Abstract: A display device may include a display panel including a pad disposed on a substrate and a driving unit including a bump electrically connected to the pad. The pad may include a first layer disposed on the substrate and including a conductive material, a second layer disposed on the first layer and including patterns arranged in a first direction and spaced apart from each other, and a third layer disposed on the second layer and including a conductive material. The first layer may include portions protruding toward the substrate and respectively corresponding to the patterns.

Abstract: A metal composition that includes a first metal; and a second metal containing a first transition metal element added to a first alloy having a melting point higher than a melting point of the first metal, and the second metal is an alloy capable of producing an intermetallic compound with the first metal.

Abstract: A method for preparing copper nanocubes with specific facets and uniform size, the method comprising combining a copper complex solution in a reaction mixture with a ligand. Using a ligand of pure, unoxidized tributylphosphine, uniform copper nanocubes with six facets are prepared.

Abstract: A display device connected by an anisotropic conductive film, wherein the anisotropic conductive film has a first z-axis length variation rate of 10% to 90%, as measured using a thermo-mechanical analyzer and calculated according to Equation 1: first z-axis length variation rate=[(L1?L0)/L0]×100(%)??(1), wherein, L0 is a z-axis length of the anisotropic conductive film at a heating start temperature, and L1 is a maximum z-axis length of the anisotropic conductive film at 130° C. to 170° C. after being heated, as measured using the thermo-mechanical analyzer.

Abstract: In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit.

Abstract: A structural component includes a first component; a second component composed of metal; and at least one connecting piece composed of metal and which penetrates the first component at least over an entire thickness of the first component, and is fixed in the first component for rotation therewith. The at least one connecting piece is connected to the second component via welding at an end facing the second component.

Abstract: According to this brazing method, a first base member having a non-plated surface, a metal layer for functioning as a diffusion barrier layer, a brazing foil, and a second base member having a surface are arranged in this order so that the non-plated surface of the first base member and the surface of the second base member are faced with each other. The first base member and the second base member are brazed by using the brazing foil. The cost of providing a diffusion barrier layer between the first base member and the brazing foil is thereby reduced.

Abstract: A liquid phase diffusion bonded pipe joint comprised of metal pipes or a metal pipe and a joint pipe joined by liquid phase diffusion bonding, the liquid phase diffusion bonded pipe joint comprised of a metal joint provided with a tapered slanted part press-fit into an end of a metal pipe by a thrust in a pipe axial direction while expanding the metal pipe in inside diameter and tightly engaging with the end and a joining surface part continuing from the tapered slanted part and joined with an end face of the metal pipe by liquid phase diffusion bonding and a metal pipe tightly engaging with the tapered slanted part in the expanded state and with an end face joined with the joining surface part by liquid phase diffusion bonding.

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

Abstract: A method is disclosed for manufacturing a shield conductor by connecting a metallic braid part formed of tubularly braided metallic wire to a part to be connected provided with a tubular part having electrical conductivity. The method includes fitting the metallic braid part to an outer peripheral surface of an end part of the tubular part to form a fitting region; attaching a metallic welding band formed in a ring shape in the fitting region with the metallic braid part fitted to the end part of the tubular part; melting the welding band that is attached in the fitting region; and welding the tubular part to the metallic braid part along a circumferential direction of the tubular part.

Abstract: A solder comprising a bismuth matrix, between about 5-24% copper; and about 0.5-36% tin or antimony or zinc; having a solidus temperature of ?271° C., a reflow temperature of ?375° C., and at least one intermetallic composition precipitate comprising copper and at least one of tin, antimony and zinc substantially excluding bismuth formed within the solidus phase.

Abstract: A first joining object and a second joining object are joined to each other using an insert material. The first joining object and/or the second joining object has a first metal composed of Sn or an alloy containing Sn. The insert material contains, as a main component, a second metal which is an alloy containing at least one selected from among Ni, Mn, Al and Cr, and Cu, and is located between the first joining object and the second joining object. When subjected to heat treatment to produce an intermetallic compound of the first metal and the second metal, the first joining object and the second joining object are joined to each other.

Abstract: In joining members to be joined (1, 1) by heating the members to be joined (1, 1) that are mated with intervening an insert (2) while applying opposing loads to the members to be joined (1, 1), so as to allow eutectic reaction to occur between the members to be joined (1, 1) and the insert (2) to discharge a eutectic melt from a joining plane along with an oxide film (1a) of the members to be joined, the members to be joined (1) are brought into contact with the insert (2) so that the oxide film (1a) is broken by a stress concentrating means previously provided at least one of joining portions breaks to produce a starting point of the eutectic reaction.

