Abstract: A manufacturing method for manufacturing a cylinder tube includes a joining step of joining a tube main body and a head member by friction welding by abutting an end surface of the tube main body and a flange portion of the head member in a state in which a through hole of the tube main body and a projecting portion of the head member are fitted to each other so as to form a predetermined clearance. In the joining step, a non-contact portion of the flange portion of the head member facing the clearance is joined to the tube main body by heating the non-contact portion with friction heat generated by relative rotation between the tube main body and the head member.

Abstract: An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.

Abstract: A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.

Abstract: Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes a slot having a generally vertical orientation positioned to receive a microfeature workpiece. In several embodiments, the system can further include a conductive material at least partially filling the slot.

Abstract: An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.

Abstract: A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering.

Abstract: A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.

Abstract: A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.

Abstract: A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.

Abstract: Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are exposed to bonding conditions effective to bond the balls with their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual solder balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are bonded with the individual associated bond pads. In another embodiment, a frame is provided having a hole. A solder ball is provided having an outer surface.

Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.

Abstract: A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the other surface of the interconnect substrate. In the soldering method, a joint section between the first electronic component and the interconnect substrate is heated at the same time as or after the step of flow soldering to melt the joint section.

Abstract: A method of manufacturing an electronic circuit module includes flow soldering including preheating an interconnect substrate on which an electronic part is placed, and supplying molten solder to a first surface of the interconnect substrate, whereby the first surface is heated to a specific temperature, wherein the interconnect substrate is heated by the preheating so that a difference between a temperature of the first surface immediately before supplying the molten solder and the specific temperature at the time of supplying the molten solder is 100° C. or less.

Abstract: A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The applicator (60) and the solder depositing units (7, 8) are attachable to and removable from a placement section (13a) and are interchangeable with each other. Each of the solder depositing units (7, 8) includes a flux bath (15) for storing a flux liquid therein, a solder bath (16) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein and capable of releasably receiving the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath 16, whereby the solder is deposited on the core.

Abstract: A circuit assembly having a thin and large-area dielectric substrate and an improved grounding condition. To make the assembly, a circuit board comprises the substrate, and a circuit pattern and a metal layer that are formed on respective sides of the substrate. A bath of conductive bonding material (e.g., a low melting point solder) is made inside a tray-like metal chassis of the assembly. The circuit board is floated on the bath and excessive portion of the conductive material is absorbed. A branch circuit for branching a first path into at least two second paths is provided by mainly using impedance transformers but by using fewest possible stubs. Also, the elements are arranged in symmetry around the axis through the first path. This yields a wide operating frequency band. A waveguide-microstrip line transition that is easy to work and low in transition loss is provided by shaping the wider walls of the ridge waveguide so as to spread out toward the end.

Abstract: A solder receiving method for a printed circuit board having electronic components soldered thereon includes the steps of forming, in a recovering apparatus body, a solder alloy layer, a metal particle layer and a liquid heat medium layer according to differences in specific gravity thereof, and dipping the printed circuit board having the electronic components soldered thereon into the recovering apparatus. An additional step includes spraying, onto the printed circuit having the electronic components soldered thereon, a mixed fluid composed of metal particles and a liquid heat medium, kept at a temperature above the melting point of a solder alloy, to scrape a solder alloy and the electronic components off the printed circuit board, so that it is possible to efficiently recover solder from the printed circuit board having the electronic components soldered thereon.

Abstract: There are provided a chamber having openings which are opened to an outer air and through which a solder-adhered object w is passed and having a heating/melting area and carrying areas arranged adjacent to the heating/melting area, a carrying mechanism for carrying the solder-adhered object w into the heating/melting area, a formic-acid supplying means for supplying a formic acid into the heating/melting area, an exhausting means for exhausting a gas from the heating/melting area and its neighboring area to lower a pressure in the heating/melting area rather than an outer air, heating means for heating directly or indirectly the solder-adhered object w in the heating/melting area, and air-stream suppressing means for disturbing a gas flow between the heating/melting area and the carrying areas.

Abstract: A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder pallet according to the present invention includes a mold base configured having an aperture formed through its cross-section. A high temperature casting material is molded within the mold base and configured to have at least one recess and at least one solder flow opening. A high temperature silicone casting material may be employed as the high temperature casting material.

