Work Portion Comprises Electrical Component Patents (Class 228/44.7)
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Patent number: 6942137Abstract: A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply a loading force to the semiconductor device. The assembly of the substrate and the semiconductor device are loaded into the fixture with the shearing element proximate the semiconductor device, and heating the solder connections of the assembly in the fixture are heated proximate the substrate to a predetermined temperature by applying a heat source to a surface of the substrate distal from the semiconductor device.Type: GrantFiled: October 16, 2003Date of Patent: September 13, 2005Assignee: International Business Machines CorporationInventors: Lannie R. Bolde, Jac A. Burke, Kevin C. Gallagher, Howard Hutchinson, Juan C. Jeri
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Patent number: 6921017Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.Type: GrantFiled: July 7, 2003Date of Patent: July 26, 2005Assignee: Micron Technology, Inc.Inventors: Sven Evers, Craig T. Clyne
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Patent number: 6918528Abstract: A transducer horn for holding a tool, such as a capillary, for a wire bonder has a pair of resilient arms which flex to clamp about a tool placed in a passage between the arms. The arms have free distal ends between which a wedge is inserted to open the passage to allow the tool to be inserted into, or removed from, the tool holder. The arms may be covered by protective walls, in which case an end wall is provided with an aperture to allow the wedge to access a slot between the arms.Type: GrantFiled: April 29, 2003Date of Patent: July 19, 2005Assignee: ASM Technology Singapore PTE LTDInventors: Srikanth Narasimalu, Sathish Kumar Balakrishnan, Ka Shing Kenny Kwan
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Patent number: 6899262Abstract: A clamping device is provided for clamping an object, such as bonding wire for a wire bonding machine. The device comprises a pair of clamping arms arranged in pivotal relationship with each other about a pivot point, the clamping arms having clamping ends movable between an open position and a closed position. An attraction device is operative to provide an attraction force between the clamping arms about the pivot point. The device includes biasing means that is operative to provide a biasing force in opposition to the attraction force about the pivot point, such that the biasing force is operative to bias the clamping ends towards the closed position. In a preferred embodiment, the biasing means comprises a flexure bearing.Type: GrantFiled: May 19, 2003Date of Patent: May 31, 2005Assignee: ASM Technology Singapore PTE LTDInventors: Ajit S. Gaunekar, Gary Peter Widdowson
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Patent number: 6886734Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.Type: GrantFiled: July 22, 2002Date of Patent: May 3, 2005Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
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Patent number: 6845898Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.Type: GrantFiled: August 4, 2003Date of Patent: January 25, 2005Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
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Patent number: 6840424Abstract: Compression bonding tools having a CVD-formed pressing member with a non-reactive working surface are disclosed and described. Generally speaking, the pressing member is coupled to a tool body, which may include head member, and a tail member. In some aspects, the tool body may include a support member of a super hard material that is coupled to the pressing member along a bonding surface thereof. Further, in some aspects, the tool body may contain a heat directing member that facilitates the transfer of heat energy in a direction toward the pressing member. Such compression bonding tools have been found useful in a variety of well-known procedures, such as tap bonding systems (TAB).Type: GrantFiled: October 8, 2002Date of Patent: January 11, 2005Inventor: Chien-Min Sung
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Patent number: 6837418Abstract: A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the method also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding and also provides for the replacement of the fixed clamp with another, or second, independent clamp.Type: GrantFiled: August 4, 2003Date of Patent: January 4, 2005Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
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Patent number: 6827253Abstract: A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of dissimilar material composition. The workpiece gripper selectively positions the workpiece closely adjacent the substrate and continually removes excess heat from the workpiece, both during and after the application of heat to the workpiece. Upon termination of the heat application, air-jet cooling can be provided to the workpiece to quickly cool the terminal and the molten layer of solderable material.Type: GrantFiled: December 24, 2002Date of Patent: December 7, 2004Inventor: Larry J. Costa
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Publication number: 20040232203Abstract: A clamping device is provided for clamping an object, such as bonding wire for a wire bonding machine. The device comprises a pair of clamping arms arranged in pivotal relationship with each other about a pivot point, the clamping arms having clamping ends movable between an open position and a closed position. An attraction device is operative to provide an attraction force between the clamping arms about the pivot point. The device includes biasing means that is operative to provide a biasing force in opposition to the attraction force about the pivot point, such that the biasing force is operative to bias the clamping ends towards the closed position. In a preferred embodiment, the biasing means comprises a flexure bearing.Type: ApplicationFiled: May 19, 2003Publication date: November 25, 2004Applicant: ASM Technology Singapore Pte LtdInventors: Ajit S. Gaunekar, Gary Peter Widdowson
