Abstract: An auxiliary control apparatus mechanically couples forces exerted on a manually operable auxiliary hand control knob to an input member of a micro-manipulator of the type used to move a point of an object such as an ultrasonic bonding tool tip relative to a workpiece in scaled ratios of motions at an end of the micro-manipulator input member. The apparatus includes a 4-bar parallelogram linkage which is mounted to a structural support member of a micro-manipulator, and which includes a rear laterally disposed lateral linkage bar pivotably connected to inner and outer parallel longitudinally disposed linkage bars which are pivotably coupled at front ends thereof to a front laterally disposed linkage bar.

Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.

Abstract: A method is provided for low loop wire bonding. The method includes forming a first bond between a first bonding ball disposed at an end of a first wire and a bond pad of a die coupled to a leadframe having one or more leads. The method also includes forming a second bond between a portion of the wire and a lead of the leadframe. The length of wire between the first and second bonds forms a loop in the wire having a first loop height. The method further includes disposing a second bonding ball on top of the first bonding ball, a portion of the loop being compressed between the first and second bonding balls. The compressed loop has a second loop height less than the first loop height. The method also includes forming a third bond between the second bonding ball, the wire, and the first bonding ball.

Abstract: A wire bonding apparatus includes a heat block (121) and a heat plate (122) provided on the heat block (121). A recess (1221) is provided in the heat plate (122) to receive the first semiconductor chip (41) and wires (51) without contact therewith when the lead frame (50) is provided on the heat plate (122) such that the first main surface (501) of the lead frame (50) faces toward heat plate. A duct (13) is provided in the heat plate (122) to connect the recess (1221) to the outside of the heat plate (122). A gas supplied through the duct (13) is heated by a heater (14) and discharged into the recess (1221).

Abstract: A bonding tool includes a body portion terminating at a tip portion. The tip portion is formed from a material, wherein a grain structure of the material is exposed for at least a portion of the tip portion.

Abstract: A method for performing a wire-bonding operation in an integrated circuit utilizes a bonding tool. A wire is bonded to a first bond site in the integrated circuit, and terminated at a second bond site in the integrated circuit. The bonding and terminating steps are repeated for a plurality of additional wire bonds of the integrated circuit. At least two wire bonds in the integrated circuit are substantially perpendicular to one another at a crossing point in a plan view of the integrated circuit.

Abstract: The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an ultrasonic tool. According to the invention, at least the surrounding area of the reference element, especially the tip of the ultrasonic tool, is optically detected by means of a camera and is displayed in an image on a display device. A marking is superimposed in the display in order to facilitate positioning. The invention also relates to an ultrasonic bonder comprising a camera which is used to support the positioning of a bond head element. Said camera can optically detect at least the area surrounding the reference element, especially the tip of the ultrasonic tool.

Abstract: Wire bonder having a bonding head which has a bonding tool and a bonding wire guide and, especially, a bonding wire cutting device which comprises a cutter for separation of that section of a bonding wire which projects beyond a bonding contact, the wire bonder having a camera with a downstream image processing device for recording and processing an image of its working region at a workpiece.

Abstract: This invention is for a wedge for bonding an elongated conductor, such as a wire, to a bond pad on a microelectronic device. A wire passes through an aperture in the wedge into a pocket or an open notch. A sidewall on each side of the pocket or open notch prevents the wire from moving sideways. The wire passes over a foot that extends below the sidewalls by an amount sufficient to prevent the sidewalls from contacting the surface of the microelectronic device during bonding. The wire is bonded to a bond pad on a microelectronic device by feeding the wire through the aperture of the wedge and over the foot, pressing said wire between the foot and the bond pad, and applying bonding energy, such as ultrasonic energy, to the wire.

Abstract: A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure.

Abstract: A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.

