Solid Flux Or Solid Filler Patents (Class 228/41)
  • Patent number: 12083626
    Abstract: A solder supply unit includes a base member, a reel holder that is provided on the base member and rotatably holds a reel of a tape-like solder material, a support member provided on the base member, and a guidance member that is provided on the support member and that guides at least a lower surface of the tape-like solder material wound around the reel when the tape-like solder material is fed out.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: September 10, 2024
    Assignee: HIRATA CORPORATION
    Inventors: Toshiomi Ikeda, Tetsunori Matsuyoshi
  • Patent number: 12021006
    Abstract: An apparatus for manufacturing packaged semiconductor devices includes a lower plate having package platforms and clamp guide pins to align an upper plate with the lower plate, and a boat tray having windows configured to receive package devices, and a plurality of upper plates configured to be aligned to respective windows and respective package platforms. Clamping force can be applied by fasteners configured to generate a downward force upon the upper plate. Package devices on the platforms are thus subjected to a clamping force. Load cells measure the clamping force so adjustments can be made.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: June 25, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu
  • Patent number: 11366136
    Abstract: A pressing assembly and a chip testing apparatus including a plurality of the pressing assemblies are provided. The pressing assembly is fixedly disposed in a lid that is configured to cover a side of a chip tray kit, and the chip tray kit is configured to carry a plurality of chips. When the lid covers the side of the chip tray kit, a pressing member of each of the pressing assemblies presses a surface of each of the chips, and each of a plurality of elastic members connected to the pressing member is in a pressed state. When the lid covers the side of the chip tray kit, the lid and the chip tray kit define an enclosed space, and an air suction device of the chip testing apparatus can suction away air in the enclosed space, so that the enclosed space is in a negative pressure state.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: June 21, 2022
    Inventors: Chen-Lung Tsai, Gene Rosenthal
  • Patent number: 11273510
    Abstract: The present application discloses a soldering apparatus including a soldering iron having an iron tip that melts solder, a driving portion that moves the soldering iron, and an operation portion displaced to instruct the driving portion of a moving direction of the soldering iron. While an operation on the operation portion is performed by a user, the driving portion moves the soldering iron in a direction corresponding to a displacement direction of the operation portion.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: March 15, 2022
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Tomoo Takahara
  • Patent number: 11004820
    Abstract: An apparatus and method for filling a ball grid array template and a method for transferring a plurality of balls are disclosed. The apparatus includes a flat base, a plate and a stationary ball supply bin. The plate is mounted on the base and configured to be rotatable about a first axis perpendicular to the base. An upper surface of the plate includes a plurality of holes forming the ball grid array template. The stationary ball supply bin is mounted to the base. The base is configured to be inclined at an angle relative to a horizontal plane. The ball supply bin is configured in use to dispense a plurality of balls onto the corresponding plurality of holes forming the ball grid array template as the plate is rotated about the first axis.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: May 11, 2021
    Assignee: Aurigin Technology Pte Ltd
    Inventors: Boon Chew Ng, Ee Teoh Lim
  • Patent number: 10335879
    Abstract: Induction soldering via an assembly fixture is utilized to bond one or more items of hardware to a vehicle window to form a vehicle window assembly. A method of operating the assembly fixture to bond the one or more items of hardware to a vehicle window by induction soldering is also an aspect of the invention.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: July 2, 2019
    Assignee: Pilkington Group Limited
    Inventors: Charles E. Ash, Charles Sitterlet
  • Patent number: 10141124
    Abstract: An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: November 27, 2018
    Assignee: Yen Technologies, LLC
    Inventor: William S. H. Cheung
  • Patent number: 9592971
    Abstract: A method and apparatus for transferring formed adhesive elements from a reservoir (30) containing plural formed adhesive elements (12) to a bonding part attachable to a glass surface or other substrate through the use of adhesives. Transfer of the formed adhesive element to the bonding part (14) is accomplished by use of a vacuum tool (10) having a vacuum outlet, an internal plenum, and a series of vacuum lines formed in an adhesive element holding face. The vacuum tool is positioned over a reservoir of formed adhesive elements. Once the formed adhesive elements have been captured by the vacuum tool (10) the tool is used to place them into contact with the heated bonding part (14) directly or indirectly by intermediate placement onto a matrix (60) having a plurality of ejector pins (72) movably fitted therein. The ejector pins move the formed adhesive elements into position against the bonding part.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: March 14, 2017
