    Type: Application
    Filed: February 19, 2013
    Publication date: April 2, 2015
    Inventors: Kosuke Nishikawa, Tetsuya Morifuji, Kyozo Mizuno, Nobuki Negoro
  • Patent number: 8987605
    Abstract: A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI includes a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A solder ball is over the PPI. A compound includes a portion adjoining the solder ball and the polymer layer, wherein the compound includes flux and a polymer.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: March 24, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Ding Wang, Hung-Jen Lin, Chien-Hsiun Lee
  • Publication number: 20150069115
    Abstract: A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space, The module group has a reduction module which is connected, in a sealed manner to the working space for reducing the bond sides.
    Type: Application
    Filed: May 30, 2012
    Publication date: March 12, 2015
    Applicant: EV GROUP E. THALLNER GMBH
    Inventor: Bernhard Rebhan
  • Publication number: 20150060030
    Abstract: Disclosed is a method for producing a permanently joined plate heat exchanger comprising a plurality of metal heat exchanger plates having a solidus temperature above 1100° C., provided beside each other and forming a plate package with first plate interspaces for a first medium and second plate interspaces for a second medium, wherein the first and second plate interspaces are provided in an alternating order in the plate package, wherein each heat exchanger plate comprises a heat transfer area and an edge area comprising bent edges which extend around the heat transfer area, wherein a first surface of the plates forms a convex shape and a second surface of the plates forms a concave shape, wherein the heat transfer area comprises a corrugation of elevations and depressions, wherein said corrugation of the plates and the bent edges are provided by pressing the plates. Also disclosed is a plate heat exchanger produced by the method.
    Type: Application
    Filed: March 27, 2013
    Publication date: March 5, 2015
    Inventors: Per Sjödin, Kristian Walter
  • Patent number: 8960526
    Abstract: There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1% and 9% by volume based on a volume of the flux.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: February 24, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tadashi Maeda, Tadahiko Sakai
  • Publication number: 20150017477
    Abstract: The present invention relates to a printed circuit board, which includes a metal circuit layer electrically connected to an electronic component, a solder layer formed on an upper surface of the metal circuit layer, an intermetallic compound layer formed between the solder layer and the metal circuit layer, and a chunk portion formed in the intermetallic compound layer according to the thickness of the metal circuit layer, wherein the thickness of the metal circuit layer is 20 to 50 ?m, and a manufacturing method thereof.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 15, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Cheol Ho HEO, Kwang Jin Kim, Jin Su Yeo, Young Ho Lee, Chul Min Lee, Joong Hyuk Jung
  • Publication number: 20140374468
    Abstract: A moisture removing method disclosed removes moisture contained in a dielectric film provided on one end surface of an optical fiber. This moisture removing method causes near infrared light to enter the optical fiber through the other end surface to heat moisture in the dielectric film with use of the near infrared light.
    Type: Application
    Filed: September 5, 2014
    Publication date: December 25, 2014
    Applicant: FUJIKURA LTD.
    Inventor: Akira Sakamoto
  • Patent number: 8915419
    Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: December 23, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Su Jin Lee, Hye In Kim, Young Kwan Lee, Chang Kyung Woo, Je Kyoung Kim
  • Patent number: 8905293
    Abstract: A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: December 9, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh, Jung-Huei Peng, Lan-Lin Chao, Chia-Shiung Tsai, Chun-Wen Cheng
  • Publication number: 20140349128
    Abstract: The invention provides a coating process for electrical steel sheet using a varnish composition, comprising the steps of a) applying at least one coating layer of a varnish composition onto the surface of the electrical steel sheet wherein the varnish composition comprises (A) 1 to 95 wt % of at least one resin comprising nucleophilic groups selected from the group consisting of OH, NHR, SH, carboxylate and CH-acidic groups, and electrophilic groups which can react with the above mentioned nucleophilic groups, wherein the resin is capable of transacylation in its main chain and/or side chain(s), (B) 5 to 75 wt % of at least one organic solvent and/or water, (C) 0 to 40 wt % of at least one resin different from (A), (D) 0 to 10 wt % of at least one customary additive, (E) 0 to 40 wt % of at least one pigment, filler and/or nano-scaled particle and/or monomeric and/or polymeric element-organic compound, wherein the wt % based on the total weight of the varnish composition.
