Abstract: A system for providing cutting and orbitally welding thin-walled tubing. The system includes a plurality of clamping blocks that hold the tubing while the tubing is trimmed and orbitally welded. The system further includes at least one tooling plate to which the clamping blocks can be mounted such that the tubing is attached to the tooling plate and properly aligned for net length trimming. The system further includes a welding cassette for retaining the clamping blocks and properly aligning the tubing during orbital welding.

Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the method also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding and also provides for the replacement of the fixed clamp with another, or second, independent clamp.

Abstract: In order that, on wire bonding by means of a Wire Bonder, optimum bonding results can be achieved after a capillary change it is suggested that, after a change from a first capillary to a second capillary, the ultrasonic transducer which applies ultrasonics to the horn which guides the capillary is controlled with a parameter P2 which results from the parameter P1 before the capillary change as P2=g(k1, k2)*P1 or P2=g(k1, k2, A1, A2)*P1 or P2=g(k1, k2, A1, A2, H1, H2)*P1, whereby the quantities k1 and k2 designate the estimated values for the flexural strength, the quantities A1 and A2 the amplitudes of the freely oscillating capillary and H1 and H2 the diameters in the narrowest part of the longitudinal drill hole of the first or second capillary and whereby the function g is a predetermined function.

Abstract: Described herein is an integrated clamping and clinching device for sheet-metal panels which simultaneously performs a clamping operation on two or more panels in the precise assembly condition, and application of at least one clinching point for obtaining joining of the panels. The device is provided with at least one pair of clamping elements and at least one pair of clinching elements which are controlled by one and the same fluid cylinder in such a way that the pair of clamping elements reaches a closed position immediately before the pair of clinching elements.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: A tool for holding a blade blank (1) comprises a frame (13) in which a control system using clamping jaws (18, 19) and lifters (30, 34, 35) grips the blade and holds it in position vertically on two supporting faces (22, 23), while the blade has been laid on three lateral faces (41, 42, 43). The blade is thus simultaneously held in a precise position and gripped sufficiently tightly, with a single control main mechanism. The mounting of the blade is thus greatly simplified and it may be subjected without further precaution to a manufacturing operation such as welding by friction to a rotor disk.

Abstract: A flexible framing system including a framing station disposed along a vehicle body assembly line to receive and hold vehicle bodies for welding. A pair of framing gates is interchangeably supportable at the framing station. A pair of underbody tool support beams is also interchangeably supportable at the framing station. The gates and beams carry tools that positively locate and hold sub-elements of a vehicle body in predetermined positions relative to one another when the gates and beams are supported in respective framing positions engaging a vehicle body received at the framing station. A transport positioner disposed at the framing station moves the gates from respective supported positions at the framing station, interconnects the gates with the beams into a single gate-beam set, and moves the gate-beam set to a transport position for removal from the framing station.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: During manufacture of certain hollow profiles suitable for use in car body construction the welded profiles are subjected to a further deformation process, namely hydroforming. At present the corresponding welding machines are charged manually. The invention relates to a method and a device for transferring hollow-profile blanks, characterized in that during transfer the positioned fusion faces of the blanks are pressed against each other at least in the area of the weld.

Abstract: The present invention relates to a method for mounting electrical components on leadframes. A conveyor belt is used, having a holder which is attached to the conveyor belt. A leadframe is placed on the conveyor belt and is adjusted and held in position relative to the holder. The leadframe thus maintains its position relative to the endless conveyor belt throughout the entire period for which it remains on the endless conveyor belt.

Abstract: A method of connecting a generally flat battery lead to at least one flat current collector of a polymer battery, comprising the steps of: bending a generally planar lead about at least one generally planar current collector tab to form a layered area, wherein at least one planar tab is disposed between planar portions of the lead with the lead wrapped around one edge of at least one tab; clamping the layered area between two weld fixtures of an ultrasonic welder; and vibrating the weld fixtures to ultrasonically weld together the battery lead and at least one current collector tab.

Abstract: A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of dissimilar material composition. The workpiece gripper selectively positions the workpiece closely adjacent the substrate and continually removes excess heat from the workpiece, both during and after the application of heat to the workpiece. Upon termination of the heat application, air-jet cooling can be provided to the workpiece to quickly cool the terminal and the molten layer of solderable material.