Abstract: An aluminium alloy sheet product or extruded product for fluxless brazing, including an aluminium alloy core having on at least one face an aluminium filler clad layer containing 4% to 15% of Si, the filler clad layer having an inner-surface and an outer-surface, the inner-surface is facing the aluminium alloy core and the outer-surface is facing a coating layer of 2 to 45 mg/sq.m of Bi or of a Bi-based alloy. Furthermore, a method of brazing a brazed assembly incorporating at least one member made from the brazing sheet material.

Abstract: A knife assembly for a shredder includes a base and a knife cap coupled to the base. The knife cap is configured to cut a material passed through the shredder. In addition, a brazing material is positioned between the base and the knife cap to secure the base and the knife cap together. The base and the knife cap have generally the same outer footprint.

Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.

Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.

Abstract: A solder is deposited on a heat sink. The solder is first reflowed at a first temperature that is below about 120° C. The solder is second heat aged at a temperature that causes the first reflowed solder to have an increased second reflow temperature. The heat aging process results in less compressive stress in a die that uses the solder as a thermal interface material. The solder can have a composition that reflows and adheres to the die and the heat sink without the use of organic fluxes.

Abstract: A method of manufacturing an orthopaedic implant device having a porous outer surface is described. In one embodiment, the implant device includes a porous layer, an intermediate layer, and a solid substrate. The porous layer is preferably bonded to the intermediate layer by cold isostatic pressing. The intermediate layer is preferably bonded by vacuum welding to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device. Preferably, a diffusion bond is created between the bonded intermediate layer and the solid substrate by hot isostatic pressing. In another embodiment, a porous layer is created on an outer surface of a solid layer by selective melting. Preferably, the solid layer is bonded to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device.

Abstract: A joining method using a metal foam, a method of manufacturing a semiconductor device by using the joining method, and a semiconductor device produced by the manufacturing method are disclosed. A metal foam body is sandwiched between members to be joined, which are then brought into contact with each other and subjected to heat treatment. In this heat treatment, films of low-melting-point metal, such as Sn films covering the members to be joined, are melted. An alloy layer—an intermetallic compound—is formed by bringing about solid-liquid diffusion of Cu of a skeleton of open cells of the metal foam body in the molten Sn. At this stage, a Cu skeleton is left in the metal foam body. Highly thermally resistant and highly reliable joining can be realized by joining the members to be joined together by using this alloy layer.

Abstract: A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.

Abstract: In one disclosed embodiment, the present method for preventing void formation in a solder joint formed between two metallic surfaces includes forming at least one slit in a layer of solder to form a slit solder layer, positioning the slit solder layer between the two metallic surfaces, and heating the slit solder layer to form the solder joint, wherein the at least one slit forms an outgas alley to prevent void formation in the solder joint. Where solder joint width is a concern, the present method includes applying external pressure concurrently with heating. The outgas alley is formed to provide a ready avenue of escape for flux gasses produced during formation of the solder joint.

Abstract: A method for securing electronic components, in particular power semiconductor components such as diodes, transistors or thyristors, and connection elements, to a substrate by pressure sintering. The method includes: applying a pastelike layer, made up of a metal powder and a solvent, to a supporting film; drying the pastelike layer; applying at least one component to the dried layer; subjecting the at least one component, the supporting film and the dried layer to pressure, as a result of which the adhesive force between the layer and the component becomes greater than that between the layer and the supporting film; lifting off the at least one component, with the layer adhering to it, from the supporting film; positioning the component, with the layer adhering to it, to the substrate; and subjecting the substrate and the component to pressure, for connecting them by sintering.

Abstract: An amorphous, ductile brazing foil is produced with a composition of FeaNibCrcSidBeMofPg with 25?a?50 atomic %; 30?b?45 atomic %; 5<c?15 atomic %; 4?d?15 atomic %; 4?e?15 atomic %; 0?f?5 atomic %; 0?g?6 atomic %; and any impurities, wherein 10?d+e+g?28 atomic % with a+b+c+d+e+f+g=100. Excellent brazing joints can be produced with these brazing foils.

Abstract: A solder material includes 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part of an electronic component is connected to a copper-containing electrode land of a substrate by using this solder material, a part having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound can be rapidly grown from the electrode land and the electrode part to form a strong blocking structure.

Abstract: A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.

Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.

Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Abstract: An amorphous, ductile brazing foil is produced with a composition of FeaNibCrcSidBeMofPg with 25?a?50 atomic %; 30?b?45 atomic %; 5<c?15 atomic %; 4?d?15 atomic %; 4?e?15 atomic %; 0?f?5 atomic %; 0?g?6 atomic %; and any impurities, wherein 10?d+e+g?28 atomic % with a+b+c+d+e+f+g=100. Excellent brazing joints can be produced with these brazing foils.

Abstract: A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.

Abstract: A method for joining two ceramic parts, or a ceramic part and a metal part, and the joint formed thereby. The method provides two or more parts, a braze consisting of a mixture of copper oxide and silver, a diffusion barrier, and then heats the braze for a time and at a temperature sufficient to form the braze into a bond holding the two or more parts together. The diffusion barrier is an oxidizable metal that forms either a homogeneous component of the braze, a heterogeneous component of the braze, a separate layer bordering the braze, or combinations thereof. The oxidizable metal is selected from the group Al, Mg, Cr, Si, Ni, Co, Mn, Ti, Zr, Hf, Pt, Pd, Au, lanthanides, and combinations thereof.

Abstract: A system and method for manufacturing welded structures comprises components to be welded, a welding additive material which, before the welding, has a shaped profile and the shaped profile is disposed between components to be welded and conforms with at least one of the components to be welded. At least one heat source is used in the method to weld the components, producing a weld seam on at least one side of one of the components.

Abstract: A thermal conduction path for a heat-sensitive, heat-generating component is formed by placing a heat-generating device, such as a laser diode, in a desired orientation relative to a supporting surface. A solid-phase mass of a heat-conducting material is positioned between the heat-generating device and the supporting surface and is converted to liquid phase by heating the supporting surface. Additional heat-conducting material is then added to the liquid-phase heat-conducting material until a meniscus is formed between the heat-generating component and the supporting surface. Because the heat-conducting material has a melting point or liquidus that is less than a critical temperature of the heat-generating component, the thermal conduction path can be formed without damaging the heat-generating component.

Abstract: A method of bonding a first component (10) comprising a titanium-containing alloy to a second metal component (12), wherein a coating layer (14,16) is applied to each of the first and second components in the region to be bonded. The coating layers (14,16) comprise a precious metal. An intermediate metallic layer (18) is interposed between the coating layer (14) of the first component and the coating layer (16) of the second component. The respective coating layers are held in contact with the intermediate layer (18) and the coating layers and the intermediate layer are heated to initiate melting of at least one of said layers so as to form a bond between the first and second components by brazing.

Abstract: In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt. % or a Zn content of the Zn series alloy layer is 90 to 100 wt. %. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, a high connection reliability can be achieved when an Al series alloy layer is left after the connection, since the soft Al thereof functions as a stress buffer material.

Abstract: The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.

Abstract: A minute ball array apparatus includes: an array jig including insert parts, into which minute balls are to be inserted, and which are formed in a predetermined pattern; a ball moving unit, which comprises a thrust surface, and which moves the thrust surface along an upper surface of the array jig so as to move the minute balls supplied onto the upper surface of the array jig to drop the minute balls into the insert parts of the array jig; a collapsing member, which is provided in a vicinity of the thrust surface, and which collapses a buildup of the minute balls rising along the thrust surface when the thrust surface is moved by the ball moving unit; and a motion imparting unit that imparts the collapse member with motion for collapsing the rising buildup of the minute balls.

Abstract: This invention provides methods and systems for brazing. One aspect of the invention provides a method of brazing cutter teeth. The method includes providing a bit body, pressing at least one cutter against the bit body with a spring device, placing the bit body and the at least one cutter in an inert gas filled chamber with about 10% H2, and heating the chamber to a temperature above the melting point of the filler metal thereby melting the filler metal. A quantity of filler metal is held between each of the at least one cutters and the bit body.

Abstract: The present invention provides a conductive connecting material having a multilayered structure comprising a resin composition (A) and a metal foil (B) selected from a solder foil or a tin foil, wherein the volume ratio ((A)/(B)) of the resin composition (A) and the metal foil (B) selected from a solder foil or a tin foil in the conductive connecting material is 1-40 or 20-500, as well as a method for connecting terminals using the conductive connecting material. The conductive connecting material of the present invention is preferably used for electrically connecting electronic members in an electrical or electronic component.

Abstract: A method of closing off a mold plug opening in a turbine component includes the steps of inserting a weld member into an opening to be closed, and to abut a necked portion within a passage leading from the opening. Heat is applied to the weld member, such that a surface of the weld member in contact with the necked portion liquefies, and such that the weld member adheres to the necked portion, closing off the opening. The weld member and application of heat are selected such that the entirety of the weld member does not liquefy, but remains in the opening, without ever having liquefied. A turbine component formed by the method is also disclosed.

