Preplacing Solid Filler Patents (Class 228/245)
  • Patent number: 10438922
    Abstract: A method for mounting components on a substrate is provided. The method includes providing a positioning plate which has a plurality of through holes. The method further includes supplying components each having a longitudinal portion on the positioning plate. The method also includes performing a component alignment process to put the longitudinal portions of the components in the through holes. In addition, the method includes connecting a substrate to the components which have their longitudinal portions in the through holes and removing the positioning plate.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: October 8, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Ling Hwang, Hsin-Hung Liao, Yu-Ting Chiu, Ching-Hua Hsieh
  • Patent number: 10081068
    Abstract: The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to an application opening (37) of an application nozzle (36) of the application device into an application position P3, wherein a first detector device (69) for triggering a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device and a second detector device (80) for locating the solder mat
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: September 25, 2018
    Assignee: PAC TECH—PACKAGING TECHNOLOGIES GMBH
    Inventor: Ghassem Azdasht
  • Patent number: 10016833
    Abstract: An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: July 10, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok-Yong Lee, Yo-Se Eum, Tea-Seog Um, Kyoung-Bok Cho, Jeong-Jin Lee
  • Patent number: 10015988
    Abstract: A coupling unit and method for inserting a support fitted with a hygroscopic pad in a base during the manufacture of a disposable cartridge for an electronic cigarette; are provided: a first seat that accepts the support fitted with the hygroscopic pad; a second seat that accepts the base and can be axially aligned with the first seat; a transfer device that inserts the support fitted with the hygroscopic pad in the base by applying a relative axial movement between the support fitted with the hygroscopic pad and the base; and a suction device, which is coupled to a first end of the base opposite to a second end of the base through which the support fitted with the hygroscopic pad enters, and causes suction that acts inside the base.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: July 10, 2018
    Assignee: G.D SOCIETA' PER AZIONI
    Inventors: Andrea Grimandi, Enrico Medina, Luca Lanzarini, Massimo Sartoni
  • Patent number: 9953944
    Abstract: A power module is disclosed, including a power module substrate in which a circuit layer is arranged on one surface of an insulating layer; and a semiconductor element that is bonded onto the circuit layer, in which a copper layer composed of copper or a copper alloy is provided on a surface of the circuit layer to be bonded to the semiconductor element, a solder layer formed by using a solder material between the circuit layer and the semiconductor element is provided, an alloy layer containing Sn as a main component, 0.5% by mass or more and 10% by mass or less of Ni, and 30% by mass or more and 40% by mass or less of Cu at an interface of the solder layer with the circuit layer is formed, and the coverage of the alloy layer at the interface is 85% or more.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: April 24, 2018
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toyo Ohashi, Yoshiyuki Nagatomo
  • Patent number: 9802273
    Abstract: A first layer (11) and a second layer (12) are layered with an intermediate layer (21) therebetween. A clad material (1) is manufactured by heating and bonding the layered body at a temperature, at which the ratio of the mass of a liquid phase generated from the intermediate layer (21) is 5% or more and 35% or less, and by rolling the body. The clad material may comprise the clad material (1) which is a two-layer material formed of the first layer (11) and the second layer (12) as described above, as well as a third layer, a fourth layer, a fifth layer, and the like.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 31, 2017
    Assignee: UACJ CORPORATION
    Inventors: Kazuko Fujita, Takashi Murase, Akio Niikura
  • Patent number: 9751147
    Abstract: A fixture may include a plurality of alloy pressure pads shaped to contact a component to be brazed or diffusion bonded, a plurality of springs, and at least one alloy support. In some examples, each spring of the plurality of springs is shaped to have a substantially constant stress throughout the spring. The plurality of springs may be between and contacting the at least one alloy support and the plurality of alloy pressure pads to exert spring forces on the plurality of alloy pressure pads. In some examples, the plurality of springs include a plurality of silicon nitride springs.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: September 5, 2017
    Assignee: Rolls-Royce Corporation
    Inventors: Jeffrey F. Rhodes, Christopher Owen Nash, Rusty M. Garner
  • Patent number: 9706652
    Abstract: A printed circuit board according the present embodiment includes an insulating layer; at least one circuit pattern or pad formed on the insulating layer; a solder resist having an opening section exposing the upper surface of the pad and formed on the insulating layer and a bump formed on the pad exposed through the opening section of the solder resist and having a lower area narrower than the upper area.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: July 11, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Wuk Ryu, Seong Bo Shim, Seung Yul Shin
