Abstract: A method which permits easy fusion of commutator risers to armature coils of an electric motor. When there are 20 risers, for example, 10 through-holes are formed in the boss portion of the armature core of the motor, each through-hole being so sized that the back surfaces of two adjacent risers are exposed through each through-hole. Sub-electrodes are inserted into the through-holes such that each sub-electrode supports the back side of the two risers exposed through the through-hole which receives this sub-electrode. First and second main electrodes are so arranged that the first electrode contacts with the first riser of the first riser group exposed through the first through-hole while the second main electrode contacts the second riser of the sixth riser group exposed through the sixth through-hole.

Abstract: A method of stretching solder joints between the input/output pads of an electrical component and corresponding input/output pads on a substrate includes the steps of: melting the solder joints; confining the component while the solder joints are melted such that the component can only move substantially perpendicular to the substrate; pulling the component, while the component is confined, by an external force in a direction away from the substrate to thereby stretch the melted solder joints; compelling the movement of the component to stop when the component has moved a predetermined distance; and, solidifying the solder joints while the component is compelled to stop. By stretching the solder joints with the above method, the solder joint shape can be changed from convex to concave; and thermally induced stress/strain in the joint is substantially reduced.

Abstract: A holding device of a frame retainer on a retainer holder used in bonding machines for manufacture of semiconductor devices including a pair retainer guides formed in the retainer holder so that the frame retainer is positionally secured between the retainer guides by positioning pins which are pushed and moved by spring members. The positioning pins are movable toward and away from the frame holder by turning (overcoming the spring force of the spring members) eccentric pins which are in contact with the positioning pins.

Abstract: A thermocompression bonding apparatus wherein object parts can be connected with a high degree of accuracy by thermocompression bonding and the entire apparatus is not deformed readily by a high pressure and a member of a large size can be connected at a fine pitch with a high degree of accuracy. The thermocompression bonding apparatus is constructed so as to bond a first member to a second member by thermocompression bonding and comprises a base member, a holding device for holding the second member thereon, a heat generation element for applying heat to the first member, and a pressurization member for pressing the heat generation element against the first member and the second member. The holding device, the heat generation element and the pressurization member are disposed mechanically separately from the base member. Also a thermocompression bonding method and a process of manufacturing a liquid crystal display device which are performed using the thermocompression bonding apparatus are disclosed.

Abstract: A braze fixture has side walls forming a cavity with an opening to receive a stack of parts to be brazed. Sidewalls of the housing have a plurality of bearing receiving openings into which bearing rods or jaws are inserted to align the stacked elements of the workpiece. The housing can also have view ports to allow a visual check of the alignment. Straps or wires around the fixture are selected to have thermal characteristics similar to the thermal characteristics of the workpiece undergoing brazing. The straps or wires make physical contact with the bearing rods thereby causing bearing rods to maintain the workpiece in proper alignment throughout the entire brazing cycle.

Abstract: A header cap and the mating surface of a water header are placed in abutting relationship with a seal for forming a layered, contiguous connection. A pressure device is attached in operative association with the header cap for operatively applying a pressure to the header cap. A spring which is received by the pressure device is compressed for applying a constant and unidirectional pressure to the pressure device which, in turn, transmits the constant and unidirectional pressure to the header cap. The connection is finally heated for brazing the header cap and water header together and for forming a seal.

Abstract: Assembling a circuit card to a straddle mount connector with improved alignment. A holder using a parallel linkage holds the card parallel to the connector despite thickness variations, during solder bonding.

Abstract: A framing system and framing device for assembling and welding a body-in-white utilizes completely separate framing and welding operations, which are typically intermixed in conventional framing systems. The framing device is a unitary frame structure within which an underbody, side frames and other body components can each be supported and accurately positioned with respect to each other prior to the welding operation. The framing device includes a cart which serves as the base and main support for the framing device, and an upper body support member. Using an appropriate number of clamping devices, the net positions of the body components which constitute the body-in-white are properly established and maintained, such that gate fixtures are unnecessary during the welding operation. The structure of the framing device provides considerable access to the body-in-white supported within the interior of the framing device, such that a greater number of welding guns can be used during the welding operation.

