Abstract: A laminate structure and a method used in the manufacturing of flexible electronics or microelectronic devices are provided. The laminate structure comprises a rigid substrate, a flexible microelectronics structure comprising and a debonding structure provided between the rigid substrate and the flexible microelectronics structure. The debonding structure comprises at least one debonding layer made of a non-metallic inorganic material. The laminate structure comprises first and second peeling surfaces, where at least one of the peeling surfaces corresponding to a surface of the debonding structure or to a surface within the debonding structure. The first and second peeling surfaces are peelable by a debonding force resulting from a mechanical delamination and/or from a pressurized fluid delamination, allowing separating the flexible microelectronic device from the rigid substrate.

Abstract: A ceramic bonded body of the disclosure includes a first silicon carbide ceramics, a second silicon carbide ceramics, and a bonding layer positioned between the first silicon carbide ceramics and the second silicon carbide ceramics. The bonding layer contains 25 mass % or more metallic silicon, and 25 mass % or more silicon carbide assuming all components constituting the bonding layer as 100 mass %, and a total of the metallic silicon and the silicon carbide is 75 mass % or more, and the bonding layer further contains at least one of nickel silicide and chromium silicide.

Abstract: In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit.

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.

Abstract: A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.

Abstract: An annealed platinum free air ball is bonded to a first contact and to a second contact. The bonding work hardens the platinum so that a work hardened platinum ball is resistant to temperature induced creep.

Abstract: The present invention is a low heat energy input repair system. The system utilizes a V-shaped feedstock that conforms to the shape of grooves in damaged parts. The V-shape of the feedstock conforms closely to the damaged region of various components and reduces the heat input needed to bond the surfaces. The repair system is deployable onsite, at a military depot, industrial manufacturing facility or other location where a mobile repair system would be beneficial. The present system provides onsite, in-situ, low heat input repair of wear, fatigue and corrosion cracks, or impact surface damage of large components. The present invention is particularly useful for components with thin walls and results in low distortion.

Abstract: Method for assembling at least two pieces of silicon carbide based materials by non reactive refractory brazing, wherein these pieces are put into contact with a non reactive brazing solder composition and the assembly formed by the pieces and the brazing solder composition is heated to a brazing temperature sufficient to fuse the brazing solder composition in order to form a refractory joint, in which the non reactive brazing solder composition is constituted, in atomic percentages, of from 40 to 97% silicon and of from 60 to 3% of another element chosen in the group consisting of chromium, rhenium, vanadium, ruthenium, iridium, rhodium, palladium, cobalt, platinum, cerium and zirconium and wherein, before brazing, a strengthening agent of SiC and/or C is added. Brazing solder composition, composition for refractory brazing. Refractory joint and assembly obtained by the method.

Abstract: Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt or soften the joining material, which upon cooling will form a strong bond, joining two or more bulk materials.

Abstract: A system and method of joining together first and second electric terminals includes providing the second terminal with an aperture extending therethrough and a notch therein. The first and second terminals are positioned in overlapping relationship with one another so the aperture overlaps the first terminal to provide access to the first terminal through the second terminal, and so the notch overlaps the first terminal. Heat is applied to the first terminal through the aperture in the second terminal to heat the first and second terminals. The end of a solder wire is positioned in engagement with the notch of the heated second terminal to locate the solder wire with respect to the terminals and to melt the solder wire to form a solder pool that contacts the first and second terminals.

Abstract: An apparatus for dispensing solder accurately onto a prescribed surface of a substrate including a feeding mechanism for dispensing the solid solder and a dispensing piece with a feeding channel. The positioning device has a front opening that is adapted for direct contact with the prescribed surface during the dispensing operation to form an enclosed cavity. The back opening couples the positioning device to the dispensing end of said dispensing piece such that during the dispensing operation the solder solid may be dispensed from the feeding channel through the cavity and onto the prescribed surface. The dispensing piece is maintained at a temperature below the melting temperature of the solder material such that the solder material stays in a solid state until it is in contact with the prescribed surface.

Abstract: An apparatus (105) and method are provided for feeding wire (135) to a tip (120) of a torch (115) in a welding system (100). The apparatus (105) includes a drive mechanism (150) attached to the torch (115), and a guide assembly (155) attached to the drive mechanism. The guide assembly (155) includes a bracket (180) by which it is attached to the drive mechanism (150), a wire guide (185) through which the wire (135) is passed, and first and second adjustors (270A, 270B) to position the wire guide relative to the tip (120). The guide assembly (155) is configured to pass the wire (135) in a straight line from the drive mechanism (150) to the tip (120). In one embodiment, the adjustors (270A, 270B) include gimbals (275) supporting the wire guide (185). Each gimbal (275) is attached to a screw (280) passing through an opening in an arm (285) projecting from the bracket (180) of the guide assembly (155).

Abstract: The invention relates to a brazing sheet product comprising a core sheet made of an aluminum alloy, an aluminum clad layer cladding at least one of the surfaces of said core sheet, and a layer comprising nickel on the outersurface of one or both said clad layer or layers, and wherein the brazing sheet product is devoid of a layer comprising zinc or tin as a bonding layer between said outersurface of said aluminum clad layer or layers and said layer comprising nickel, and wherein the aluminum clad alloy layer comprises, in weight percent: Si 2 to 18, Mg up to 8.0, Zn up to 5.0, Cu up to 5.0, Mn up to 0.30, In up to 0.30, Fe up to 0.80, Sr up to 0.20, at least one element selected from the group consisting of: (Bi 0.01 to 1.0, Pb 0.01 to 1.0, Li 0.01 to 1.0, Sb 0.01 to 1.0), impurities each up to 0.05, total up to 0.20, balance aluminum.

Abstract: The present invention describes the precise metering of soldering material realized in a preferred desktop preferably portable device designated for hand-soldering in small and medium volume operations. It combines the fully automated process of precise metering of the soldering wire for high accuracy and quality soldering with the freedom of a hand-operated soldering process.

Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.

Abstract: Method for assembling at least two pieces of silicon carbide based materials by non reactive refractory brazing, wherein these pieces are put into contact with a non reactive brazing solder composition and the assembly formed by the pieces and the brazing solder composition is heated to a brazing temperature sufficient to fuse the brazing solder composition in order to form a refractory joint, in which the non reactive brazing solder composition is constituted, in atomic percentages, of from 40 to 97% silicon and of from 60 to 3% of another element chosen in the group consisting of chromium, rhenium, vanadium, ruthenium, iridium, rhodium, palladium, cobalt, platinum, cerium and zirconium and wherein, before brazing, a strengthening agent of SiC and/or C is added.

Abstract: The present invention (FIG. 1) relates to a new method for brazing a connecting piece of electrically conducting material, for example of metal, to a metal surface by means of a new type of temperature-controlled brazing whereby for certain types of material, for example steel, a martensite-free brazing is obtained, i.e. a brazing without deleterious structural changes (martensite formation). A brazing is obtained that is completely free of martensite underneath the brazed joint in for example railway track and/or pipework. The invention also relates to an arrangement for carrying out the said method.

Abstract: The invention relates to a hermetic optical fiber feedthrough or connector, and a method of hermetically sealing an optical fiber at low temperature. The method involves stripping a portion of the buffer layer of an optical fiber. The stripped portion of the fiber is inserted into a ferrule having a high coefficient of thermal expansion closely matching that of a low melt temperature solder. The ferrule is heated to melt the solder, the stripped portion of the fiber is then directly soldered into the ferrule. Upon cooling the solder and ferrule cool and shrink relatively uniformly thereby forming a compressive hermetic solder joint surrounding the stripped fiber. An epoxy may be inserted into an aperture formed in the ferrule. The epoxy forms a seal around the hermetic solder joint and bonds with the stripped fiber to improve the tolerance of the hermetic seal to mechanical deformation and increases the pull strength of the seal. Advantageously, the optical properties are not altered by the process.

Abstract: The invention relates to a brazing sheet product comprising a core sheet made of an aluminum alloy, an aluminum clad layer cladding at least one of the surfaces of said core sheet, and a layer comprising nickel on the outersurface of one or both said clad layer or layers, and wherein the brazing sheet product is devoid of a layer comprising zinc or tin as a bonding layer between said outersurface of said aluminum clad layer or layers and said layer comprising nickel, and wherein the aluminum clad alloy layer comprises, in weight percent: Si 2 to 18, Mg up to 8.0, Zn up to 5.0, Cu up to 5.0, Mn up to 0.30, In up to 0.30, Fe up to 0.80, Sr up to 0.20, at least one element selected from the group consisting of: (Bi 0.01 to 1.0, Pb 0.01 to 1.0, Li 0.01 to 1.0, Sb 0.01 to 1.0), impurities each up to 0.05, total up to 0.20, balance aluminum.

Abstract: A self-brazing material 10 for use in a heat exchanger 50 using a corrosive heat exchanger fluid is manufactured by providing a first substrate layer 10 and a second layer 12 metallurgically bonding the two layers together to form a composite material 22. This second layer 12 is made of a material chosen from a group consisting of materials capable of having good high temperature and corrosive properties, and melting at a temperature well below that of the first material 10. The bonded material 22 is then reacted so as to render the second layer 12 a brazing layer for the first substitute layer 10 with excellent high temperature and corrosive properties.