    Type: Application
    Filed: December 18, 2012
    Publication date: November 27, 2014
    Applicant: AXALTA COATING SYSTEMS IP CO., LLC
    Inventors: Frank-Rainer Boehm, Barbara Froschauer, Michael Herm, Reinhard Wallner, Wolfgang Schuelke, Volker Rittinghaus
  • Publication number: 20140332192
    Abstract: Embodiments disclosed herein generally relate to methods, systems and apparatuses configured to form and/or configure hydrophobic and/or hydrophilic surface features on the workpieces to enhance a brazing process. The hydrophilic and/or the hydrophobic surface features can be arranged to facilitate directing a melted filler material to where the filler material may be desired, and may also help prevent/reduce the filler material flowing to where the filler material may not be desired. The surface features can be micro milled on a surface of the workpiece.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 13, 2014
    Applicant: TRANE INTERNATIONAL INC.
    Inventors: Ronald Maurice COSBY, II, William Burgess FOX
  • Publication number: 20140312101
    Abstract: Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts).
    Type: Application
    Filed: June 27, 2014
    Publication date: October 23, 2014
    Inventor: RAVINDRA V. TANIKELLA
  • Patent number: 8841540
    Abstract: In accordance with one embodiment of the present disclosure, a thermoelectric device includes a plurality of thermoelectric elements that each include a diffusion barrier. The diffusion barrier includes a refractory metal. The thermoelectric device also includes a plurality of conductors coupled to the plurality of thermoelectric elements. The plurality of conductors include aluminum. In addition, the thermoelectric device includes at least one plate coupled to the plurality of thermoelectric elements using a braze. The braze includes aluminum.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: September 23, 2014
    Assignee: Marlow Industries, Inc.
    Inventors: Joshua E. Moczygemba, James L. Bierschenk, Jeffrey W. Sharp
  • Publication number: 20140262458
    Abstract: An interconnect structure that includes a substrate having an electrical component present therein, and a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate. The UBM stack includes a metallic adhesion layer that is direct contact with the contact pad to the electrical component, a copper (Cu) seed layer that is in direct contact with the metallic adhesion layer, a first nickel (Ni) barrier layer that is present in direct contact with copper (Cu) seed layer, and a layered structure of at least one copper (Cu) conductor layer and at least one second nickel (Ni) barrier layer present on the first nickel (Ni) barrier layer. A solder ball may be present on second nickel (Ni) barrier layer.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: International Business Machines Corporation
    Inventors: Charles L. Arvin, Minhua Lu, Eric D. Perfecto, Krystyna W. Semkow, Thomas A. Wassick
  • Publication number: 20140255717
    Abstract: Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.
    Type: Application
    Filed: March 6, 2013
    Publication date: September 11, 2014
    Applicant: UT-BATTELLE, LLC
    Inventor: Andrew A. Wereszczak
  • Patent number: 8786084
    Abstract: A semiconductor package includes a semiconductor die attached to a support having electrically conductive paths, the semiconductor die having a bond-pad electrically connected to the electrically a conductive path on the support by a bond-wire of a first metallic composition, the bond-wire and the bond-pad being coated with a protection layer of a second metallic composition.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: July 22, 2014
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventors: Romain Coffy, Jean-François Sauty
  • Publication number: 20140198411
    Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.
    Type: Application
    Filed: February 19, 2013
    Publication date: July 17, 2014
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Li ping PENG, Shen kuang Sidney CHOU, Chi hung YUEN, Yan bin WANG, Lu Xiao
  • Publication number: 20140187103
    Abstract: Presented herein are an interconnect and method for forming the same, the method comprising forming an interconnect on a mounting surface of a mounting pad disposed on a first surface of a first substrate, the interconnect comprising a conductive material, optionally solder or metal, the interconnect avoiding the sides of the mounting pad. A molding compound is applied to the first surface of the first substrate and molded around the interconnect to covering at least a lower portion of the interconnect and a second substrate may be mounted on the interconnect. The interconnect may comprise an interconnect material disposed between a first and second substrate and a molding compound disposed on a surface of the first substrate, and exposing a portion of the interconnect. A sidewall of the interconnect material contacts the mounting pad at an angle less than about 30 degrees from a plane perpendicular to the first substrate.