Abstract: System and method for creating single stud bumps having an increased stand-off height. A preferred embodiment comprises a capillary for use in creating stud bumps in a flip chip assembly, comprising a hole section adapted to pass a wire, a chamfer section providing a transition from the hole section to a stud bump section, and a sidewall within the stud bump section, the sidewall having a sidewall height, wherein the side wall height is equal to, or greater than, the a diameter of the stud bump section.

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: An apparatus for wire bonding and a capillary tool thereof are provided. An exemplary embodiment of a capillary tool capable of a wire bonding comprises a body having a first internal channel of a first diameter for accommodating a flow of a conductive wire. A compressible head is connected to the body, having a second internal channel of a second diameter for accommodating the flow of the conductive wire, wherein the first diameter is fixed and the second diameter is variable, the second diameter is not more than the first diameter and a diameter the conductive wire flowed through the compressible head is adjustable. An integrated circuit (IC) package is also provided.

Abstract: Means to increase the UPH of TAB bonding on an HSA manufacturing line to allow a higher UPH to keep cost down and also allow the use of one or more grounds to be add to an HSA to help control ESD without lowering the UPH or redesigning the lines through the use of a multi-head contact TAB bonding tool as described herein A bonding tool for use in tape automated bonding (TAB) is provided that is for multi-contact. The multi-contact TAB bonding tool is ESD safe so as not to damage a device being bonded.

Abstract: In the manufacture of electronic devices (22, 22?), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use of the wedge-tip (1) at one end (11) for bonding wires (21), the tip (1) is worn somewhat. Instead of needing to replace the bond tool as in the prior art, the tool (10) in accordance with the invention is then reversed to use the wedge-tip (2) at the opposite end (12) for bonding further wires (20?). Thus, a cost saving is achieved with regard to tool material.

Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.

Abstract: A filament attachment system includes a bond head comprising a de-spooling system with a spool and balanced dancer arm assembly, a clamp having a curved filament entry, a narrower gripping region, and a wider filament exit, and a bond tool comprising a guide portion, a grooving portion, and a staking portion. The grooving portion forms a groove into a bond and the staking portion closes the groove over the filament, securing the filament in the bond. Thus, the filament can be attached with a single pass of the bond head using a single bond.

Abstract: A capillary tip for a wire bonding tool has a chamfer provided with at least one annular groove. The annular groove is generally oriented in a plane perpendicular to the axis of the capillary. In a sectional view through the capillary axis, the groove profile may be generally part-oval or part circular, such as semicircular or half-oval; or generally rectangular; or generally triangular. In some embodiments the width of the groove profile at the face of the chamfer is at least about one-tenth, more usually at least about one-fifth, the length of the chamfer face; and less than about one-half, more usually less than about one-third, the length of the chamfer face. In some embodiments two or more such grooves are provided. The grooved chamfer can improve the transmission of ultrasonic energy to the wire ball during formation of the bond.

Abstract: A wire bonding apparatus 10 including an X table 18 guided to move in the X direction on an XY table base 14 and a driving motor 20 mounted on a motor base 16 with the movable element 22 of the driving motor 20 connected to the X table 18. The motor main body 24 is guided by a pair of motor guides 26 so as to be movable in the X direction via the laminated bodies 40. In each laminated body 40, viscoelastic flat rubber plates that have a spring element and a damping element, and flat rigid plates, are alternately disposed and laminated, so that the rigidity is large in the direction perpendicular to the laminated surfaces, and the rigidity is small in the direction parallel to the laminated surfaces, and the laminated bodies have a recovery force and a damping force due to the viscoelasticity.

Abstract: A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 that rotate about the rotational center 13 of the bonding arm 1 are attached to the bonding arm 1, and the rotating shaft parts 21 of circular arc form air bearings 20 that rotate about this rotational center 13 are provided so that the rotating shaft parts of the circular arc form air bearings 20 are rotatable as a unit with the rotating shaft parts 11 of the rotary motors 10.

Abstract: A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links.

