Abstract: A method of joining a semiconductor die to a substrate includes: applying a solder preform to a metal region of the semiconductor die or to a metal region of the substrate, the solder preform having a maximum thickness of 30 ?m and a lower melting point than both metal regions; forming a soldered joint between the metal region of the semiconductor die and the metal region of the substrate via a diffusion soldering process and without applying pressure directly to the die; and setting a soldering temperature of the diffusion soldering process so that the solder preform melts and fully reacts with the metal region of the semiconductor die and the metal region of the substrate to form one or more intermetallic phases throughout the entire soldered joint, each intermetallic phase having a melting point above the melting point of the preform and the soldering temperature.

Abstract: A motor vehicle structural component includes a first metal sheet and a second metal sheet placed against the first metal sheet. The first and second metal sheets are joined together in some areas. A gap is provided between the first and second metal sheets in the regions between the areas where the first and second metal sheets are joined together. The gap is configured to receive a coating material. At least one of the first or the second metal sheets includes at least one hole. Each hole opens to the gap and is configured to convey an inflow of the coating material to the gap.

Abstract: A method of bonding two members including an aluminum alloy material as one member, and an aluminum alloy material or a pure aluminum material as the other member, the method being characterized in: that the aluminum alloy material for the one member and the aluminum alloy material for the other member are composed of an aluminum alloy containing Mg of not more than 0.5 mass %; and that a bonding process is carried out in a furnace having a non-oxidizing atmosphere at a temperature, at which a ratio of a mass of liquid phases generated in the aluminum alloy material defined as the one member to the total mass of the aluminum alloy material falls within a range from 5% to 35%, on the condition that there is either a coated fluoride-based flux or a coated chloride-based flux between both of the members to be bonded.

Abstract: In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit.

Abstract: An electronic device includes: a first electronic component; first members that are provided on a first surface of the first electronic component and that include outside surfaces configured to face diagonally upward with respect to the first surface; a second electronic component provided above the first surface; second members that are provided corresponding to the first members on a second surface of the second electronic component which faces the first surface and that include inside surfaces configured to face diagonally downward with respect to the second surface and configured to face the outside surfaces; and solder that is provided between the first surface and the second surface and that electrically connects the first electronic component and the second electronic component.

Abstract: In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chip 13 and a temperature 100° C. below the thermal resistance temperature is interposed between a circuit board 12 and the semiconductor chip 13; a heat insulating body 17 is placed on an upper side of the semiconductor chip 13 in this state; a metal weight 16 is disposed on the heat insulating body 17; and load is applied to the semiconductor chip 13 while the solder material 14 is melted and solidified.

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

Abstract: A method for producing a metal sheet with a welded-on tube which has at least partially curved sections, wherein the tube is guided by at least one guide element onto the sheet, is pressed thereon with at least one pressure element and is welded thereto at least at some points and wherein the tube is bent to form the curved sections. In order to achieve the welding-on in a simple manner even in the curved sections, it is provided that a bending is carried out in a plurality of discrete steps, wherein in individual steps firstly the tube with the at least one guide element is bent around a last created welding point and thereafter a new welding point is created. Furthermore, the invention relates to a device for carrying out the method.

Abstract: A method for manufacturing welded lap joints comprising the following steps: Providing of two components each having at least one base; allocating the components in such a way that the bases face each other and the components overlap in an overlapping area, which extends at least partially over both components; joining the components by welding in the overlapping area such that a weld joint is formed, wherein at the edge of the overlapping area non welded areas are formed; removing of the non welded areas whereby outer cutting areas are formed at the components, which are arranged at obtuse angles to the overlapping area.

Abstract: A heat dissipation device includes an insulating substrate, a metal layer connected to the insulating substrate via a first brazing filler material, a stress relaxation member connected to the insulating substrate via a second brazing filler material, and a cooler connected to the stress relaxation member via a third brazing filler material. The stress relaxation member has one or more stress relaxation spaces each including an opening that is open to at least one of a face side and a back side of the stress relaxation member. At least one of the second and third brazing filler materials has one or more through-holes. Each through-hole includes an opening overlapped with the opening of the stress relaxation space or with the opening of a corresponding one of the stress relaxation spaces, and an edge of each through-hole opening is located externally to an edge of the corresponding stress relaxation space opening.