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Patent number: 6820793Abstract: An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The apparatus has at least one comb which can be raised and lowered in order to move the substrates in transport direction as well as resiliently mounted elements which press against the substrates.Type: GrantFiled: July 29, 2002Date of Patent: November 23, 2004Assignee: ESEC Trading SAInventors: Daniel Kellenberger, Guido Suter
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Patent number: 6821381Abstract: A ceramic holder 2 is mounted on the lower end of a connecting block 30 of metal mounted on the lower end of a tool main body 1 of metal, such ceramic holder 2, a ceramic heater 4 and a ceramic presser 5 being sintered. In addition) the coefficient of linear expansion of the ceramic holder 2 is approximately equal to those of the ceramic heater 4 and ceramic presser 5; furthermore, the thermal conductivities of the ceramic holder 2 and ceramic presser 5 are greater as the pressure side of the ceramic presser 5 as seen from the ceramic heater 4 is approached and are smaller as the attaching surface side of the ceramic holder 2 is approached.Type: GrantFiled: May 15, 2003Date of Patent: November 23, 2004Assignee: Toray Engineering Co., Ltd.Inventors: Akira Yamauchi, Yoshiyuki Arai
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Patent number: 6814277Abstract: A method of securing articles to each other and an alignment and holding apparatus comprising a platform having an alignment member for positioning and holding a first article, such as a substrate, in a first position and a further alignment member for aligning extensions of a second article, such as a lead frame, in an assembleable position with respect to the first article while a spacer maintains the extensions in proper lateral position and a clamp that secures the extensions proximate the first article while an electrical connection is formed between the first article and the extensions of the second article.Type: GrantFiled: December 16, 2002Date of Patent: November 9, 2004Assignee: Lockheed MartinInventors: Robert James Monson, Richard L. Cellini, Roger J. Karnopp
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Patent number: 6799714Abstract: A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk hole is drilled in the bottom of the pallet to accommodate the pin. The pin is inserted into the countersunk hole and secured with a high-temperature epoxy resin. The epoxy holds the pin securely in place and keeps the pin from moving up or down. The present invention also comprises at least one arm affixed at one end to a swivel joint. The swivel joint allows the arm to rotate about a vertical axis. The upper portion of the swivel joint is hinged such that the arm can rotate about a horizontal axis. The combination of movement about the horizontal and vertical axis allows the arm to be positioned at any point over the pallet.Type: GrantFiled: March 6, 2003Date of Patent: October 5, 2004Inventor: James Gleason
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Patent number: 6783052Abstract: The invention provides an apparatus and method for clamping an object. The apparatus comprises a clamping mechanism and an actuation system to actuate clamping and de-clamping of the clamping mechanism, wherein the actuation system comprises two actuator devices which are operatively coupled whereby to provide an actuation force to the clamping mechanism. Preferably, the actuator devices comprises a variable reluctance actuator and a linear induction actuator coupled together and adapted to cooperate to provide the actuation force to the clamping mechanism.Type: GrantFiled: November 21, 2002Date of Patent: August 31, 2004Assignee: ASM Technology Singapore PTE LTDInventors: You Yong Liao, Ajit Gaunekar, Gary Peter Widdowson
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Patent number: 6769469Abstract: A process for mounting a semiconductor device and a mounting apparatus whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other.Type: GrantFiled: August 14, 2001Date of Patent: August 3, 2004Assignee: Sony Chemicals Corp.Inventor: Yukio Yamada
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Publication number: 20040140339Abstract: A clamp post holder has a mounting portion for mounting on a wire bonding machine, and a clamp post holding portion, which holds a clamp post. The mounting portion and post holding portion are separated by a slot except for a connecting portion. A screw passes through a threaded hole in the clamp post holding portion into the slot, with its end abutting the mounting portion. By turning the screw, the clamp post holding portion is pulled away from the mounting portion, thereby moving the clamp post. This allows fine adjustment of the positioning of a clamp member on the clamp post.Type: ApplicationFiled: January 22, 2003Publication date: July 22, 2004Inventor: Kek Theng-Hui
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Publication number: 20040112943Abstract: A method of securing articles to each other and an alignment and holding apparatus comprising a platform having an alignment member for positioning and holding a first article, such as a substrate, in a first position and a further alignment member for aligning extensions of a second article, such as a lead frame, in an assembleable position with respect to the first article while a spacer maintains the extensions in proper lateral position and a clamp that secures the extensions proximate the first article while an electrical connection is formed between the first article and the extensions of the second article.Type: ApplicationFiled: December 16, 2002Publication date: June 17, 2004Inventors: Robert James Monson, Richard L. Cellini, Roger J. Karnopp