    Type: Application
    Filed: January 28, 2013
    Publication date: July 3, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Ting Chen, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii
  • Publication number: 20140183746
    Abstract: A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.
    Type: Application
    Filed: February 8, 2013
    Publication date: July 3, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hung Lin, Ming-Che Ho, Yu-Feng Chen, Yi-Wen Wu, Hsien-Liang Meng, Han-Ping Pu
  • Patent number: 8766140
    Abstract: A system and method is provided where a coated work piece is welded at high speeds with minimal porosity and spatter. The coating on the work piece is removed or ablated by a high energy heat source prior to being welded in a welding operation, such that high welding speeds are attained. The high energy heat source is positioned upstream of the welding operation to vaporize any surface coatings on a work piece.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: July 1, 2014
    Assignee: Lincoln Global, Inc.
    Inventor: Paul Edward Denney
  • Patent number: 8740043
    Abstract: A method for producing a surface on a component, which has regions having different wettabilities with respect to a solder. The method includes forming a first metallic layer on the component and forming a second metallic layer on the first metallic layer, the second metallic layer preventing oxidation of the first metallic layer. The method furthermore includes removing the second metallic layer with the aid of a laser in a predefined surface region for exposing the first metallic layer, and oxidizing the exposed first metallic layer on the surface, which results in a wettability with respect to a solder in the predefined surface region that is less than in a surface region adjacent to the predefined surface region.
    Type: Grant
    Filed: October 5, 2009
    Date of Patent: June 3, 2014
    Assignee: Robert Bosch GmbH
    Inventor: Hans-Martin Irslinger
  • Publication number: 20140124365
    Abstract: In a method of forming a cylindrical sputter target assembly, comprising the steps of: (a) providing a cylindrical backing tube; (b) providing a cylindrical sputter target, the inner diameter of which is larger than the outer diameter of the backing tube; (c) arranging the sputter target about the backing tube; and (d) bonding the sputter target to the backing tube by providing a solder layer between the backing tube and the sputter target; In accordance with the invention step (d) comprises directionally solidifying the solder layer.
    Type: Application
    Filed: April 29, 2011
    Publication date: May 8, 2014
    Inventors: Dieter Wurczinger, David Daniel
  • Patent number: 8716864
    Abstract: A DBA-based power device includes a DBA (Direct Bonded Aluminum) substrate. An amount of silver nanoparticle paste of a desired shape and size is deposited (for example by micro-jet deposition) onto a metal plate of the DBA. The paste is then sintered, thereby forming a sintered silver feature that is in electrical contact with an aluminum plate of the DBA. The DBA is bonded (for example, is ultrasonically welded) to a lead of a leadframe. Silver is deposited onto the wafer back side and the wafer is singulated into dice. In a solderless silver-to-silver die attach process, the silvered back side of a die is pressed down onto the sintered silver feature on the top side of the DBA. At an appropriate temperature and pressure, the silver of the die fuses to the sintered silver of the DBA. After wirebonding, encapsulation and lead trimming, the DBA-based power device is completed.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: May 6, 2014
    Assignee: IXYS Corporation
    Inventor: Nathan Zommer
  • Publication number: 20140111956
    Abstract: A joining method using a metal foam, a method of manufacturing a semiconductor device by using the joining method, and a semiconductor device produced by the manufacturing method are disclosed. A metal foam body is sandwiched between members to be joined, which are then brought into contact with each other and subjected to heat treatment. In this heat treatment, films of low-melting-point metal, such as Sn films covering the members to be joined, are melted. An alloy layer—an intermetallic compound—is formed by bringing about solid-liquid diffusion of Cu of a skeleton of open cells of the metal foam body in the molten Sn. At this stage, a Cu skeleton is left in the metal foam body. Highly thermally resistant and highly reliable joining can be realized by joining the members to be joined together by using this alloy layer.
    Type: Application
    Filed: September 10, 2013
    Publication date: April 24, 2014
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Katsumi TANIGUCHI
  • Publication number: 20140099516
    Abstract: An article comprising a substrate, the substrate having a surface; a diffusion barrier layer disposed on a portion of the surface of the substrate, a brazing layer disposed on the diffusion barrier layer, the brazing layer comprising at least one diffusible element, wherein the diffusion barrier layer inhibits the at least one diffusible element from diffusing into the diffusion barrier layer and the substrate. Also provided herein is a method of making an article comprising providing a substrate, the substrate having a surface; forming a diffusion barrier layer on a portion of the surface of the substrate, the diffusion barrier layer being formed by electro-spark deposition; forming a brazing layer on the diffusion barrier layer, the brazing layer comprising at least one diffusible element, wherein the diffusion barrier layer inhibits the at least one diffusible element from diffusing into the substrate.
