Abstract: Stenciling machines and methods for forming solder balls on microelectronic-workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stencil having a plurality of apertures at least proximate to the workpiece. The method further includes placing discrete masses of solder paste into the apertures and reflowing the discrete masses of solder paste while the stencil is positioned at least proximate to the workpiece and while the discrete masses are in the apertures. In another embodiment of the invention, a stenciling machine for depositing and reflowing solder paste on the microelectronic workpiece includes a heater for reflowing the solder paste, a stencil having a plurality of apertures, and a controller operatively coupled to the heater and the stencil. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.

Abstract: An apparatus for dispensing solder accurately onto a prescribed surface of a substrate including a feeding mechanism for dispensing the solid solder and a dispensing piece with a feeding channel. The positioning device has a front opening that is adapted for direct contact with the prescribed surface during the dispensing operation to form an enclosed cavity. The back opening couples the positioning device to the dispensing end of said dispensing piece such that during the dispensing operation the solder solid may be dispensed from the feeding channel through the cavity and onto the prescribed surface. The dispensing piece is maintained at a temperature below the melting temperature of the solder material such that the solder material stays in a solid state until it is in contact with the prescribed surface.

Abstract: The invention relates to a device for applying pieces of material to a workpiece. Said device comprises a plurality of capillaries which respectively bring a piece of material (6) to a work station (3) in one working cycle. The piece of material is placed on the work station. A filling station fills a circular conveyer with a number of pieces of material (6) corresponding to the number of capillaries (4). An extracting station (19) is arranged in the transport path from the filling station (18) to the machining station (4′), said extracting station (19) extracting individual fragments of material (6) in a selective manner.

Abstract: Spherical balls, notably microballs of welding alloys, are produced by passing a melted material through vibrating orifices of a granulation pot, in order to form droplets which solidify when falling, by gravity, into a cooling tower filled with an inert gas. To improve the surface condition of the balls, the inert gas comprises approximately 15 to 150 ppm of oxygen. Moreover, the melted material is subject to ultrasound stirring just before being fed into the granulation pot. The balls are, preferably, dampened at the outlet of the cooling tower by brushes composed of polyamide wires. Besides, the control of the vibration frequency of the vibrating orifices in relation to the percentage of balls meeting the standards enables to improve the output.

Abstract: A fluxer applies powdered flux to an object. The fluxer includes an enclosure that defines a chamber where the object is fluxed. The enclosure includes an inlet for receiving the object into the chamber prior to application of the flux and an outlet for discharging the object from the chamber after the flux has been applied. A conveyor extends through the enclosure for traversing the object into and out of the chamber. The fluxer also includes a hopper for storing the flux and an applicator in fluid communication with the hopper for applying the flux to the object. A flux recovery system is in fluid communication with the chamber to introduce and maintain a negative pressure within the chamber. As a result, excess flux is retained within the enclosure. This excess flux can then be recovered and recycled to the hopper.

Abstract: A conductive powder is stored at a predetermined position in a tank. At least one substrate is placed at a predetermined position opposite the conductive powder in the tank. The tank is rotated so as to immerse the substrate into the conductive powder. Thereby, the conductive powder is applied to the substrate.

Abstract: An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform to support the substrate at a first sphere placement position in the apparatus, and a placement station disposed above the platform that places spheres at locations on the substrate. The placement station includes a first container having a chamber to contain spheres, and a first carrier tray having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes formed therein to receive spheres. The first carrier tray is movable to position the second section between a fill position beneath the first container and a place position disposed over the first sphere placement position.

Abstract: A modified aperture shape for screen printing eliminates insufficient solder without increasing the number of solder bridges. The shape is narrow in the area where the component lead will touch and wide or overprinted in the area where the lead does not touch. To further increase solder volume the length of the aperture can also be overprinted. The overprinted areas provide greater solder volume, while the narrow area where the lead will touch prevents solder bridging.