Abstract: A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapted to secure the terminal between a pair of jaws and selectively position the terminal closely adjacent the structure. The jaws further serve as heat sinks to continually remove residual heat from the terminal, both during and after the application of heat to the terminal. Upon termination of the heat application, air-jet cooling is provided to the terminal to quickly cool the terminal and the molten layer of solder. The method of rapidly heating and cooling the terminal and layer of solder prevents the annealing of certain silica substrates and provides better solder connections.

Abstract: A flexible framing system including a framing station disposed along a vehicle body assembly line to receive and hold vehicle bodies for welding. A pair of framing gates is interchangeably supportable at the framing station. A pair of underbody tool support beams is also interchangeably supportable at the framing station. The gates and beams carry tools that positively locate and hold sub-elements of a vehicle body in predetermined positions relative to one another when the gates and beams are supported in respective framing positions engaging a vehicle body received at the framing station. A transport positioner disposed at the framing station moves the gates from respective supported positions at the framing station, interconnects the gates with the beams into a single gate-beam set, and moves the gate-beam set to a transport position for removal from the framing station.

Abstract: This invention relates to a method for producing a full face vehicle wheel and comprises the steps of: (a) providing a rim including an inboard tire bead seat retaining flange, an inboard tire bead seat, a well portion, an outboard tire bead seat, the inboard tire bead seat retaining flange including an outer surface, the inboard tire bead seat including an outer surface, an the outboard tire bead seat including an outer surface; (b) providing a disc including a generally centrally located inner wheel mounting portion and an outer annular portion, the outer annular portion including an inner surface and an outer surface, the inner wheel mounting portion including at least one of a fully formed center pilot hole and a plurality of fully formed lug bolt mounting holes, the center pilot hole defining a pilot hole axis and each of the lug bolt holes defining a lug bolt hole axis; (c) providing a wheel fixture tooling assembly for supporting the rim and the disc relative to one another, the wheel fixture tooling a

Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.

Abstract: Concentric, tubular sections are assembled by first securing annular centralizers and insulation about the external surface of the smaller diameter tube while the tube is horizontally disposed. The larger tube is then vertically aligned and lowered into a recessed area formed below the assembly area work level. A lifting cable, secured at one end to a lifting device, is extended through the smaller diameter tube and attached to a hoisting arrangement that vertically orients the tube concentrically over the larger diameter tube. Spring-loaded legs on the lifting device are manually retracted radially to permit the smaller tube to be lowered concentrically through the larger tube. The inner tube is lowered until the legs spring radially outwardly to engage the base of the larger tube. The entire assembly may then be lifted as a unit by the hoist with the lifting device, establishing the axial positions of the two tubes relative to each other.

Abstract: A heating furnace tube, a method of using the same and a method of manufacturing the same which have been developed with a view to eliminating inconveniences occurring when a carbon-containing fluid is made to flow in the heating furnace tube. The heating furnace tube which comprises a rare earth oxide particle distributed iron alloy containing 17-26 wt. % of Cr and 2-6 wt. % of Al. The method of manufacturing this heating furnace tube which comprises the steps of forming or inserting an insert metal on or into at least one of a joint end portion of one heating furnace tube element and that of the other heating furnace tube element, bringing these two joint end portions into pressure contact with each other directly or via an intermediate member, and diffusion welding the two heating furnace tube elements to each other by heating the insert metal.

Abstract: The invention describes a device for producing a soldered joint between two joining partners which can be joined via a common contact surface (7), using a solder material which can be introduced between the two joining partners.

Abstract: Described herein is an integrated clamping and clinching device for sheet-metal panels which simultaneously performs a clamping operation on two or more panels in the precise assembly condition, and application of at least one clinching point for obtaining joining of the panels. The device is provided with at least one pair of clamping elements and at least one pair of clinching elements which are controlled by one and the same fluid cylinder in such a way that the pair of clamping elements reaches a closed position immediately before the pair of clinching elements.