Abstract: A brush auger machine for assembling a brush to an auger is disclosed. The machine includes a frame for supporting an auger having a shaft and a spiral blade. A welding station is adjacent the frame. A guide chute receives the continuous brush and defines a diameter approximately equal to the outer diameter of the completed brush auger assembly. A discharge frame is positioned adjacent the welding station and includes a motor driven chuck which holds and rotates the end of the auger shaft. The motor and chuck are mounted on a movable platform. Welding is completed at the welding station and rotation of the auger shaft moves the assembly and the platform along the discharge frame.

Abstract: A method for fastening an elastic sealing ring on a pipe includes the steps of applying a base portion of the sealing ring against the circumferential surface of the pipe, and placing a clamping strap under tension around the outer face of the base portion. The clamping strap is secured to the pipe by spot-welding in at least two welding spots, the spot-welding operation being carried out with the material of the sealing ring located between the clamping strap and the pipe. A device for fastening the sealing ring on the pipe is provided which comprises, in addition to the clamping-strap supply, a movable assembly for feeding the clamping strap to the pipe; an assembly for applying the strap on the base portion of the sealing ring; a unit for spot-welding the clamping strap to the pipe; and a friction-exerting mechanism for gripping and exerting a braking action on the clamping strap.

Abstract: A method for brazing end rings to rotor bars for a squirrel cage rotor assembly comprises assembling the rotor in a brazing fixture with a braze shim between the rotor bars and the end rings; preheating the rotor and brazing fixture to a temperature that is below the aged temperature of the rotor bars and end rings and which is sufficiently high so that the difference in thermal expansion of the rotor bars and brazing fixture applies a predetermined amount of pressure on the brazing joint such that after the joint is brazed and has cooled, a braze filler having a predetermined thickness inches will bond the rotor bar end faces to the end ring, and brazing each joint to bond the rotor bar end faces to the end ring.

Abstract: A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.

Abstract: A method for manufacturing a circuit board with a plurality of conductive terminal pins includes the steps of: providing a bed with an array of receiving holes formed therein; providing the bed on a vibrating apparatus; placing a plurality of conductive terminal pins on the bed, each of the terminal pins having a shank and an enlarged head; operating the vibrating apparatus to permit insertion of the shank of each of the terminal pins into a respective one of the receiving holes, the enlarged heads of the terminal pins being sized to prevent extension thereof in the respective one of the receiving holes; providing a fiber glass reinforcing plate formed with an array of through-holes; providing a fiber glass circuit board body having a bottom side formed with an array of connectors; superimposing the reinforcing plate and the circuit board body on the bed such that each of the connectors of the circuit board body and the heads of the terminal pins extend in a corresponding one of the through-holes and abut aga

Abstract: A method for producing a semiconductor modular structure includes placing semiconductor bodies, a ceramic substrate with metallizing, and a metal base plate, in an elastomer compression mold. A heatable pressure ram with a surface being concave relative to the base plate is placed on the base plate. At least the base plate and the ceramic substrate are convexely deformed and joined with pressure exerted by the pressure ram, at a temperature above room temperature.

Abstract: A method of mechanically mating two workpieces when one of the workpieces lacks physically matable surface characteristics. An adaptor is formed through crystallographic etching techniques and is precisely positioned and mounted to the surface of the workpiece lacking physical features in order to provide mechanical points of contact for mating with the other workpiece. Solder points are formed on the surface of the workpiece and the adaptor by photolithographic metalization. The adaptor is then solder bump mounted to the surface of the workpiece for highly precise positioning. The adaptor forms precisely positioned points of contact for mechanical mating with the physical features of the other workpiece.

