Abstract: A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.

Abstract: A conductive circuit board is produced by imparting tackiness to the conductive circuit surface on a printed wiring board, attaching solder powder to the tacky area by supplying a slurry containing solder powder, and then heating the printed wiring board to melt the solder, thereby forming a solder circuit. In the solder circuit prepared by this method, tackiness is imparted to portions of the circuit with an insufficient amount of solder attached thereto and solder powder is attached to these tacky areas, or a solder paste is applied to the portions of the circuit with an insufficient amount of solder attached, and the solder powder or solder paste is melted to rectify the solder circuit, thereby producing a conductive circuit board with little variation in the amount of solder attached.

Abstract: Some embodiments include an apparatus comprising a spray head to spray a substrate, the substrate having a region to be sprayed and a region to be masked, the two regions separated by a boundary, and a mask having channels, the mask located between the spray head and the substrate. In an embodiment, the mask further has a lip to prevent flux overspray from falling onto a substrate below. In an embodiment, flux overspray removal is assisted with a vacuum system. Other embodiments are described and claimed.

Abstract: The present invention relates to a method and a device for wetting the bumps of a semiconductor chip with a soldering flux, in which a container, which accommodates the soldering flux and is open on the bottom, and a base plate, which contains at least one cavity, are moved back-and-forth in relation to one another on one side of the cavity to the other side of the cavity. The viewed in the movement direction front wall of the container is lifted up during the relative movement, so that it is located at a distance above the base plate. The distance is somewhat greater than the height difference by which the soldering flux projects above the level of the surface of the base plate. This measure has the effect that the front wall of the container does not convey any soldering flux onto the base plate, which has caused the loss of this soldering flux until now.

Abstract: Embodiments include materials which may be used during electronic device fabrication, including a flux material. The flux material comprises a solution including a plurality of micellar structures in a solvent, the micellar structures each including a plurality of amphiphilic block copolymer elements. The amphiphilic block copolymer elements each include at least one non-polar region and at least one polar region. A fluxing agent is contained within the micellar structures. Other embodiments are described and claimed.

Abstract: A conductive ball mounting apparatus and method for holding a conductive ball on the holding face, as has a suction port formed therein, of a holder head thereby to mount the held conductive ball, while interposing a flux therein, on a workpiece. After the end of the mounting action and before a next conductive ball is held, flux removing means for removing the flux adhered to the holding face is brought into abutment against the holding face of the holder head thereby to remove the flux from holding face.

Abstract: A flux for soldering of the present invention, in connecting a mounting pad exposed on a board to a solder ball, is applied onto at least one of a surface of the mounting pad and the solder ball. The flux for soldering contains a solvent, and the solvent contains a compound, which is represented by a general formula (1) and having a boiling point of 218° C. or higher and 240° C. or lower: R1-R2n-OH . . . (1).

Abstract: Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.

Abstract: A flip-chip type semiconductor light-emitting device having a positive electrode and a negative electrode similar in electrode area and capable of preventing the misalignment of the light-emitting device by utilizing the self alignment effect in manufacturing a light-emitting diode lamp and a printed circuit board for the flip-chip type semiconductor light-emitting device are provided. Furthermore, adopted are a flip-chip type semiconductor light-emitting device 1 which is provided with a negative electrode pad and a positive electrode pad formed on the side opposite the transparent substrate side of the semiconductor layer, wherein each of the electrode pads is formed in the same shape as each other and a printed circuit board for the light-emitting device has a pair of the electrode patterns which are formed in the same shape as each other. Still furthermore, a soldering film is included in each of the electrode pads.

Abstract: An aqueous aluminum brazing composition containing an organic binder and a zinc-based flux which prevents the precipitation of the zinc-based flux having a large specific gravity while securing an excellent brazeability. The thixotropic index of the brazing composition is adjusted to 1.01-1.20 by adding a (meth)acrylic acid/(meth)acrylate copolymer emulsion to the brazing composition as a precipitation inhibitor in an amount of 0.03-1.50 wt % of 100 wt % of the brazing composition. Since the (meth)acrylic acid/(meth)acrylate copolymer emulsion is used as the precipitation inhibitor in a specific amount instead of other types of compounds used for a powder-containing paint, such as ultrafine particle silica, poly(meth)acrylate, or polyvinyl alcohol, the precipitation of the zinc-based flux can be prevented without impairing the brazeability.

Abstract: The purpose of the present invention is provide a method of forming a flux layer on an aluminum plate member, wherein a heating step for drying after a spray-coating of a flux composition can be omitted. The invention relates to a flux layer 2 composed of solid constituents of 5-25 g/m2 formed on a surface of an aluminum plate member 1, by spray-coating a flux composition from a nozzle 20 to the plate member 1 with a thickness of 0.2-1.6 mm, which was press-molded and heated for degreasing in a heat-degreasing oven 10, while a temperature of the plate member 1 is kept from 120 to 180° C. under the remaining heat after completing a heating step for degreasing, and naturally drying for volatilizing volatile constituents of the flux composition utilizing the remaining heat.

Abstract: The present invention provides an amorphous caesium aluminium fluoride complex, a process for its production and the use of the complex as a flux, in particular for the soft soldering of aluminium.

Abstract: A method for soldering or hybridizing two components to each other by means of a solder material, including producing, on the opposite-facing surfaces of the components to be soldered or hybridized, a surface capable of being wetted by said solder material, this surface being produced on a first component which is in electrical contact with a metallic conductor, depositing an appropriate quantity of solder material capable of constituting a solder or hybridization pad on one of the wettability surfaces, depositing a flux material in liquid form, bringing the wettability surface of the other component into contact with the solder material thus deposited and raising the temperature until at least the melting temperature of the solder material is reached in order to ensure effective soldering or hybridization of the two components to each other due to the reflow effect.

Abstract: A hydrocarbon compound mixed with an organic peroxide is placed between a copper electrode and a solder-coated electrode, and is heated at a temperature of about 300° C. The organic peroxide is exposed to a heating energy and thermally decomposed into an organic peroxide radical whose oxygen-oxygen bond has been released. Since this organic peroxide radical is active, it abstracts hydrogen from the hydrocarbon compound. The formation of a hydrocarbon compound radical is accelerated by the organic peroxide so that even at a relatively low heating temperature, a sufficient amount of a hydrocarbon compound radical can be formed. As a result, an oxide film can be removed from the metal surface even at a relatively low heating temperature by the reduction caused by a hydrocarbon compound radical.

Abstract: There are provided a flux cored wire for joining dissimilar materials with each other, capable of enhancing a bonding strength upon joining an aluminum-base material with a steel-base material, and excellent in bonding efficiency, a method for joining the dissimilar materials with each other, and a bonded joint obtained by the method. In particular, there is provided a method for joining dissimilar materials with each other, in the case of melt weld-bonding of high-strength dissimilar materials with each other, that is, the high-strength steel member with the high-strength 6000 series aluminum alloy member and in the case of the steel member being a galvanized steel member. In one mode, use is made of a flux cored wire wherein the interior of an aluminum alloy envelope is filled up with a flux, the flux has fluoride composition containing a given amount of AlF3 without containing chloride, and the aluminum alloy of the envelope contains Si in a range of 1 to 13 mass %.

Abstract: The invention is directed to a method for arc or beam brazing/welding of workpieces (A) made of steel, cast iron, nickel, cadmium, beryllium, titanium, molybdenum, magnesium, aluminum, copper, lead, zinc, tin, hard metal and alloys thereof with workpieces (B) made of steel, cast iron, nickel, cadmium, beryllium, titanium, molybdenum, magnesium, aluminum, copper, lead, zinc, tin, hard metal and alloys thereof, wherein said workpieces (A) and (B) may consist of identical or different metals or metal alloys, using a fused additional metal alloy, characterized by the following steps: a) positioning the workpieces to be joined; b) fusing the additional metal alloy containing an SnZn, SnAg, SnZnAg, SnCu, SnCuAg, SnZnCu or SnZnCuAg alloy; c) applying the fused additional metal alloy on the contact surfaces or partial areas of the contact surfaces between the positioned workpieces; and d) cooling the joined workpieces; steps b) and c) being carried out one immediately after the other.

Abstract: A wave soldering apparatus includes a solder supply and a first wave soldering nozzle in fluid communication with the solder supply. The first wave soldering nozzle includes a flat plate having a plurality of square-shaped openings formed therein to generate a first solder wave. An inert system is configured to deliver an inert gas around the first solder wave. Other embodiments and methods of wave soldering are further disclosed.

Abstract: An apparatus 10A for manufacturing semiconductor devices includes a plurality of receiving portions 12 for receiving an upper semiconductor package 30 on a top surface of the receiving portion 12. The receiving portion has a function of restricting the movement of the upper semiconductor package 30 in a direction parallel to a top surface of the upper semiconductor package 30. The receiving portion 12 is a concave portion in which the upper semiconductor package 30 is adapted to be received. An adhesive material having a function of immovably holding the upper semiconductor package 30 to the receiving portion 12 may be provided within the receiving portion 12, for example.

Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.

Abstract: A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.

Abstract: The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: A flux based on alkali fluoroaluminate is described which is highly suitable for dry application (“dry fluxing”). This is a flux which is free of fine-grained fraction, which is defined by a range of grain-size distribution.

Abstract: Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may atomize prior to deposition onto the substrate as relatively smaller broken down flux droplets that may aid reduced spray splash. Other embodiments are also described.

Abstract: A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the brazing sheet only where metallurgical bonds or joints are required, that is sufficiently durable to withstand processing operations and also provides good metallurgical bonds upon brazing.

Abstract: A welding flux that includes a flux agent and a binder. The binder includes a colloidal binder formed from small particles of silicon dioxide. The binder can be dried at lower temperatures to thereby for a greater range of fluxing agents and/or metal alloys to be included in the welding flux. The colloidal binder can constitute 100 percent of binder or form only part of the binder.

Abstract: Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.

Abstract: A printed circuit board that can be connected with a pin connector and a method of manufacturing the printed circuit board are provided. Solidified solder can be formed on the tap unit without the need for additional processes, by applying solder printing to the tap unit at the same time it is applied to pads of the printed circuit board and, for example, by performing high temperature reflow. In addition, reliability and reduction in cost of a pin connector can be ensured without using a pin connector into which a high-priced wired solder is inserted. Rather a general pin connector can be used because the pin connector and the tap unit are connected to each other through the solidified solder formed on the tap unit.

Abstract: A stainless steel slab containing B, wherein a protecting material is joined onto at least two faces across the bloom from each other in a stainless steel bloom containing B of 0.3–2.5 mass %, being integrated into one-piece by forming a weld metal comprising a stainless steel with chemical composition that satisfies the relationship expressed by following formulas (1)–(4), and a method to produce a steel product by rolling said slab. Further, it is preferable to interpose an insert material between above stainless steel bloom and above protecting material in bonding process. 15?Cr eq?30,??(1) 4?Cr eq?Ni eq?17,??(2) Cr eq=Cr+1.5 Si+Mo?5 B,??(3) Ni eq=Ni+30 (C+N)+0.5 Mn??(4) Herein, each symbol of a chemical element designates the content (mass %) of relevant chemical element contained in steel.

Abstract: The object is the capability of providing a method of manufacturing mounting boards that enables extensive adoption of a stacked structure at a low cost. As a solution, in the method of manufacturing a mounting board in which a mounting board is manufactured by mounting a first electronic part 11 and a second electronic part 12 each having a solder bump in its bottom plane on a substrate 3 in stacked plural levels, after the first electronic part 11 is mounted on the substrate 3 that has been fed with solder, the solder bump 18 of the second electronic part 12 is mounted on the electrode 17 provided on the upper plane of the first electronic part 11, and thereafter the substrate 3 is heated in a reflow step to solder-bond the first electronic part 11 to substrate 3 along with solder-bonding the second electronic part 12 to the first electronic part 11. By such process, a stacked structure can be applied to a wide variety of electronic parts at a low cost.