Abstract: In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top of the ball bond bump without severing the wire. This is then followed by a further set of coordinated xy motions to from the loop and bring the capillary over the second bond site (e.g., on the lead frame). The wire is then stitch bonded to the second bond site and the tail severed to complete the wire loop interconnect.

Abstract: A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position sensor 29 that detects the position of the bonding arm 20 in the vertical direction. This computer 41 includes a memory 60, which stores the detected position of the capillary 5 at the time that secondary bonding is performed on a bump that is formed in a normal manner on the second conductor, and a comparator circuit 61, which outputs a “bump not-adhered” signal in cases where the output value of the height position counter 44 is outside the permissible error range of the detected position that is stored in the memory 60.

Abstract: An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main body with an elongated slot having a width that extends into the main body from a side of the main body generally in a first direction and the slot also extends from a top surface to a bottom surface of the main body in a second direction perpendicular to the first direction for the width of the slot. The slot is sized to receive a tip of the capillary which is operable to pass through the slot in the second direction. A gas outlet, which may be formed inside the slot, supplies shielding gas into the slot.

Abstract: An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical connector fixes to the spool and is configured to receive an electrical connection with the uninsulated end-portion of said insulated wire. A stationary electrical contact is provided for connecting to a ground. The stationary electrical contact is further configured to be placed about the shaft. A conductive bearing is also provided. The conductive bearing is configured to be placed about the shaft and between the electrical connector and the electrical contact. The conductive bearing electrically couples the electrical connector to said stationary electrical contact, thereby providing said ground to said uninsulated end-portion of said insulated bond wire. A wire-bonder including such a contact device and a method for making such a wire-bonder are also provided.

Abstract: A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At least one sensor is attached to the bondhead that detects vibrations of the bondhead and at least one actuator is arranged between the flange and the rocker that enables movement of the horn relative to the rocker. From an output signal delivered by the at least one sensor, a control device calculates a control signal for the at least one actuator and drives the at least one actuator in order to eliminate or at least reduce vibrations of the horn. The at least one sensor is preferably arranged on the rocker and is preferably an acceleration sensor.

Abstract: A transducer assembly and wire bonding method has a vibration unit for generating an ultrasonic wave. A body section is coupled to the vibration unit for transferring the ultrasonic wave. A tapered horn is coupled to the body section for transferring and concentrating the ultrasonic wave. A capillary is coupled to a front section of the horn. The capillary has a channel running the length thereof. A wire is inserted through the channel. A discharge device is coupled to the capillary for forming a ball on the wire for wire bonding.

Abstract: A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.

Abstract: A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the bonding tool in a vertical direction and translates the bonding tool along a first horizontal axis. A work table supports at least one semiconductor device to be wire bonded. A work table conveyance system translates the semiconductor device along a second horizontal axis.

Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.

Abstract: An apparatus and method for automatically controlling a clamp gap between clamping arms of a wire clamp is provided wherein a motor generates an actuation force for moving the clamping arms relative to each other. A resilient member is positioned such that the actuation force acts upon and flexes the resilient member to an extent that is proportional to the clamp gap, and the clamp gap is controlled by adjusting the amount of actuation force according to a predetermined relationship between the actuation force and the clamp gap.

Abstract: A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a first orifice extending from a first end of the body portion to the working tip; and at least one second orifice extending from an outer portion of the working tip and communicating with the first orifice, wherein the vacuum source is coupled to the body portion so that a vacuum generated by the vacuum source is provided to the at least one second orifice.

Abstract: The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.

Abstract: A flange-mounted transducer, such as an ultrasonic transducer, is provided that comprises a horn and a driver coupled to the horn for generating an oscillatory energy supply to the horn. A support structure interface is positioned at a node of longitudinal oscillatory displacement of the transducer and a support structure spaced from the horn extends from the support structure interface in a direction substantially parallel to a longitudinal axis of the horn. A flange mounted to the support structure at a node of radial oscillatory displacement of the support structure allows the transducer to be mounted to a machine, such as an ultrasonic wire-bonding machine, at a mounting position so that minimal vibration is transmitted from the transducer to the mounting position.