  • Patent number: 9263329
    Abstract: A method of fabricating an electronic package. The method includes filling a mold with an electric conductor to form a number of electrical interconnects within the mold. The mold includes openings that are filled with several electric conductors to form a number of electrical interconnects. The method of fabricating an electronic package further includes attaching the mold to a substrate such that the electrical interconnects engage electrical contacts on the substrate. The method of fabricating an electronic package may further include forming conductive pads on the electrical insulator that engage the electrical interconnects and attaching a die to the substrate such that the die is electrically connected to at least some of the electrical interconnects.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: February 16, 2016
    Assignee: Intel Corporation
    Inventors: Chia-Pin Chiu, Kinya Ichikawa, Yoshihiro Tomita, Robert L. Sankman, Eric Li
  • Patent number: 9120170
    Abstract: An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: September 1, 2015
    Assignee: Zen Voce Corporation
    Inventor: Tu-Chen Lee
  • Publication number: 20150129564
    Abstract: A method of brazing including melting a surface region (26) of a substrate (12, 14, 22) and contacting a braze material (10) with the melted surface region, the braze material including a plurality of braze fillers (16) and a plurality of carbon structures (18). The method further includes subjecting the braze material to an amount of energy effective to melt the braze fillers but not the carbon structures, and cooling the braze material to form a brazement (28, 32) including the carbon structures within at least a portion of the substrate. The brazement includes a gradient (30) of the carbon structures, wherein a concentration of the carbon structures increases in a direction away from an interior of the substrate.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 14, 2015
    Inventors: Kai Kadau, Michael Clossen-von Lanken Schulz
  • Patent number: 9004343
    Abstract: In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: April 14, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyuki Inoue, Tadayoshi Ohtashiro
  • Patent number: 8967453
    Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: March 3, 2015
    Assignee: GM Global Technology Operations LLC
    Inventors: Khiet Le, Vicentiu Grosu, Gregory S. Smith, Yunqi Zheng, Gregory D. Rosdahl
  • Patent number: 8960523
    Abstract: When a friction stir weld tool penetrates the interface of two workpieces of dissimilar metal alloy materials, the resultant weld of the different alloy materials may produce a weak weld joint. Such weak joints are often experienced, for example, when attempting to form spot welds or other friction stir welds between a magnesium alloy sheet or strip and an aluminum alloy sheet or strip. It is discovered that suitable coating compositions including an adhesive placed at the interface of assembled workpieces can alter the composition of the friction stir weld material and strengthen the resulting bond. In the example of friction stir welds between magnesium alloy and aluminum alloy workpieces, it is found that combinations of an adhesive with copper, tin, zinc, and/or other powders can strengthen the magnesium-containing and aluminum-containing friction stir weld material.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: February 24, 2015
    Assignee: GM Global Technology Operations LLC
    Inventors: Robert T. Szymanski, Sri Krishna Chimbli, Mark T. Hall, Yen-Lung Chen
  • Patent number: 8960526
    Abstract: There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1% and 9% by volume based on a volume of the flux.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: February 24, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tadashi Maeda, Tadahiko Sakai
  • Publication number: 20150035137
    Abstract: There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member.
    Type: Application
    Filed: February 14, 2013
    Publication date: February 5, 2015
    Inventors: Shuji Nishimoto, Kimihito Nishikawa, Yoshiyuki Nagatomo
  • Patent number: 8944309
    Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: February 3, 2015
    Assignee: The Regents of The University of Michigan
    Inventors: Stephen R. Forrest, Gregory McGraw
  • Patent number: 8939347
    Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: January 27, 2015
    Assignee: Intel Corporation
    Inventors: Rajasekaran Swaminathan, Ravindranath V. Mahajan
  • Patent number: 8925792
    Abstract: A method of bonding superalloys is provided. The method includes: aligning a first superalloy subcomponent having a gamma-prime solvus g?1 and a second superalloy subcomponent having a gamma-prime solvus g?2, with a filler material that includes at least 1.5 wt % boron disposed between the first and second superalloy subcomponents; performing a first heat treatment at a temperature T1, where T1 is above the solidus of the filler material and below the liquidus of the filler material; and performing a second heat treatment at a temperature T2, where T2 is greater than T1, and where T2 is greater than or equal to the lower of g?1 and g?2.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: January 6, 2015
    Assignee: General Electric Company
    Inventors: Akane Suzuki, Jeffrey Jon Schoonover, David Austin Wark
  • Patent number: 8925793
    Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: January 6, 2015
    Assignee: DunAn Microstaq, Inc.