Abstract: A processing apparatus that is formed from a plurality of metal layers that are stacked and aligned together and then connected together to form one or more portions of the processing apparatus.

Abstract: A processing apparatus that is formed from a plurality of metal layers that are stacked and aligned together and then connected together to form one or more portions of the processing apparatus.

Abstract: A processing apparatus that is formed from a plurality of metal layers that are stacked and aligned together and then connected together to form one or more portions of the processing apparatus.

Abstract: Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices.

Abstract: A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of the middle ceramic layer. The lower metal layer has a plurality of millichannels configured to deliver a coolant for cooling the power electronics, wherein the millichannels are formed on the lower metal layer prior to attachment to the lower surface of the middle ceramic layer. Methods for making a cooling device and an apparatus are also presented.

Abstract: A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.

Abstract: A method to improve the impact resistance of a braze joint between a tungsten/carbide/cobalt substrate and a substrate including titanium or alloy thereof includes utilizing a brazing material including gold, nickel, and copper present in respective amounts to improve the ductility of the braze joint.

Abstract: A heating apparatus comprising an energetic nanolaminate film that produces heat when initiated, a power source that provides an electric current, and a control that initiates the energetic nanolaminate film by directing the electric current to the energetic nanolaminate film and joule heating the energetic nanolaminate film to an initiation temperature. Also a method of heating comprising providing an energetic nanolaminate film that produces heat when initiated, and initiating the energetic nanolaminate film by directing an electric current to the energetic nanolaminate film and joule heating the energetic nanolaminate film to an initiation temperature.

Abstract: Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure.

Abstract: A material for welding 5 having a region 11 in which welding such as laser welding or arc welding is performed, the region including indentations 5a-1 which are produced by carrying out a first working step comprising embossing, V-bending, U-bending, L-bending, drawing, stepped drawing, or a combination of these to form a curved portion 5a in the material being worked, and a second working step which is press working which crushes the curved portion 5a which is formed by the first working step. The indentations 5a-1 have a protruded portion 11a which projects from a flat surface which forms the surface of the material being worked 5, and a recessed portion 11b which is formed on the inside of the protruded portion 11. Indentations 5a-1 are provided in the form of at least two separated dots so as to be generally parallel to the predicted welding position and are arranged on the expected welding position.

Abstract: Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt or soften the joining material, which upon cooling will form a strong bond, joining two or more bulk materials.

Abstract: An object of the present invention is to provide a filler metal for an aluminum brazing sheet for heat exchangers capable of preventing or controlling occurrence of a melting hole during heating for brazing, and a method of manufacturing the same. In an Al—Si alloy filler metal which is clad on the aluminum brazing sheet and melted during heating for brazing, the maximum particle diameter of a coarse Si particle crystallized in the eutectic structure of the filler metal is 20 ?m or less. Provided that an average value and a standard deviation in a normal distribution of the particle diameter of the coarse Si particle in the filler metal are respectively ? and ?, (?+3?) is preferably 10 ?m or less. This brazing sheet is obtained by a method of adding a specific amount of Na, Sr, or Sb to the filler metal, a method of limiting the amount of impurities in the filler metal within a specific range, a method of specifying a cooling rate during the casting of the filler metal, or the like.

Abstract: A laser diode bar, solder preform and heat sink are assembled prior to reflowing the solder in a manner to prevent molten solder from being drawn by capillary action over the light emitting end of the diode bar. A recessed pin 30 locates the ends of the laser bar and solder preform with respect to an edge of the heat sink so that the laser bar and solder preform overhang the heat sink edge by respective amounts. When molten, the solder will not be drawn by capillary action to obscure the light emitting end of the laser diode bar.

Abstract: Disclosed are different titanium aluminide (Ti—Al) honeycomb panel structures formed from a gamma-based Ti—Al (&ggr;-Ti—Al) or orthorhombic Ti—Al (O—Ti—Al) honeycomb core brazed to a &ggr;-Ti—Al or O—Ti—Al facing sheet(s), where a metal braze filler foil containing copper and one or more other metals is used to join the faying surface of the honeycomb core and the faying surface of the facing sheet(s). The structures and method of the invention are useful where high strength, lightweigth materials are required, such as in aircraft and other aerospace-related applications.