Abstract: A process for establishing and maintaining parallelism and balance forces between the surfaces of two bodies, in particular, surfaces to be snuggled against each other for the transfer of thermal energy, includes holding springs for laterally holding one of the bodies against movement transverse to a force direction. Resilient mounting bearings are also provided for resiliently holding the body substantially parallel to the force direction but with all points of rotation for the body being spaced away from the body and preferably laterally of the body. Forces apply between the bodies to establish parallelism. The resilient mounting is adjusted during this static mode to maintain the parallelism for subsequent dynamic modes of operation. During the dynamic modes of operation, the resiliency of the holding and mounting arrangements maintain parallelism and balanced forces even in the dynamic mode.

Abstract: In manufacturing packaged modules for computer systems, many modules require sealing a lid to a lower substrate by using solder around the outer edges of the lower substrate. When the solder is heated, it often flows inward towards the chips on the substrates (solder intrusions) and may cause shorts. This invention solves the problem of solder intrusions by using a graphite lid seal fixture during lid seal. The fixture is comprised of lower and upper parts. The substrate, which has a sealband area, rests on and is held in place by the lower part of the fixture. The upper part of the fixture rests on the lower part. The lid, which has solder on its lower surface which is slightly smaller but otherwise generally matches the sealband area of the substrate, fits in a hole in the upper part and rests on the substrate.

Abstract: A bonding apparatus (40) is provided for use in coupling a first substrate (20) with flip chip type interconnections (24) to a second substrate (22) having matching flip chip type interconnections (26). The bonding apparatus (40) includes a pedestal assembly (50) which may be used to align and couple the first substrate (20) with the second substrate (22) and transport the substrates (20 and 22) from the bonding apparatus (40) to a heater assembly (110). Magnetic force is used to maintain the alignment of the first substrate (20) with the second substrate (22) during temperature cycling within the heater assembly. The pedestal assembly (50) includes a magnet slidably disposed on the exterior of the pedestal assembly (50). For some applications, the magnet (60) may be formed from one or more permanent magnets. For other applications, magnet (60) may be formed from one or more electromagnets.

Abstract: Apparatus is described for transporting sections of pipe and connecting them together for laying pipe above ground or in a trench. The apparatus includes a wheeled frame (e.g., a trailer), a support for one end of a first pipe section, and an alignment mechanism for supporting the other end of the first pipe section and the leading end of a second pipe section so that the opposing ends of the pipe section can be welded together.

Abstract: An improved internal line up clamp (10) is disclosed which has an integral back up ring (12). A first set of pipe clamps (22) move radially outward to engage the inner surface of a first pipe (14). A second set of pipe clamps (62) and a set of back up ring segments (88) are simultaneously moved radially outward into engagement with the inner surface of the pipes. The back up ring segments (88) are spring loaded to exert a relatively constant back up force against the inner surface of the pipes at the weld. In a modification, a fill block (118) can be used to fill the gap between adjacent back up ring segments when engaging the inner surface of the pipe.

Abstract: A device and device for manufacturing loops of steel employed in continuous-operation presses to manufacture single-layer or multiple-layer webs of material. To equalize the tension in the ends of a strip before they are welded together to form a loop and to increase the strength of the weld, the strip (10) is laid over drums (2 and 3) and its ends secured in grippers (13) that travel across the drums' axes (4 and 5). The strip is tensioned to a prescribed tension. The tension is maintained while the ends (11 and 12) of the strip are secured by transverse tensioning arms. The tension is released by moving the movable axis to an operating distance. The strip is cut with a blade, the ends of the strip are ground parallel, and are welded together to form a loop.

Abstract: A bonding apparatus (40) having one or more electromagnets (60) is provided for use in coupling a first substrate (20) with flip chip type interconnections (24) to a second substrate (22) having matching flip chip type interconnections (26). The bonding apparatus (40) includes a pedestal assembly (50) which may be used to align and couple the first substrate (20) with the second substrate (22). The bonding apparatus (40) includes an electrical control system (108) with a control unit (130) for varying the amount of electrical power supplied to the electromagnet (60). One or more heater assemblies (110) are provided for temperature cycling of the substrates (20 and 22) during the bonding process. Magnetic force is used to maintain the alignment of the first substrate (20) with the second substrate (22) during temperature cycling.

