Abstract: In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit.

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

Abstract: There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.

Abstract: A welding method and a welded joint for high strength, temperature resistant steels produce the same strength as the base metal in the welded joint, thereby resolving strength problems in the heat affected area by making a simple change to the welding method. Additionally, this advantage is extended to high strength ferrite heat resistant steels by providing a multi-pass buildup welding method for such high strength ferrite heat resistant steels. A multi-layered cap 15a fusion area extends past the heat affected area 13 that lies outside groove 11, and the surface area of the foregoing extension that is required to impart the same level of creep strength as is inherent in the base metal is based on the relationship between the groove width and the base metal thickness shown as hatched area in FIG. 1(B).

Abstract: A method of providing thermal vias in a printed circuit board that includes one or more layers of board material is disclosed. The vias provide for conducting heat from components mounted on the board. One or more holes (4) are provided in a printed circuit board that may include several metal layers. A metal ball (6) is inserted into each hole and subjected to pressure such as to deform said ball, and tightly fixating the resultant slug against the wall (5) of said hole. The deformed ball or slug fixed in the hole, which may have a metallised inner surface, functions to conduct heat and/or electricity between a metallised topside (2) and bottom side (3) of the printed circuit board and also between intermediate metallised layers in the case of a multi-layer board.

Abstract: A method of retaining a solder mass within a solder-bearing component is provided and includes the steps of: (a) forming a plurality of fingers in the solder-bearing component at one edge thereof, with each finger being defined by a pair of slots formed in the solder-bearing component; and (b) interleaving a solder mass between the fingers such that the solder mass is securely held by the fingers. The solder-bearing component includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

Abstract: An electromagnetic shield is provided and includes a shield body having an upper wall connected to opposing side walls and opposing end walls. At least two opposing walls of the electromagnetic shield each have a plurality of resilient fingers formed at a lower edge thereof. The electromagnetic shield also includes a solder mass securely held by the fingers by being interleaved between the fingers of each of the at least two opposing walls. The interleaving of the solder mass results in the solder mass being securely held by the fingers and ready for mounting to an electronic component for shielding a portion of the electronic component from undesirable and potentially damaging emissions from neighboring components. A method of mounting an electromagnetic shield to an electronic component having a planar surface and a method of interleaving the solder mass are also provided.

Abstract: A system for joining a pair of structural members having widely differing coefficients of thermal expansion is disclosed. A mechanically “thick” foil is made by dispersing a refractory metal powder, such as molybdenum, niobium, tantalum, or tungsten into a quantity of a liquid, high expansion metal such as copper, silver, or gold, casting an ingot of the mixture, and then cutting sections of the ingot about 1 mm thick to provide the foil member. These foil members are shaped, and assembled between surfaces of structural members for joining, together with a layer of a braze alloy on either side of the foil member capable of wetting both the surfaces of the structural members and the foil. The assembled body is then heated to melt the braze alloy and join the assembled structure. The foil member subsequently absorbs the mechanical strain generated by the differential contraction of the cooling members that results from the difference in the coefficients of thermal expansion of the members.

Abstract: A method of retaining a solder mass within a solder-bearing component is provided and includes the steps of: (a) forming a plurality of fingers in the solder-bearing component at one edge thereof, with each finger being defined by a pair of slots formed in the solder-bearing component; and (b) interleaving a solder mass between the fingers such that the solder mass is securely held by the fingers. The solder-bearing component includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

Abstract: This invention provides a welding method and a welded joint for high strength, temperature resistant steels that produces the same strength as the base metal in the welded joint, thereby resolving the strength problems in the heat affected area by making a simple change to the welding method, and additionally, to extend this advantage to high strength ferrite heat resistant steels by providing a multi-pass buildup welding method for such high strength ferrite heat resistant steels. The multi-layered cap 15a fusion area extends past the heat affected area 13 that lies outside groove 11, and the surface area of the foregoing extension that is required to impart the same level of creep strength as is inherent in the base metal is based on the relationship between the groove width and the base metal thickness shown as hatched area in FIG. 1(B).

Abstract: Brazing or soldering of pieces of low wettable materials (1, 3), such as single crystal silicon, is accomplished by sandwiching the brazing material (5) between the pieces and sealing the edges of the brazing material with a tape (11) wrapped about the periphery of the brazing material, mechanically placing that tape in compression and maintaining that compression while heating (21) the sandwiched assembly to the brazing temperature of the brazing material. The tape possesses the characteristic of being non-wettable by the brazing material in the molten state and, hence, is impermeable to that melt. The tape may comprise a fibrous porous ceramic material.