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Publication number: 20040099711Abstract: The invention provides an apparatus and method for clamping an object. The apparatus comprises a clamping mechanism and an actuation system to actuate clamping and de-clamping of the clamping mechanism, wherein the actuation system comprises two actuator devices which are operatively coupled whereby to provide an actuation force to the clamping mechanism. Preferably, the actuator devices comprises a variable reluctance actuator and a linear induction actuator coupled together and adapted to cooperate to provide the actuation force to the clamping mechanism.Type: ApplicationFiled: November 21, 2002Publication date: May 27, 2004Applicant: ASM Technology Singapore Pte LtdInventors: You Yong Liao, Ajit Gaunekar, Gary Peter Widdowson
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Patent number: 6732902Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or nonpenetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.Type: GrantFiled: August 5, 2002Date of Patent: May 11, 2004Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Patent number: 6729527Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.Type: GrantFiled: January 30, 2001Date of Patent: May 4, 2004Assignee: Kulicke & Soffa Investments, Inc.Inventors: Benjamin Sonnenreich, Sigalit Robinzon
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Publication number: 20040079785Abstract: 19An electronic component carrier includes a frame, a circuit board clamp fixed to the frame for clamping a circuit board, a vibrating device for vibrating the circuit board while the circuit board is carried through a reflow oven and the temperature inside the reflow oven is a predetermined temperature, and a collector installed on the frame for collecting electronic components dropping from the circuit board.Type: ApplicationFiled: April 11, 2003Publication date: April 29, 2004Inventor: Chun-Wei Yang
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Publication number: 20040074945Abstract: A system for performing a welding operation, such as a spot weld, using a robot incorporating an articulated and movable arm terminating in a weld gun. The system includes a portable and rechargeable electrical supply unit adapted to being secured to the robot arm in communicable fashion with the weld gun. The electrical supply unit includes a charging component, such as a battery, and a delivery (high capacitance/low voltage) component. A docking unit is positioned at a remote and accessible location relative the robot arm and associated supply unit, a primary voltage supply communicating with the docking unit. The electrical supply unit associated with the robot arm is electrically communicated with primary voltage input of the docking unit in a first charging condition.Type: ApplicationFiled: October 17, 2002Publication date: April 22, 2004Inventor: Joseph P. Brady
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Publication number: 20040065719Abstract: A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the method also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding and also provides for the replacement of the fixed clamp with another, or second, independent clamp.Type: ApplicationFiled: August 4, 2003Publication date: April 8, 2004Inventors: Michael B. Ball, Rich Fogal
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Patent number: 6715659Abstract: An apparatus for supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.Type: GrantFiled: July 8, 2002Date of Patent: April 6, 2004Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Publication number: 20040041002Abstract: An alignment weight is provided. The alignment weight includes a body of material having first and second opposing surfaces. A number of depressions are formed in the first surface. The depressions receive pins of a floating pin field when placed on a floating pin field during connection of the floating pin field to a printed circuit board.Type: ApplicationFiled: September 5, 2003Publication date: March 4, 2004Applicant: Intel CorporationInventors: Cheryl M. Waldron-Floyde, Brad C. Irwin
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Publication number: 20040026486Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.Type: ApplicationFiled: July 7, 2003Publication date: February 12, 2004Inventors: Sven Evers, Craig T. Clyne
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Publication number: 20040026483Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.Type: ApplicationFiled: August 5, 2003Publication date: February 12, 2004Inventor: Michael B. Ball
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Patent number: 6662993Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.Type: GrantFiled: July 25, 2002Date of Patent: December 16, 2003Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
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Patent number: 6648045Abstract: The present invention relates to a chip bonding apparatus for bonding a chip to a substrate, with a support structure for preventing a deviation or error in parallelism of a head 1 holding the chip. A first support mechanism 4 supports a pressure cylinder 3 for pressing the head 1 toward a substrate 2. A second support mechanism 5 is provided separately from and independently of the first support mechanism 4 for supporting a reactive force acting on the pressure cylinder 3 when the head 1 is pressed toward the substrate 2. The second support mechanism 5 is in contact with the pressure cylinder 3 through a spherical point of contact 12.Type: GrantFiled: May 30, 2002Date of Patent: November 18, 2003Assignee: Toray Engineering Co., Ltd.Inventor: Akira Yamauchi