Abstract: A circuit board manufacturing system has a paste source, a circuit board processing apparatus, and a controller. The circuit board processing apparatus includes a carrier configured to receive a circuit board having (i) a section of circuit board material and (ii) virgin metallic surface mount pads supported by the section of circuit board material. The circuit board processing apparatus further includes a paste distribution assembly coupled to the carrier and to the paste source. The paste distribution assembly is configured to dispose a paste from the paste source onto a surface of the circuit board. The carrier further includes a surfacing assembly coupled to the carrier. The surfacing assembly is configured to move the paste over the surface of the circuit board to remove a portion of each virgin metallic surface mount pad. The controller is configured to selectively start and stop operations of the paste distribution and surfacing assemblies.

Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.

Abstract: A solder paste stenciling apparatus for minimizing residue of solder paste has a stencil disposed above a substrate in a proper distance. Multiple stencil opens are defined through the stencil and distributed in a predetermined formation. A squeegee for applying solder paste onto the stencil has a hollow body for receiving the solder paste. A piston is used to apply pressure to the solder paste in the body so that the solder paste is urged to flow through an outlet defined in a bottom surface of the body. Two blowers are mounted on opposite sides of the body and a vent is defined in each blower. In operation, the solder paste flows out of the body via the outlet and into the stencil opens to be further deposited onto the substrate. Then, air coming out of the blowers assists the solder paste to be fully evacuated from the stencil opens.

Abstract: A two-part solder preform for use in attaching a leaded circuit component to a circuit board. The preform is formed by two different solid components, a first of which is formed of a lower-temperature solder alloy and the second of a higher-temperature solder alloy, in which the first solid component is present in a sufficient amount to dissolve the second solid component when the preform is heated above the melting temperature of the lower-temperature solder alloy but below the melting temperature of the higher-temperature solder alloy. Upon cooling, the preform yields a solder joint having a substantially homogenous composition, which bonds the lead to the circuit board. Preferred solder alloys for the first and second solid components are lead-free.

Abstract: An apparatus (105) and method are provided for feeding wire (135) to a tip (120) of a torch (115) in a welding system (100). The apparatus (105) includes a drive mechanism (150) attached to the torch (115), and a guide assembly (155) attached to the drive mechanism. The guide assembly (155) includes a bracket (180) by which it is attached to the drive mechanism (150), a wire guide (185) through which the wire (135) is passed, and first and second adjustors (270A, 270B) to position the wire guide relative to the tip (120). The guide assembly (155) is configured to pass the wire (135) in a straight line from the drive mechanism (150) to the tip (120). In one embodiment, the adjustors (270A, 270B) include gimbals (275) supporting the wire guide (185). Each gimbal (275) is attached to a screw (280) passing through an opening in an arm (285) projecting from the bracket (180) of the guide assembly (155).

Abstract: A filling device for and a method of filling balls in an array of apertures in a ball-receiving element, the filling device comprising: a housing including an opening at a lower surface thereof and defining in part a chamber for containing a supply of balls, the housing being in use movably disposed over a ball-receiving element including an array of apertures; and distribution means disposed within the housing for distributing balls contained in the chamber such as to maintain a limited number of layers of the balls over at least a region of the opening in the housing.

Abstract: An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

Abstract: An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

Abstract: A method and apparatus for depositing solder paste on a printed wiring board has a stencil with a pattern of multiple apertures. The pattern aligns with a through-hole in the printed wiring board when the stencil is in physical contact with the printed wiring board. A squeegee arrangement applies solder paste through the multiple apertures in the stencil through the through-hole of the printed wiring board to the upper surface of the printed wiring board for securely mounting electronic components to the upper surface of the printed wiring board, for providing a thermal path for the heat sinks of the electronic components and for providing a low inductance electrical path to ground for the electrical components.

Abstract: Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of electrically conducting particles is preferred. The substrate having an array of tacky and non-tacky areas can either be electrically non-conducting (e.g., a dielectric substrate) or electrically-conducting. The methods involve use of first and second electrode plates with the substrate therebetween, the plates having applied thereto a direct current potential, which potential in preferred embodiments is reversed in polarity for a number N of cycles. Methods and articles are disclosed using an electrically conductive surface adjacent the tacky and non-tacky areas to minimize static buildup on the particles and tacky and non-tacky areas.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: An apparatus including a backing plate and at least one “U” shaped structure emanating from and secured to the backing plate to form a closed loop, and a method for attaching a pad of friction material to a backing plate are disclosed. The apparatus comprises at least one rigid structure attached to the backing plate in at least two places. These structures form at least one closed loop with the backing plate. The pad is formed around the structures, completely surrounding the structures. In the preferred embodiment, the structures are two “U” shaped loops made of friction material, so that the pad can continue to be used when the pad wears down to the level of the loops.