    Assignee: A. Raymond Et Cie
    Inventor: Mathias Hansel
  • Patent number: 9579741
    Abstract: Provided are an apparatus of adsorbing solder balls and a method of attaching the solder balls using the same. The solder ball adsorbing apparatus includes a body, a plurality of eject pins disposed in the body and configured to move in downward and upward directions with respect to a substrate on which the solder balls are to be loaded, and a solder ball holder disposed in the body and configured to hold the solder balls at the eject pins and release the solder balls therefrom. The eject pins include a first eject pin disposed at a center of the body in parallel with a vertical surface that is perpendicular to a bottom surface of the body, a second eject pin disposed at an edge of the body at a first angle with respect to the vertical surface, and a third eject pin disposed between the first and second eject pins.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: February 28, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Eun-Sun An
  • Patent number: 9505017
    Abstract: A method of monitoring a rotary paint atomizer includes determining a target rotational speed, a target air flow rate, a target torque, and a target electrostatic current; and measuring an operating rotational speed, an operating air flow rate, an operating torque, and an operating electrostatic current. The method includes detecting at least one of a first condition in which the operating rotational speed differs from the target rotational speed, a second condition in which the operating air flow rate differs from the target air flow rate, a third condition in which the operating torque differs from the target torque, and a fourth condition in which the operating electrostatic current differs from the target electrostatic current. After detecting, the method includes producing an indicator signal indicative of at least one of the first, second, third, and fourth condition. A rotary paint atomizer system is also disclosed.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: November 29, 2016
    Assignee: GM Global Technology Operations LLC
    Inventors: George J. Sinnott, Derek J. Eschenburg
  • Publication number: 20150144683
    Abstract: A screen printer includes a mask, a substrate holding unit that clamps and holds a substrate below the mask by clamping members, a substrate holding unit moving mechanism that moves the substrate holding unit to contact the substrate with a lower surface of the mask, a paste filling unit that fills pattern holes of the mask with a paste, mask suction portions provided in the clamping members which suck the mask contacted with the substrate. The mask suction portions keep sucking the mask when the substrate holding unit moving mechanism moves the substrate in a direction away from the mask to perform plate releasing, and release the suction of the mask in a state in which the mask sucked to the mask suction portions maintains a posture parallel to the substrate after the movement of the substrate is started.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 28, 2015
    Inventors: Yuuji OOTAKE, Mitsuru KOUCHI, Seiya KURODA
  • Publication number: 20150129640
    Abstract: A screen printing machine for forming a print of paste supplied to a mask plate having pattern holes, includes: a filling squeegee which is held to have a given clearance with respect to the mask plate, and which fills the pattern holes with the paste by moving the filling squeegee relative to the mask plate in a printing direction; and an urging member which urges the filling squeegee toward the mask plate such that at least the given clearance is maintained. The screen printing machine further includes a scraping squeegee which is held to maintain a given interval from the filling squeegee in the printing direction, and which scraps off paste remaining on the mask plate after passage of the filling squeegee by moving the scraping squeegee together with the filling squeegee in the printing direction.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 14, 2015
    Inventors: Seiya KURODA, Hachiro NAKATSUJI
  • Publication number: 20150129641
    Abstract: A screen printing machine for forming a print of paste supplied to a mask plate having pattern holes, includes: a flexible filling squeegee which performs a squeegeeing operation in which the filling squeegee is moved relative to the mask plate in a printing direction; and a scraping squeegee which is held to maintain a given interval from the filling squeegee in the printing direction and to be movable together with the filling squeegee in the printing direction, and which scraps off the paste remaining on the mask plate after passage of the filling squeegee. In the squeegeeing operation, the filling squeegee is pushed up and bent by the paste to provide a clearance between a bottom end of the filling squeegee and the mask plate with the paste interposed therebetween so that the pattern holes are filled with paste with a prescribed filling pressure.