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Patent number: 6648204Abstract: An alignment weight is provided. The alignment weight includes a body of material having first and second opposing surfaces. A number of depressions are formed in the first surface. The depressions receive pins of a floating pin field when placed on a floating pin field during connection of the floating pin field to a printed circuit board.Type: GrantFiled: January 4, 2001Date of Patent: November 18, 2003Assignee: Intel CorporationInventors: Cheryl M. Waldron-Floyde, Brad C. Irwin
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Patent number: 6641027Abstract: A method of connecting a generally flat battery lead to at least one flat current collector of a polymer battery, comprising the steps of: bending a generally planar lead about at least one generally planar current collector tab to form a layered area, wherein at least one planar tab is disposed between planar portions of the lead with the lead wrapped around one edge of at least one tab; clamping the layered area between two weld fixtures of an ultrasonic welder; and vibrating the weld fixtures to ultrasonically weld together the battery lead and at least one current collector tab.Type: GrantFiled: December 18, 2001Date of Patent: November 4, 2003Assignee: NGK Spark Plug Co., Ltd.Inventors: Ronald V. O'Connell, Mark L. Daroux, Shawn E. Thomas, Xuekun Xing
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Patent number: 6637636Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.Type: GrantFiled: April 23, 2001Date of Patent: October 28, 2003Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Patent number: 6634538Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.Type: GrantFiled: December 11, 2001Date of Patent: October 21, 2003Assignee: Micron Technology, Inc.Inventors: Sven Evers, Craig T. Clyne
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Publication number: 20030178468Abstract: Stage structure in a bonding machine including a plate movably fitted in a bonding chamber, a plurality of blocks of electro-static chucks fitted to the plate for providing an electro-static force to hold a substrate, a plurality of vacuum holes in the plate around the electro-static chucks for receiving a vacuum force, and adsorbing and holding the substrate, and a plurality of alignment mark confirming holes in a periphery of the plate for confirming the marks for aligning the adsorbed substrate, thereby separating substrate from the stage more easily by applying a DC power with polarities opposite to a regular DC power.Type: ApplicationFiled: December 20, 2002Publication date: September 25, 2003Inventors: Sang Seok Lee, Sang Ho Park
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Patent number: 6604671Abstract: A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the method also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding and also provides for the replacement of the fixed clamp with another, or second, independent clamp.Type: GrantFiled: July 25, 2002Date of Patent: August 12, 2003Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
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Patent number: 6604670Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.Type: GrantFiled: March 5, 2002Date of Patent: August 12, 2003Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Publication number: 20030146267Abstract: In order that, on wire bonding by means of a Wire Bonder, optimum bonding results can be achieved after a capillary change it is suggested that, after a change from a first capillary to a second capillary, the ultrasonic transducer which applies ultrasonics to the horn which guides the capillary is controlled with a parameter P2 which results from the parameter P1 before the capillary change as P2=g(k1, k2)*P1 or P2=g(k1, k2, A1, A2)*P1 or P2=g(k1, k2, A1, A2, H1, H2)*P1, whereby the quantities k1 and k2 designate the estimated values for the flexural strength, the quantities A1 and A2 the amplitudes of the freely oscillating capillary and H1 and H2 the diameters in the narrowest part of the longitudinal drill hole of the first or second capillary and whereby the function g is a predetermined function.Type: ApplicationFiled: February 3, 2003Publication date: August 7, 2003Applicant: ESEC Trading SAInventors: Michael Mayer, Martin Melzer
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Patent number: 6588649Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.Type: GrantFiled: January 16, 2002Date of Patent: July 8, 2003Assignee: Micron Technology, Inc.Inventors: Sven Evers, Craig T. Clyne
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Publication number: 20030121955Abstract: The present invention relates to a method for mounting electrical components on leadframes. A conveyor belt is used, having a holder which is attached to the conveyor belt. A leadframe is placed on the conveyor belt and is adjusted and held in position relative to the holder. The leadframe thus maintains its position relative to the endless conveyor belt throughout the entire period for which it remains on the endless conveyor belt.Type: ApplicationFiled: February 21, 2003Publication date: July 3, 2003Applicant: Infineon Technologies AGInventors: Johann Breu, Josef Dirnberger
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Patent number: 6585145Abstract: A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.Type: GrantFiled: December 4, 2001Date of Patent: July 1, 2003Assignee: ESEC Trading SAInventors: Stefan Behler, Beat Zumbuehl, Reto Schubiger, Ruedi Grueter, Rolf Schuermann