Abstract: There is provided an LED that can prevent the dissolution and separation of electrodes due to etching in the manufacturing stage and has a high light emission efficiency even when horizontally mounted as well as a method for manufacturing the LED. In a light-emitting diode 100 which is cut from a wafer by dicing and in which a positive electrode 4 and a negative electrode 3 are formed parallel to a pn junction plane 20, the positive electrode 4 provided by a p-side ohmic contact metal layer 41 formed on a surface of a p-type semiconductor layer (p-type GaN layer 2) and a p-side electrode metal layer 42 made of an alloy including gold and nickel, while the negative electrode 3 is provided by an n-side ohmic contact metal layer 31 formed on a surface of an n-type semiconductor layer 1 and an n-side electrode metal layer 32 made of an alloy including gold and nickel. The side surface 7 of a light-emitting diode chip that is brought in contact with a dicing blade is etched by an acid solution.

Abstract: A vacuum-tight cable feedthrough device includes a metallic first flange that is penetrated by a slot. Passing through the slot is a flat stripline cable that includes a plurality of conductive signal channels encompassed by a dielectric material on whose upper and lower surfaces is disposed a conductive material includes a ground. The stripline cable is sealed within the slot to provide a substantially vacuum-tight seal between the cable and the first flange. In a preferred embodiment, the cable feedthrough device includes a plurality, at least 16, of stripline cables. In a further preferred embodiment, the device includes a second flange and a bellows sealably connecting the first and second flanges, thereby providing a substantially vacuum-tight, flexible housing for the plurality of cables.

Abstract: An electrical contact that is mounted on a printed circuit board to provide an electrical connection to the printed circuit board. The contact has the structural integrity of a through-hole component with the capability of being soldered to the circuit board using a surface mount reflow process. The contact includes a pair of elongated, conductive pins with a base disposed therebetween, and a solder preform supported on one of the conductive pins adjacent the base. The pin supporting the solder preform is insertable into a plated-through hole on the circuit board so that the solder preform can be reflowed into the hole along the pin to form a solder joint between the contact and the hole. The contact may include a retainer to secure the solder preform to the pin and the end of the base adjacent the pin may be beveled to facilitate gas ventilation from the hole during the soldering process. The base may be configured so that it can be grasped with a test instrument or support a wire connection to the contact.

Abstract: A method of fabricating an electric generator main lead bushing is provided for attaching a flange to a hollow conductor. In one application typically used for an air side flange, a gap is formed in the flange that is sized to receive an end of the conductor, a groove is formed in the conductor end, a braze alloy insert is placed into the groove, the conductor end is inserted into the gap, and the flange and the conductor are heated and cooled to provide a seal between the flange and the conductor. In another application typically used for a gas side flange, a counterbore is formed in an inner portion of the hollow conductor that is sized to receive the flange, a groove is formed in the counterbore, a braze alloy insert is placed into the groove, the flange is fitted into the counterbore, and the flange and the conductor are heated and cooled to provide a seal between the flange and the conductor.

Abstract: A bonding insert material mounting method includes the following steps. A bonding insert material having projections of a suitable shape formed on an outer periphery thereof at predetermined intervals is held by half-splittable holder into which joining members can be inserted in such a manner that the projections are held by the holder and that the bonding insert material is disposed at that area of the holder into which the joining members P can be inserted. One end of the holder on an end of one of the joining members is fitted so that one side of the bonding insert material is abutted against an end surface of the one joining member. An end of the other joining member is inserted into the other end of the holder, so that the end of the other joining member is abutted against the other side of the bonding insert material with a predetermined pressing force. Then, the holder is divided into two division members, and the holder is removed from the joining members.

Abstract: A reflow mounting method and a semiconductor device for efficient manufacture of TCPs superior in reliability by preventing the deformation of leads and ensuring a dependable contact between the bonding pads on a circuit board and the leads, wherein metal pieces arranged as weights on the leads are temporarily positioned adequately to specified bonding pads, thus restraining the leads from shifting from appropriate positions, which may occur if the leads deform, and wherein the metal pieces become wettable by bonding agent when heated, thus making sure that the leads are firmly fixed between the metal pieces and the bonding pads.

