Lap Patents (Class 228/251)
  • Patent number: 9027823
    Abstract: A workpiece arrangement includes at least two join regions of at least one workpiece that are joined together by a material-to-material connection seam. The material-to-material connection seam covers only a portion of a first of the at least two join regions. A thermal insulation device is disposed in an area of the material-to-material connection seam and corresponds to the first of the at least two join regions.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: May 12, 2015
    Assignee: GSI Helmholtzzentrum fuer Schwerionenforschung GmbH
    Inventors: Tobias Engert, Ivan Kojouharov, Juergen Gerl
  • Patent number: 9004343
    Abstract: In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: April 14, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyuki Inoue, Tadayoshi Ohtashiro
  • Patent number: 8944309
    Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: February 3, 2015
    Assignee: The Regents of The University of Michigan
    Inventors: Stephen R. Forrest, Gregory McGraw
  • Patent number: 8939347
    Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: January 27, 2015
    Assignee: Intel Corporation
    Inventors: Rajasekaran Swaminathan, Ravindranath V. Mahajan
  • Patent number: 8770464
    Abstract: A method for manufacturing welded lap joints comprising the following steps: Providing of two components each having at least one base; allocating the components in such a way that the bases face each other and the components overlap in an overlapping area, which extends at least partially over both components; joining the components by welding in the overlapping area such that a weld joint is formed, wherein at the edge of the overlapping area non welded areas are formed; removing of the non welded areas whereby outer cutting areas are formed at the components, which are arranged at obtuse angles to the overlapping area.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: July 8, 2014
    Assignee: Airbus Operations GmbH
    Inventors: Marco Pacchione, Juergen Silvanus
  • Publication number: 20130056589
    Abstract: An exhaust pipe assembly comprises an exhaust pipe extending along a pipe axis and a fastening panel that is mounted to the exhaust pipe. The cross-section of the fastening panel is configured in a curved manner, and two contact surfaces of the fastening panel, which are spaced apart in the circumferential direction, are soldered to the exhaust pipe. A support connected with the fastening panel is arranged between the two contact surfaces of the fastening panel. The fastening panel can be fastened to the exhaust pipe by the following steps: an exhaust pipe and a sheet-metal tab are provided; a soldering material is then captively fixed to the sheet-metal tab; and the sheet-metal tab is then arranged on the exhaust pipe such that the soldering material contacts the exhaust pipe to finally solder the sheet-metal tab to the exhaust pipe.
    Type: Application
    Filed: September 4, 2012
    Publication date: March 7, 2013
    Inventors: Holger Lampe, Bemhard Mayereder, Julian Raphael Olm
  • Patent number: 8317081
    Abstract: A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: November 27, 2012
    Assignee: NHK Spring Co., Ltd.
    Inventors: Shogo Ogaki, Takashi Ando, Masaru Inoue
  • Patent number: 6902825
    Abstract: A brazed sintered compact composed of first and second components, which are easily positioned relative to each other, enabling the provision of a good joining clearance. If a protrusion 3 of a first component 1 is fitted into a recess 13 of a second component 10, both components are able to be positioned relative to each other. Simultaneously, a joining clearance A can be easily obtained between a joining surface 2 of the first component 1 and a joining surface 12 of the second component 10, corresponding to a dimensional difference therebetween. Also, an inner side surface 4a of a storage groove 4 is aligned with a right or left end 11a of a leg 11, disposed opposite to the inner side surface 4a. Accordingly, it is possible to allow as much brazing material as properly needed to permeate between the joining surfaces 2 and 12. Further, as the surface tension of the surplus brazing material becomes unlikely to be developed in the storage grooves 4,4?, the backflow of the material is prevented.
    Type: Grant
    Filed: May 9, 2003
    Date of Patent: June 7, 2005
    Assignee: Mitsubishi Materials Corporation
    Inventors: Katsuhiko Yano, Toshiro Harakawa
  • Patent number: 6796480
    Abstract: A laser diode bar, solder preform and heat sink are assembled prior to reflowing the solder in a manner to prevent molten solder from being drawn by capillary action over the light emitting end of the diode bar. A recessed pin 30 locates the ends of the laser bar and solder preform with respect to an edge of the heat sink so that the laser bar and solder preform overhang the heat sink edge by respective amounts. When molten, the solder will not be drawn by capillary action to obscure the light emitting end of the laser diode bar.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: September 28, 2004
    Assignee: Spectra-Physics
    Inventors: Jeffrey Powers, Nicolo Sciortino
  • Publication number: 20030189084
    Abstract: A method of forming a stress isolating joint on a dump body of on an off-highway rubber-tired haulage vehicle includes providing a first plate having an elongated edge, a top side, and a face, and providing a second plate including an elongated edge. Overlapping the first and second plates to define a widened seam bounded at least in part by the elongated edges of the respective plates, and welding along the elongated edge of the first plate to join the elongated edge of the first plate to an adjacent surface of the second plate. The weld and at least a portion of the second plate disposed along the widened seam cooperate to permit the second plate to apply a resisting load to the face of the first plate in response to the application of a load against an opposing face of the first plate.
