Abstract: To improve the solderability of the terminals or connections of integrated circuit components (IC-components) with parallel connection rows these must be pre-tin plated. An apparatus is disclosed which immerses the connections or terminals to be pre-tin plated as deeply as possible into the solder bath without exposing the components to impermissible thermal loads. This is obtained in that the components which are to be initially or pre-tin plated are tilted about an axis extending parallel to the terminal or connection row in a manner such that the connections of a row are simultaneously immersed into the solder bath.

Abstract: An apparatus for soldering printed circuit boards includes carriers each adapted for holding a printed circuit board and conveyed successively through a soldering zone to dip each printed circuit board into molten solder contained in a vessel. The vessel is disposed between a pair of laterally spaced apart track members which are engageable two front and two rear wheels of the carrier to support the carrier and the printed circuit board generally in the horizontal state throughout the movement thereof along the track members. Each track member has a first and a second depression at such locations that the two front and the two rear wheels can simultaneously position in the first and second depressions, respectively. Each depression has a depth sufficient to permit the printed circuit board to be dipped into the molten solder when the four wheels travel therealong.

Abstract: A fixture is provided for holding a hybrid substrate having a plurality of components already soldered to conductive patterns and/or lands on the front side thereof and having fingers of a lead frame pressed over one edge thereof for dip soldering lead frame fingers to lands. The fixture comprises a flat plate having a plurality of titanium clips or hook elements extending below the bottom edge of the plate, assembled hybrid substrates being loaded into the fixture with the base of the lead frame resting on the hooks. Slots cut in the front of the plate define a rib that extends over the length of the plate near the bottom edge. The rib contacts the backside of a substrate to form an air gap that prevents flux and solder wicking up it. A hinged cover rests against components on a substrate to hold the latter in place. Only the hook ends of the titanium clips, the lead frame, and a portion of the substrate adjacent the one edge are dipped into molten solder to solder lead fingers to associated lands.

Abstract: A wave solder machine is provided which includes an endless moving mesh belt that is made of a nonsolderable material such as titanium wire. The belt is supported so as to be totally immersed in the solder wave as it passes the latter. This causes the undersides of stuffed printed circuit boards on the belt to be brought into contact with the molten solder. The belt wires preferably have a plurality of projections thereon to support the circuit boards above the major portion of the belt. In another machine, the circuit boards are moved along a plurality of parallel wires that pass through the solder wave. Alternatively, the wires themselves may be moving for carrying circuit boards across the solder wave.

Abstract: A metal wick to be used for the absorption of molten solder is deoxidized and flux coated by a process that does not involve the application of heat to the wick or the flux. In one embodiment the wick is cleaned by heating in a reducing atmosphere and is then immersed in a coating bath containing a solution of a rosin flux in an organic solvent. On leaving the bath the welted wick enters a low-pressure chamber in which the solvent rapidly evaporates at room temperature. In another embodiment the deoxidized wick is coated with comminuted solid resin by electro-static means.

Abstract: An apparatus for automatically soldering components to a printed-circuit board in accordance with the "drag bath" process wherein the board is moved through a lowered section with its undersurface in contact with a solder bath and withdrawn therefrom perpendicularly by lift means.

Abstract: .[.Article.]. .Iadd.An article .Iaddend.to be soldered, fused or brazed is placed in hot saturated vapors generated by continuously boiling .Iadd.a .Iaddend.heat transfer liquid having selected properties including .Iadd.a .Iaddend.boiling point at least equal to, and preferably above, .Iadd.the .Iaddend.temperature required for .Iadd.such .Iaddend.operation. Vapors condense on .Iadd.the .Iaddend.article and give up latent heat of vaporization to heat .Iadd.the .Iaddend.article to .Iadd.the .Iaddend.temperature for soldering, fusing or brazing. .[.Heat.]. .Iadd.The heat .Iaddend.transfer liquid may be a fluorocarbon. Apparatus is shown for soldering, fusing or brazing a single article, a batch of articles, or a continuously moving line of articles. Specifically, mass reflow soldering and mass wave soldering operations are described. .Iadd.