Wire Lead Bonder Patents (Class 228/4.5)
  • Patent number: 11004822
    Abstract: This wire clamp apparatus calibration method comprises: a step for driving a driving piezoelectric element by applying a predetermined frequency that causes a pair of arm portions to vibrate in an opening/closing direction; a step for detecting whether or not end portions of the pair of arm portions collide with each other on the basis of an output current outputted from the driving piezoelectric element when the pair of arm portions are vibrating in the opening/closing direction; a step for calculating, on the basis of the detection result, reference voltages in a state where the pair of arm portions are closed; and a step for performing calibration of a drive voltage to be applied to the driving piezoelectric element on the basis of the reference voltages. Accordingly, accuracy improvement and stabilization in an opening/closing operation of the wire clamp apparatus can be achieved.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: May 11, 2021
    Assignee: SHINKAWA LTD.
    Inventors: Yohei Uchida, Naoya Taira
  • Patent number: 10882134
    Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The weld head assembly is moveable along a plurality of substantially horizontal axes. The sonotrode is configured to operate during a welding operation at a bond force of between 5-500 kg, and with a sonotrode tip motion amplitude of between 5-150 microns.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: January 5, 2021
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Christoph B. Luechinger, Orlando L. Valentin
  • Patent number: 10847491
    Abstract: A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (a) a first planar portion between the region and the front edge of the tip portion, and (b) a second planar portion between the region and the back edge of the tip portion.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: November 24, 2020
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Mark A. Delsman, Theodore J. Copperthite, Garrett W. Jones, Todd J. Walker, Tick-Kwang Loh, Jay C. McCandless
  • Patent number: 10679962
    Abstract: A jig for holding a wire bonding capillary includes a first arm and an opening in the first arm, wherein a wire bonding capillary is receivable within the opening. A second arm is pivotally attached to the first arm. The second arm has a surface facing the first arm, wherein the surface is contactable with a capillary mount of a wire bonding machine.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: June 9, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Mohd Azri Hashim, Mohd Muzamir Kamalluddin
  • Patent number: 10361169
    Abstract: A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: July 23, 2019
    Assignee: International Test Solutions, Inc.
    Inventors: Alan E. Humphrey, Wayne C. Smith, Janakraj Shivlal, Bret A. Humphrey
  • Patent number: 10195685
    Abstract: A capillary alignment tool for installing a new capillary in the transducer on a wire bonding machine. A capillary alignment tool for installing a new capillary in a transducer on wire bonding machine. A method for installing a new capillary in the transducer of a wire bonding machine using the capillary alignment tool.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: February 5, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Elmer Rad Bais Tabio, Pablo E. Remogat, Jr., Rolando B. Zarraga, Jr., Armando U. Carrera, II
  • Patent number: 10147701
    Abstract: There is provided with a surface for contacting a wire. At least a part of the surface comprises a surface of a ceramic sintered body containing aluminum oxide as a main ingredient and titanium carbide as an accessory ingredient.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: December 4, 2018
    Assignee: KYOCERA CORPORATION
    Inventor: Hidekazu Shigeyoshi
  • Patent number: 10086453
    Abstract: This process for manufacturing a closed loop of cutting wire comprises manufacturing a cutting wire comprising a central core extending continuously between two free ends. The central core having a tensile strength higher than 1400 MPa. The process includes welding the two free ends together to form the closed loop of cutting wire, in which: the manufacture of the cutting wire comprises making the central core from a material that is solid-state weldable. The welding is a solid-state welding operation comprising crushing, at a temperature below the melting point of the material of the central core, one of the free ends against the other of its free ends until the two ends have interpenetrated and formed a single uniform body of material.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: October 2, 2018
    Assignee: THERMOCOMPACT
    Inventor: GĂ©rald Sanchez
  • Patent number: 10050008
    Abstract: A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: August 14, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Shui Cheung Woo, Liang Hong Tang, Wan Yin Yau
  • Patent number: 9889521
    Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: February 13, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Keng Yew Song, Yi Bin Wang, Qing Le Tan, Lin Wei Zheng, Jia Le Luo
  • Patent number: 9772012
    Abstract: A driving mechanism including a first rod (103a), a second rod (104a), a first planar motor (106) moving on a plane, a center planar motor (105) moving on the plane and a moving portion (101), in which one end of the first rod is rotatably connected to the moving portion by a first rotation fulcrum (125a), the other end of the first rod is rotatably connected to the first planar motor by a second rotation fulcrum (126a), one end of the second rod is rotatably connected by a third rotation fulcrum (128a) provided on the first rod. The other end of the second rod is rotatably connected to the center planar motor by a fourth rotation fulcrum (127a), and the moving portion is moved so as to recede from the center planar motor when the first planar motor is moved near to the center planar motor.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: September 26, 2017
    Assignee: KAIJO CORPORATION
    Inventor: Shuichi Takanami
  • Patent number: 9682589
    Abstract: An apparatus has a first structure, an adhesive layer having a first height adhered to the first structure, the adhesive layer having an array of openings, the adhesive layer having a region adjacent each opening having a height less than a first height. A print head has a stack of plates forming a jet stack, the jet stack having a nozzle plate with an array of nozzles, an array of transducers in contact with the jet stack opposite the nozzle plate, an adhesive layer having a first height adhered to the array of transducers, the adhesive layer having openings adjacent the transducers and regions adjacent the openings having a height less than the first height, and a conductive material in the openings of the adhesive layer in contact with the transducers.