Abstract: A self-contained fire escape apparatus for mounting in a wall of a building adjacent an associated window includes a collapsible ladder. A cover is securely attached to a first end of the ladder. A box is configured to provide storage space for the ladder and defines a bottom wall, front and rear walls, a pair of sidewalls, and an opening in the front wall. A second end of the ladder is securely anchored to the box. The cover is releasably attached to the box to cover at least a portion of the opening such that a person can manually remove the cover and eject the cover and the first end of the ladder through the associated window. The box is configured for mounting within a building wall in close reception between a pair of upright structural members of the building wall. The collapsible ladder 2 is sufficiently small in its collapsed condition that it fits within the box 8 for storage.

Abstract: An inert atmosphere spot soldering process and apparatus uses pockets arranged to match the arrangement of the terminals to be soldered. The pockets are filled to over flowing with liquid solder by lowering the pockets below the surface of the molten solder in a solder pot. A flow of hot inert gas is provided through orifices adjacent the pockets. The terminals and their surrounding area are exposed to the hot inert gas for a period sufficient to drive off substantially all volatile liquids and the terminals are then immersed in the solder to a depth determined by the menicus of the solder in the pockets. After immersion, the terminals are seperated from the solder surface and the flow of inert gas is terminated after permitting the solder to solidify. The inert gas may be heated by thermal conduction from the liquid solder.

Abstract: A system is provided for selectively attaching or detaching a land grid array component to a surface of circuit board where the attachment is a grid array of solid conductive solder beads or balls. A chamber contains an inert liquid, and a heater heats the inert liquid to a temperature above the melting temperature of the solder beads. A fluid level adjustment means adjusts the level of the inert liquid in the chamber between a first level below the component and a second level above the component. A first mounting means supports the circuit board above the component, and a second mounting means is positioned at least partially in the container to support the component below the circuit board and to bias the component against the circuit board. An component/board assembly is positioned in the system. The beads are uniformly melted by raising the level of the inert liquid in the chamber to above the component to permit removal of the board.

Abstract: Apparatus for applying solder to electrical or electronic components mounted in a horizontally oriented carrier, includes a solder bath, a pair of tracks (1,2) for guiding the carrier across the solder bath, and a device for urging the carrier along the tracks. The track has a first profiled region (12,19) for guiding a leading position of the carrier down towards the surface of the solder, and a second profiled region (16,20) longitudinally spaced from the first region, and laterally offset, for simultaneously guiding a trailing portion of the carrier down towards the surface of the solder, the profiles being substantially the same so that the carrier maintains its horizontal orientation while being moved vertically towards and away from the surface of the solder. The carrier moves on follower wheels which run along the tracks.

Abstract: In a soldering apparatus using a rotary station, a component holder is lowered and/or moved vertically by a stepper motor drive. A motor, lowers a drive shaft by a lead screw, and a second motor rotates the shaft via a toothed bearing wheel, the shaft having a hexagonal cross-section. A pivotable lobe couples the shaft to a shaft to lower the component holder and to rotate it (by rotation of shaft). The stepper motors allow for variable speed of vertical movement of the component holder and for selective rotation.

Abstract: A soldering process and apparatus for soldering difficult to reach junctions. Small containers, just large enough to accommodate the junctions are filled to overflowing from a pot of liquid solder. Once filled the flow of solder is terminated and the junction dipped into the container. The meniscus on the liquid solder in the container establishes a consistent level enabling a mechanized process to dip the junctions the same depth each time. Between dips the container is refilled. The size of the container limits the exposure of other adjacent devices to the heat of the solder and also provides a limited quantity of solder to the junction thus providing a consistent soldered connection.

Abstract: A vertical solder coating machine is described incorporating a tank containing molten solder with a bath of solder leveling fluid on the top thereof. Drive rollers are positioned within the tank and in the solder leveling fluid for grasping workpieces such as a printed circuit board and lowering the workpiece through the solder leveling fluid into the molten solder. The workpiece is forced into the molten solder until it is no longer gripped by the drive rollers and is trapped in the space formed by the rollers in contact with each other. When the rollers reverse direction, the workpiece is withdrawn through the solder leveling fluid and past a pair of leveling tubes positioned in the bath on either side of the workpiece. The leveler tubes direct a stream of solder leveling fluid onto the surface of the workpiece to level the solder thickness and remove solder from within any through-holes in the workpiece. The drive rollers are tapered and thus contact the workpiece only along opposite edges thereof.

