Abstract: Method of manufacturing an accumulator device including a shell portion having an open mouth and a cap member affixed over the open mouth after a bladder assembly has been secured within the shell portion of the pressure vessel. The method comprises in the provision of an exterior annular weld connecting the cap member to the outer wall portion of the vessel as well as an interior weld connection between the interior wall portion of the cap member and the upwardly directed end edge of the mouth of the pressure vessel. By locating the metallic skirt member which functions to support the bladder such that the top of the skirt forms a dam for containing the weld which secures the cap member interior to the uppermost edge of the pressure vessel, the possibility of weld fragments falling into the bladder causing damage to the latter is minimized.

Abstract: A method for mounting an electrical slide switch on a printed circuit board having apertures formed therein by means of a wave soldering after putting protective material between the electrical lead contacts. The switch is then cleaned by passing a solvent through the open areas after which the protective material is removed.

Abstract: A method is provided for electrically interconnecting a plurality of varistors of the type formed predominantly of metal oxide. Molten solder is first applied to the receiving surfaces provided on opposite sides of each of the varistors. The molten solder is then subjected to vibrations of from 5,000 to 35,000 hertz, causing the solder to strongly adhere to the receiving surfaces. The varistor bodies are then soldered to one another along their receiving surfaces to electrically interconnect the varistor bodies. In one embodiment of the method, the applying of molten solder, vibrating the molten solder, and soldering the varistor bodies to one another are all performed substantially simultaneously by means of a vibrating solder bath.

Abstract: A method providing for the non-wetting of predetermined portions of articles exposed to molten filler metals during soldering or brazing operations wherein predetermined areas of said elements are provided with a layer of chemical vapor deposited titanium carbide with an overlayer of titanium nitride or with a layer of titanium diboride to resist wetting of the coated areas by the filler metals. Articles coated by the non-wetting titanium compounds include circuit board support brackets and other elements used in immersion soldering machines, and heating elements for soldering operations such as soldering tips for various types of heated soldering tools and the like.

Abstract: A method for preventing solder sticking on printed circuit substrates comprises mechanically roughening the surface of the substrate.

Abstract: A thick solder blob (56) is bonded to a land area 34 on a metallized substrate (31) by (a) depositing a thick layer of solder paste on the land area; (b) confining the solder paste with a hard material; and (c) reflowing the solder paste to bond the solder blob (56) to the land area (34) while maintaining the thickness thereof.

Abstract: Component masks are described for preserving unoccupied holes in a printed circuit board when such board is subjected to wave soldering. Each mask is a body of plastic resistant to adherence to the solder and capable of withstanding the temperature of solder when the printed circuit board is subjected to wave soldering and includes a supporting block from which a plurality of parallel pins protrude for reception into the printed circuit board lead-holes to be preserved. The pins are spaced from one another by distances equal to the distances between lead-holes on a printed circuit board, and component masks are provided respectively having a single row and a double row of such pins. Each pin is tapered slightly toward its free end, and is connected to its associated supporting block by a conically shaped transition body.

Abstract: A solder-bearing lead (10 or 10') is provided with solder-confining stops (20 and 22 or 20' and 22') to preclude detrimental flow of molten solder from a solder preform (12 or 12') on a contact finger (26 or 26') of the lead, along a stem (18 or 18') of the lead in a soldering operation. Accordingly, substantially all of the molten solder flows across the thickness of the contact (26 or 26') to a contact pad (14 or 14') and is confined on the contact pad to form a solder connection (44 or 44'). The solder-confining stops (20 and 22 or 20' and 22' ) are formed by oxidized portions of a base metal (phosphor bronze) from which portions of solder-wettable (tin) coatings (36 and 38 or 36' and 38') have been removed.

Abstract: The flux dams used to form mounds of granular flux in submerged arc welding deteriorate rapidly because they are subjected to elevated temperatures and high heat. These flux dams also twist and distort creating gaps. Granular flux bleeds through these gaps. Flux is wasted and the welding arc may be exposed to the atmosphere. Flux dams are also awkward to move and slow production down. The apparatus and method disclosed herein overcome these problems by utilized an elongate flux dam (19) that is stationary during welding and which extends for the length of the weld. The flux dam (19) is mounted on a heat exchanger (24) by a mounting plate (21) that minimizes thermal distortion of the flux dam (19). The heat exchanger (24), the mounting plate (21), and the flux dam (19) are pivotally connected to a support arm (26) that is mounted for motion about the platform (6) on a pivot point (32).

Abstract: A dam, or barrier, structure is moved along the edge, or corner, of a workpiece to control the flow limits of molten material of arc welding. The dam structure provides a dimentionally stable groove at the edge of the workpiece surface into which is received granulated flux and positions the body of the flux along the edge, or corner, of the workpiece surface to function as a mold for the molten material, and, thereby, prevent the falling of the flowing material from the surface. The dam structure has the specific form of a continuous tread of segments which advances around parallel rollers to reform the retaining groove structure opposite the arc operation on the surface of the workpiece.

Abstract: A component protective system is disclosed for an electrical component which can be soldered in a printed circuit board by means of a solder bath. A portion of the components which projects through the printed board is protected from the influence of the solder bath by use of a protective collar arranged around the portion to be protected. The protective collar is open in a direction toward the solder bath and projects beyond the portion to be protected. Upon immersion of the component together with the printed circuit board into a solder bath, an air cushion is formed within the protective collar. This air cushion prevents contact between the solder and the portion to be protected and forms a heat insulator which protects this portion from heat damage.