Abstract: A method of butt welding is performed in the following steps: a step of pressing first and second blank materials onto first and second loading bases respectively by clamping devices thereby fixing them; a step of shearing end surfaces of the first and second blank materials thereby forming joint surfaces; and a step of performing butt welding on each of the joint surfaces of the first and second blank materials while these blank materials are maintained in fixed state where the first and second blank materials are pressed by the clamping devices.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: The present invention provides a sealing system for implementing an optimum temperature profile for solder melting and improving productivity, and a sealing method therefor. The present invention comprises a sealing machine for superimposing a pre-soldered cap onto a package on which an electronic device element is mounted, a multi-clip for receiving and holding a plurality of sets of the packages and caps superimposed by the sealing machine in batch, and a sealing furnace for heating the plurality of sets held in batch by the multi-clip, and generating a plurality of electronic devices in batch by melting the previously applied solder and sealing the plurality of sets of packages and caps. According to the present invention, the plurality of sets of the packages and caps held in batch by the multi-clip are heated and sealed, therefore the sealing efficiency of the packages and caps can be improved.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapted to secure the terminal between a pair of jaws and selectively position the terminal closely adjacent the structure. The jaws further serve as heat sinks to continually remove residual heat from the terminal, both during and after the application of heat to the terminal. Upon termination of the heat application, air-jet cooling is provided to the terminal to quickly cool the terminal and the molten layer of solder. The method of rapidly heating and cooling the terminal and layer of solder prevents the annealing of certain silica substrates and provides better solder connections.

Abstract: In a method for welding closed one end of each of a multiplicity of open-ended tubes suitable for use as brachytherapy capsules (100), each tube is loaded into a holder (52), brought to a welding station (80), has one end welded closed and is then released from the holder (52). A number of holders can 2 be arranged on the periphery of a rotatable member (50), each holder being loaded with a tube at a first station, and then carrying the tube to a welding station (80) and an ejection station (90). The tubes can be loaded into the holders individually by means of an escapement mechanism (40). The invention also extends to apparatus for carrying out the method.

Abstract: Abutted portion of face plates 12b and 22b of frame members 10 and 20 are friction stir welded. With the abutting, a projecting portion 20c of an end portion of the face plate 20b of the frame member 20 is inserted into a recessed portion 12c of an end portion of the face plate 12b of the frame member 10. By this engagement, the outer faces on one face side of the face plates 12b and 20b form a smooth surface, so that at the joined edges there is no step. Next, a rotary tool 250 is inserted into the gas between the abutted plates from the side of the raised portions 16 and 26 side of the face plates 12b and 20b, while the other faces 12bc and 20bc of the face plates 12b and 20b, are supported flatly on a bed during the friction stir welding. Accordingly, the welding of the engaged plates can be carried out without any step-wise difference.

Abstract: Method for welding piped (2, 3) to each other, in which the outer side of the one pipe is engaged tightly with the help of first clamping means and the outer side of the other pipe is engaged tightly with the help of second clamping means in which the first and second clamping means are kept in the line and with their ends close to or against each other by means of a rigid frame on which both clamping means are arranged, after which welding means are operated in order to make a welding seam from the outside for connecting both pipes, after which the frame with the first and the second clamping means and with the welding means is moved along and over the other pipe to the other end of the other pipe for repeating the aforementioned steps for welding the other pipe and a next pipe.

Abstract: A front floor panel (31) and a first small component such as a second cross member (35) to be assembled to a surface thereof, with the first small component at the bottom side are positioned and set into a locator jig (29) at a part setting station (S), a moving stage (27) is moved to a welding station (T), and the front floor panel (31) and first small component are welded. A handling robot (55) reverses the front floor panel 31 front-to-rear, the moving stage (27) is caused to retreat to the part setting station (S), and a second small component such as a front floor reinforcement (41) to be assembled to the rear surface of the front floor panel (31) is positioned in locator jig (29), the moving stage (27) being moved to the welding stage and the reversed front floor panel (31) being positioned in a locator jig (29), after which the front floor panel (31) and second small component are welded together.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: A method for designing a weld fixture. The method includes modeling a set of distortions produced by applied mechanical forces on a material to be welded, modeling a set of distortions produced by applied thermal forces on the material to be welded, determining a set of reaction forces at a series of locations on a simulated weld fixture as a function of the modeled distortions, and designing a weld fixture as a function of the set of reaction forces.

Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

Abstract: An apparatus and method for positioning and soldering together multiple stanined glass sections is disclosed.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Abstract: A tube clamping assembly comprising a first portion having a base and a clamping device carried on the base, and a second portion having a base and a clamping device carried on the base. The first and second portions are coupled to each other such that the portions may be adjusted relative each other. In another embodiment, the invention is a tube clamping assembly comprising a base, and a first movable clamp arm and a first stationary clamp arm coupled to the base for gripping a cylindrical workpiece therebetween. The tube clamping assembly further comprises a second movable clamp arm and a second stationary clamp arm coupled to the base for gripping a cylindrical workpiece therebetween, wherein at least one of the stationary clamp arms is removably coupled to the base.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: A wire fixing jig for arranging and fixing covered wires when intersection portions thereof are welded. The jig has a jig body on which the covered wires are arranged, supporting portions for supporting the covered wires are formed around the intersection portions to be welded. These portions are located at a predetermined pitch from a corresponding one of the intersection portions, at both sides in the longitudinal direction thereof and for ensuring a space that allows a core part of each of the intersection portions, which are pressurized when welded, to spread out, and through holes through which welding device is inserted when the intersection portions of the covered wires are welded to each other.

Abstract: An apparatus and method for positioning and soldering together multiple stained glass sections is disclosed.

Abstract: A pipe fitting apparatus includes first and second connector units for releasable connection to respective first and second pipe sections adjacent pipe ends to be coupled, so as to hold the pipe sections relative to one another in the desired relative orientations during welding. Each connector unit has a groove on one face for location against the outside of a pipe, with the longitudinal groove axis extending parallel to the axis of a pipe to which it is secured. The units are adjustably secured together by a pivot coupling having a pivot axis extending transverse to the groove axis for pivotal adjustment of the orientation of the second connector unit relative to the first connector unit, whereby the relative orientation of the first and second pipes to be coupled can be adjusted. A releasable locking device releasably secures the second connector unit at a selected orientation relative to the first connector unit.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: A back-up clamp suitable for backing up a weld to be formed between adjacent pipe lengths in a pipeline, the clamp having a rigid clamp body, at least one set of clamping members mounted upon the clamp body, a set of back-up shoes mounted upon the clamp body, the set of clamping members and the set of back-up shoes being movable relative to the body, movement of the set of clamping members and the set of back-up shoes being controlled by fluid pressure applied to at least one location of the clamp, the clamp having a number of conduits adapted to deliver pressurised fluid to the location(s), all of each conduit being located within the body. The invention permits the provision of a back-up clamp which requires no flexible or external fluid hoses, and permits the manufacture of a back-up clamp suitable for use with small-diameter pipelines.

Abstract: In a system and method for adjusting a height of a base of a clamp to fit to strips of a plurality of IC (integrated circuit) package sizes, the clamp is comprised of a fixed clamp portion and the base having a height that is adjustable with respect to the fixed clamp portion. A bar is disposed over the base of the clamp along a length of the base of the clamp, and the bar is fixed with respect to the fixed clamp portion. Each of a plurality of dummy strips of IC packages corresponds to a respective IC package size. A respective dummy strip of IC packages corresponding to a respective IC package size is placed on the base of the clamp to be supported by the base of the clamp. In addition, a plurality of height adjustment jigs are disposed on the bar to slide along the bar. Each of the height adjustment jigs has a respective size corresponding to a strip of a respective IC package size.

Abstract: Method and apparatus for welding the inside diameter and the outside diameter of bellows diaphragms for forming a bellows without using chill rings or spacers. This universal welding fixture consists of at least one drive wheel and at least one idler wheel for holding and aligning different size bellows diaphragms. A concentrated heat source such as a laser beam is applied at the edge for joining diaphragms together.

Abstract: Laminated metal structure includes a radially outer component and a radially inner component concentrically interconnected with each other. The radially outer component has a porosity of at least 80% and the radially inner component is a radially impermeable strength element such as a metal foil. The metal structure can be used in a continuous ambulant peritoneal dialysis treatment for anchoring a catheter in the human body.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: The invention provides a gripper for a tack welding gun wherein the tack gripper is U-shaped in design. The tack gripper has two arms connected by a base. At least one arm of the tack gripper is resilient in design. The arms have a bent back portion at their free end. The portion is arranged between the respective arms. The portions contain holes in which the catch knobs formed on the workpiece to be welded can engage.