Abstract: The present invention describes the precise metering of soldering material realized in a preferred desktop preferably portable device designated for hand-soldering in small and medium volume operations. It combines the fully automated process of precise metering of the soldering wire for high accuracy and quality soldering with the freedom of a hand-operated soldering process.

Abstract: Dispensing apparatus is provided for dispensing items. The dispensing apparatus includes a dispensing outlet and an item holder having item holding areas and being movably disposed to position the item holding areas one at a time in sequence over the dispensing outlet so that when one of the item holding areas is positioned over the dispensing outlet, the other item holding areas are not disposed over the dispensing outlet. The dispensing apparatus further includes a blocker disposed over the item holder opposite the dispensing outlet, the blocker blocking access to the dispensing outlet from directly above the item holder when the item holder positions one of the item holding areas over the dispensing outlet.

Abstract: In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the positioning of a solder ball, (3) the blowing of nitrogen gas N2, and (4) the melting of the solder ball by laser radiation in one device is available, there are various problems that cannot improve the efficiency of laser radiation, maintenance, or operation efficiency, due to spatial restriction, difficulty of weight reduction, or fixed operation procedures. A solder-ball holder and an optical device are configured separately, and a vacuum pad is provided. A solder ball held in a solder-ball holding hole of the solder-ball holder is transported by the vacuum pad to a connecting portion of a head gimbal assembly, and solder reflow is carried out by the optical device.

Abstract: An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls.

Abstract: Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of electrically conducting particles is preferred. The substrate having an array of tacky and non-tacky areas can either be electrically non-conducting (e.g., a dielectric substrate) or electrically-conducting. The methods involve use of first and second electrode plates with the substrate therebetween, the plates having applied thereto a direct current potential, which potential in preferred embodiments is reversed in polarity for a number N of cycles. Methods and articles are disclosed using an electrically conductive surface adjacent the tacky and non-tacky areas to minimize static buildup on the particles and tacky and non-tacky areas.

Abstract: A welding tab assembly has a weld tab and a metal rod. The weld tab has an inverted L-shaped recess defined in one side of the weld tab and an inclined hole defined in a top face of the recess. The metal rod is inverted L-shaped and is received in the inverted L-shaped recess. An inclined section obliquely extends from one end of the metal rod and is received in the inclined hole in the weld tab. A fastener detachably holds the metal rod in the recess. In such an arrangement, the welding slag can be cleaned or exhausted during the welding process by means of detaching the weld tab from the welded parts, such that the welding quality is improved.

Abstract: An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

Abstract: There is disclosed a solder ball pitcher supplying a large number of solder balls stored in a solder ball housing chamber in a row into a solder ball supply passage unit through a taper portion, and then delivers the solder balls in sequence through a solder ball supply opening at the tip end of the solder ball supply passage unit by a swing motion of the release link in case of allowing a release lever reciprocated by a pusher and a compressive coil spring to translate by a parallel link composed of the release link and a follower link.

Abstract: A device (14) for implementing a method for setting on a substrate (2) interconnecting balls or preforms (1) comprising the following phases: storing in bulk the preforms (1); seizing in ordered position the preforms (1) with an adapted gripping device (9); setting the preforms (1) on the substrate (2) with the gripping device (9). Said device (14) is charaterized in that it consists of at least a matrix for storing the preforms, said matrix comprising a floor capable of acting as stop for the preforms when the matrix is being filled thereby enabling the implementation of a method whereby the passage from bulk storage to ordered storage is performed in masked time. The device is useful for incorporating or replacing balls in substrates of electronic components.