    Inventors: Parthiban Arunasalam, Siddharth Bhopte, Joe Albert Ojeda, Sr.
  • Patent number: 8925789
    Abstract: A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: January 6, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt
  • Patent number: 8919634
    Abstract: A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XY? stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: December 30, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Akio Igarashi, Hirokuni Kurihara, Ryosuke Mizutori
  • Publication number: 20140348571
    Abstract: Provided in one embodiment is a method of joining one or more articles together using pressurized fluid to deform a bulk-solidifying amorphous alloy material and form a mechanical interlock between the respective surfaces joined together.
    Type: Application
    Filed: October 21, 2011
    Publication date: November 27, 2014
    Inventors: Christopher D. Prest, Joseph C. Poole, Matthew S. Scott, Dermot J. Stratton, Stephen P. Zadesky, Richard W. Heley
  • Patent number: 8894780
    Abstract: Disclosed are a braze, such as a braze in the form of an amorphous, ductile brazing foil, having a composition consisting essentially of FeaNirestSibBcMd with 5 atomic percent?a?35 atomic percent, 1 atomic percent?b?15 atomic percent, 5 atomic percent<c?15 atomic percent, 0?d?4 atomic percent, rest Ni and incidental impurities, wherein M is one or more of the elements Co, Cr, Mn, Nb, Mo, Ta, Cu, Ag, Pd or C, and having a liquidus temperature TL?1025° C. Also disclosed are apparatus containing parts joined by said braze, methods for using said braze, and methods for making said amorphous, ductile brazing foil.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: November 25, 2014
    Assignee: Vacuumschmelze GmbH & Co. KG
    Inventors: Dieter Nuetzel, Thomas Hartmann
  • Patent number: 8881967
    Abstract: An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: November 11, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Yuhsuke Matsumoto, Tatsumi Tsuchiya, Eiki Oosawa, Tatsushi Yoshida
  • Publication number: 20140284375
    Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.
    Type: Application
    Filed: January 27, 2014
    Publication date: September 25, 2014
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Warren M. Farnworth, Rickie C. Lake, William M. Hiatt
  • Patent number: 8841576
    Abstract: A method for producing a metal sheet with a welded-on tube which has at least partially curved sections, wherein the tube is guided by at least one guide element onto the sheet, is pressed thereon with at least one pressure element and is welded thereto at least at some points and wherein the tube is bent to form the curved sections. In order to achieve the welding-on in a simple manner even in the curved sections, it is provided that a bending is carried out in a plurality of discrete steps, wherein in individual steps firstly the tube with the at least one guide element is bent around a last created welding point and thereafter a new welding point is created. Furthermore, the invention relates to a device for carrying out the method.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: September 23, 2014
    Assignee: DTEC GmbH
    Inventors: Michael Dietl, Arnold Teufel
  • Publication number: 20140256462
    Abstract: Some embodiments include a reinforced face of a club head. Other embodiments for related reinforced faces of club heads and related methods are also disclosed.
    Type: Application
    Filed: May 20, 2014
    Publication date: September 11, 2014
    Inventors: Eric V. Cole, Eric J. Morales
  • Patent number: 8807416
    Abstract: A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: August 19, 2014
    Assignee: Denso Corporation
    Inventors: Takuji Sukekawa, Hiroyuki Yamada, Noriyasu Inomata
  • Patent number: 8789743
    Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: July 29, 2014
    Assignee: Component Re-Engineering Company, Inc.
    Inventors: Alfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veytser
  • Patent number: 8763881
    Abstract: A method for applying a wear reducing material to a tool used in a wellbore operation that includes welding a hardfacing alloy to a surface of the tool, wherein the welding comprises friction stirring the alloy into the tool's surface is disclosed. Methods of welding a preformed sleeve or width of wear reducing material using friction stirring are also disclosed.
    Type: Grant
    Filed: August 14, 2009
    Date of Patent: July 1, 2014
    Assignee: Smith International, Inc.