Abstract: An aluminum alloy filler material for use in welding of metal members including at least one aluminum die-cast member containing Mg includes an aluminum or an aluminum alloy as base material and Al—K—F series flux. The Al—K—F series flux is contained by 2 to 4 mass % with respect to the entire filler material.

Abstract: An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. After deposition the layer is dried until a solid protective film is obtained. An additional advantage obtained by the present invention is that the protective layer can be deposited also by means of an offset printing process, avoiding the use of the stencil and of the screening steps. Screening process is a labourious operation which requires very sophisticated equipment and a very high precision in the design of the stencil. Because of these requirements, screening is an expensive process. On the other hand offset printing is a very simple, cheap and reliable method. In addition, the film forming properties allow the material to create a protective film even with a thin deposited film.

Abstract: A process of making a shaped product consisting of aluminium or an aluminium alloy comprising the steps of producing an intermediate object by extrusion or rolling and having at least one flat surface, coating the at least one flat surface with a brazing flux retaining coating which is composed of flux particles and a binder containing at least 10% by weight of a synthetic resin based, as its main constituent, on methacrylate homopolymer or a methacrylate copolymer, reshaping of the intermediate object into the shaped product and heating the shaped product to a temperature sufficient to provide at least one brazed connection between defined parts of the shaped products.

Abstract: The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

Abstract: A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for the external contacts, and to hold the external contacts on the contact pads during a reflow bonding process. The flux is also configured to cure or polymerize, to form donut shaped polymer support members for the external contacts. In addition, the flux is configured to mask conductive traces in electrical communication with the contact pads, and to electrically insulate the external contacts from the conductive traces. The external contacts can be pre-formed solder balls, or deposited solder bumps. In the case of solder bumps, the flux can include solder particles configured to coalesce into the solder bumps.

Abstract: The present invention relates to a soldering flux, a soldering paste and a soldering method that achieve a sufficient degree of bonding strength even when components are mounted at a higher density, components are further miniaturized or components are mounted with a smaller pitch. A flux 3 contains an adhesive resin and a hardening agent. This flux or a soldering paste containing the flux is applied onto a component mounting board 1, and then, an electronic component 4 is mounted and soldered onto the component mounting board 1.

Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

Abstract: The invention relates to a method for improving the quality of soldered connections between large-area SMD components and wiring carriers, in the case of which the parts to be joined are electrically and mechanically connected to one another by reflow soldering, a flux being used to activate the solder. The intention of the invention is to provide a method of improving the quality of soldered connections which is simple to realize and particularly effective and with which the number of voids can be drastically reduced. According to the invention, this is achieved by the parts to be joined being positioned one over the other and connected to each other by forming a force of adhesion and by the parts to be joined being arranged in such a way that they are tilted at a predetermined tilting angle with respect to the normal plane, at least during the melting of the solder paste. The tilting angle during the melting should lie between greater than 0° and less than 180° and preferably be about 90°.

Abstract: A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second balls; disposing the wire on a substrate so that the first and second balls of solder contact a single conductor on the substrate; and melting the first and second balls of solder and flux and soldering the wire to the conductor.

Abstract: A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both surfaces, a filler alloy layer comprised of an Al—Si-based alloy and contains Mg incorporated at least in a constituent layer except the filler alloy layer, thereby to form a hollow structure whose one surface clad with the filler alloy is the inner surface, wherein the brazing is carried out in an inert gas atmosphere without applying any flux; and an aluminum alloy brazing sheet which satisfies the relationship: (X+Y)?a/60+0.5 and X>Y, wherein a (?m) represents the thickness of the filler alloy layer clad on the core material of the inner side of the hollow structure, and X and Y (mass %) represent the Mg contents of the core material and the brazing material, respectively.