Abstract: A method and apparatus are disclosed for placing solder balls 320 on electronic pads 910 or 1010 on a component 900 or substrate 1000, such as for a ball grid array (BGA) applicator 100. The solder balls 320 are held to openings 202 in a foil 130 against a second layer 350 by a holding force, whereby the second layer is of a porous material and laminated to the foil 130. One such holding force can be a vacuum force 222 applied to the solder balls 320 through the openings 202 in a foil 130. After locating the solder balls 320 at electronic pads 910 or 1010 on a component 900 or substrate 1000, by removing the holding force 222, the solder balls 320 are released and placed on the electronic pads 910, 1010. Optionally, a plurality of pins may provide a releasing and/or placing force.

Abstract: A minute work piece in various mechanical or electric component parts is securely brazed by shooting a thin gas flame toward the work piece at a pinpoint while supplying a thread of soldering metal straight to the work piece to heat the work piece and melt the soldering metal, thereby to braze the soldering metal to the work piece. The pinpoint brazing method and device makes it possible to form reliable connection between the conductive terminal of a relay coil and a lead wire wound on a coil bobbin through a sphere-shaped soldering metal. The relay coil thus produced by the brazing method is suitably applicable to various kinds of machinery bringing about vibration, such as automobiles.

Abstract: An exothermic welding system uses compressible layers of disposable refractory batting or gaskets to form a weld chamber for parts to be welded. The parts to be welded are layered with the batting between a base and a crucible platen supported by a clamping fixture. The layered batting is provided with the holes intersecting the parts to be welded. The holes form the weld chamber. The crucible platen is provided with a chamber for the exothermic material which when ignited forms molten metal which flows through a tap hole into the weld chamber. When the weld is made, the fixture is opened and the batting is discarded. The invention is also the method of forming the welded connection by compressing the layered batting and the parts to be welded to form the disposable weld chamber enabling a simpler and lower cost welding system to make a wide variety of connections not requiring a large inventory of special and costly refractory mold parts.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the positioning of a solder ball, (3) the blowing of nitrogen gas N2, and (4) the melting of the solder ball by laser radiation in one device is available, there are various problems that cannot improve the efficiency of laser radiation, maintenance, or operation efficiency, due to spatial restriction, difficulty of weight reduction, or fixed operation procedures. A solder-ball holder and an optical device are configured separately, and a vacuum pad is provided. A solder ball held in a solder-ball holding hole of the solder-ball holder is transported by the vacuum pad to a connecting portion of a head gimbal assembly, and solder reflow is carried out by the optical device.

Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto the flux. A conveyor assembly is included to move the substrate between the flux station and the solder ball placement station.

Abstract: An apparatus (105) and method are provided for feeding wire (135) to a tip (120) of a torch (115) in a welding system(100). The apparatus (105) includes a drive mechanism (150) attached to the torch (115), and a guide assembly (155) attached to the drive mechanism. The guide assembly (155) includes a bracket (180) by which it is attached to the drive mechanism (150), a wire guide (185) through which the wire (135) is passed, and first and second adjustors (270A, 270B) to position the wire guide relative to the tip (120). The guide assembly (155) is configured to pass the wire (135) in a straight line from the drive mechanism (150) to the tip (120). In one embodiment, the adjustors (270A, 270B) include gimbals (275) supporting the wire guide (185). Each gimbal (275) is attached to a screw (280) passing through an opening in an arm (285) projecting from the bracket (180) of the guide assembly (155).

Abstract: A method is provided for manufacturing a piezoelectric actuator having a piezoelectric element and a lead wire for supplying a drive signal to the piezoelectric element. A melt material is immersed into a fusing agent. A quantity of the material and the fusing agent is supplied to a transfer plate and then adjusted. A preselected quantity of the melt material and the fusing agent is then transferred preselected quantity of the melt material and the fusing agent is supplied from the transfer tool to the lead wire. The melt material is then welded on the lead wire and on the piezoelectric element to thereby connect the lead wire to the piezoelectric element.

Abstract: There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.

Abstract: A tool for applying solder paste to leadless chips has recesses adapted to receive the leadless chips. Apertures in each recess are arranged according to pads on the leadless chip. With the chips held in the recesses, solder paste is applied in the apertures.

Abstract: An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.