    Type: Grant
    Filed: January 19, 2015
    Date of Patent: June 20, 2017
    Assignee: XEROX CORPORATION
    Inventors: Chad D. Freitag, Chanthy Luy, Samuel V. Schultz, Garry A. Jones
  • Patent number: 9461013
    Abstract: Disclosed is a wire spool system for a wire bonding apparatus, comprising: a wire reel arranged to receive a wire; a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus; and a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide. The wire spool system comprises an imaging module comprising a camera having an image sensor. The imaging module also comprises an image processing unit. The camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data. The image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: October 4, 2016
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Chi Wah Cheng, Hon Kam Ng
  • Patent number: 9446524
    Abstract: A wire clamp includes a clamp body; a pair of arms coupled to the clamp body; and a piezoelectric actuator having a longitudinal axis extending between a first end and a second end, the actuator being coupled to the pair of arms at the first end and to the clamp body at the second end. The second end of the actuator is coupled to the clamp body by a preload mechanism for applying a preload force along the longitudinal axis, and the preload mechanism comprises at least one wedge having an inclined surface which is slidable over a mating inclined surface.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: September 20, 2016
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Yue Zhang, Chong Hao Chen, Zheng Yu Lin
  • Patent number: 9401561
    Abstract: An exemplary header insert assembly, and methods of manufacture and use thereof. In one embodiment, the header insert assembly comprises a connector insert assembly having an insert body assembly consisting of an insert body element. The insert body element includes an electronic component receiving cavity that is configured to receive any number of electronic components. The insert body assembly also includes a wire termination feature that includes termination slots that position the wire ends of the wire wound electronic components adjacent to a substrate to which the wire ends are ultimately to be secured. The wire ends are then secured to the substrate using, for example, a mass termination technique. The aforementioned header insert assembly can then be optionally inserted into a single or multi-port connector assembly. Methods of manufacturing the aforementioned single or multi-port connector assemblies are also disclosed.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: July 26, 2016
    Assignee: Pulse Electronics, Inc.