    Type: Application
    Filed: October 5, 2012
    Publication date: April 10, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Mark Lawrence Hunt, Gary Charles Shubert, Jerry Ellison Gould
  • Publication number: 20140097231
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Application
    Filed: May 23, 2012
    Publication date: April 10, 2014
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai
  • Publication number: 20140087171
    Abstract: Certain embodiments here include compositions of matter and methods of manufacturing a ply composition, comprising a piece of fabric, wherein the fabric includes a plurality of plated tows, and eutectic alloy, wherein the plated tows are intertwined with the eutectic alloy.
    Type: Application
    Filed: September 19, 2013
    Publication date: March 27, 2014
    Applicant: Vanguard Space Technologies, Inc.
    Inventors: Eldon P. KASL, Matthew W. Thompson
  • Publication number: 20140069817
    Abstract: Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask layer. Solder is injected over the pillars or BLM, filling the channels. Molten solder can be injected in cavities formed in round wafers without leakage using a carrier assembly that accommodates wafers that have been previously subjected to mask layer deposition and patterning. One such carrier assembly includes an elastomeric body portion having a round recess, the walls of the recess forming a tight seal with the round wafer. Other carrier assemblies employ adhesives applied around the peripheral edges of the wafers to ensure sealing between the carrier assemblies and wafers.
    Type: Application
    Filed: September 12, 2012
    Publication date: March 13, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bing Dang, Michael A. Gaynes, Paul A. Lauro, Jae-Woong Nah
  • Publication number: 20140042740
    Abstract: A system and method of joining workpieces is provided where a clad layer is deposited in between the components and a weld bead is providing such that it contacts the clad layer. The system and method provided minimizes the heat input into the components by using the clad layers to provide the joining strength between the pipe components.
    Type: Application
    Filed: March 14, 2013
    Publication date: February 13, 2014
    Applicant: LINCOLN GLOBAL, INC.
    Inventor: Mike BARRETT
  • Publication number: 20140017509
    Abstract: Provided in the present invention is a bonded tungsten carbide-based super hard alloy assembly equipped with a first metal member having a first bonding surface and comprised of a steel material containing a martensite structure and a second metal member having a second bonding surface directly bonded to the first bonding surface of the first metal member and comprised of a tungsten carbide-based super hard alloy. The martensite structure-containing steel material which constitutes the first metal member is a stainless steel having an average carbon concentration of from 0.10 to 0.40 mass %. The first metal member has a high carbon concentration region at a depth ranging from 0.70 to 3.00 mm from the first bonding surface. The high carbon concentration region has a maximum carbon concentration of from 0.3 to 1.2 mass %. The bonded tungsten carbide-based super hard alloy assembly has both high bonding strength and excellent mechanical strength.
    Type: Application
    Filed: September 16, 2013
    Publication date: January 16, 2014
    Applicant: NGK INSULATORS, LTD.
    Inventors: Hironori TAKAHASHI, Hiroyuki TANAKA
  • Publication number: 20140016330
    Abstract: The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.
    Type: Application
    Filed: March 30, 2012
    Publication date: January 16, 2014
    Applicant: CERAMTEC-PLATZ GmbH
    Inventors: Alexander Dohn, Alfred Thimm
  • Patent number: 8618420
    Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: December 31, 2013
    Assignee: Semblant Global Limited
    Inventors: Mark Robson Humphries, Frank Ferdinandi, Rodney Edward Smith
  • Publication number: 20130328204
    Abstract: A DBA-based power device includes a DBA (Direct Bonded Aluminum) substrate. An amount of silver nanoparticle paste of a desired shape and size is deposited (for example by micro-jet deposition) onto a metal plate of the DBA. The paste is then sintered, thereby forming a sintered silver feature that is in electrical contact with an aluminum plate of the DBA. The DBA is bonded (for example, is ultrasonically welded) to a lead of a leadframe. Silver is deposited onto the wafer back side and the wafer is singulated into dice. In a solderless silver-to-silver die attach process, the silvered back side of a die is pressed down onto the sintered silver feature on the top side of the DBA. At an appropriate temperature and pressure, the silver of the die fuses to the sintered silver of the DBA. After wirebonding, encapsulation and lead trimming, the DBA-based power device is completed.