    Type: Application
    Filed: March 27, 2003
    Publication date: October 9, 2003
    Applicant: Terex Corporation
    Inventors: Steven J. Fujan, William R. Borthick
  • Publication number: 20020179683
    Abstract: The invention relates to a hermetic optical fiber feedthrough or connector, and a method of hermetically sealing an optical fiber at low temperature. The method involves stripping a portion of the buffer layer of an optical fiber. The stripped portion of the fiber is inserted into a ferrule having a high coefficient of thermal expansion closely matching that of a low melt temperature solder. The ferrule is heated to melt the solder, the stripped portion of the fiber is then directly soldered into the ferrule. Upon cooling the solder and ferrule cool and shrink relatively uniformly thereby forming a compressive hermetic solder joint surrounding the stripped fiber. An epoxy may be inserted into an aperture formed in the ferrule. The epoxy forms a seal around the hermetic solder joint and bonds with the stripped fiber to improve the tolerance of the hermetic seal to mechanical deformation and increases the pull strength of the seal. Advantageously, the optical properties are not altered by the process.
    Type: Application
    Filed: June 3, 2002
    Publication date: December 5, 2002
    Inventors: Geary R. Carrier, Anthony Boncore
  • Patent number: 6440583
    Abstract: Disclosed is an Al alloy for a welded construction having excellent welding characteristics, which Al alloy comprises 1.5 to 5 wt % of Si (hereinafter, wt % is referred to as %), 0.2 to 1.5% of Mg, 0.2 to 1.5% of Zn, 0.2 to 2% of Cu, 0.1 to 1.5% of Fe, and at least one member selected from the group consisting of 0.01 to 1.0% of Mn, 0.01 to 0.2% of Cr, 0.01 to 0.2% of Ti, 0.01 to 0.2% of Zr, and 0.01 to 0.2% of V, with the balance being Al and inevitable impurities. Also disclosed is a welded joint having this Al alloy base metal welded with an Al—Mg- or Al—Si-series filler metal.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: August 27, 2002
    Assignees: The Furukawa Electric Co., Ltd., Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Seizo Ueno, Yoichiro Bekki, Noboru Hayashi
  • Patent number: 5720425
    Abstract: The invention provides a method of splicing rolled plates with each other, including the steps of (a) positioning a rear end portion of a leading rolled plate above a front end portion of a following rolled plate by a distance slightly greater than a diameter of a cylindrical cutter having a rotation axis extending in a width-wise direction of the leading and following rolled plates, the positioning being carried out while the leading and following rolled plates are being transferred, (b) cutting an upper surface of the front end portion of the following rolled plate with the cylindrical cutter only within a region at which the following rolled plate is to be spliced with the leading rolled plate, the cutting being carried out in a direction F in which the rolled plates are being transferred, (c) blowing a first reducing flame to the upper surface being cut from above the upper surface in the direction F while the step (b) is being carried out, (d) cutting a lower surface of the rear end portion of the leadin
    Type: Grant
    Filed: September 15, 1995
    Date of Patent: February 24, 1998
    Assignees: Ishikawajima-Harima Heavy Industries Co., Ltd., Sumitomo Metal Industries Co., Ltd.
    Inventors: Nobuhiro Tazoe, Toshio Iwanami, Masaumi Oki, Kouiti Sakamoto, Tadao Ebukuro
  • Patent number: 5299965
    Abstract: A laser welding method for preparation of an electron gun of a color cathode-ray tub. This laser welding comprises the steps of forming a coining part on an evaporation section of a weld zone of an upper part to be welded to a lower part, and focusing a laser beam on a bottom surface of the coining part. This coining part has a diameter larger than a diameter of the evaporation section and is formed in such a manner that it permits the weld zone of the upper part to have a predetermined thickness. In accordance with this laser welding, a weld nugget formed at the juncture between the upper and lower parts by is enlarged in its diameter and, as a result, increases the weld strength between the upper and lower parts. The coining part has a bottom surface of a plane surface or a curved surface. This laser welding can weld all of the parts of the electron gun even when an upper part to be welded to a lower part is thicker than the lower part and permit the welding condition to be easily determined.