Abstract: There is disclosed a positive cathode electrode structure formed by brazing a thin porous membrane to a backing material by preselecting a predetermined area of the thin porous membrane and thereafter providing a braze flow barrier throughout the remainder of the membrane and electrolessly plating a nickel-phosphide alloy on the backing material, or in this case the honeycomb structure. The preselected area of the thin porous membrane is placed in intimate contact with the electrolessly plated portion of the backing material and heated to elevated temperatures in the absence of oxygen to form a brazed joint limited to a preselected area. If the braze flow barrier is provided by application of a liquid organic solvent, then the organic solvent is driven off by maintaining the thin porous membrane at elevated temperatures for an extended period of time prior to the brazing operation.

Abstract: A photopolymerisable composition particularly useful as a solder resist composition able to withstand molten solder without loss of adhesion, pitmarks or shrinkage and for forming durable coatings on substrates generally is obtained by a combination of a photoinitiator, a polythiol acting as a chain modifier, and a polymer having hydroxy terminated chains capped by acrylate groups connected to the chains via the residue of a polyisocyanate.

Abstract: Disclosed is a method of joining, by brazing, two metal pieces at least one of which is a powdered metal piece, each piece having a joint surface. The method includes the step of plating the joint surface of the powdered metal piece with a thin layer of metal having a relatively high melting point, assembling the pieces with their joint surfaces in substantial abutment, and applying a metal brazing composition having a flow temperature at least about 300.degree.-400.degree. F. or more less than melting point of the plating metal to the joint surfaces while heating the joint with a torch. The method eliminates the need for rigorous temperature control customarily employed in powdered metal brazing.

Abstract: In a side-seam soldering machine wherein successive can bodies are fed and their side-seams progressively soldered by an applicator means, a solder deflecting member (which would otherwise interfere with an internal pre-stripe or coating) is mounted for cooperation with the can feeding means to insure that the member does not adversely affect the pre-stripe or coating, but does prevent solder from being introduced between successive can bodies and deposited therein.

Abstract: Disclosure is made of a method for brazing ferromagnetic materials whereby a metalloceramic braze, containing a ferromagnetic refractory component and a fusible component the melting point of which is lower than the Curie point for the refractory component, is placed in the gap between the materials to be joined. In the gap a magnetic field is created whose lines of force cross the gap and whose intensity is adequate enough to retain within the gap, the ferromagnetic refractory component in the process of brazing during the melting of the fusible component. The zone of joining the materials is heated to the temperature of brazing and then cooled. It is proposed also to use a metalloceramic braze, containing an alloy based on Cu--Co, consisting of 50-90% by weight of Cu, and a Cu-Mn-Ni alloy, containing 50-66% by weight of Cu, 24-34% by weight of Mn, and 2-16% by weight of Ni.

Abstract: An improved process plug for use during immersion soldering of aluminum heat exchanger coils, such as an air conditioner evaporator. The plug allows the solder to flow into an open bell or female socket of a suction header tube to "pretin" the internal finish of the bell or tube joint while preventing the solder bath from entering the coil. The process plug is designed to achieve a "short" or reduced area joint so that the plug can be readily removed by heating. The suction header tube joint is completed by hand soldering of a precoated male copper transition tube.

Abstract: A means for preventing weld splatter produced during the welding together of two housing parts from entering a fluid passageway contained within the housing. The preventing means comprises an annular chamber located between the fluid passageway and the surfaces to be welded together and a screen contained within the chamber to cover a vent passage connecting the chamber to the fluid passageway. The screen prevents weld splatter from passing through the vent passage into the fluid passageway where it may later contaminate the fluid flowing therethrough.

Abstract: A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the melted polysulfone in place during the solder dipping operation.

Abstract: An arcing contact for a high current capacity switch having a pair of switch members in sliding face-to-face engagement is formed from a set of resilient laminations that shunt the switch members as the switch makes on closing or breaks on opening. One end of the set of laminations is mounted on a face of one of the switch members, usually a blade, and the other end of the set of laminations is angled so that the end surfaces or tips bear against a face of the other switch member, usually a termination, when the arcing contact shunts the switch members. While in this position, a deflection of the laminations develops a spring force that urges the tips of the laminations into contact with the termination. The tips are inwardly bevelled with respect to the face of the termination and lie in a common plane so that during electrical connection they are in a substantially parallel relationship with the face of the termination, at substantially the same pressure.

Abstract: An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a solder-nonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shape of the solder bands and by reducing their structural integrity through the creation of numerous hairline fractures.

Abstract: A machine and a method for applying a solder resistant material or solder resist to predetermined portions of miniature connector structures are disclosed. The machine permits large numbers of the miniature connector structures to be precisely treated with the solder resist without the need for costly and time consuming masking procedures. More particularly, the miniature connector structures attached to a carrier strip are fed through a hybrid fluid dispensing assembly similar to a bath, which is continuously supplied with the solder resistant material. The quantity of material supplied to the hybrid fluid dispenser or bath is coordinated with the speed at which the miniature connector structures are driven through the bath so that each of the miniature structures absorbs a predetermined amount of solder resistant material by capillary action. The quantity of material absorbed by each of the miniature connector structures is controlled so that it is just sufficient to fill a desired area.

Abstract: Before skins are brazed on airfoil cores having cooling channels recessed into the surfaces thereof, the surfaces of the cooling channel walls are covered with a layer of oxide material. The oxide formation selected is one that is not reducible in dry hydrogen. Thereafter, when the normally employed hydrogen or vacuum brazing operation is conducted to apply the airfoil skin, the oxide-covered sides of the cooling channels will not be wet by the molten braze alloy. Plugging of the covered cooling channels during manufacture is thereby greatly reduced.

Abstract: An annular composite joint of wire and braze alloy fluid-tightly seals the bucket of a gas turbine to the root sidewall piece bridging the space provided between the two parts to eliminate the necessity for close tolerance fit.