Abstract: This invention relates to a solder leveler and in particular to one including a solder trough assembly having a container, two blowing means and two angular frames, two pneumatic rods mounted on the angular frames and having an elongated case in which there are mounted a horizontal pneumatic cylinder and a plurality of pneumatic cylinders, two conveyer belts mounted at two sides of the solder trough assembly, a jig fitted on the solder trough assembly, an elevated device for moving the jig upwards and downwards, and a revolving means for rotating the jig whereby the printed circuit board is first fed by the first conveyer belt into a clamping unit of the jig, then moved up to an appropriate height by the elevated device, rotated downwards by the revolving means, lowered down into the container for soldering, lifted up from the container, blown by the blowing means so as to remove excess solder thereon, rotated upwards by the revolving means to a horizontal position, released by the jig, and delivered by the s

Abstract: A method and an apparatus for solder plating parallel arranged leads on an electronic device, e.g. QFP having leads on four sides or SOLC having leads on two sides. A metal plate of solder wettable material having an inclined upper surface is placed in a molten solder bath. The electronic device, with the leads to be solder plated exposed, is lowered horizontally in the solder bath and is pulled out horizontally. A large quantity of solder adhering on the inclined plate pulls solder adhering on the leads sequentially along an inclined surface of the plate to obtain uniform thickness of solder plating on the leads without causing bridging.

Abstract: A solder leveller for tinning exposed metal on printed circuit boards comprises a solder bath and paired rollers therein for carrying a board in a curvilinear path downwardly into, through and upwardly out of the bath. At least one pair of rollers having a board engaging nip within the bath is driven. The bath includes means for providing a solder-oxidation inhibiting oil over the solder.

Abstract: A method and apparatus for producing flush solder fill over recessed pins and over passage holes in circuitized substrates. A substrate carrying rack is immersed in a vessel of molten solder after it has been similarly immersed in a flux bath. While in the molten solder, the rack is vigorously agitated. The rack is then withdrawn from the molten solder and is pivoted upwardly while positioned over the molten solder. Simultaneously, an anvil is rotated from a home position to an impact position at precisely the correct moment. With the solder still molten on the substrate surfaces, the rack is then permitted to descend and is positively biased to strike the anvil thereby dislodging any excess molten solder. A unique supporting arrangement for the rack insures that only a minimum of mass acutally impacts against the anvil while insuring the effectiveness of the operation.

Abstract: The invention is an improved drag soldering machine for printed wiring boards (PWB) for providing a uniform vertical velocity at the point of separation between the solder and the PWBs. The improved drag soldering machine has a molten solder bath, an entry guide for directing the PWB to a horizontal position partially submerged in the solder bath, a drag guide for horizontally directing the PWB across the solder bath, an exit guide for separating the PWB from the solder bath by directing the PWB up and away from the solder bath and a transport means for advancing the PWB in the guide means, wherein the improvement comprises an exit guide providing an approximately uniform vertical velocity at the point of separation between the PWB and the solder bath thereby promoting a uniform soleder distribution over the length of the PWB.

Abstract: New perfluoroalkanes and haloperfluoroalkanes, having low melting point and high thermal and chemical stability, constituted by preferably branched perfluorinated and haloperfluorinated chains, obtained by starting from precursors containing two halogen atoms equal to or different from each other, one of them necessarily being an iodine atom, which are reacted with C.sub.3 F.sub.6 and possibly subsequently halogenated with either fluorine or chlorine or bromine.

Abstract: A surface mounted chip soldering apparatus comprises a number of stations for fluxing and soldering the chip. For each station, the chip is carried by a suction pad in which is created a partial vacuum by a respective piston and cylinder mounted on a turret. The piston is upwardly spring biassed and operated in time and in sequence by pneumatically operated pistons to hold and to reject the chips as required for carrying out a soldering sequence.

Abstract: Novel compositions include compounds of the formula: ##STR1## wherein the carbon rings are fully fluorinated.