Abstract: The aim of the present invention is a process for manufacturing a plated product (1) comprising a support part in steel (2) and an anticorrosion metallic coating (3), characterized in that the anticorrosion coating (3) is fixed on the support part (2) by controlled-atmosphere brazing, in particular by vacuum brazing. The process according to the invention makes it possible to fix solidly an anticorrosion coating with a thickness smaller than 1 mm on a steel plate.

Abstract: A method and system for making a monolithic intermetallic structure are presented. The structure is made from lamina blanks which comprise multiple layers of metals which are patternable, or intermetallic lamina blanks that are patternable. Lamina blanks are patterned, stacked and registered, and processed to form a monolithic intermetallic structure. The advantages of a patterned monolithic intermetallic structure include physical characteristics such as melting temperature, thermal conductivity, and corrosion resistance. Applications are broad, and include among others, use as a microreactor, heat recycling device, and apparatus for producing superheated steam. Monolithic intermetallic structures may contain one or more catalysts within the internal features.

Abstract: Manufacturing method for bonded electroforming metallic mold, including steps of: 1. preparation of metallic material 2. preparation of electroforming metallic plate and plastic mold core and electroforming substrate; 3. preparation of power supply; 4. forming of electroforming deposited film; and 5. final-shaping. In order to significantly shorten the electroforming time and firmly connect with the steel material of the mold, the steel material of the mold and the electroforming article are simultaneously electrically connected to the cathodes of power supplies. So, the electroforming metal is simultaneously deposited on both sides to quickly achieve the desired thickness of the electroforming metallic plate. By the metal-to-metal bonding force, the electroforming metallic plate and the steel material of the mold are firmly connected with each other. Also, the electroforming metallic plate keeps having the original cast pattern and is tightly combined with the steel material of the mold.

Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.

Abstract: Reaction-brazing of tungsten or molybdenum metal bodies to carbonaceous supports enables an x-ray generating anode to be joined to a preferred lightweight substrate. Complementary surfaces are provided on a dense refractory metal body and a graphite or a carbon-carbon composite support. A particulate braze mixture comprising Hf or Zr carbide, Mo or W boride, Hf or Zr powder and Mo or W powder is coated onto the support surface, and hafnium or zirconium foil may be introduced between the braze mixture and the refractory metal body complementary surface. Reaction-brazing is carried out at or near the eutectic point of the components, which may be influenced to some extent by the presence of carbon and boride. Heating to about 1865° C.

Abstract: Disclosed is a method of manufacturing an assembly of components joined by brazing, comprising the steps of:

Abstract: Brazing or soldering of pieces of low wettable materials (1, 3), such as single crystal silicon, is accomplished by sandwiching the brazing material (5) between the pieces and sealing the edges of the brazing material with a tape (11) wrapped about the periphery of the brazing material, mechanically placing that tape in compression and maintaining that compression while heating (21) the sandwiched assembly to the brazing temperature of the brazing material. The tape possesses the characteristic of being non-wettable by the brazing material in the molten state and, hence, is impermeable to that melt. The tape may comprise a fibrous porous ceramic material.

Abstract: A laminated structural panel is formed of top, bottom, and one or more intermediate layers of material having low strength at high temperature and with perforated high temperature, high strength materials interleaved between the top, bottom and intermediate layers. Brazing material is clad on the top and bottom layers and the intermediate layer or layers may be entirely of brazing material or clad on both sizes with brazing material, such that when the assembled stack is subjected to high temperature in a high vacuum environment brazing material is caused to melt and fill the perforations in the high strength material. A particular application is for structural panels, used as shelves in manufacturing electronic chips or displays where aluminum is advantageous because it does not outgas or release particles under the high temperature, high vacuum environment used to make the product. Aluminum, however, does not maintain its strength and stiffness at the high temperatures involved.