    Type: Application
    Filed: June 7, 2012
    Publication date: December 12, 2013
    Applicant: IXYS Corporation
    Inventor: Nathan Zommer
  • Patent number: 8604353
    Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.
    Type: Grant
    Filed: January 19, 2012
    Date of Patent: December 10, 2013
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Vladimir Noveski, Sujit Sharan, Shankar Ganapathysubramanian
  • Publication number: 20130314879
    Abstract: A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.
    Type: Application
    Filed: June 28, 2012
    Publication date: November 28, 2013
    Applicant: INTERSIL AMERICAS LLC
    Inventors: Jian YIN, Nikhil KELKAR, Loyde M. CARPENTER, JR., Nattorn PONGRATANANUKUL, Patrick J. SELBY, Steven R. RIVET, Michael W. ALTHAR
  • Patent number: 8575248
    Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: November 5, 2013
    Assignee: Promerus, LLC
    Inventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
  • Publication number: 20130286609
    Abstract: Systems and methods for shielding circuitry from interference with conformal coating are disclosed. Systems having conformal EMI shields according to embodiments are provided by applying insulating and conductive layers to areas of a printed circuit board (PCB). This produces systems that may be thinner and also smaller in surface area, and that may be suitable as part of electronic devices.
    Type: Application
    Filed: April 30, 2012
    Publication date: October 31, 2013
    Applicant: APPLE INC.
    Inventor: Nicholas Merz
  • Publication number: 20130270328
    Abstract: A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the surfaces such that the surfaces to be assembled allow assembly by bonding; forming a diffusion barrier selectively in copper portions of the first and second elements, wherein the surface of the diffusion barrier of the first and second elements is level with the surface, to within less than 5 nanometers; and bringing the two surfaces into contact, such that the copper portions of one surface cover at least partly the copper portions of the other surface, and such that direct bonding is obtained between the surfaces.
    Type: Application
    Filed: July 21, 2011
    Publication date: October 17, 2013
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventors: Lea Di Cioccio, Pierric Gueguen
  • Publication number: 20130269987
    Abstract: In an electrical component having at least one flexible carrier material, the connecting surfaces formed on conductive pathways thereof are joined to the connecting surfaces of individual metal bodies via individual bonded connections. At least one rail profile is conformed in the surface structure of each bonded connection; each bonded connection having at least one ultrasonic welding bond. In order to produce the electrical component, individual metal bodies are arranged on the conductive pathways of a flexible carrier material. Connecting surfaces of the individual metal bodies and connecting surfaces of the conductive pathways are materially bonded to each other. One of the connecting surfaces to be bonded is produced from a foil that is fully furnished with conductive pathways, and energy directors made from aluminium are integrated in the conductive pathway or the metal body.
    Type: Application
    Filed: April 11, 2013
    Publication date: October 17, 2013
    Applicant: Johnson Electric S.A
    Inventor: Martin KOEPSELL
  • Publication number: 20130269984
    Abstract: Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31a; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31b, the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31c.
    Type: Application
    Filed: April 14, 2012
    Publication date: October 17, 2013
    Applicant: TANIGUROGUMI CORPORATION
    Inventor: Katsumori Taniguro
  • Publication number: 20130248229
    Abstract: An electrical conductor includes a base substrate of at least one of copper, copper alloy, nickel or nickel alloy and a layered structure applied to the base substrate. The layered structure includes a foil and a graphene layer deposited on the foil. The layered structure is applied to the base substrate after the graphene layer is deposited on the foil. A method of manufacturing the electrical conductor includes providing a base substrate, providing a foil, depositing a graphene layer on the foil to define a layered structure, and depositing the layered structure on the base substrate.
    Type: Application
    Filed: February 5, 2013
    Publication date: September 26, 2013
    Applicant: Tyco Electronics Corporation
    Inventor: Rodney I. Martens
  • Patent number: 8535454
    Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: September 17, 2013
    Assignee: Promerus, LLC
    Inventors: Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang