Abstract: There is provided by the present invention method and apparatus for damping vibrations or other unwanted motions of a brush seal, the apparatus including a damper having a plurality of individual plates that are bonded directly to the inlet rows of bristles of the seal. Methods for producing a damped brush seal in accord with the present invention contemplate brazing damping plates to the bristles, absorbing a melting point suppressor into the surface of the damping plates and then heating the damping plates until the treated surface melts and bonds with the bristles, or sintering a braze alloy to the bristles such that the braze alloy functions as a damping plate.

Abstract: A method for fabricating a printed circuit board for high pin count surface mount pin grid arrays is provided where surface mount pads for soldering a surface mount pin grid array package are isolated by solder mask layers. The printed circuit board is laminated with one or more solder mask layers containing apertures therein to expose the surface mount pad locations.

Abstract: A method of making a filter assembly is described wherein a filter pack is seated in an end cap and contacted with a mixture comprising a binder and a particulate material including a low temperature component and a high temperature component. The filter pack, the end cap, and the particulate material are heat treated to form a strong, effective bond.

Abstract: A method is provided for applying a self-fluxing, self-bonding alloy coating of a hard facing alloy in powder form to a ferrous metal plate or substrate of melting point substantially higher than that of the hard facing alloy. The method comprises providing a plate of a ferrous metal substrate to be coated in which a surface of the plate to be coated is cleaned, e.g., by grit blasting. A retaining bank is formed substantially about a predetermined periphery of the plate by forming a ridge of a predetermined height on the clean surface to provide a confining zone into which a powder of the hard facing alloy is smoothly applied to a predetermined thickness to provide a composite of the alloy powder and the substrate. The powder may have an average particle size ranging from about 40 mesh to about 400 mesh (U.S. Standard) e.g., about 80 mesh to about 325 mesh.

Abstract: A weld support (50) for use with a center sill assembly (16) for supporting a cradle pad (12) used to support the end of a railway tank car body (B). The center sill assembly includes first and second spaced apart side plates (18, 20) spaced to either side of the car body, and a top plate (28). The weld support comprises first and second support members (52, 54) installed on opposite sides of the assembly. A pocket (56) is formed in the center sill assembly on each side thereof. A respective weld support member is attached to the top plate adjacent the respective pockets, for the weld support members to extend above the upper surface of the top plate. The weld support members each provide a substantial contact surface with the cradle pad. Each weld support member also helps pool welding material in the respective pockets to effect a strong weld between the cradle pad and center sill assembly.

Abstract: An underbody structure (10) supporting an end of a railway car body (B, B') cradled in a cradle pad (12, 12'). A center sill assembly (16) has first and second spaced apart side plates (18, 20) spaced to either side of the longitudinal centerline of the car body. A top plate (28) extends along the center sill assembly, the width of the top plate corresponding to the width between the side plates. The top plate is attached to the side plates to form part of the center sill assembly. A weld support (50) is installed on both sides of the assembly. Part of the respective side plates and top plate are cut-away at the junction formed between to form a pocket (56) in which welding material pools. Weld support members (52, 54) are attached to the top plate adjacent the pockets. The weld supports provide a substantial contact surface between the center sill assembly and the cradle pad.

Abstract: A layer selected from a group comprising: molybdenum, tantalum, tungsten, osmium, rhenium, ruthenium and an alloy of two or more thereof on the under surface of an electrical contact acts as a barrier to copper diffusion from the braze material into the contact structure. A thin nickel layer on the barrier facilitates the brazing of the barrier coated contact surface to the copper electrodes.

Abstract: A splash protector assembly for printed wiring boards includes splash protector rails for permitting printed wiring boards to be coupled together without additional aids as they are conveyed in a given conveying direction across different conveying planes through soldering machines. The splash protector rails include successive front and rear splash protector rails as seen in the given conveying direction. Each of the splash protector rails are L-shaped and define a longer leg being in an upright position during use, and a shorter leg. Each of the splash protector rails have springs for clamping the printed wiring boards. The longer leg of the rear splash protector rail has hooks and the longer leg of the front splash protector has braces for hanging the rear splash protector rail from the front splash protector rail of the next printed wiring board, and the braces prevent the printed wiring boards from becoming unhung as they are conveyed across meeting points of the different conveying planes.

Abstract: A shielding apparatus for use with a non-conductive package has an insulated lid (102) which is retained in contact with a substrate (104) for holding an electrical circuit. The shielding apparatus includes a first conductive flash (201) deposited on the interior surface of the insulated lid (102), to produce a substantially contiguous conduction layer, and a second conductive flash (203) deposited over a film (110) disposed on the edge of the insulated lid (102), to produce a partially contiguous conduction layer. The shielding apparatus also includes a layer (108) for affixing the insulated lid (102) to the substrate (104), to produce an enclosure for isolating the electrical circuit from extraneous radio frequency (RF) energy.

Abstract: A system and method for manufacturing an article that is formed by the incremental buildup of layers on a work surface contains a material deposition station to deposit the layers. In addition, a plurality of processing stations are employed. Each processing station performs a separate function such that when the functions are performed in series, a layer of the article is produced and is prepared for the deposition of the next layer. An article transfer apparatus repetitively moves the work surface and any layers formed thereon selectively among the deposition station and the processing stations. The article transfer apparatus continues to move between the processing stations until each layer is processed and a completely manufactured article is produced.

Abstract: A solder bump interconnection (34) bonding a metal bump (30) affixed to an integrated circuit component (10) to a terminal pad (18) of a printed circuit board (12) is formed using a consumable path (24) and a solder deposit (28) applied to the path spaced part from the terminal pad. In addition to the terminal pad, the printed circuit board includes a solder-nonwettable surface (21). The consumable path extends from the terminal pad on the solder-nonwettable surface and is formed oa solder-soluble metal. The solder deposit is heated, preferably by a laser beam, to form molten solder that is drawn along the pathdissolving the path as it proceeds. At the terminalmolten solder wets the pad and the metal bump and solidifies to complete the inerconnection.

Abstract: A plated-through hole solder thief for inhibiting solder bridges between adjacent leads of an integrated circuit and simultaneously providing for electrical interconnection of certain leads of the integrated circuit other surfaces or layers of a printed wiring board. Plated-through holes are used as solder thieves and are located in the proximity of the last solder pad in a row of solder pads. The plated-through hole draws the solder from the last solder pad to fill the plated-through hole and inhibit bridging between functional leads of the integrated circuit as well as make an electrical interconnection between the last lead of the integrated circuit in each row and other surfaces or layers of the printed wiring board. The plated-through hole is located askew from the rows of solder pads so that functional use may be made of the plated-through hole once it is filled to provide a test point for testing the integrated circuit.

Abstract: The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.

Abstract: A corrosion resistant insert of the present invention is used for fitting at an opening in a metallic liquid tank. The insert has an open end, a radially outwardly extending lip at the open end, a closed end and an axially extending side wall spacing the open end and closed ends from one another. The closed end has a displaceable portion secured to the insert in a preweakened manner which facilitates opening in one direction while resisting opening in the other direction. The use of the insert in the tank enables lining and then pressure testing of the tank ready for fittings after which the closed end of the insert is opened to allow liquid flow through the tank when the tank is in use.

Abstract: A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e.g., in an oven). The paste, dewetting from the organic material, "balls up" and substantially surrounds a solder member (ball) attached to a bridging portion of the flexible substrate's conductor, thereby connecting both substrates. A frame member may be used to align the flexible substrate, both during solder member attachment thereto, as well as for aligning the flexible substrate having solder members attached, to the respective solder paste locations on the lower substrate.

Abstract: Wicking-resistant solder preforms and methods for making such preforms are provided. The preforms include a solder layer for electrically mounting a lead to a printed circuit board upon heating the solder above its flow temperature. The preform also includes a flux layer disposed in contact with the solder layer and a wicking barrier disposed on a component-facing side of the solder layer for minimizing solder wicking along the lead during subsequent reflow soldering operations.

Abstract: An electronic component (14) is soldered to a circuit carrying substrate (11) by a method that allows the component to remain in better contact with the flat solder pads of the substrate. The circuit carrying substrate (11) has a plurality of solder pads (12) disposed thereon, each pad consisting of a terminal portion (16), a solder reservoir portion (18), and a bridging portion (17). The terminal portion is connected to the reservoir portion by the bridging portion. The bridging portion is typically a necked down portion of the pad. The electronic component (14) has a plurality of solderable terminals (15) corresponding to the terminal portions (16) of the solder pads (12). Each of the solder pad reservoir portions are coated with a reservoir of solder (23). The amount of solder coated onto the reservoir portion is sufficient to provide a fillet between the component (14) and the solder pad terminal portion (16) during a subsequent heating step.

Abstract: A method of soldering leadless components to a printed circuit board without using solder paste is disclosed. A thick layer of solder (42) is plated onto a printed circuit board (40), and an oxide layer (43) is formed by heating. Solder flux (45) is applied to those solder pads that are intended to be reflowed, and components (54) are placed. The printed circuit board is heated, and a solder joint (68) is effected between the components (54) and the circuit board (40), while the unfluxed solder pads (66) do not reflow and remain flat. Solder flux is then applied to the remaining solder pads (66) on the same or the opposite side of the circuit board. Additional components (77) are placed, and the circuit board (40) is reflowed a second time.

Abstract: Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.

Abstract: A method for pre-oxidizing a nickel alloy honeycomb core by heating the core while exposing the core to a controlled flow of an oxygen containing gas, such as dry air. The preoxidized core can be brazed in a vacuum furnace to two face sheets to manufacture a honeycomb panel using thin foil brazing material. The methods of preoxidation and panel production for Inconel 718, Rene' 41 and Inconel 625 are specifically described.

Abstract: A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e.g., in an oven). The paste, dewetting from the organic material, forms a substantially spherical ball and connects to the flexible circuit's conductor, connecting the two. In an alternative embodiment, the solder ball is formed to its desired shape and cooled (to solidification), separate from the flexible circuitized substrate. The flexible substrate is then lowered until the conductor engages the solder ball's upper surface. Heat is then applied to bond solder and conductor.

Abstract: Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion.Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion.Finally, disclosed is a method of testing the solderability of the above structures.

Abstract: Heat recoverable soldering devices comprising a heat recoverable tubular article having at least one open end, and containing a solder insert, is provided with a curable adhesive insert between the solder insert and the open end. The curable adhesive melts, flows and cures when heat is applied to recover the article. The adhesive cures such that its viscosity increases to a value of at least 1.5 its initial viscosity during recovery of the article. Curing of the adhesive inhibits flow of the adhesive through the open end of the article and/or into the solder connection formed between two (or more) elongate bodies inserted into the article.

Abstract: The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.

Abstract: A forkhook has a beveled portion formed on the periphery thereof so as to be welded to a fork. Dams are provided at corners of the beveled portion to prevent the liquid weld bead from dropping to the outer peripheral areas. Also, dams are provided between the beveled portion and the groove for receiving a locking pin to prevent the liquid weld bead from dropping into the groove. Thus, the operation for welding the forkhook to the fork is facilitated.

Abstract: A method of forming solder bumps includes the steps of applying a thick layer of solder resist to a substrate. The resist is selectively removed to provide wells at solder pads on the substrate. The solder paste is applied to the substrate in the wells. The solder paste is reflowed to form solder bumps on the pads. A socket for a solder bumped member is obtained by first providing a substrate having metalized pads corresponding to the solder bumps of the member. A thick layer of photo definable solder resist is applied to the substrate. The resist is selectively removed to provide wells at the metalized pads of the substrate. Solder paste is then deposited in the wells. The solder bumped member can then be positioned so that the solder bumps are located in the wells. The solder paste is reflowed to bond to the solder bumps and the metalized pads. The solder paste can be selected to have a lower melting temperature than the solder bumps.

Abstract: A soldered electrical interconnection is made between a device and a circuit carrying substrate. A device (200) is formed with two solderable surfaces, the second solderable surface (204) adjacent to, but not touching, the first solderable surface (202). A sphere of solder (206) is placed upon a solderable surface (202) of the device and reflowed. The component and solder sphere assembly is placed on a circuit carrying substrate (210) and reflowed, such that the solder sphere reflows and is wetted to both solderable surfaces on the device.

Abstract: A structure and method for selectively forming interconnections between the interconnect lines of a printed circuit board. At the same time solder is deposited through a solder application mask to bond the modules to the board, solder is also deposited on pad interconnect structures between the interconnect lines. Thus, line interconnections can be formed at minimal additional cost, reducing the number of different boards needed to mount different sets of modules or alternate component or circuit configurations. In a preferred embodiment, the pads comprise an arcuate member and an elongated member extending within the arc described by the arcuate member. By optimizing the spacing between the members, the total area of the members, and the volume of the solder, a highly reliable solder fillet interconnection can be formed.

Abstract: A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulting material. The wire may be bonded to the contact on the first component by means of a wire bonder having a bonding head which weakens or severs the wire to the desired length.

Abstract: Composite bodies comprise a metallic member and a ceramic member integrally joined together by joining a projection of the ceramic member to a recess of the metallic member. Their joining strength is improved by substantially limiting brazing metal to an interface between the outer peripheral surface of the projection of the ceramic member and the innner peripheral surface of the recess of the metallic member. The joining strength is also improved by forming a groove around the outer periphery of the metallic member at the joined end. The joining strength is also improved by providing a space or an intermediate member between a tip end surface of the projection and a bottom surface of the recess and attaining the relation: ##EQU1## in which G, L.sub.1, .alpha., .alpha.', T.sub.S and T.sub.

Abstract: A method and an apparatus for solder plating parallel arranged leads on an electronic device, e.g. QFP having leads on four sides or SOLC having leads on two sides. A metal plate of solder wettable material having an inclined upper surface is placed in a molten solder bath. The electronic device, with the leads to be solder plated exposed, is lowered horizontally in the solder bath and is pulled out horizontally. A large quantity of solder adhering on the inclined plate pulls solder adhering on the leads sequentially along an inclined surface of the plate to obtain uniform thickness of solder plating on the leads without causing bridging.

Abstract: A dot print head including armatures, supporting parts for supporting the armatures, and torsion bars for supporting the armatures on the supporting parts. Open grooves are formed at least in either the armatures or the supporting parts to place the torsion bars therein, to contain a brazing filler metal therein and to braze the torsion bars to the armatures or the supporting parts by melting the brazing filler metal in the open grooves, and flanges are formed integrally with each torsion bar so as to be positioned between the elastic portions of the torsion bar and the open grooves. The width of the base end of each armature or that of each supporting part is reduced to form a gap between the armature and the supporting part in a width sufficient to form the elastic portion of the torsion bar in a length greater than a predetermined value.

Abstract: A heated tool for soldering objects to a plurality of pads which are spaced apart by a selected pitch, comprises a tool member having a heating surface with a plurality of spacer bars thereon, spaced by the pitch between the pads. The spacer bars act to separate one pad from the other to avoid the flow of solder between the pads.

Abstract: A method is disclosed for creating a strong point for the attachment of carbon composites to metallic bodies that is suitable at high temperatures (1600.degree. F.) as well as ambient temperatures. A pocket of suitable dimensions and depth is molded into the carbon composite structure on both sides at an edge, with the edge relieved and rounded. A hole for a fastening member is molded or drilled in the approximate center of the pocket. After preparation of the surface the pocket, through hole, and relieved edge are nickel-plated to produce a rigid strong point. A doubler can be brazed to the nickel plate to strengthen the bond. The disclosed method can be used for attaching any type of electrically conductive composite material to a metallic structure.

Abstract: A shielded high-frequency apparatus has a partitioned shielding case with a printed circuit board mounted therein. The partitioned shielding case is formed of a plurality of mutually intersecting shield plates which are attached within a frame to form a plurality of shield chambers. The partitioned shielding case is manufactured by first forming a solder resist film over the partitioned plate surfaces other than at specific end regions of the partition plates and over the frame internal surface other than at positions immediately adjacent to the end regions of the partition plates when the partitioned shielding case is assembled. The partition plates are then mounted in the frame, solder is next applied to the regions from which the solder resist film was omitted. Secure attachment of the partition plates and ease of implementation of automatic manufacture are attained, with reduced manufacturing costs.

Abstract: A method of welding in a groove (1) machined in a solid alloyed steel part, characterized in that bottom passes (2) are performed and then each wall (11, 13) of the groove (1) is faced with low alloy steel filler material, heat treatment is performed so as to eliminate the stresses in the zones (18, 19) of the part adjacent to the walls (11, 13) of the groove, and the empty space (20) between the two facing layers (15, 17) is filled with low alloy steel filler materials, said operation of facing the wall (11, 13) being performed by placing a carbon steel plate (4, 4', 2, 22') in the groove (1) at a certain distance from said wall (13, 11), by filling the space (12, 16) between the plate (4, 4', 22, 22') and the wall (11, 13) with layers (14, 14') of low alloy steel having a carbon content lying in the range 0.08% and 0.12%, and by getting rid of the steel plate (4, 4', 22, 22') and optionally a portion of the fill so as to leave only a layer (15, 17) on the wall (13, 11).

Abstract: A rotor-shaft assembly which includes a ceramic, solid hubbed turbine rotor having an integral stub shaft brazed within one end of a generally cylindrically shaped sleeve member. A metal shaft is either brazed or cold press fitted within the other end of the sleeve member in a torque transmitting relationship. The stub shaft is formed with an annular relief therearound in order to reduce the compressive forces acting on the stub shaft by the sleeve member.

Abstract: Alumina is bonded to a metal by means of an active brazing filler alloy. When the metal to which the alumina is bonded is a high blushing metal, that is, a metal on which the active brazing filler alloy readily flows on the surface, a thin layer of a low blushing metal is disposed therebetween.

Abstract: To avoid having to metallize a bare glass fiber prior to soldering it into a hole of a metal part to obtain a hermetically sealed lead-through bushing, the solder is permitted to shrink onto the glass fiber. This is achieved by either soldering an additional solder body to the metal part outside the hole or providing the wall of the hole with a nonsolderable coating over part of its length. If the metal part is designed as a sleeve, a recess exposing part of the hole causes the solder to firmly shrink on to the bare glass fiber during solidification. The hermetic seal is obtained by arranging the connections of the solder with the metal part and with the glass fiber essentially one behind the other in the longitudinal direction of the glass fiber.

Abstract: A method is provided of temporary assembling by soldering of peel off plates through soldering material and a flexible junction element for a mechanical release device to release two parts temporarily fixed edgewise by peeling off the flexible element and the soldering material. There is provided on the plates and flexible junction element reserve areas without any adherence to the soldering material, and preferably at the limits of said reserved areas a recess for removing any excess of soldering material, and the melting solder material is put under load for distributing it between the plates and the flexible junction element. A so obtained assembly can be applied particularly to obtain automatic opening of containers in particular in space for spreading out solar panels.

Abstract: A manufacturing method for an electronic component connected at a lead terminal thereof to electrodes at an element so that the element is coated at the surface with an over-coat resin, which prevents the lead terminal from being unnecessarily coated with the over-coat resin, thereby improving the automatic insertion efficiency of the electronic component with respect to a printed circuit board.An intermediate portion of the lead terminal positioned at the outer peripheral edge of the element is previously applied with a repellent against the over-coat resin, the lead terminal being mounted on the element and thereafter the element being dipped into the over-coat resin, so that the over-coat resin, when coated on the element, is prevented from adhering to the portion of lead terminal applied with the repellent, thereby avoiding creation of running of the over-coat resin at the lead terminal.

Abstract: A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a first step; joining the semiconductor sandwiches and the carrier unit together with a low-melting solder in a second step; performing the first and second soldering steps without flux in a gas from the group consisting of hydrogen and forming gas; and preventing a mixture of the high-melting solder and the low-melting solder during the second step.

Abstract: A solder resist paste having the feature that it is relatively easily removed is disclosed. The paste is comprised of a liquid polyglycol (e.g. Pluronic 25R2 by BASF) and either Kaoline or talc powder. In operation, the paste is selectively applied to holes in the PCB which it is desired to keep open during a soldering process. The paste is then washed out of the holes, additional components mounted via those holes, and soldered into place.

Abstract: A device for building up a workpiece of any shape by deposit welding comprising a support device for the workpiece and a welding head for depositing the filler material. A form shoe is arranged on both sides of the workpiece wall that it being built up. Each form shoe is movable independently from the other one and transverse to the workpiece wall. The welding head is reciprocably mounted between the form shoes. There is provided a device for producing relative movement between the support device with the workpiece and/or the welding head and the form shoes.

Abstract: A method is provided of temporary assembling by soldering of peel off plates through soldering material and a flexible junction element for a mechanical release device to release two parts temporarily fixed edgewise by peeling off the flexible element and the soldering material. There is provided on the plates and flexible junction element reserved areas without any adherence to the soldering material, and preferably at the limits of said reserved areas, a recess for removing any excess of soldering material, and the melting solder material is put under load for distributing it between the plates and the flexible junction element. A so obtained assembly can be applied particularly to obtain automatic opening of containers in particular in space for spreading out solar panels.

Abstract: In a hot isostatic pressing operation, an apparatus and method are disclosed for isolating the interface of the two materials to be diffusively bonded from the pressure transmitting medium. The apparatus includes a member defining a cavity which is interference fit about the interface, thus preventing the energy transmitting medium from penetrating the interface.

Abstract: A method of producing a fluid-tight seal between a thin, flexible member and a support including the steps of providing a moat for receiving excess braze material on an external surface of a member support and a dam adjacent to the moat to confine the excess braze material to the moat and having a height above the bottom of the moat to accommodate a brazing of the member to the external surface, positioning the member to extend across the dam and the surface while contacting only the top of the dam and brazing the member to the surface while maintaining the contact between the top of the dam and the member to uniformly support the member.

Abstract: An ultrasonic liquid ejecting unit comprises a piezoelectric transducer coated with a conductive film on each of its front and rear surfaces, a nozzle plate secured to the transducer to form a bimorph vibration system and a body having a liquid chamber defined by the nozzle plate in pressure transmitting relation with the liquid in the chamber. The nozzle plate is coated on each of its front and rear surfaces with a pattern of adjoining regions of cement-active and cement-inactive properties. The cement-active region on the front surface conforms to the rear surface of the transducer and the cement-active region of the rear surface conforms to a contact surface of the body. When fabricating the unit, a cementing material in liquid phase, such as molten solder, is applied to each surface of the nozzle plate to exclusively wet the cement-active regions prior to contacting the nozzle plate to the transducer and to the body.

Abstract: Pressurized molten solder 71 is flowed along a confined first channel 86 and forced through a series of spaced, aligned apertures 88 as solder jets which rise, fall and merge to form a solder stream which flows along a second channel defined by channel walls 93 and 94. Spring held printed circuit boards 10 are advanced by a conveyor 21 which is tilted to move a far section of each board into engagement with the top of channel wall 93 and then a near section of each board into engagement with the top of channel wall 94 whereafter the board is spring held to ride along the tops of channel walls while a thin stripe of solder is applied to the board.

Abstract: In a contact device having at least first and second contact surfaces which may be placed in electrically conducting contact with one another, that improvement which includes a solder-repellent and self-lubricating casing material applied to at least one of said contact surfaces. The solder-repellent contact surface also serves as a stop-off when soldering component leads to terminals of a printed circuit board.