Abstract: A joining jig 5 is constituted of a pair of flat-plate sandwiching portions 17, 18 including sandwiching faces 15 which sandwich therebetween a plate member laminate 4 prepared by laminating two plate members 2, 3 with providing a solder on a joined face between the plate members. The joining jig has a plurality of vapor inflow ports provided in the sandwiching face 15 so that surplus solder vapor on the joined face flows into the vapor inflow ports in a case where the plate member laminate 4 is heated while sandwiching the plate member laminate between the pair; vapor flow paths provided so that the vapor flow paths communicate with the vapor inflow ports; and vapor discharge ports 42 provided in the side surface of the joining jig so that the vapor discharge ports communicate with the vapor flow paths to discharge the vapor of the solder to the outside.

Abstract: The present invention relates to a method of brazing two materials (1, 2) together using a filler metal (3), which comprises the following steps: the filler metal is placed between the two contacting materials in a brazing zone where they are intended to be joined; on at least one of the two materials, which is mounted so as to move, a stress force is exerted along each of the directions of expansion provided for the two materials; the assembly in the brazing zone is brought to what is called a brazing temperature, which is both above the melting point of the filler metal and below the melting point of each of the two materials; during the temperature rise, the forces exerted on the materials to be assembled are gradually reduced as said materials expand, so that there is substantially no longer a force exerted on the materials when the brazing temperature is reached; and, once the filler metal has melted and wetted each material to be assembled, the assembly is cooled so as to solidify the filler metal, whic

Abstract: The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal.

Abstract: The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.

Abstract: Barrier apparatus for use with fuel tanks are described. An example barrier apparatus includes a protective barrier having a support surface and a wall protruding from the support surface to define a cavity. The support couples the protective barrier to a surface of the fuel tank. A weld pad is disposed within the cavity adjacent the support surface.

Abstract: A method of manufacturing a blisk comprising a disc joined to an aerofoil, wherein a union piece of partially sintered powder and having an alignment feature is provided. The union piece is connected between the disc and the aerofoil, which is aligned relative to the disc by the alignment feature of the union piece. Heat and pressure is subsequently applied to consolidate the first workpiece, union piece and second workpiece.

Abstract: Disclosed are amorphous, ductile brazing foils with a composition consisting essentially of FeRestNiaCrbSicBdPe, wherein 0 atomic %?a<25 atomic %; 0 atomic %?b?15 atomic %; 1 atomic %?c?10 atomic %; 4 atomic %?d?15 atomic %; 1 atomic %?e?9 atomic %; any impurities?0.5 atomic %; rest Fe, wherein 2 atomic %?c+e?10 atomic % and 15 atomic %?c+d+e?22 atomic %, or consisting essentially of FeRestNiaCrbMofCugSicBdPe, wherein 0 atomic %?a<25 atomic %; 0 atomic %?b?15 atomic %; 1 atomic %<c?10 atomic %; 4 atomic %?d?15 atomic %; 1 atomic %?e?9 atomic %; 0 atomic %<f?3 atomic %; 0 atomic %?g?3 atomic %; any impurities?0.5 atomic %; rest Fe, wherein 2 atomic %?c+e?10 atomic % and 15 atomic %?c+d+e?22 atomic %. Also disclosed are brazed objects formed using these foils, particularly exhaust gas recirculation coolers and oil coolers, and methods for making the brazing foils and for making the brazed parts.

Abstract: A substrate manufacturing apparatus manufactures a ball-mounted substrate and has a ball mounting apparatus which includes a ball vacuum chucking apparatus including a vacuum chucking head that carries out a vacuum chucking process to chuck balls at edges of inlets formed in a vacuum chucking surface and which mounts the balls vacuum-chucked by the vacuum chucking head on a substrate, the ball vacuum chucking apparatus further including: a holding vessel that holds the balls; and a vacuum chucking/holding unit that vacuum chucks and holds the balls held in the holding vessel on a front end thereof, and carrying out a supplying process that brings the vacuum chucking/holding unit that holds the balls on the front end thereof and the vacuum chucking surface of the vacuum chucking head relatively close to supply the balls to the vacuum chucking head while air is being drawn through the inlets.

Abstract: In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt. % or a Zn content of the Zn series alloy layer is 90 to 100 wt. %. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, when an Al series alloy layer is left after the connection, since the soft Al functions as a stress buffer material, the high connection reliability can be achieved.