    Type: Application
    Filed: November 12, 2014
    Publication date: May 14, 2015
    Inventors: Seiya KURODA, Tetsuya TANAKA, Michinori TOMOMATSU
  • Publication number: 20150122873
    Abstract: An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced.
    Type: Application
    Filed: November 1, 2013
    Publication date: May 7, 2015
    Inventor: Tu-Chen Lee
  • Publication number: 20150125999
    Abstract: Provided are apparatuses configured to attach a solder ball, methods of attaching a solder ball, and methods of fabricating a semiconductor package including the same. An apparatus configured to attach a solder ball includes a chuck configured to receive a package substrate on which solder balls are provided; a shielding mask configured to shield the package substrate and including holes configured to expose the solder balls; and a heater configured to melt the solder balls exposed through the holes.
    Type: Application
    Filed: August 28, 2014
    Publication date: May 7, 2015
    Inventors: Seokhyun LEE, Jaegwon JANG, Chul-Yong JANG
  • Publication number: 20150115016
    Abstract: Embodiments of the invention provide a ball mount module for sucking and sticking balls positioned in a ball supply bath, transferring the balls, and mounting the balls on a ball pad of a substrate. The ball mount module includes a sucking head, a sucking base coupled to the sucking head and having irregular air channels, and a sucking and sticking panel including bail sucking and sticking holes formed therein so as to be in communication with the irregular air channels of the sucking base and coupled to the sucking head. The sucking base is made of ceramic.
    Type: Application
    Filed: March 20, 2014
    Publication date: April 30, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sun Moon KIM, Jung Hoon KIM
  • Publication number: 20150097024
    Abstract: An electrode forming device has a pressing unit that presses a substrate on a printing table from above, a suction unit that sucks the substrate on the printing table, a mask member integrally formed with a first mask section used for applying flux on the substrate and a second mask section used for filling a conductive ball on the substrate applied with the flux, a squeegee head that applies the flux via the first mask section, an air cylinder that moves the mask member, and a filling head that fills a conductive ball via the second mask section.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 9, 2015
    Inventors: Hirokuni KURIHARA, Akio IGARASHI, Ryosuke MIZUTORI, Akinori GOWA, Naoaki HASHIMOTO
  • Publication number: 20150097025
    Abstract: An electrode forming device has a flux application unit that applies flux on a substrate; a plurality of ball filling units that are arranged in series at a downstream side of the flux application unit and fill conductive balls on the substrate applied with the flux to form electrodes; and a first conveying device, a second conveying device, a first bypass conveyor and a second bypass conveyor that convey the substrate to one of the ball filling units and conveys the substrate in such a way as to bypass the other ball filling unit.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 9, 2015
    Inventors: Hirokuni KURIHARA, Shoichi GUNJI, Takao KAWANO, Tomoyuki YAHAGI, Naoaki HASHIMOTO
  • Publication number: 20150076213
    Abstract: A robot according to an embodiment includes a flange, a wrist arm, a forearm, and a feeder. The flange configured so that a welding torch is attached thereto and configured to rotate about a T axis. The wrist arm configured to rotate about a B axis substantially perpendicular to the T axis and configured to support the flange. The forearm configured to support the wrist arm. The feeder attached to a position between a base end and a tip end of the forearm and configured to feed a welding wire.
    Type: Application
    Filed: September 18, 2014
    Publication date: March 19, 2015
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Atsushi TERADA, Kazuhiro YASUTOMI
  • Publication number: 20150060529
    Abstract: A working machine for a board including a working device that selectively performs work for mounting conductive balls on a circuit board by a ball holder and work for transferring viscous fluid onto the circuit board by transfer pins, and a tray in which the viscous fluid is stored, when the conductive balls are to be mounted on the circuit board, the viscous fluid being transferred onto the circuit board by the transfer pins and the conductive balls having been immersed in the viscous fluid are mounted on the transferred viscous fluid. Accordingly, the conductive balls can be fixed onto the circuit board by the viscous fluid, which is transferred onto the circuit board by the transfer pins, and the viscous fluid that adheres to the conductive balls due to the immersion of the conductive balls in the viscous fluid.
    Type: Application
    Filed: April 10, 2012
    Publication date: March 5, 2015
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Hiromitsu Oka, Tetsuo Hayashi
  • Patent number: 8955735
    Abstract: A method is used for implanting solder balls of an integrated circuit by operating a ball implanting machine. The ball implanting machine includes a suction fixture, an evacuating device, two pivoting and inverting devices, a guide plate, a ball carrier, and a substrate. The suction fixture has a plurality of ball grooves. The guide plate has a plurality of guide holes each aligning with a respective one of the ball grooves of the suction fixture. The ball carrier contains a plurality of solder balls. Thus, each of the solder balls is extended through the respective guide hole of the guide plate into the respective ball groove of the suction fixture, so that the solder balls will not protrude outward from the guide plate and will not interfere with or jam each other during movement of the ball carrier.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: February 17, 2015
    Assignee: Zen Voce Corporation
    Inventors: Chao-Shang Chen, Yu-Kai Lin
  • Patent number: 8944306
    Abstract: An apparatus for transferring metal solidified in blind cavities is described incorporating a first flexible tape having blind cavities, a second flexible tape having adhesive regions, rollers for guiding respective tapes and means for moving respective tapes. Also a conveyor belt having blind or through cavities, rollers and a vibration transducer or pressurized gas is described to release solidified metal in the cavities.
    Type: Grant
    Filed: October 20, 2013
    Date of Patent: February 3, 2015
    Assignee: International Business Machines Corporation
    Inventors: Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah
  • Publication number: 20150021376
    Abstract: A method for bonding a wire to a substrate includes forming a wire ball at a working tip of a capillary and contacting the wire ball to a substrate via the capillary. The method also includes driving a protrusion at the working tip of the capillary into contact with a region of the substrate surrounding the wire ball. A capillary for wire bonding includes a working face, an annular chamfer section, and a cylindrical bore offsetting the annular chamfer section from the working face. A capillary for wire bonding includes a capillary body comprising a working tip having a working face. The capillary body defines an axial passage extending from the working face along a longitudinal axis of the capillary. The axial passage includes a cylindrical bore extending internally from the working face, and a first annular chamfer having a major diameter defined by the cylindrical bore.
    Type: Application
    Filed: July 17, 2013
    Publication date: January 22, 2015
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Trent Uehling, Ilko Schmadlak
  • Publication number: 20150008251
    Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.
    Type: Application
    Filed: July 1, 2014
    Publication date: January 8, 2015
    Inventors: Keng Yew SONG, Yi Bin WANG, Zuo Cheng SHEN, Jia Le LUO, Qing Le TAN
  • Publication number: 20150001278
    Abstract: An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.
    Type: Application
    Filed: February 3, 2014
    Publication date: January 1, 2015
    Applicants: SAMSUNG TECHWIN CO., LTD., SAMSUNG ELECTRONICS CO., LTD.
    Inventors: SEOK-YONG LEE, YO-SE EUM, TEA-SEOG UM, KYOUNG-BOK CHO
  • Patent number: 8919634
    Abstract: A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XY? stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: December 30, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Akio Igarashi, Hirokuni Kurihara, Ryosuke Mizutori
  • Publication number: 20140291384
    Abstract: A hand-held device shaped as a pencil used for dispensing solder wire onto a soldering point. Such device contains a roll of solder wire that can be gradually extracted through a hole on the tip by pressing a button in forward motion to extract the solder without touching it. The device can be held in one hand and the dispensing of the solder wire is performed by an internal servo-mechanism that controls the amount of solder and the speed at which it is dispensed. The extracted solder can be pulled back into the device in order to retrieve small portions of the already extracted solder by pressing the same or a different button in backward motion in order to maintain a desired amount of solder outside the device. The device can be electrically powered by “AA” size batteries, or by an external power supply.
    Type: Application
    Filed: March 27, 2013
    Publication date: October 2, 2014
    Inventor: Nelson Sigfrido Canelo
  • Publication number: 20140263589
    Abstract: A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XY? stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion.
    Type: Application
    Filed: February 27, 2014
    Publication date: September 18, 2014
    Applicant: Hitachi, Ltd.