Abstract: A single point bonding tool which self aligns misaligned leads. The top of the tool is indented in a manner which, when in contact with a misaligned lead, guides the lead into alignment.

Abstract: An integrated circuit device support tool which includes a device for providing a vacuum for holding an integrated circuit device to be soldered to a printed circuit board. The tool also includes a plurality of thin, pressure transferring members for pressing the leads of the integrated circuit device against a printed circuit board during soldering. The pressure transferring members are of a thin material so as not to provide a heat sink during the soldering operation.

Abstract: A lead arrangement is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining means are also provided integral with the lead arrangement to hold the substrate against the leads, as during soldering. The retaining means may be disengaged from the substrate separately or simultaneously with the trimming of the leads from the lead arrangement after connecting to the substrate.

Abstract: A method for brazing end rings to rotor bars for a squirrel cage rotor assembly comprises assembling the rotor in a brazing fixture with a braze shim between the rotor bars and the end rings; preheating the rotor and brazing fixture to a temperature that is below the aged temperature of the rotor bars and end rings and which is sufficiently high so that the difference in thermal expansion of the rotor bars and brazing fixture applies a predetermined amount of pressure on the brazing joint such that after the joint is brazed and has cooled, a braze filler having a predetermined thickness inches will bond the rotor bar end faces to the end ring, and brazing each joint to bond the rotor bar end faces to the end ring.

Abstract: The method and apparatus for the manufacture of product subassemblies by computer programmed robots is an end effector fixture assembly, or geometry station wherein at least two individual elements of the particular subassembly are dimensionally positioned relative to one another between a lower base fixture and an upper fixture of the end effector fixture assembly to establish a net location therebetween. The robot manipulates the end effector fixture assembly and transports the two individual elements located therein to a work performing station located within a defined region of the robot to perform work on the subassembly.

Abstract: An assembly arranged for mounting to a pipe to be welded is provided, wherein the assembly includes a support pipe having a counterweight slidably mounted therealong. The support pipe includes a V-shaped lock receiving the pipe to be welded, with a clamp chain arranged for securing the pipe to be welded relative to the V-shaped lock, whereupon sliding of the counterweight relative to the support pipe provides for counter-balancing of the pipe to be welded in an adjustable manner.

Abstract: A method of forming a long 100-inch low resistance lap joint suitable for joining magnet coils in a superconducting magnet assembly on the magnet drum, which is accomplished by forming a flat solder sandwich within a groove on the drum and moving a heat source along the lap joint with controlled temperature, pressure and rotational speed of the drum.

Abstract: In a process of manufacturing a channel plate assembly including a plurality of partial plates confining passages for a first medium which continuously define on all sides in direction of flow and interconnected by a plurality of spacers spaced apart in the direction of flow, the spacers are fixed in a fixture and joined to a first plate, and then the spacers are joined to another plate in a fixture on a side which faces away from the first plate.

Abstract: An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered while the printed circuit is heated, wherein transporting means transports a carrier carrying the printed circuit board to be soldered, positioning means arranged on the carrier position the printed circuit board on the carrier and support means arranged on the carrier support the printed circuit board to prevent the latter from being warped when heated to be soldered. The printed circuit board is transported through all of the soldering processes from a heating process to a cooling process while the printed circuit board is thus positioned and supported. Further provided is means which is automatically operated to position and support the printed circuit board on the carrier.

Abstract: A method for bonding leads of an IC component with electrodes of a circuit board includes the steps of using a mounting device to hold the IC component with flat portions of the leads inclined downward, mounting the IC component on the circuit board at a predetermined position thereof with the IC component held by the mounting device, moving the mounting device toward the circuit board to compress the IC component against the circuit board at the predetermined position while allowing the leads to flex to accommodate for nonuniformity in the heights of metal pieces to be bonded with the electrodes and bending of the circuit board. In this manner, the flat portions of the leads are brought into close contact with the electrodes. The leads are then irradiated with an optical beam so as to melt the metal pieces of the electrodes for bonding of the leads to the circuit board.

Abstract: A trailing end of a preceding bar is arranged slantingly by an angle .theta. relative to a succeeding bar such that the lower edge of the leading end face of the succeeding bar is vertically shifted from the lower edge of the trailing end face of the preceding bar with the leading end face of the succeeding bar abutting against the trailing end face of the preceding bar. After that, the succeeding bar is vertically depressed by applying a predetermined force. Since the trailing end face is inclined by .theta. relative to the leading end face, the depression causes a relative slide between surfaces of both the end faces and, at the same time, a pressure P is also produced by the wedge effect, the pressure P causing a compression force and a plastic deformation between both the end faces.

Abstract: Apparatus is described for transporting sections of pipe and connecting them together for laying pipe above ground or in a trench. The apparatus includes a wheeled frame (e.g., a trailer), rotary support for supporting one end of a first pipe section, and an alignment mechanism for supporting the other end of the first pipe section and the leading end of a second pipe section. The first pipe section can be rotated relative to the second pipe section to either connect or disconnect the pipe sections. In another embodiment, apparatus is provided for supporting pipe sections which are to be welded together.

Abstract: A module frame work to which outfits are mounted is manufactured with high accuracy and is installed to a larger structure without adjustment operation. The module frame work comprises a pair of horizontal and mutually parallel main beams, a pair of beam members connecting the main beams, support columns vertically extending from each of junctions of the main beams with the beam members and at least a connector on an end of any of the main beams, beam members and support columns.

Abstract: A magnet is disposed in proximity to an un-lidded semiconductor package being assembled. When a ferrous lid is placed over the package opening, the magnetic field holds the lid in place, and also holds the package on an assembly boat carrying the package through an oven for hermetic sealing.

Abstract: The device is intended for application by oven soldering of covers on semiconductor capsules (1) when they are still held in a fixture (2) used in a previous manufacturing step. A cover portion (3), which is applied, has a centering means (30) for centering a semiconductor capsule (1) in relation to a cover (4) hanging in a permanent magnet in the cover portion (3). After the cover portion is in place and during heating, a pusher (6) of memory metal will after changing shape press the cover (4) into place on the capsule (1) where it is soldered in place.

Abstract: In a wire bonding method and apparatus to bond electrodes on pellets to leads on lead frames, substrates, when such a bonding is performed, a portion of the lead away from bonding point of the lead is pressed by a pressing section of pressing arm which is moved vertically and horizontally by lead pressing device.

Abstract: A device and method for butt-welding metal strips using a laser is disclosed. The present invention utilizes clamping bridges to selectively grip the metal strips to be welded together. The ends of the metal strips are first prepared for welding by severing the ends using a movable laser. After the prepared strip ends are moved into butt-welding relationship, the same laser is used to weld the two strips together. Where the strips are of differing width, the laser may be rotated and its height above the strips adjusted in order to achieve the proper welding angle. Where one strip is continuously moving, a buffer facility is provided for selectively storing a portion of the continuously moving strip prior to cutting and welding. Through adjustment of the buffer facility, the clamped portion of the continuously moving strip, i.e. the trailing portion, remains stationary during cutting and welding while the leading portion of the strip continues to advance.

Abstract: A friction welding method for joining a rim and a disc of a disc wheel and an apparatus therefore wherein an outside material or a rim and an inside material or a disc, each of which is a component of a disc wheel, are joined together. This friction welding apparatus comprises, typically, a mechanism for fixing firmly the circumference of one material almost entirely circumferentially, a mechanism for rotating another material, a mechanism for generating frictional heat between the two materials, with the inside material fitted into the outside material, by pressurizing the rotated material to the fixed material. This method employs a lap joint process instead of a butt joint process. Either or both of the materials can be provided with a projection on the circumference. A projection absorbs the turning force, inertia force and braking force produced at the time of joining operation to prevent the above forces from being concentrated on a local portion of the materials in process.