    Inventors: Hengshan Zhou, Yonggang Wang
  • Patent number: 9209147
    Abstract: A method of forming a pillar bump includes feeding a bond wire in a capillary. The capillary has a hole portion and a chamfer section arranged downstream of the hole portion. The hole portion has a length along a feed direction of the bond wire that is greater than a maximum diameter of the hole portion. The method further includes performing an electric flame off (EFO) on a free end of the bond wire extending from the chamfer section to form a free air ball (FAB), tensioning the bond wire and applying a vacuum to the capillary to withdraw a portion of the FAB back into the capillary to substantially fill the hole portion for forming a tower, attaching the FAB to a bonding site, and at least partially removing the capillary from the bonding site and breaking the bond wire above the tower.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: December 8, 2015
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Chee Seng Foong, Lee Fee Ngion, Navas Khan Oratti Kalandar, Zi Song Poh
  • Patent number: 9171790
    Abstract: Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: October 27, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Yung Ching Chen, Chien-Hsun Lee, Jiun Yi Wu, Mirng-Ji Lii, Ming-Da Cheng
  • Patent number: 9136254
    Abstract: Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: September 15, 2015
    Assignee: Invensas Corporation
    Inventors: Zhijun Zhao, Roseann Alatorre
  • Patent number: 9126312
    Abstract: A positioning fixture includes a support base and two clamping assemblies. The support base includes a support surface defining a positioning hole and two sliding slots. The two clamping assemblies are mounted in the two sliding slots respectively, and partly protruding out from the support surface. Each of the clamping assemblies includes a pair of clamping blocks and a pair of elastic members. The pair of clamping blocks is slidably engaged in the corresponding sliding slot. The pair of elastic members is mounted in two ends of the corresponding sliding slot to resist one of the pair of the clamping blocks against the other one of the pair of the clamping blocks, respectively, such that the pair of the clamping blocks is capable of abutting and resisting each other.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: September 8, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Min-Tsang Tseng
  • Patent number: 8998063
    Abstract: A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: April 7, 2015
    Assignee: Orthodyne Electronics Corporation
    Inventor: Jonathan Michael Byars
  • Publication number: 20150024589
    Abstract: Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter.
    Type: Application
    Filed: January 22, 2013
    Publication date: January 22, 2015
    Inventor: Jean Brun
  • Publication number: 20150008254
    Abstract: A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.
    Type: Application
    Filed: June 25, 2014
    Publication date: January 8, 2015
    Inventors: Matthew B. Wasserman, Michael P. Schmidt-Lange
  • Patent number: 8893953
    Abstract: A wire bonding method in a circuit device mounted on a lead frame, the wire bonding method including: counting a stop time if an operation of a capillary stops; removing a contaminated free air ball (FAB) formed on an end of the capillary if the stop time exceeds a reference time; forming a new FAB; and restarting a wire bonding process.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: November 25, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Joon-gil Lee
  • Publication number: 20140332583
    Abstract: Provided is a wire bonding apparatus including: a base (11); a bonding head (13) configured to move a capillary (15) in X, Y, and Z directions with respect to the base (11); and a wire-cleaning plasma unit (30). The wire-cleaning plasma unit (30) includes: hollow casings (31a), (31b) in which an inert gas is introduced so that an internal pressure is higher than an atmospheric pressure; holes (33a), (33b) respectively provided in the casings (31a), (31b) so that the wire (21) is inserted therebetween; and electrodes for plasma respectively disposed within the casings (31a), (31b) around circumferences of the holes (33a), (33b). The wire (21) is cleaned by having the wire (21) be inserted into plasma generated within the casings (31a), (31b) in a state in which air is not contained. With this, a surface of the wire used for wire bonding can be effectively cleaned.
    Type: Application
    Filed: July 24, 2014
    Publication date: November 13, 2014
    Applicant: SHINKAWA LTD.
    Inventor: Toru MAEDA
  • Patent number: 8881966
    Abstract: An improvement in the quality of wire bonding is achieved by reducing the vibration of a lead frame or a wiring substrate after wire bonding. Over a heat block in a wire bond portion of a wire bonder, there is provided a cooling blower for cooling a wire-bonded matrix frame so that the temperature thereof may decrease stepwise. After wire bonding, cold air is blown from the cooling blower to the matrix frame, and temperature control of the matrix frame is performed so that the temperature of the matrix frame after wire bonding may decrease stepwise. Or, the wire-bonded matrix frame is fixed with a holding tool such as a frame holding member, a guide member, a roller means, or an elastic means until cooling is completed.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: November 11, 2014
    Assignee: Renesas Electronics Corporation
    Inventors: Kazuyuki Misumi, Hideyuki Arakawa, Shunji Yamauchi, Mitsuru Aoki
  • Publication number: 20140319199
    Abstract: A multi-functional detachable and replaceable wire bonding heating plate is provided with a heat blocking layer, a heating layer, a heat equalization layer, and a top layer. The bottom of the heat blocking layer has a recessed portion and the heating layer is disposed on top of the heat blocking layer. The heat equalization layer is disposed on top of the heating layer. A detachable and replaceable top layer is disposed on top of the heat equalization layer wherein a protruding support block is disposed on top of the top layer. The heat equalization layer and the top layer can be securely bonded to each other by the attraction force method, the engaging method, and the vacuum method. The invention allows the top layer to be timely detached and properly replaced to meet the specifications of different lead frames or PCB substrates and can reduce the production cost.