    Inventors: Madapusi K. Keshavan, Russell J Steel, Cary A. Roth, Shelton W. Alsup
  • Patent number: 8746538
    Abstract: A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: June 10, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Aya Muto, Masayoshi Shinkai
  • Patent number: 8740046
    Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: June 3, 2014
    Assignee: Wistron Corporation
    Inventors: Hao-Chun Hsieh, Chia-Hsien Lee
  • Patent number: 8733620
    Abstract: A solder is deposited on a heat sink. The solder is first reflowed at a first temperature that is below about 120° C. The solder is second heat aged at a temperature that causes the first reflowed solder to have an increased second reflow temperature. The heat aging process results in less compressive stress in a die that uses the solder as a thermal interface material. The solder can have a composition that reflows and adheres to the die and the heat sink without the use of organic fluxes.
    Type: Grant
    Filed: December 8, 2005
    Date of Patent: May 27, 2014
    Assignee: Intel Corporation
    Inventors: Mukul Renavikar, Susheel G. Jadhav
  • Publication number: 20140126956
    Abstract: A solder joint structure includes a metal pin in the shape of a prism or a circular or substantially circular cylinder; an aluminum wire including a wound portion wound around the metal pin; and a solder layer arranged to join the metal pin and at least one portion of the wound portion to each other. The at least one portion of the wound portion includes a deformed surface resulting from a partial disappearance or elimination of the aluminum wire in a cross-section perpendicular or substantially perpendicular to a direction in which the aluminum wire extends, and the solder layer is directly and closely adhered to the deformed surface.
    Type: Application
    Filed: September 12, 2013
    Publication date: May 8, 2014
    Applicant: NIDEC CORPORATION
    Inventor: Tomoyoshi YOKOGAWA
  • Patent number: 8701973
    Abstract: A method of forming solder bumps on electrodes of a circuit board without producing bridging using a solder transfer sheet which does not require alignment includes superposing a circuit board and a solder transfer sheet having a solder layer adhered to at least one side of a supporting substrate, performing heating under pressure to a temperature lower than the solidus temperature of the solder to selectively perform solid phase diffusion bonding of the solder layer to electrodes, and peeling the transfer sheet from the circuit board. The solder layer is in the form of a continuous solder coating or in the form of a monoparticle layer of solder particles which are adhered to the supporting substrate by an adhesive layer.
    Type: Grant
    Filed: February 15, 2010
    Date of Patent: April 22, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takeo Kuramoto, Kaichi Tsuruta, Takeo Saitou
  • Patent number: 8690041
    Abstract: A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: April 8, 2014
    Assignee: Wistron Corporation
    Inventors: Hao-Chun Hsieh, Chia-Hsien Lee
  • Patent number: 8684256
    Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: April 1, 2014
    Assignee: Component Re-Engineering Company, Inc.
    Inventors: Alfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veyster
  • Patent number: 8678271
    Abstract: In one disclosed embodiment, the present method for preventing void formation in a solder joint formed between two metallic surfaces includes forming at least one slit in a layer of solder to form a slit solder layer, positioning the slit solder layer between the two metallic surfaces, and heating the slit solder layer to form the solder joint, wherein the at least one slit forms an outgas alley to prevent void formation in the solder joint. Where solder joint width is a concern, the present method includes applying external pressure concurrently with heating. The outgas alley is formed to provide a ready avenue of escape for flux gasses produced during formation of the solder joint.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: March 25, 2014
    Assignee: GLOBALFOUNDRIES Inc.
    Inventor: Phanit Tameerug
  • Patent number: 8662377
    Abstract: A method for securing electronic components, in particular power semiconductor components such as diodes, transistors or thyristors, and connection elements, to a substrate by pressure sintering. The method includes: applying a pastelike layer, made up of a metal powder and a solvent, to a supporting film; drying the pastelike layer; applying at least one component to the dried layer; subjecting the at least one component, the supporting film and the dried layer to pressure, as a result of which the adhesive force between the layer and the component becomes greater than that between the layer and the supporting film; lifting off the at least one component, with the layer adhering to it, from the supporting film; positioning the component, with the layer adhering to it, to the substrate; and subjecting the substrate and the component to pressure, for connecting them by sintering.
    Type: Grant
    Filed: April 22, 2005
    Date of Patent: March 4, 2014
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventor: Gerhard Palm
  • Patent number: 8663438
    Abstract: The invention relates to a target arrangement comprising a tubular-shaped carrier element and a hollow-cylindrical target having at least one target material, said target comprising at least one one-piece tube segment which at least partially surrounds the carrier element. Said carrier element and the tube segment are partially interconnected in a material fit by at least two plastically deformable compensating means. The invention also relates to a method for producing said type of target arrangement and a tubular segment.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: March 4, 2014
    Assignee: GFE Fremat GmbH
    Inventors: Grit Hüttl, Folke Steinert, Joachim Wagner
  • Patent number: 8651362
    Abstract: A braze joint is made between two workpieces by first forming a thermal shrink fit region between the two workpieces adjacent to, or around, a braze or filler region in which a filler metal is located adjacent to, or within. The filler metal is suitably heated so that it flows in the braze or filler region to form the braze joint of the two workpieces. Cutouts may be formed in the thermal shrink fit region adjacent to the braze or filler region to extend the braze joint region or provide paths for gas byproducts in the brazing process.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: February 18, 2014
    Assignee: Radyne Corporation
    Inventor: John Justin Mortimer
  • Patent number: 8637994
    Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: January 28, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Rick C. Lake, William M. Hiatt
  • Publication number: 20140016253
    Abstract: A sealing material includes a metallic glass
    Type: Application
    Filed: July 15, 2013
    Publication date: January 16, 2014
    Inventors: Eun Sung LEE, Se Yun KIM, Jin Man Park, Young Hwan KIM, Suk Jun KIM, Sang Soo JEE, Sang Mock LEE, In Taek HAN
  • Publication number: 20130292457
    Abstract: Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability.
    Type: Application
    Filed: July 20, 2012
    Publication date: November 7, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Jung Lee, Young Ju Lee, Yun Bog Kim, Seon Young Myoung, Suk Jin Ham, Seong Chan Park
  • Patent number: 8561879
    Abstract: Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: October 22, 2013
    Assignee: Apple Inc.
    Inventors: Eric S. Jol, Mathias W. Schmidt, Edward Siahaan, Albert J. Golko
  • Publication number: 20130248585
    Abstract: A brazing method includes the steps of providing a first part and a second part, at least a first portion of the first part configured to fit inside a second portion of the second part, preplacing a non-self-fluxing braze alloy on one or more of the first portion and the second portion, thermally treating at least one of the first portion and the second portion, to create a temperature differential between the first portion and the second portion, inserting the first portion into the second portion, and heating at least one of the first portion and the second portion to melt the non-self-fluxing braze alloy. The first portion is joined by brazing to the second portion.
    Type: Application
    Filed: March 23, 2012
    Publication date: September 26, 2013
    Inventors: Kurt Allen Rakozy, Jeffrey Michael Breznak, Andrew Batton Witney
  • Patent number: 8516692
    Abstract: A solder layer, a substrate for device joining utilizing the same and a method of manufacturing the substrate are provided whereby the device joined remains thermally unaffected, an initial bonding strength in solder joint is enhanced and the device can be soldered reliably. The solder layer formed on a base substrate (2) consists of a plurality of layers (5a) of a solder free from lead, which are different in its phase from one another. They are constituted by a layer of a phase that is completely melted, and a layer of a phase that is not completely melted at a temperature not less than a eutectic temperature of the solder. The solder layer (5) can be applied to a device joining substrate (1) comprising an electrode layer (4) formed on the base substrate (2) and the solder layer (5) formed on the electrode layer.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: August 27, 2013
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Yoshikazu Oshika, Munenori Hashimoto, Masayuki Nakano
  • Patent number: 8514030
    Abstract: Provided are an oven controlled crystal oscillator in which in a case where a metal lead is soldered to a substrate, even if cracks occur in the solder, its reliability is not reduced, and a production method. That is, an oven controlled crystal oscillator in which pre-tinning solders are formed around openings on a front surface and a rear surface of a substrate in which of a through hole for passing a metal lead therethrough is formed; and in a state where a metal lead including a solder layer (a pre-tinning solder) formed on its surface is inserted into the through hole of the substrate, the metal lead extending from the openings is soldered to the openings on the front surface and the rear surface of the substrate, so as to form a main solder, and a production method of the oven controlled crystal oscillator are provided.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: August 20, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd
    Inventors: Daisuke Nishiyama, Hiroyuki Murakoshi, Kenji Kasahara
  • Publication number: 20130206230
    Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
    Type: Application
    Filed: July 22, 2011
    Publication date: August 15, 2013
    Applicant: Ferro Corporation
    Inventors: Srinivasan Sridharan, Robert P. Blonski, Chandrashekhar Khadilkar, John J. Maloney