Abstract: An apparatus for lining up micro-balls in accordance with the present invention includes: ball carrying pallets having a plurality of pits for holding the micro-balls, respectively, on its surface, a pallet holder for holding the ball carrying pallets, a lining-up container defining a sealed chamber in association with the pallet holder hermetically fitted thereto, a storing tank for storing liquid carrier in which micro-balls are dispersed, and applying/collecting device for communicating the storing tank with the lining-up container via a passage to supply the micro-balls together with the liquid carrier from the storing tank to the sealed chamber and return the surplus micro-balls together with the liquid carrier from the sealed chamber to the storing tank.

Abstract: A method and apparatus are provided for attaching conductive materials to a substrate and for attaching a semiconductor chip to a substrate. A pallet is provided with pockets to hold the conductive materials, the substrate is placed over the pallet, and the semiconductor chip is placed over the substrate. The assembled semiconductor package is then placed in a heating oven or reflowed and the conductive materials and semiconductor chip are simultaneously attached to the substrate. Also provided is a stencil for varying the pockets into which the conductive materials are placed. In uses involving the stencil, a pallet with a full array of pockets is used and a stencil with holes corresponding to the desired pattern of application of the conductive materials is placed over the pallet. When the conductive materials are applied over the stencil, they fill only those pockets in the pallet that correspond to the desired pattern of application.

Abstract: There is disclosed a solder ball pitcher supplying a large number of solder balls stored in a solder ball housing chamber in a row into a solder ball supply passage unit through a taper portion, and then delivers the solder balls in sequence through a solder ball supply opening at the tip end of the solder ball supply passage unit by a swing motion of the release link in case of allowing a release lever reciprocated by a pusher and a compressive coil spring to translate by a parallel link composed of the release link and a follower link.

Abstract: An apparatus, comprising a substrate having a surface, comprising one or more solder pads, each having a center and connected to a via, each via having a center; positioned relative to the surface such that at least one of the one or more solder pad centers is offset from the connecting via center and an area of the at least one of the one or more solder pads overlaps an area of the connecting via.

Abstract: A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.

Abstract: A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms 32 on a respective pattern of electronic pads 14 on a receiving substrate 12 for such uses as a Ball Grid Array component 24. The release mechanisms are of either compliant mechanical 11, vibratory 90, air pressure 100 or 120, or sound pressure waves 140. Additionally, a method and apparatus is disclosed for the electrical inspection for presence or absence of the complete pattern of conductive preforms.

Abstract: A conductive ball transferring apparatus including: an arranging member having in its top face a plurality of recesses in a predetermined arrangement pattern each capable of receiving one conductive ball therein; a tilting mechanism for tilting the arranging member with respect to a horizontal plane; a speed controller for controlling the moving speeds of the conductive balls that move along the top face of the tilted arranging member in a direction the arranging member has been tilted; and a transferring head for picking up the conductive balls arranged by the arranging member and transferring them onto predetermined positions. With this structure, the moving speeds of the conductive balls are stabilized and the conductive balls are arranged into the recesses quickly without fail, and thereby the transferring head can pick up these conductive balls onto predetermined positions promptly.

Abstract: A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside the housing member. A suction pump is provided to evacuate the air space and to receive an array of solder balls in the through-holes by suction. The through-holes are formed by etching, and the porous member reinforces the thin arrangement plate.

Abstract: A method for aligning and bonding balls to substrates, such as semiconductor wafers, dice and packages, is provided. The method employs a ball retaining plate having a pattern of micromachined cavities and vacuum conduits for retaining the balls. In addition, a substrate alignment member attached to the ball retaining plate, aligns the substrate to the balls. Using the substrate alignment member, bonding sites on the substrate can be placed in physical contact with the balls which are held by vacuum on the ball retaining plate. Next, the ball alignment plate and substrate can be place in a furnace for reflowing and bonding the balls to the bonding sites. An apparatus for performing the method includes the ball retaining plate and the substrate alignment member. A system for performing the method includes a ball loader mechanism for loading balls onto the ball retaining plate, and a vacuum fixture for applying a vacuum to the ball retaining cavities.