    Type: Grant
    Filed: December 21, 1992
    Date of Patent: April 5, 1994
    Assignee: Goldstar Co., Ltd.
    Inventor: Hee S. Lee
  • Patent number: 5255837
    Abstract: A method of forming a long 100-inch low resistance lap joint suitable for joining magnet coils in a superconducting magnet assembly on the magnet drum, which is accomplished by forming a flat solder sandwich within a groove on the drum and moving a heat source along the lap joint with controlled temperature, pressure and rotational speed of the drum.
    Type: Grant
    Filed: August 3, 1992
    Date of Patent: October 26, 1993
    Assignee: General Electric Company
    Inventors: Bu X. Xu, Granville G. Ward, Winfield S. DeWitt, III, Gerhard S. Kobus, Craig C. Duer, Jimmy L. Turner
  • Patent number: 5174014
    Abstract: The invention improves upon the diaphragm/beam-type transducers and method of manufacturing same described in U.S. Pat. No. 4,368,575. The new transducers and method of manufacture utilize strips or slivers of silicon or germanium which are larger than the individual strips used in the apparatus and method described in U.S. Pat. No. 4,368,575 by an amount sufficient to permit (a) the formation of two gages on each strip and (b) the forming of bonding pads on each gage. The bonding pads are formed on the gage strip before the strip is bonded to the beam, so that formation of the bonding pads and bonding of the strip to the beam can be handled automatically. The strips are mounted to one side of the midpoint of the beams, so that when a diaphragm/beam is deflected by application of a fluid pressure, one of the two gages will undergo a tension strain while the other gage will undergo a compression strain.
    Type: Grant
    Filed: December 3, 1991
    Date of Patent: December 29, 1992
    Assignee: Data Instruments, Inc.
    Inventors: Herman W. Erichsen, Louis J. Panagotopulos, Mark Levine, William T. Holmes
  • Patent number: 5071174
    Abstract: In a construction for joining a copper tube (20) to a steel body (10) which may be part of a device such as an accumulator used in an air conditioning system, the copper tube is passed into an opening (14) in a wall (12) of the steel body. The opening in the steel body is bounded by a neck projection (18) which extends outward therefrom. A copper collar (24) includes a first portion (26) which accepts neck projection (18) of the steel body. A second portion (28) of the copper collar (24) accepts the copper tube. A mass (34) of brazing material is positioned in the collar in a tapered transitional portion (30) between the first and second portions of the collar. When the body, tube and collar are assembled and placed in a brazing furnace, the brazing material melts and flows by capillary action between the first portion of the collar and the outside of the neck projection of the steel body. The brazing material also flows between the second portion of the collar and the tube.
    Type: Grant
    Filed: October 18, 1990
    Date of Patent: December 10, 1991
    Assignee: Parker-Hannifin Corporation
    Inventors: Gary E. Griffin, David C. Clark
  • Patent number: 4582243
    Abstract: A die (40) for extrusion of optical grade fibers has its hard insert (42) placed under compression within a sleeve (44). Sleeve (44) is provided with a tapered interior surface (50) which matches the tapered exterior surface (48) of the insert (42). A metal lubricating layer (60) is provided between the tapered surfaces. The insert is pressed in to obtain compressive prestressing thereof, and the lubricating metal diffuses at the tapered surfaces to lock the insert in the sleeve.
    Type: Grant
    Filed: December 14, 1984
    Date of Patent: April 15, 1986
    Assignee: Hughes Aircraft Company
    Inventor: Jon H. Myer
  • Patent number: 4117969
    Abstract: A method for interconnecting adjacent batteries applicable to the combination of a plurality of batteries into a single battery system. An alloy having a melting point in a range of from C to C and formed into a foil is inserted between the terminals to be connected together, or between a terminal and a conductor to be connected together, and the alloy is then heated to a temperature higher than its melting point.
    Type: Grant
    Filed: October 20, 1976
    Date of Patent: October 3, 1978
    Assignee: Japan Storage Battery Company Limited
    Inventor: Kiyohide Fukuba
  • Patent number: 4059882
    Abstract: A method of making a heat exchanger in which extended heat transfer material, such as a fin annulus composed of thin corrugated deformable metal, is installed in annular fluid flow paths defined between concentric tubes. Concepts of electromagnetic forming and metallurgical bonding are used in a unique combination of steps to arrive at a method well suited to economical production and which at the same time assures a high efficiency level of heat transfer and leak protection effects.
    Type: Grant
    Filed: May 24, 1976
    Date of Patent: November 29, 1977
    Assignee: United Aircraft Products, Inc.
    Inventor: John E. Wunder