    Inventors: Akio IGARASHI, Hirokuni KURIHARA, Ryosuke MIZUTORI
  • Publication number: 20140252073
    Abstract: A device for providing a reliable and robust electrical connection of a chip to a board using a plurality of solder balls, the device including a non-rigid body formed of a thermal resistant material having a top side and a bottom side, the bottom side having an adhesive layer; and an array of openings formed in the body, the array of openings arranged in a pattern that matches a pattern of conductive pads on the board, each opening having a circular plan form shape that is sized to enable a single solder ball to be slideably received in the opening, each opening spaced from adjacent openings by a distance that prevents adjacent solder balls from electrically connecting to each other when the solder balls are subjected to a temperature sufficient to reflow the solder ball.
    Type: Application
    Filed: March 5, 2014
    Publication date: September 11, 2014
    Applicant: Summit Imaging, Inc.
    Inventor: Stephenjon Besagar Barredo
  • Patent number: 8813350
    Abstract: A ball grid array presentment apparatus and associated method are provided. The apparatus has a stationary guard defining a first passage. A core is mounted adjacent to the stationary guard, the core being operably moveable between an unload position and a second position. The core defines a second passage and supports a workpiece fixture operably retaining the ball grid array. The unload position of the core operably aligns the second passage to the first passage, the aligned passages being sized to permit access to unload the ball grid array from the workpiece fixture. The second position of the core operably misaligns the second passage from the first passage whereat the core and the stationary guard cooperatively form an enclosure around the workpiece fixture containing a supply of balls that are not retained in the ball grid array.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: August 26, 2014
    Assignee: Seagate Technology LLC
    Inventors: Niandong Liu, William A. Nelson, James O. Anderson
  • Publication number: 20140224861
    Abstract: Provided is an apparatus for feeding wire solder with high tensile strength and pull cut resistance. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The apparatus for feeding the wire solder comprises a wire solder storage section where the wire solder with a core wire is stored and a core wire rewinding member that takes up an end of the core wire to rewind the core wire. While the core rewinding member is rotated to rewind the core wire, the single or multiple strands of solder are heated to perform soldering at the location of soldering upstream of the core wire rewinding member.
    Type: Application
    Filed: April 16, 2014
    Publication date: August 14, 2014
    Applicant: NIHON SUPERIOR CO., LTD.
    Inventor: Tetsuro Nishimura
  • Publication number: 20140183249
    Abstract: Disclosed herein is a substrate processing device, including: a first mask disposed over a base substrate and provided with a first opening which exposes a connection pad of the base substrate; a first squeeze inserting a flux ball into a first opening of the first mask; and a first heating means heating a flux ball which is disposed on the connection pad.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 3, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Sik CHOI, Bong Yeol LEE, Min Hee YOON, Seung Chul KIM
  • Patent number: 8766132
    Abstract: A method of identifying and selecting welding electrodes and welding output parameters on a welding power source is provided. The method includes identifying electrodes and/or electrode packaging with distinct colors and/or patterns which correspond to properties of the electrode. The method also may include employing distinguishable identifying markings on a power supply which correspond to the electrodes to be used to allow for easy setting of output parameters.
    Type: Grant
    Filed: July 6, 2009
    Date of Patent: July 1, 2014
    Assignee: Lincoln Global, Inc.
    Inventors: George Blankenship, Rob Micco, Arthur B Papineau
  • Publication number: 20140158751
    Abstract: A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.
    Type: Application
    Filed: February 26, 2013
    Publication date: June 12, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Koji Motomura, Arata Kishi, Hiroki Maruo, Yasuhiro Suzuki, Hironori Munakata
  • Patent number: 8708215
    Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: April 29, 2014
    Assignee: Samsung Electro-Machanics Co., Ltd.
    Inventors: Hueng Jae Oh, Yon Ho You, Jin Won Choi
  • Publication number: 20140110462
    Abstract: A process and apparatus for forming and transferring metal arrays of balls and shapes is described incorporating molds, tape, injection molded metal such as solder, metal reflow and a mask on a substrate for shearing solidified metal of metal arrays into respective openings in the mask.
    Type: Application
    Filed: August 30, 2013
    Publication date: April 24, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: PETER A. GRUBER, PAUL A. LAURO, JAE-WOONG NAH
  • Patent number: 8704137
    Abstract: This invention introduces the welding technology of an electrical connector and its welding device. The welding device comprises of a base frame, IR lamp that can emit infrared rays, and convex lens used to collect infrared rays. The lamp and lens are set in the base frame, with the convex lens in front, which collects all infrared rays from the lamp and irradiates them to the solder paste, allowing for fast heating. The melted solder paste forms defect-free welding spots with sound electrics performance and low energy consumption, thus saving energy. This invention of welding device is used for the welding when electrical connector is assembled, solder paste is put and the connector is fixed in the conveying belt. The electrical connector goes through the heating zone in welding device, which enables the automatic welding of each cored wire in the electrical connector and wire connecting terminal. The welding is fast and the production can be continuous free of any tack welding.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: April 22, 2014
    Inventor: Ching-Jen Hsu
  • Publication number: 20140103098
    Abstract: Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 17, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Won Choi, Yon Ho YOU, Seon Jae MUN, Noriaki MUKAI, Seung Wan KIM, KiJu LEE, Jung In CHOI
  • Publication number: 20140008421
    Abstract: An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: A) moving the dispenser head above a next substrate place, B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place, C) dispensing solder by: C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp, C2) further advancing of solder wire to melt a predetermined quantity of solder, and C3) retracting the solder wire, D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, and E) raising the stamp.
    Type: Application
    Filed: June 12, 2013
    Publication date: January 9, 2014
    Inventors: Heinrich Berchtold, Rene Betschart
  • Publication number: 20130306709
    Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.
    Type: Application
    Filed: May 14, 2013
    Publication date: November 21, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hueng Jae Oh, Yon Ho You, Jin Won Choi
  • Patent number: 8556155
    Abstract: A solder paste mounting tool is provided, and includes a base, a positioning plate, a screen plate, and a pushing element. The base includes a first surface, a second surface, a through hole extending through the first surface and the second surface, a first chip accommodating portion, and positioning pillars. The first chip accommodating portion and the positioning pillars are located on the first surface, and the position of the first chip accommodating portion is corresponding to the position of the through hole. The positioning plate includes a second chip accommodating portion and first positioning holes corresponding to the positioning pillars. The screen plate includes a mesh region and second positioning holes corresponding to the positioning pillars. The pushing element is movably disposed in the through hole and includes a first end portion and a second end portion.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: October 15, 2013
    Assignee: Compal Information (Kunshan) Co., Ltd.
    Inventor: Jin-Bao Xu
  • Patent number: 8517246
    Abstract: A wire handling facilitator in the form of a backpack. An apparatus that is useful for handling small rolls of wire that is to be welded into channels of metal surfaces.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: August 27, 2013
    Assignee: AltoTec Wire Corporation
    Inventor: Thomas W. Burns
  • Publication number: 20130171816
    Abstract: A system and process for forming a ball grid array on a substrate includes defining a plurality of openings in a resist layer on the substrate, and forming a plurality of openings in the resist layer, each positioned over a contact pad of the substrate. Flux is then deposited in the openings, and solder balls are positioned in each opening with the flux. Solder bumps are formed by reflowing the solder balls in the respective openings. The resist layer is then removed, leaving an array of solder bumps on the substrate. The flux can be deposited by depositing a layer of flux, then removing the flux, except a portion that remains in each opening. Solder balls can be positioned by moving a ball feeder across the resist layer and dropping a solder ball each time an aperture in the ball feeder aligns with an opening in the resist layer.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 4, 2013
    Applicant: STMICROELECTRONICS PTE LTD.
    Inventor: Yonggang Jin
  • Patent number: 8474681
    Abstract: An apparatus for presoldering electrical components can include a die device having a punch member for punching a solder preform from a sheet of solder, and pressing the solder preform against an electrical component. A heating device can press against the electrical component on a opposite side from the die device for sandwiching the electrical component between the punch member and the heating member, for heating the electrical component and melting the solder preform thereon.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: July 2, 2013
    Assignee: Antaya Technologies Corp.