Abstract: A carrier for holding SOIC packages during the application of solder to their leads, the carrier including a frame provided with an end plate (17) with mounting lugs (20). On each lug (20) is mounted an upper U-shaped member (1) and a lower U-shaped elongate member (8) with the respective legs (3) and (10) of the members projecting downwardly. The legs (10) are disposed within the legs (3) but extend further and terminate at outwardly turned ends (11). Adjacent assemblies of the members (1) and (8) define a track (T) therebetween for a line of SOIC packages (24) whose leads (26) rest on end portions (11), and which are restricted against upward movement by the ends (4) of legs (3).

Abstract: A solder reflow machine for removing and replacing electronic components of the pin-grid array type having a large number of leads soldered into a very densely populated printed circuit board. The machine utilizes a heat-transfer liquid and a vacuum to remove the component from the board. The printed circuit board is positioned with the component facing downwardly. A tank containing the heat-transfer liquid is located below the printed circuit board. The apparatus includes a solder reflow head which has a component-engaging vacuum plate with a central opening that is in communication with a vacuum source through a pipe which is pulled downwardly to remove the component. The component is surrounded by a wall in combination with the bottom of the printed circuit board and seals off the liquid flow path.

Abstract: Novel compositions of matter are disclosed having the formula: ##STR1## wherein the carbon rings are fully fluorinated to remove all hydrogens and olefinic character. The compositions have utility as heat transfer agents, hydraulic fluids, vapor phase soldering fluids, gas (O.sub.2, N.sub.2, CO.sub.2, H.sub.2, etc.) transport agents, such as in biological and medical fields, as well as utility as burn-in test fluid.

Abstract: A method for removing excess solder from a printed circuit board is practiced by mixing a quantity of ceramic beads with an oil to form a fluidized bed mixture. The fluidized bed mixture is heated to a temperature above the melting point of a solder on the printed circuit board. A surface of the printed circuit board to be cleaned is placed in contact with the heated fluidized bed and agitated against the bed to remove excess solder.

Abstract: A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.

Abstract: A vapor phase bonding apparatus wherein articles to be bonded are heated with hot vapors of a heat transfer liquid so that a bonding agent such as a solder provided between the articles to be bonded is melted to effect the bonding. The apparatus includes a vessel for containing the heat transfer liquid, a heater for vaporizing the heat transfer liquid, inlet and outlet port means provided in the vessel to allow the passage of articles to be bonded therethrough, conveying means to convey the articles through the inside of the vessel via inlet and outlet port means, closure means for opening and closing the inlet and outlet port means, and cooling means provided on the closure means for condensing vapors of the heat transfer liquid.

Abstract: A process for soldering circuit boards comprising the steps of:(a) applying a solder flux coating to the solder side of a board;(b) drying the flux on the board and preheating the solder side of the board by sequentially(i) directing a stream of warm gas over the solder side of the board,(ii) positioning the solder side of the board over a hot molten solder bath,(c) soldering the solder junctions on the board by immersing the solder side of the board into the surface of the hot molten solder bath by sequentially(i) immersing a first edge of the board into the surface of the solder bath,(ii) lowering the remainder of the board into the surface of the solder bath,(iii) longitudinally moving the board in the solder bath, and(iv) lifting the board from the surface of the solder bath at an angle to the surface of the solder bath to drain excess hot molten solder from the board.

Abstract: Printed circuit boards that may contain through-holes, conductors, connectors, etc. are soldered by covering such boards with liquid solder. During such a process, excess or undesirable solder is typically residual on the surface of such boards, and, more specifically, within the through-holes. By the present system, the printed circuit boards are placed in contact with liquid flux, then with liquid solder and are then removed from contact with the liquid solder and passed between two heat transfer medium spray elements which are fully immersed within the heat transfer medium. Said spray elements direct generally opposing laminar flows, enhanced by a Venturi effect, onto such board thereby sweeping off the undesired solder, clearing the holes, and leaving an optimum thickness solder layer where appropriate. The excess solder removed is collected within the system reservoir to be returned to the solder tank for reuse. A final rinse is provided to remove heat transfer medium from the printed circuit board.

Abstract: An automatic soldering apparatus which makes it possible to automate the whole steps, from the step of feeding the work to the step of collecting the same, as well as simultaneously enhance the reliability in transportation and the economy in soldering operation. The automatic soldering apparatus has a track type transportation mechanism for slidably transporting the body of the work having lead portions to be soldered, through a track constituted by a plurality of long guide members; a fluxing unit and a soldering unit provided with respect to the track of the track type transportation mechanism and adapted to flux and solder the lead portions, respectively; a work feed unit provided at the starting end of the track type transportation mechanism and adapted to feed the work to the track type transportation mechanism; and a work collecting unit provided at the terminating end of the track type transportation mechanism and adapted to collect the work from the track type transportation mechanism.