Abstract: Hydraulic piston pumps and motors are used in various applications to power implements, steering, propel, and auxiliary systems. However, it is important to keep the piston weight and compressible fluid volume low in order to have a smaller more efficient pump. The subject piston is manufactured in a simple manner to achieve a reliable, light weight design. The piston has a cylindrical body having an outer surface. The piston is manufactured by forming a first bore having a large diameter in the body extending from the outer surface and terminating at an annular shoulder. A second bore is formed which extends from the annular shoulder to a predetermined depth. A tube is inserted through the bore and extends a predetermined distance into the second bore. A cap has a bore and is positioned on the body in abutment with at least a portion of the outer surface. The cap slidably receives the tube through the bore.

Abstract: To splice two metal tapes by means of a solder wire that is thicker than the tapes themselves, their terminal edges are positioned upon one electrode, a spacing shim is inserted upon one of the tapes, another electrode is lowered onto the shim, the wire is inserted into the channel formed by the tape and shim edges and the electrodes, the shim is withdrawn to lower the upper electrode down upon the solder, and the latter is then fused.

Abstract: Means and method are presented for butt-splicing two metal tapes by confining molten solder between two carbon electrodes while the tape edges are moved together.

Abstract: A method of manufacturing a vent element having vent pores extending therethrough in parallel with the axial direction for use in die casting, rubber and plastic molding, metering and supplying of fluids, a ball-point pen and others. The method comprises winding one or more wire rods consisting of metal, ceramics or a compound material thereof having a melting point higher than that of a core rod in the form of a single or plural layer spirally around the core rod to form a secondary wire rod, heating the secondary wire rod or a bundle of a plurality of the secondary wire rods to a temperature which exceeds the melting point of the core rod but does not melt the wire rod so as to melt the core rod, whereby the melt is infiltrated into the interspaces between the wire rods and/or the windings of the wire rod to form one pore at every position where the core rod was.

Abstract: A continuous strip of brazing foil is partially folded about transverse parallel fold lines in a repetitive pattern. When this strip is positioned between the nodes of honeycomb cells the fold lines will index the cells into proper alignment for assembly. The brazing strip also serves its normal function of providing brazing material for attaching the assembly to other components.

Abstract: A solder delivery system has a continuous element of solder material adjacent to at least one polymeric layer, which is provided with window means to control the flow of solder. The layers, if there are more than one, may be separate pieces, or may be parts of a folded sheet or a tube of polymeric material. In use, the conductors to be soldered are placed adjacent to corresponding terminals of a substrate and the system placed in contact with and perpendicular to the conductors, with the window means towards the conductors. On the application of heat and pressure, the solder melts and flows toward the terminals, and solder bridges are prevented by the "window frames" which lie between the terminals.

Abstract: The present invention is directed to a method of fabricating heat exchanger tubes in which twisted tapes are utilized for promoting turbulence and heat transfer. The method of the present invention provides for the brazing of the tapes to the inner walls of the tubes for enhancing heat transfer between the fluid within the conduit and a fluid medium outside of the conduit by conduction through the tape. The braze joint of the present invention is coextensive with the tape over the entire length thereof within the conduit. The practice of the present invention is achieved by placing a filler wire of brazing metal along the tape at a location removed from the side walls and then heating the conduit and tape sufficiently to effect the displacement of the filler metal by wicking to the contact point between the tape and the conduit wall to form a braze joint coextensive with the length of the tape within the conduit.

Abstract: Solder wire attached along its length to a base metal by a small quantity of solder melted at the solder-base metal juncture.

Abstract: A solder delivery system has a continuous element of solder material disposed between two polymeric layers, one of which is provided with window means to control the flow of solder. The layers may be separate pieces, or may be parts of a folded sheet or a tube of polymeric material. In use, the conductors to be soldered are placed on corresponding terminals of a connector body and the system placed in contact with and perpendicular to the conductors, with the side having the window means towards the conductors. On the application of heat and pressure, the solder melts and flows toward the terminals, and solder bridges are prevented by the "window frames" which lie between the terminals.

Abstract: To permit direct bonding of a composite electric contact-and-bonding material to a carrier, such as a reed, magnetic strip, or the like, by thermo-electric heating, the side of the contact-and-bonding material is formed with projections, preferably projecting ridges, ribs, or beads, and a bonding or solder material in wire form is adhered, by rolling on to the valley between the projecting ridges, the bonding or soldering material leaving space free between adjacent ridges or ribs and not filling the entire recess, but projecting outwardly at least as far as the projections or ridges, and preferably slightly therebeyond. The soldering or bonding wire may have round or polygonal, preferably triangular cross section with a pointed tip extending outwardly to provide for concentration of heat upon resistance heating the contact material against the carrier strip.

Abstract: A method and apparatus for soldering terminals to printed circuit boards, and particularly for soldering terminals simultaneously to both sides of a printed circuit board. The apparatus consists of a connected series of preformed cones of solder which are positioned above holes in the circuit board, and through which terminals to be heated are inserted. The solder flows through the hole by capillary action, and provides electrical connection between the terminal and conduction paths on both sides of the circuit board.