Abstract: Fluxing agents comprising potassium fluorostannate and/or cesium fluorostannate which can be used for brazing or soldering components of aluminum or of an aluminum alloy, even by solderless brazing or soldering. Conventional fluxing agents or other fluorometallates, such as alkali metal fluorozincates and/or alkali metal fluorosilicates, can also be added to the fluorostannate-containing fluxing agent. The fluxing agents of the invention can be applied by either dry or wet fluxing methods.

Abstract: In a method of making finned tubes as components of air-cooled systems or condensers, a sheet metal strip of aluminum is first shaped into a waved finned structure with plural fins in parallel relationship and arched ends for connecting the fins, thereby defining crests on opposite ends of the finned structure. A fluxing agent of cesium-aluminum tetrafluoride is applied in lines onto the crests on at least one of the ends of the finned structure. The finned structure is then placed upon a broad side of a flat steel tube coated with a zinc/aluminum alloy. The finned structure and the flat tube are subsequently joined in a brazing furnace in the presence of an inert gas at a temperature between 370° C. and 470° C. to produce a unitary structure which is then allowed to cool down at room temperature.

Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.

Abstract: One method of the present invention includes applying a paste-like fluxing agent to an aluminum body part; heating the fluxing agent to deoxidize the surface of the aluminum body part; applying a solder filler to the aluminum body part; and heating the solder filler to bond the solder filler to the aluminum body part. The melting point of the solder filler is at least 100 degrees C. lower than the melting point of the aluminum body part. Another method includes forming a filler/flux mixture; applying the filler/flux mixture; and heating the filler/flux mixture to bond the solder filler to the aluminum body part. The disclosed solder fillers include tin-based alloys as follows: (1) 12-22% copper, 3-5% zinc and 75-85% tin; and (2) 3-5% copper, iron, cobalt, or nickel, 12-40% zinc and 55-85% tin and zinc-based solder filler alloys composed of 78-98% zinc and 2-22% aluminum.

Abstract: A method for manufacturing a metallic component comprises the steps of assembling different metallic parts of said component, and subsequently fixing the assembled parts by heat treatment. According to the invention, said heat treatment includes the steps of placing the assembled parts in an adapted enclosure, associating heater means with said assembled parts, and subsequently switching on said heating means within said enclosure in order to heat said assembled parts to a predetermined temperature at which mechanical fixing of said assembled parts occurs. The method is preferably used in the manufacturing of heat exchangers.

Abstract: The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.

Abstract: The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

Abstract: A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the active ingredients are disposed primarily in the first phase and the carrier is disposed primarily in the second phase. The use of this solder flux composition is found to reduce solder migration, during solder reflow, that can result in bridging in ball grid arrays and other such devices.

Abstract: A novel process and apparatus for manufacturing Solid Solder Deposit-Printed Circuit Board (SSD-PCB) by either melting solder paste or dry solder powder previously deposited on a pocketed-PCB 20. Said process and apparatus, unlike the prior art, utilize as heat source an electrically heated conveyor wire mesh 76 instead of a reflow oven. Relatively thick flat-shaped SSDs 44 metallurgically bonded over each soldering pad 24 of said pocketed-PCB 20 are formed. By itself, SSD-PCB technology provides the electronic assembly industry with ready-to-solder PCBs consequently eliminating the need to use solder paste at the assembly line. This invention, unlike the prior art for producing SSD-PCBs, can utilize dry solder powder piles 38 in conjunction with flux layers 116 deposited on top of said conveyor wire mesh 76 thereby excluding, all together, the use of paste printing equipment.

Abstract: Fluoride-based flux is uniformly dispersed in and mixed with synthetic resin, which has fluidity at room temperature and sublimes at a temperature lower than a brazing temperature, so as to constitute 40 to 70 wt. % of the mixture, thereby producing coating material. This coating material is applied to coating belts which undergo rotation and is transferred from the coating belts to the surface of the aluminum material. The coating material has high viscosity and stably adheres to the transferred areas.