Abstract: For protecting the surface of a soldering bath a covering means is used which comprises two phases (3,4), which are placed one on top of the other, are not soluble in each other and are liquid at the soldering temperature. The bottom phase (3) is produced by spreading over the top phase (4), which consists of a liquid synthetic polyalphaolefin, a powder of a chemically active component of sebacic acid and/or suberic acid which is solid at room temperature and liquid at the soldering temperature.

Abstract: An automated discreet soldering system for plated holes of a printed wiring board, having a free piston type crucible mode of graphitic material, which is propelled along a guided path by pressurized nitrogen. A laser beam is directed along a path substantially coincident with the path of travel of the crucible to heat a susceptor surface for melting the solder therein.

Abstract: Carriers each carrying a printed circuit board is conveyed successively through a soldering zone to dip each printed circuit board in molten solder contained in a vessel disposed below a space defined by two pairs of parallel front and rear rails. The four rails are engageable with four wheels of the carrier simultaneously and are vertically moveable so the printed circuit board carried on the carrier on the rails are contacted with the molten solder when the rails are in their lowered positions. Engaging means is provided for movement with one of the rails and for supporting engagement with the carrier. The engaging means is horizontally moveable so that the carrier engaged by the engaging means is horizontally moved forward and backward. By suitably moving the rails and the engaging means, the printed circuit board may alight on and leave from the surface of the molten solder in any desired tilted state.

Abstract: A displacement soldering device having first and second ends to support, a PCB over the surface of molten solder in a container, and a support structure handling mechanism having, a first member to which said first end is pivotally attached, a latch, to which said second end is pivotally attached, moveable between latched and unlatched operational positions, said latch in its latched position being pivotally supported on said member and in its unlatched position permitting said support structure to pivot downwardly about said first end, means for lateral displacement of said support structure between a soldering position and a PCB access position, means for unlatching said latch when said solder is displaced into contact with a PCB supported by said support structure, means for latching said latch subsequent to a soldering operation, and means for elevating said support structure during said lateral displacement from said soldering position and for lowering said support structure during said lateral displacem

Abstract: The method of solder leveling comprising maintaining a zone of hot saturated inert vapor at substantially the temperature of molten solder above a molten bath of solder, moving the part to be treated through the vapor at a rate such that it will become uniformly heated to substantially the temperature of the molten solder prior to immersion therein, immersing the part in the molten solder, withdrawing the part from the molten solder through the saturated vapor to the ambient atmosphere and, while withdrawing the part, projecting streams of hot, high density fluid on the surfaces of the part in directions opposite to the direction of withdrawal to sweep the surfaces of the excess solder.

Abstract: An apparatus for soldering printed circuit boards includes a carrier adapted to support a printed circuit board and to be moved along a predetermined transfer path, preferably in the form of a closed loop; a pair of laterally spaced movable rails defining a part of the transfer path and adapted for supporting engagement with the carrier; a vessel containing molten solder placed beneath the space between the rails; and driving means for moving the rails up and down to allow the printed circuit board to be dipped in the molten solder.

Abstract: Carriers each holding a printed circuit board are conveyed successively through a soldering zone to dip each printed circuit board into molten solder contained in a vessel. The vessel is disposed between a pair of laterally spaced apart track members which are engageable with two front and two rear wheels of the carrier to support the carrier and the printed circuit board generally in the horizontal state throughout the movement thereof along the track members. Each track member has a first and a second depression at such locations that the two front and the two rear wheels can simultaneously be positioned in the first and second depressions, respectively. Each depression has a depth sufficient to permit the printed circuit board to be dipped into the molten solder when the four wheels travel therealong.

Abstract: Disclosed is a method of soldering external leads to film circuits formed on insulating substrates. The leads, usually in the form of lead frames, are clipped onto the substrates and a flux is applied. The assemblies are then immersed into molten solder. As they are withdrawn from the solder, they pass through high-pressure hot gas jets which remove the excess solder.