Abstract: A method of bonding together at least two long, metal alloy segments, of turbine components, such as turbine blade segments (18, 19, 20 and 21) by: putting a melting point depressant between the segments at bond planes (34) between contracting segments; forming a heated zone across the segments and a heated front (32); where melt pools (36) form in a molten zone (38) at the heated front which front (32), pools (36) and zone (38) continuously move and pass along the bond planes (34); where crystal re-growth (35) occurs along the bonding planes to form bonds (34) between the individual segments (18, 19, 20 and 21) behind the moving molten zone (38).

Abstract: A nozzle is provided for the reworking of printed circuit boards with CBGA and CCGA solder containing chips comprising a housing having an internal hot gas chamber and configured to hold at the lower end of the nozzle a chip to be attached to the printed circuit board. The nozzle is provided with a support member and resilient means on the lower surface thereof which resilient means contacts the upper surface of the chip when the chip is placed in the nozzle. When a vacuum is applied to the nozzle the chip is held against the resilient means and compresses the resilient means so that the lower portion of the solder array is below the lower end of the nozzle. When the nozzle is then placed against a printed circuit board, the resilient means provides a pressure force against the chip and the printed circuit board which enables rework of the printed circuit board even though the printed circuit board may be warped.

Abstract: An aluminum brazing alloy composite sheet is provided which can be utilized in both the vacuum brazing process and the controlled atmosphere brazing process for the brazing of aluminum parts, The brazing alloy composite sheet consists of an aluminum core alloy of the 3XXX, 5XXX or 6XXX type clad at least on one major surface with a lithium-containing aluminum filler alloy containing from about 0.01% to about 0.

Abstract: An aluminum brazing alloy composite sheet is provided which can be utilized in both the vacuum brazing process and the controlled atmosphere brazing process for the brazing of aluminum parts. The brazing alloy composite sheet consists of an aluminum core alloy of the 3XXX, 5XXX or 6XXX type clad at least on one major surface with a lithium-containing aluminum filler alloy containing from about 0.01% to about 0.30% by weight lithium. The core alloy may contain up to about 2% by weight magnesium and is suitable for producing aluminum alloy heat exchanger assemblies, such as radiators or evaporators.

Abstract: Two metal objects are bonded together by positioning a brazing composite on the surfaces that are to be bonded together and heating the metal objects causing the composite to disintegrate with brazing alloy that is held in the composite melting to bond the two surfaces together. The composite is a combination of the brazing alloy and fibrillater polytetrafluoroethylene. This product which is very malleable can be formed to any desired shape to facilitate bonding a variety of different objects together. It is particularly useful for bonding honeycombed objects to metal surfaces.

Abstract: A method is provided for joining Be-Al alloy structural members to yield a high shear strength at the interface. Surface oxides are first removed from the Be-Al alloy members. Aluminum is then selectively etched from the bonding surfaces to allow the flow of braze alloy into high aspect ratio capillary sites. A discontinuous ceramic reinforcing material, such as Al.sub.2 O.sub.3 or SiC in particulate or whisker form, is added in small quantities to a braze foil, such as Al-Si, to create a composite at the bond interface. The braze foil and reinforcing material are sandwiched between the Be-Al alloy members, and the joint is heated to above the liquidus temperature of the braze alloy but below the melting point of aluminum. The resulting interface shear strength of the Be-Al alloy bond has been tested to an average of about 60% of the parent alloy shear strength.

Abstract: A method of obtaining effective faying in joining parts includes forming a first and second member into predetermined complementing shapes. The members are then placed together and sealed along a peripheral track to form a chamber between the members. The method further includes applying a pressure differential to the members with the lesser pressure residing in the chamber and heating the members to soften at least one of the members to conform the members to each other under the force of the differential pressure.

Abstract: Tungsten anode targets are joined to graphite substrates by a brazing method employing a controlled atmosphere and a suitable braze material such as platinum and an alloy of platinum and chromium.

Abstract: A process for making a solderable composite body containing silver cadmium oxide comprising forming an assembly having an intermediate layer of a silver copper alloy located between a layer of a silver cadmium alloy and a layer of silver of silver alloy, welding the layers together, and subsequently oxidizing the cadmium.