    Type: Application
    Filed: April 30, 2014
    Publication date: October 30, 2014
    Applicant: Pram Technology Inc.
    Inventor: Wen-Long Liu
  • Patent number: 8870052
    Abstract: A method and apparatus for welding lines having metallic braids or strands to form an end node or transit node by introducing a first portion of each line into a compression space of an ultrasonic welding apparatus, wherein the first portions run along a straight line, wherein at least one line has a component at a distance from the end node or transit node to be welded, and at least the line which has the component is attenuated between the compression space and the contact element in a second portion by a change in profile of the line which is imposed using a deflection device. To this end, the line which has the component is oriented in extension of the straight line.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: October 28, 2014
    Assignee: Schunk Sonosystems GmbH
    Inventors: Sebastian Ruhl, Heiko Strobel, Sinan Koc, Peter Wagner, Dieter Stroh
  • Publication number: 20140263584
    Abstract: A method of making an electrical connection includes passing a bond wire through a wire bonding system having a wire polisher and a wire bonding tool. The wire polisher removes contamination from a first portion of the bond wire. A first bond is then formed by bonding the first portion of the bond wire to a first contact such that the bond wire and the first device are electrically connected. A second bond is then formed by bonding a second portion of the bond wire to a second contact such that the first contact and the second contact are electrically connected.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Inventors: Jia Lin Yap, Yin Kheng Au, Poh Leng Eu, Hung Yang Leong, Mohd Rusli Ibrahim, Navas Khan Oratti Kalandar, Mohd Faizal Zul-Kifli
  • Patent number: 8820609
    Abstract: A wire bonding tool including a body portion terminating in a tip portion is provided. The tip portion includes opposing walls defining a groove, each of the opposing walls having a curved profile.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: September 2, 2014
    Assignee: Orthodyne Electronics Corporation
    Inventor: Todd J. Walker
  • Publication number: 20140217152
    Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
    Type: Application
    Filed: April 7, 2014
    Publication date: August 7, 2014
    Inventors: Phui Phoong CHUANG, Hasrul Bin HASIM, Wan AZMI, Siti Nurulhaida Bt. RAMLAN, Ka Shing KWAN, Ting Yu HE, Jun WAN
  • Patent number: 8796826
    Abstract: A device and method for minimizing the forces that may compromise a lead frame mount to a support structure in an integrated circuit die package during various packaging method steps. When a window clamp is used to provide pressure during a lead frame bonding step or during a wire bonding step during packaging, the vertical force applied by the window clamp may be transferred in lateral direction by the physical contour of the top plate of the support structure. By changing the physical contour of the top plate of the support structure, such as by disposing a specific kind of contoured protrusion, one may minimize or eliminate the lateral forces that act against achieving a solid bond of the lead frame to the support structure. Further, during wire bonding, the same minimization or elimination of lateral forces lead to improved wire bonding.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: August 5, 2014
    Assignee: STMicroelectronics Pte Ltd
    Inventors: Xueren Zhang, Kim-Yong Goh, Wingshenq Wong
  • Publication number: 20140209663
    Abstract: Disclosed is a wire bonder comprising: a processor; a bond head coupled to the processor, the processor being configured to control motion of the bond head; a bonding tool mounted to the bond head, the bonding tool being drivable by the bond head to form an electrical interconnection between a semiconductor die and a substrate to which the semiconductor die is mounted using a bonding wire; and a measuring device coupled to the bond head, the measuring device being operable to measure a deformation of a bonding portion of the bonding wire as the bonding tool is driven by the bond head to connect the bonding wire to the semiconductor die via the bonding portion.
    Type: Application
    Filed: January 23, 2014
    Publication date: July 31, 2014
    Inventors: Keng Yew SONG, Wai Wah LEE, Yi Bin WANG
  • Publication number: 20140203065
    Abstract: An ultra-fine pitch wedge bonding tool and method for its manufacture are disclosed. The wedge tool is formed with a foot width calculated to enable accurate bonding of wires separated at an ultra-fine pitch. The wedge tool is made out of a tungsten carbide alloy having characteristics conforming to specified constraints that lead to improved performance and enable the use of thicker wire. A pocket is formed at the tip of the wedge tool and a wire feeding hole is formed from the rear side of the tool and exiting inside the pocket, at an elevation above the bonding foot. Side walls are provided on both sides of the pocket to guide the wire exiting the feed hole inside the pocket towards the bonding foot.
    Type: Application
    Filed: January 22, 2014
    Publication date: July 24, 2014
    Applicant: Micro Point Pro LTD.
    Inventors: Uri Zaks, Irina Voskoboynikov, Yefim Prosso, Irina Sastiel
  • Patent number: 8777086
    Abstract: A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: July 15, 2014
    Assignee: ASM Technology Singapore Pte. Ltd.
    Inventors: Jiang Wen Deng, Hei Lam Chang, Tim Wai Mak
  • Patent number: 8752751
    Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: June 17, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Phui Phoong Chuang, Hasrul Bin Hasim, Wan Azmi, Siti Nurulhaida Bt. Ramlan, Ka Shing Kwan, Ting Yu He, Jun Wan
  • Patent number: 8746537
    Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: June 10, 2014
    Assignee: Orthodyne Electronics Corporation
    Inventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
  • Publication number: 20140151341
    Abstract: Provided with a wire bonding apparatus capable of preventing oxidation of a surface of a free air ball. The apparatus is provided with: a capillary for bonding a wire to each electrode; a horizontal plate provided with a through hole allowing a tip of the capillary to be inserted and removed; and a first and a second antioxidant gas flow channel for allowing an antioxidant gas to be blown to a center of the through hole along an upper surface of the horizontal plate, the gas from the second channel being blown in a direction substantially intersecting with a direction in which the first channel extends. The horizontal plate is configured such that the antioxidant gas on the upper surface of the horizontal plate is allowed to flow outside the horizontal plate from its edges, where no antioxidant gas flow channel is disposed.
    Type: Application
    Filed: February 3, 2014
    Publication date: June 5, 2014
    Applicant: Shinkawa Ltd.
    Inventors: Katsutoshi KUNIYOSHI, Hayato KIUCHI
  • Publication number: 20140138426
    Abstract: Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed.
    Type: Application
    Filed: November 15, 2013
    Publication date: May 22, 2014
    Applicant: Shinkawa Ltd.
    Inventors: Yoshihito HAGIWARA, Naoki SEKINE, Koichi TAKAHASHI, Yasuo NAGASHIMA, Motoki NAKAZAWA
  • Patent number: 8720767
    Abstract: In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: May 13, 2014
    Assignee: Orthodyne Electronics Corporation
    Inventors: Jonathan Byars, Theodore J. Copperthite
  • Patent number: 8707550
    Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: April 29, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Keng Yew James Song, Ka Shing Kenny Kwan, Choong Kead Leslie Lum, Ting Yu He
  • Publication number: 20140110461
    Abstract: A system for cleaning bond wire for use by a wire bonding machine includes a bond wire supply station, a bond wire cleaning bath station, a bond wire neutralizing station, a bond wire drying station, and a wire bonding machine. In operation, the bonding machine is supplied with bond wire stored at the supply station, which is firstly de-oxidized with a cleaning solution in the cleaning bath station. Next, the cleaning solution on the bond wire is neutralized with a neutralizing liquid in the neutralizing station. The bond wire is then dried in the drying station. The speed of the bond wire passing through the cleaning bath station, neutralizing station and drying station is controlled by the wire bonding machine.
    Type: Application
    Filed: December 16, 2012
    Publication date: April 24, 2014
    Inventors: Mohd Rusli Ibrahim, Yin Kheng Au, Poh Leng Eu
  • Publication number: 20140103096
    Abstract: A wire bonding machine and a method for testing wire bond connection s using the wire bonding machine. The method includes providing a semiconductor assembly that has a semiconductor die mounted to a substrate, each of which has bonding pads. The method includes bonding a wire to one of the bonding pads to form a first wire bond. A shear force then is applied to the first wire bond. A fault signal is generated when a sensor detects the first wire bond moving during application of the shear force.