Abstract: A bondhead assembly having a bond body for mounting a bonding tool, a support structure that is configured to be drivable for moving the bondhead assembly to different locations and flexural elements arranged substantially along at least one plane which couple the bond body to the support structure for flexibly supporting the bond body during movement with respect to the support structure. A motor is coupled to the support structure and it is operative to drive the bond body to move relative to the support structure along an axis extending substantially perpendicular to the at least one plane.

Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Abstract: An initial ball forming method for wire bonding wire and wire bonding apparatus that uses: a capillary through which a wire is passed; a torch electrode made of a low-melting-point material that contains, for instance, tin; and a direct-current high voltage power supply. When the direct-current high voltage power supply is turned ON, a space discharge occurs between the tip end of the wire and the torch electrode, resulting in that the wire tip end melts and is formed into a ball and that the tin of the torch electrode is also heated to a high temperature and diffused into space, so that ionized plus tin ions are attracted to the tip end of the melted wire, thus causing tin to adhere to the surface of the ball-shaped tip end of the wire, and forming an initial ball that has a low-melting-point coating material adhered to its surface.

Abstract: A wire bonder including two link driving mechanisms and a head supporting stage provided with a bonding head via fluid pressure so that the bonding head is movable in the horizontal plane. Each link driving mechanism is formed by a motor, a driving arm, and a movable arm. The movable arm that extends from the driving arm of the first link driving mechanism is fastened to the bonding head, and the movable arm that extends from the driving arm of the second link driving mechanism is rotatably connected at its one end to the bonding head. A thrust aiming at the center of gravity of the bonding head is applied to the bonding head by the movable arms, thus moving the bonding head around.

Abstract: In an actuator of a bonding apparatus, a rotating body 16 that has a bonding head is rotatably supported on a supporting carrier having the same shape as magnetic path members 32L and 32R, and coil portions 40 and 42 are disposed on both outer sides of this supporting carrier. Rectilinear magnetic fields created by the coil portions 40 and 42 and a circumferential magnetic field created by permanent magnets of the rotating body 16 act cooperatively via magnetic path members 32L and 32R in which a plurality of magnetic paths are formed, so that the rotating body 16 makes a movement combining rotation and a linear movement along the Y axis in accordance with the respective driving of the coil portions 40 and 42. The rotating body 16 is movable along the X and Y axes by the shape of the magnetic paths of the magnetic path members.

Abstract: An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the materials through another face of the one of the materials, wherein the ultrasonic tool has a coating layer comprising chromium oxide as a main component formed on at least the surface of the tool that is in contact with the face of the one of the materials through which the ultrasonic waves are applied to the one of the materials. An ultrasonic bonder provided with the ultrasonic tool is also disclosed.

Abstract: A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.

Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion.

Abstract: A wire clamping plate is provided for a wire clamp that is adapted to contact a length of metallic wire when the wire clamp is applying a clamping force on the wire. The wire clamping plate comprises doped silicon carbide, which makes it electrically conductive and exhibit a high level of wear resistance.

Abstract: A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the electronic device and an opening in the main body for providing access to a part of the electronic device to be worked upon. A support structure is attachable for coupling it to a periphery of the opening whereby the support structure is extended across the opening for supporting the part of the electronic device that is accessible through the opening.

Abstract: Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.

Abstract: A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a chuck table, a semiconductor chip take-out area and an electrode cutting area, a cutting mechanism having a cutting tool for cutting the plurality of electrodes projecting from the front surface of the semiconductor chip held on the chuck table and arranged in the electrode cutting area to make them uniform in height, a semiconductor chip take-in mechanism, and a semiconductor chip conveying mechanism.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.

Abstract: A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of wire extending at least partially within the bonding tool and (2) the deposited conductive bump. The method also includes moving the bonding tool to contact the conductive bump such that a location of the junction is moved with respect to the bonding location.