Abstract: In the production of a metallic honeycomb body for use as a metallic carrier, for supporting a catalyst, in the purification of an exhaust gas from automobiles or the like, a desired joint site for each layer constituting the metallic honeycomb body is preset, and, when a portion of contact between a metallic corrugated foil and a metallic flat foil for forming the metallic honeycomb body has reached the joint site, a brazing foil which has been cut into a predetermined length is inserted and enfolded in the contact portion.

Abstract: A high performance soldering sleeve having improved heat transfer characteristics. The soldering sleeve has a continuous winding of solder coils positioned within a heat shrinkable tubular member. The solder coils, having a proper flux to solder ratio which increases performance of the soldering sleeve by generating a better solder flow. The solder coils also have better heat adsorption and heat transfer characteristics than prior art solid solder inserts. The solder coils further have the advantage of forming a plurality of lines which provide a fail safe configuration as a visual cue to indicate when a proper amount of heat has been applied to the soldering sleeve.

Abstract: A method for making a manifold for a tube and fin type heat exchanger is disclosed wherein the manifold includes a solder strip. The manifold includes a channel having a base member and a pair of vertical walls, a plurality of fluid conducting passageways in the base member, and a solder strip disposed in the channel. The strip is secured in place by bending a portion of the wall over a longitudinal edge of the solder strip.

Abstract: A solder delivery and array device for soldering electronic components and/or IC chips to printed circuit boards (PCB) or substrates comprises solder performs with predetermined weight, size, shape, and a flexible retaining means with spaced openings according to the layout of pins or leads of the components and/or IC chips. The solder performs are positioned and fixed in the openings through mechanical locking. The devices are located between components and PCB or substrate during the soldering processing. By using these devices, through hole type components and surface mount type parts can be attached onto the PCB through heat reflow soldering at same time without the wave soldering process, and overheating can be avoided during the soldering process especially for the pin grid array component. Another bonus for the application of the device is shorting the required lead time for research and development in new electronic products.

Abstract: A method is available for forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts which is capable of forming a precise and fine pattern. The method comprises selectively imparting tackiness to only a predetermined part of the metallic surface by use of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Abstract: A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux.

Abstract: A composite blank is formed from an aluminum base blank and an aluminum brazing alloy clad material which is affixed to the base blank. Alternately, a multielement blank is formed by at least one base preform and at least one separate clad preform. The composite and multielement blanks are forged into required parts such that as the required parts are formed, the clad material forms an integral coating on the finished part in one or more positions which are to be clad. The composite blank may be formed by initially forming a base blank having one or more recesses on its surface into which clad material is inserted. Recesses can be formed in base blanks as slots during extrusion of the base blanks in a continuous form or otherwise. Clad material is then inserted into each slot on the continuous form with composite blanks being formed by cutting the resulting continuous form.

Abstract: A heat exchanger for an automobile air conditioning system and a method for manufacture of the same. The heat exchanger a plurality of refrigerant flowing tubes, a plurality of corrugated fins sandwiched between the tubes and a pair of header pipes liquid-tightly brazed and jointed to the opposite ends of the tubes respectively. Each of the header pipes is a hollow solid body produced by an extrusion of an aluminum material and having a flat section and a rounded section. The flat section includes a plurality of apertures for receiving the tubes and is thicker than the rounded section. Top and bottom support beams are not only brazed to the outermost corrugated fins but also jointed at their opposite ends to the flat sections of the header pipes. A plurality of brazing beads braze and liquid-tightly joint the opposite ends of the tubes to the first and second header pipes.

Abstract: A hermetic seal is provided for a conductive feedthrough through a thin ceramic component by a platinum or palladium lead by sealing the gap between the lead and the ceramic with a copper-copper oxide eutectic. The lead may have a copper coating on it prior to and subsequent to formation of the copper-copper oxide eutectic.

Abstract: The forward surface of a bit mount against which the shoulder of a cutting bit can rotatably bear has carbide inserts brazed therein to reduce wear of the forward surface. In the manufacture thereof, there are insert holes in the forward surface into which the carbide inserts are inserted. There are smaller holes next to the insert holes, and overlapping therewith, into which braze slugs are inserted. There is an interference fit between the carbide inserts and the braze slugs, which aids in retaining the carbide inserts in the insert holes during the brazing operation.

Abstract: A solder preform containing a series of islands that are joined together in a matrix by bridging bands. Each band has a reduced cross-sectional area in its midregion. In one form of this invention, at least some of the islands contain pin receiving holes formed therein and solder tabs that are arranged to frictionally engage a pin that is passed into the hole to prevent the preform from being misaligned or dislodged from the pins and which at the time of bonding, prewets the pins to promote flowing of solder to the pins from the islands to form a superior solder joint.