    Type: Application
    Filed: April 17, 2013
    Publication date: April 17, 2014
    Inventors: Hanmin Zhang, Qingchun He, Liqiang Xu, Fei Zong
  • Patent number: 8678266
    Abstract: A wire bonding method for bonding a ball 11 which is formed at a tip end of a bonding wire to a pad 2 that is a first bond point to form a first bonding part 12 and bonding the wire 10 to an interconnect wiring 4 that is a second bond point to form a second bonding part, thus connecting the pad 2 and the interconnect wiring with the wire, wherein after the ball is bonded to the first bond point and a capillary 6 is ascended, examination is performed to find any bonding failure of the first bonding part; and when the bonding failure at the first bond point is found, then the capillary is caused to descend to execute bonding to bond the first bonding part to the first bond point.
    Type: Grant
    Filed: February 24, 2006
    Date of Patent: March 25, 2014
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Tatsunari Mii, Toshihiko Toyama
  • Patent number: 8672210
    Abstract: A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: March 18, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young Sik Kim, Doo Jin Kim, Sung Bok Hong, Ki Taik Oh
  • Patent number: 8657180
    Abstract: For selecting suitable bonding parameters for forming wire bonds onto bond pads of a substrate, one or more indentations are made onto at least one bond pad of the substrate with an indentation tool by applying a series of predetermined forces onto the at least one bond pad with the indentation tool. A depth-force profile of the substrate is measured comprising a relationship between each predetermined force that is applied and a resultant depth of the indentation made by the indentation tool. An appropriate set of bonding parameters suitable for forming wire bonds on the substrate is determined based on the measured depth-force profile.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: February 25, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Ming Li, Dewen Tian, Madhukumar Janardhanan Pillai
  • Patent number: 8657181
    Abstract: Disclosed is a wedge bonder, comprising a wedge for bonding a wire to surfaces to form an electrical interconnection therebetween, a cleaning device for cleaning the wedge, and a positioning device to which the wedge is mounted. In particular, the positioning device is operative to move the wedge to the cleaning device for cleaning. A method of cleaning a wedge of a wedge bonder is also disclosed.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: February 25, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Chi Wah Cheng, Man Kit Mui
  • Patent number: 8651355
    Abstract: To provide a bonding apparatus capable of bonding at a high speed without performing a height measurement of a bonding point before a searching operation and the bonding. A confocal optical system mounted on a bonding arm pivotable upward and downward and configured to perform detection of a focus of a bonding point located on a surface of a bonded part, a bonding tool configured to be movable integrally with the bonding arm and perform bonding, and position detecting means configured to detect the position of the bonding tool, wherein the bonding tool is configured to move downward by a predetermined distance from a position of the bonding tool detected by the position detecting means by focus detection by the confocal optical system to a preset bonding point (amount of downward movement from a focus) during the downward movement of the bonding tool to the bonding point and stop on the bonding point.
    Type: Grant
    Filed: May 28, 2012
    Date of Patent: February 18, 2014
    Assignee: Kaijo Corporation
    Inventor: Akio Sugito
  • Patent number: 8651360
    Abstract: An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: February 18, 2014
    Assignee: Orthodyne Electronics Corporation
    Inventor: Vahid Safavi Ardebili
  • Patent number: 8646675
    Abstract: The invention relates to a laying device which is used to lay wire windings on transponder units, wherein the wire is guided in an axial manner in the laying device, a contacting device is used place the wires in contact with an automatic thermal clamping arrangement, an advancing system is used to advance machining devices by means of a piezo-leg-motor, a production system is used to produce transponder units in a console structural manner. The invention also relates to a method for the production of transponder units with horizontal ultrasonic introduction and a transponder unit wherein the wire ends engage directly on the ends of the connection surfaces of the chip.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: February 11, 2014
    Assignee: HID Global GmbH
    Inventor: Ulrich Lang
  • Publication number: 20140034712
    Abstract: In wire bonding in which a bonding tool is cleaned through plasma irradiation, the plasma application to a wire and therefore the formation of an unexpectedly large-sized ball in the following bonding operation is prevented. The cleaning of the bonding tool through plasma irradiation is followed by dummy bonding, the bonding tool is cleaned with a ball formed thereon, or a prohibition period is provided during which ball forming is prohibited until the energy of plasma attenuates after the bonding tool is cleaned to prevent the plasma irradiation from having an impact on the bonding operation so that the ball cannot have an increased diameter.
    Type: Application
    Filed: October 4, 2013
    Publication date: February 6, 2014
    Applicant: Shinkawa Ltd.
    Inventors: Toru Maeda, Tetsuya Utano