    Inventors: John Pereira, John P. Hendrick, Lawrence Richard Cole
  • Publication number: 20130140344
    Abstract: A solder ball mounting tool is provided, and includes a base, a positioning plate, a screen plate, and a pushing element. The base includes a first surface, a second surface, a through hole extending through the first surface and the second surface, a first chip accommodating portion, and positioning pillars. The first chip accommodating portion and the positioning pillars are located on the first surface, and the position of the first chip accommodating portion is corresponding to the position of the through hole. The positioning plate includes a second chip accommodating portion and first positioning holes corresponding to the positioning pillars. The screen plate includes a mesh region and second positioning holes corresponding to the positioning pillars. The pushing element is movably disposed in the through hole and includes a first end portion and a second end portion.
    Type: Application
    Filed: March 16, 2012
    Publication date: June 6, 2013
    Inventor: Jin-Bao Xu
  • Publication number: 20130075039
    Abstract: A system for fabricating silicon carbide assemblies that includes at least two silicon carbide materials; at least one joining interlayer positioned between the at least two silicon carbide materials, wherein the at least one joining interlayer further includes a first material that melts at a first temperature and a second material interspersed throughout the first material, and wherein the second material melts at a temperature that is lower than that of the first material; and at least one apparatus for applying energy to the joining interlayer, wherein applying energy to the joining interlayer is operative to soften the first material and melt the second material, and wherein softening the first material and melting the second material is operative to transform the joining interlayer into a substantially porosity-free adherent material capable of joining together the at least two silicon carbide materials.
    Type: Application
    Filed: September 21, 2012
    Publication date: March 28, 2013
    Applicant: EDISON WELDING INSTITUTE, INC.
    Inventors: Edward D. HERDERICK, Kirk E. COOPER, Nathan D. AMES
  • Publication number: 20130048699
    Abstract: The invention relates to a system for mounting a wire core (26) for a welding wire (9) in a coupling (29) of a hose assembly (21), the wire core (26) being fixed with a wire inlet nozzle (27) in the coupling (29) and the wire inlet nozzle (27) being connected to the coupling (29) by way of a mounting means (31) which is formed in a cylindrical manner and has at least one slot (36) to form at least two movable jaws (37), and relates to a wire inlet nozzle (27) for such a mounting system. According to the invention, at the end opposite from a wire inlet element (32), the mounting means (31) is provided with an oval flange (35), which oval flange (35) is formed in a raised manner with respect to the cylindrical region.
    Type: Application
    Filed: May 11, 2011
    Publication date: February 28, 2013
    Applicant: FRONIUS INTERNATIONAL GMBH
    Inventors: Johannes Fuerlinger, Walter Mitterhumer
  • Publication number: 20130043297
    Abstract: An automatic fluxing machine is provided and includes a dispensing section including a surface having through holes formed therein through which flux material is dispensable toward a braze joint and a plugging section disposed below the braze joint to prevent downward flow of dispensed flux material.
    Type: Application
    Filed: August 15, 2012
    Publication date: February 21, 2013
    Applicant: CARRIER CORPORATION
    Inventors: Timothy Andrecheck, Luis F. Avila, Jeffrey L. Jones
  • Patent number: 8348132
    Abstract: Disclosed herein is a mask frame apparatus capable of forming a bump having a micro-pitch without performing the manufacturing and the operation controlling of a separate head apparatus and preventing the reduction of a mounting speed of solder balls due to the repetition of an operation of separately recovering the solder balls after they are mounted on a mask. A mask frame apparatus for mounting solder balls includes: an outer circumferential mask frame configured to supply solder balls and having a hollow type duct shape; and an inner mask duct having a duct shape and positioned over the inside of a circumference of the outer circumferential mask frame so as to be in communication with the outer circumferential mask frame, and including a plurality of mask openings formed in a duct shape bottom surface so that the solder balls introduced through the hollow type outer circumferential mask frame are mounted on a substrate by the flow of air.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: January 8, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Jong Won Park
  • Patent number: 8338752
    Abstract: A modular portable welding wire feeder housed in a easily removable and interchangeable housing. The wire feeder includes a wire feeding module conveniently mounted inside of the housing. The housing is configured so that it may easily be removed from the wire feeing module, thereby allowing the housing to be easily replaced or exchanged as needed by the user.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: December 25, 2012
    Assignee: Lincoln Global, Inc.
    Inventors: Edward A. Enyedy, Kenneth L. Justice