Abstract: A solder button may be attached to an elongated conductor by substantially surrounding a portion of the conductor with a mass of solder. The mass of solder may be crimped or heat welded into fixed position onto the elongated conductor, which is typically in ribbon form, with the solder being cut from a strip of solder by cutting and crimping means, the strip of solder being in transverse relation to the conductor at the crimping means. The elongated conductor, with attached solder buttons, may be attached by automated means in a single step to a plane of glass or the like.

Abstract: Cast solder preforms, rings or donuts suitable for use in a reflow solder process to interconnect through-hole pins in an electrical connector to plated through holes in a printed circuit board are disclosed. A plurality of solder donuts are cast into an array so that the plurality of donuts are initially formed as a single unit. The donuts can be either cast onto pins in a connector or cast onto a separate carrier for subsequent insertion onto the pins in a connector.

Abstract: The present invention provides a method for brazing a metal object to a ceramic surface defining a recess for receiving the metal object where the space between the metal object and the ceramic surface defining the recess inhibits the establishment of the oxygen depleted environment necessary to establish a reliable braze joint. The present invention includes the use of a material having a high affinity for oxygen that is positioned adjacent to the space between the metal object and the ceramic surface defining the recess and serves to pull or draw oxygen from the space to establish the oxygen depleted environment required to produce a reliable braze joint.

Abstract: According to the disclosed method for the soldering of wires of components, at least one wire is stamped to make it lose its symmetry of revolution. The result thereof is one or more impressions. A solder strip is crimped by deformation around the wire to form a solder preform held still by the impressions, which leaves free a surface of the wire. The component to be soldered, held against said surface of the wire, is soldered by reflow process. Application: the soldering of components such as disk ceramic capacitors.

Abstract: A method for replacing a damaged or defective section of a length of original piping or tubing located within a structrue such as the turbine of a jet engine wherein access to the tubing is limited, and replacing such damaged section with a new section of tubing comprises inserting a cutter mounted at one end of a flexible shaft into the interior of the original tubing and rotating the shaft to cut out and remove the damaged section of tubing leaving at least one stub section of original tubing. The stub sections of original tubing are then prepared for welding or brazing to a section of replacement tubing with a series of tools each mounted to an elongated shaft. These tools include a chamfering tool, a deburring tool, and a polishing tool.

Abstract: A method of applying solder to contacts of a connector, when the contacts are spaced apart according to a given arrangement. The method includes the steps of perforating a water-soluble adhesive material to form perforations in a pattern according to the given arrangement, applying solder preforms around the perforations, positioning the adhesive material to center the solder preforms around the contacts, washing off the adhesive material with water, and heating the contacts to the flow-point temperature of the solder.

Abstract: A solder button may be attached to an elongated conductor by substantially surrounding a portion of the conductor with a mass of solder. The mass of solder may be crimped or heat welded into fixed position onto the elongated conductor, which is typically in ribbon form, with the solder being cut from a strip of solder by cutting and crimping means, the strip of solder being in transverse relation to the conductor at the crimping means. The elongated conductor, with attached solder buttons, may be attached by automated means in a single step to a pane of glass or the like.

Abstract: A packaging technique for finely leaded electronic devices for attachment by surface methods to printed circuit boards is disclosed wherein the leads are imbedded in solder foil prior to the completion of lead forming operations so as to maintain planarity of the leads and to prevent damage thereto during handling, placement and attachment processes.

Abstract: Method and apparatus effective for emplacing a ring (52) at a selected axial location of a pipe (45) by reducing its diameter and establishing a circumferential bulge (146) adjacent to the selected location and ring (52), said bulge (146) cooperatively resisting axial displacmeent thereof and being in physical conformity therewith.

Abstract: A serpentine-type aluminum heat exchanger comprising a serpentine-anfractuous flat tube of an aluminum alloy, a plurality of corrugated fin units made of an aluminum alloy having a high aluminum content of 99 wt. % or more, and brazing metal coating layers fixed onto entire flat surfaces of parallel portions of the serpentine-anfractuous flat tube and for joining the flat tube and the fin units, is produced by preparing the serpentine-anfractuous flat tube of an aluminum alloy, the corrugated fin units and U-shaped members of an aluminum alloy brazing filler metal, closely fitting the U-shaped members onto the parallel portions of the flat tube, disposing the fin units in spaces between adjacent U-shaped members fitted onto the parallel portions of the flat tube, and heating the flat tube, the fin units and U-shaped members in the assembled relation to the brazing temperature.

Abstract: A circuit board connector (14) is assembled to a printed wiring board (11) by first aligning a plurality of leads (18) by urging them into spaced guide grooves (49) of a workholder (41). The spacing of the guide grooves (49) corresponds to the spacing of terminals, also referred to as solder lands (19) on the printed wiring board (11). Within the guide grooves (49) the leads (18) are retained against a possible, lateral resilient stress while a deformable material, such as a solder, is formed across the leads and into spaces between the leads (18). The solder temporarily retains the spacing between the leads while the leads are removed from the workholder and become aligned with the lands (19). During the assembly of the connector (14) to the printed wiring board (11), the leads become resiliently deflected perpendicularly to the plane of the printed wiring board (11). The deflection generates a resilient force which frictionally urges the leads and the lands into contact with each other.

Abstract: Disclosed is a method and apparatus for mechanically and metallurgically holding a cutter in a drill bit pocket. The method includes using powder metallurgy techniques in the formation of a drill bit member having a plurality of pockets configured to inhibit displacement of cutters out of the pockets in a direction transverse to the drill bit working surface. The method further includes the steps of metallurgically bonding and mechanically engaging the cutter with the cutter pocket. The drill bit manufactured in accordance with the methods of the present invention include a carbide menstrum drill bit head having a working surface with a plurality of fluid courses and nozzles thereon in adjacent relationship with a plurality of cutter blade bands comprising a series of cutter pockets having cutters disposed therein in a fashion parallel with the working surface.

Abstract: A leakproof soldered joint between overlying surfaces of two pieces of metal which are riveted together to bring areas of said surfaces into intimate contact with one another all around the holes through which the rivets pass, said joint being achieved by a method which, before the riveting operation, involves placement of thin washers of solder between said pieces of metal in register with aligning rivet holes therein, to establish a slight space between said pieces, and after the riveting operation, applying molten solder to all of the marginal edges of said overlying surfaces of the two pieces of metal so as to cause it to flow by capillary action between the entire areas of said overlying surfaces, and utilizing the heat of the molten solder to melt said washers and thereby cause molten solder therefrom to flow into any and all interstices between the rivets and the edges of the holes through which they pass.

Abstract: Providing solder on electrical spring contacts being stamped in a press by arranging the press to form a mounting section on the contact, position a segment of solder adjacent the mounting section, cut the segment, and then wrap the same over the mounting section.

Abstract: The invention relates to shielded cables and in particular to an electrically conductive junction between the conduit which shields the cable and the electrical connector at the end of the cable which serves as the cable termination. The invention comprehends an adapter back-shell for this junction which is a simple solder casting.

Abstract: In order to secure a copper spacer element between two wires while brazing the wires to the spacer, a brazing clip is provided with retaining members to aid in maintaining the brazing clip and the copper spacer between the wires during the brazing operation. Retention of the copper spacer element between the two wires is additionally facilitated by configuring the clip to retain the spacer element by means of spring forces.

Abstract: A method for fastening by brazing (hard-soldering) the blades of a rotor for a hydrodynamic torque converter or the like, in which the blades are fastened with respect to an inner shell by means of lugs which are extended through corresponding slots in the inner shell and are thereafter bent over; in the assembly, the blades are fixed in the given position in an outer shell by one circumferential clamping band each whereafter the inner shell is assembled by extending the lugs through the slots thereof and the lugs are thereafter bent over; a wire ring of soldering or brazing material is then applied at least within the joint area of the outer clamping band with the outer shell and the assembly is then heated, preferably in a protective gas atmosphere to a temperature above the melting temperature of the soldering or brazing material; after the soldering or brazing material has run into the gaps and cracks the assembly is then cooled.

Abstract: An apparatus consisting of a pair of rollers with tangentially meeting perimeters for crimping successive portions of a continuous strip of solder into rings around a strip of terminal posts carried in parallel manner upon a common carrier strip. The roller perimeters each contain a circumferential track of crimping ridges which are both axially and angularly positioned to coincide with corresponding ridges on the other roller to crimp said solder strip around each post on the strip of terminal posts, both strips being simultaneously passed between the crimping tracks on said rollers. Each roller also comprises a circumferential track of spur-type gear teeth, the two tracks being axially offset on opposite sides of said crimping tracks and having bottom lands (the troughs of the teeth) which coincide when the teeth pass through the common tangential or pitch plane of the rollers.