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Patent number: 6584670Abstract: The present invention relates to a workpiece implementation device that fabricates individual workpieces, positions them at their point of use on a component, and connects the workpieces to the components. The device further comprises an accessory assembly capable of shaping the workpieces, coating the workpieces with a solderable material, burnishing the point of use on the component, and testing the connection between the workpieces and the component. The positioning, attaching, and accessory assemblies of the workpiece implementation device are adapted to selectively perform their individual functions without the necessity of first repositioning the component or the implementation device. Accordingly, the present invention increases overall production efficiency by integrating several separate implementation tools and workstations into a single, adaptable device.Type: GrantFiled: May 16, 2001Date of Patent: July 1, 2003Inventor: Larry J. Costa
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Patent number: 6561408Abstract: There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly parallel. The pressing face can be thus disposed with the higher parallelism to the bonding stage as compared with the conventional art, so that components and a circuit form object can be bonded with a high bonding quality.Type: GrantFiled: January 14, 2002Date of Patent: May 13, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Naoto Hosotani, Shuji Ono, Hidenobu Nishikawa, Mitsuo Maeno, Hiroshi Nasu
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Patent number: 6550668Abstract: A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapted to secure the terminal between a pair of jaws and selectively position the terminal closely adjacent the structure. The jaws further serve as heat sinks to continually remove residual heat from the terminal, both during and after the application of heat to the terminal. Upon termination of the heat application, air-jet cooling is provided to the terminal to quickly cool the terminal and the molten layer of solder. The method of rapidly heating and cooling the terminal and layer of solder prevents the annealing of certain silica substrates and provides better solder connections.Type: GrantFiled: May 7, 2001Date of Patent: April 22, 2003Inventor: Larry J. Costa
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Patent number: 6547121Abstract: An apparatus is provided wherein a substrate is mechanically clamped to a heater block of a die bonder to hold down the heated substrate before and during the die bonding operation, thereby preventing warpage of the substrate. Embodiments include a clamp comprising a plurality of spring-loaded rollers which push down opposing outer edges of the substrate onto the heater block while the substrate is being heated and die bonded. The clamp minimizes warpage of the substrate by pushing the substrate flat onto the heater block, and allows the substrate to be moved into and away from the die bonding area.Type: GrantFiled: January 19, 2001Date of Patent: April 15, 2003Assignee: Advanced Micro Devices, Inc.Inventors: Sally Y. L. Foong, Kok Khoon Ho
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Patent number: 6533158Abstract: Disclosed is a wire bonding apparatus which has a structure as simple and as light as possible, which substantially reduces the inertia in a Z-direction rotating portion swinging at a high speed in the Z-direction, and which can realize a stable high-speed swinging of the Z-direction rotating portion while restraining vibration. A wire bonding apparatus (21) is arranged on a base capable of moving in X- and Y-directions by an XY stage, and is equipped with a wire clamp (22) rotatable in the Z-direction perpendicular to the X- and Y-directions. A driving portion (15) imparts a wire gripping force to the wire clamp. An elastic sack-like member (14) is arranged on the wire clamp and adapted to change its shape by a fluid introduced by the driving portion (15) through a tube (23), to thereby generate a wire gripping force.Type: GrantFiled: October 29, 2001Date of Patent: March 18, 2003Assignee: NEC CorporationInventors: Junichiro Oishi, Noriyuki Kubota
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Patent number: 6516994Abstract: A wire bonding apparatus for connecting a semiconductor device including a semiconductor chip, to a lead frame having a die pad to which the semiconductor chip is joined, through a plurality of inner leads which are aligned along a periphery of the die pad at intervals. The apparatus includes a heat block having an inner lead mounting portion for mounting the inner leads, a concave portion located inward of the inner lead mounting portion, and at least one supporting pad for mounting the semiconductor chip. Restoration of the lead frame at wire bonding portions are decreased at the time a lead frame forcing mold holding the lead frame to heat block is detached.Type: GrantFiled: August 21, 2001Date of Patent: February 11, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventor: Yoshiharu Takahashi
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Publication number: 20030024963Abstract: A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr; 1, so that it is possible to suppress the occurrence of bubbles in the solder.Type: ApplicationFiled: July 31, 2002Publication date: February 6, 2003Applicant: FUJITSU TEN LIMITEDInventors: Toshihiko Fujii, Takashi Ohta, Shinichi Sugiura, Toshimasa Akamatsu, Katsufumi Morimune
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Patent number: 6494357Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or nonpenetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.Type: GrantFiled: June 7, 2001Date of Patent: December 17, 2002Assignee: Micron Technology, Inc.Inventor: Michael B. Ball
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Publication number: 20020185520Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or nonpenetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.Type: ApplicationFiled: August 5, 2002Publication date: December 12, 2002Inventor: Michael B. Ball