Abstract: A process for connecting a switch to a printed circuit board comprising the steps of, providing a printed circuit board having at least one aperture formed therein, providing a switch including a housing having at least one electrical terminal extending therefrom, providing a fastener made of a molded plastic material capable of withstanding a soldering environment, mounting the switch on the board such that the at least one terminal thereof extends through the at least one board aperture, connecting the switch to the board by means of a fastener and wave-soldering the at least one terminal to the printed circuit board after the connecting step.

Abstract: A device for soldering an electronic element to a substrate has a support head for supporting the substrate, and a pusher having a push head provided above the support head for pushing the electronic element to the substrate. The holder is upwardly moved to push the element to the substrate.

Abstract: A lead frame is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining members are also provided with the frame to hold the substrate against the leads. The retaining member is preferably disengaged from the substrate simultaneously with the trimming of the leads from the frame after connecting to the substrate.

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates.

Abstract: A method and article made by such method are described for connecting electrodes on one face of an integrated circuit semiconductor device with those on a supporting substrate. The method comprises positioning electrodes formed on one face of the device into engagement with electrodes formed on the substrate. A force is applied to press the electrodes together and during application of the force a first adhesive is applied along only a minor portion of two edges of the device. The first adhesive is stiffened to provide a temporary connection of the device and the substrate. A mass of a second adhesive is applied over a face of said device opposite said one face and onto portions of the substrate adjacent the periphery of the device with substantially no adhesive located between the one face of the device and the substrate at a center area of the one face. The second adhesive is hardened to form an adhesive dome that permanently connects the device to the substrate.

Abstract: A component is mounted to a circuit board by covering a section of the board's conductive pads with a nonconductive mask. It is also possible to plate additional conductive material onto the pads before applying the mask. The component's contacts are soldered to the uncovered sections of the pads or plating.

Abstract: Palletized, unassembled workpieces are transported by a carousel to successive work stations at which pallets are deposited on work tables. The tables and each of the pallets are provided with registering mechanism so that the workpieces are identically located in each station. Robotic welding or other tasks requiring a high degree of repetitive accuracy can be performed at each station to fabricate the workpieces into finished or semi-finished end products. Both the depositing of pallets on and lifting them from the work tables can be accomplished at a creep speed.

Abstract: The present invention is a method for performing a joining operation to couple a first component to a second component. One embodiment of the present method includes the steps of aligning the first component and the second component so that a first portion of the first component is aligned with a first portion of the second component, heating the first component so that a melt is formed at the first portion of the first component, and forcing the first portion of the second component into the melt so that when the melt solidifies, the first component and the second component are bonded.

Abstract: A body welding station receives a succession of differing body component parts in order to weld such component parts into an integrated body structure of differing styles. A fixture frame has clamping and locating fixtures mounted thereon by disconnectable fixture holding devices which permit the individual and selective removal of certain of the fixtures from the fixture frame and permit the mounting of different fixtures thereon for the subsequent clamping and locating of body components for a body structure of different style. A fixture changing station is located remote from the welding station and has associated fixture storage apparatus storing additional fixtures therein. A transport apparatus moves the fixture frame between the welding station and the fixture changing station.

Abstract: An apparatus for assembling workpieces in which an assembling work is performed includes a workpiece setting jig, a setting station including a workpiece setting apparatus for setting a first workpiece on the workpiece setting jig, an assembling station including an assembling unit for assembling a second workpiece with the first workpiece on the workpiece setting jig, a welding station including a welding unit for welding the first and the second workpieces together, a discharging station including a discharging unit for taking the welded workpieces out of the workpiece setting jig, a charging station provided in a position which faces the setting station as seen in the direction of sending and withdrawing the workpiece setting jig. The charging station, the assembling station, the welding station and the discharging station being arranged in a circular form.